Abstract: A CPU voltage testing system and method uses a parameter storing unit to store a number of VID codes and a plurality of allowable voltage ranges. A number of VID code control signals corresponding to the number of the VID codes are sent to a VID code coding unit to control a voltage converting module to output corresponding voltage signals to a CPU. A voltage collecting unit collects CPU core voltages of the CPU and outputs the collected CPU core voltages to a data processing unit. The data processing unit can determine whether the collected CPU core voltages are within the plurality of allowable voltage ranges via comparing with a number of testing parameters stored in the parameter storing unit.

Abstract: A method and apparatus for evaluating and optimizing a signaling system is described. A pattern of test information is generated in a transmit circuit of the system and is transmitted to a receive circuit. A similar pattern of information is generated in the receive circuit and used as a reference. The receive circuit compares the patterns. Any differences between the patterns are observable. In one embodiment, a linear feedback shift register (LFSR) is implemented to produce patterns. An embodiment of the present disclosure may be practiced with various types of signaling systems, including those with single-ended signals and those with differential signals. An embodiment of the present disclosure may be applied to systems communicating a single bit of information on a single conductor at a given time and to systems communicating multiple bits of information on a single conductor simultaneously.

Abstract: A multi-strobe circuit that latches a signal to be tested, an evaluation target, at each edge timing of a multi-strobe signal having a plurality of edges. An oscillator oscillates at a predetermined frequency in synchronization with a reference strobe signal. A latch circuit latches the signal to be tested at an edge timing of an output signal of the oscillator. A gate circuit is provided between a clock terminal of the latch circuit and the oscillator, and makes the output signal of the oscillator pass therethrough for a predetermined period. A clock transfer circuit loads the output signal of the latch circuit at an edge timing of the output signal of the oscillator and performs retiming on the output signal of the latch circuit by using a reference clock.

Abstract: A built-in self test circuit includes a pattern generator, an elastic buffer, a symbol detector, and a comparison unit. A pattern generator generates a first test pattern to test a port under test and then a result pattern is gotten and stored in the elastic buffer. The symbol detector detects if a starting symbol exists in the test result pattern. If it exists, a second test pattern is generated to be compared with the test result pattern. As a result, a reliability of data transmission of the port under test is determined.

Abstract: A method, device, and system are disclosed. In one embodiment method includes determining a left edge and right edge of a valid data eye for a memory. The method continues by periodically checking the left and right edges for movement during operation of the memory. If movement is detected, the method retrains the valid data eye with an updated left edge and right edge.

Abstract: A processor comprises a processor core and a controller. The processor core has an execution unit configured to execute instructions and to attempt to perform at least one operation in executing one of the instructions. The processor core is configured to detect a processor error associated with the at least one operation. The controller is configured to change an operating point of the processor core in response to a detection of the processor error such that the processor core operates at a new operating point, and the processor core is configured to retry the at least one operation while the processor core is operating at the new operating point.

Abstract: Disclosed is a design structure for an associated first system for extending product life of a second system in the presence of phenomena that cause the exhibition of both performance degradation and recovery properties within system devices. The first system includes duplicate devices incorporated into the second system (e.g., on a shared bus). These duplicate devices are adapted to independently perform the same function within that second system. Reference signal generators, a reference signal comparator, a power controller and a state machine, working in combination, can be adapted to seamlessly switch performance of that same function within the second system between the duplicate devices based on a measurement of performance degradation to allow for device recovery. A predetermined policy accessible by the state machine dictates when and whether or not to initiate a switch.

Abstract: Detecting brown-out in a system having a non-volatile memory (NVM) includes loading data in the NVM, wherein a next step in loading is performed on a location in the NVM that is logically sequential to an immediately preceding loading. A pair of adjacent locations include one with possible data and another that is empty. Determining which of the two, if at all, have experienced brownout includes using two different sense references. One has a higher standard for detecting a logic high and the other higher standard for detecting a logic low. Results from using the two different references are compared. If the results are the same for both references, then there is no brownout. If the results are different for either there has been a brownout. The location with the different results is set to an invalid state as the location that has experienced the brownout.

Abstract: An integrated circuit may have a circuit under test. The integrated circuit may have a clock generation circuit that receives a reference clock from a tester and that generates a corresponding core clock. The integrated circuit may have a built in self test circuit and a clock synthesizer that receives the core clock. The built in self test circuit may provide clock synthesizer control signals that direct the clock synthesizer to produce test clock signals at various test clock frequencies. The test clock at the test clock frequencies may be applied to the circuit under test during circuit testing. The circuit under test may assert a pass signal when the circuit tests are completed successfully. The built in self test circuit may inform the tester of the maximum clock frequency at which the circuit under test successfully passes testing.

Abstract: Logic circuitry has a test point to detect a signal about a delay fault propagating on a logic path between an input terminal and an output terminal, the test point being coupled to the logic path, wherein the test point includes a delay component to delay timing to detect the signal about a delay fault propagating on the logic path by predetermined time.

Abstract: A method of testing a proximity communication system for voltage margin by impressing a voltage upon the data link between the transmitter on one chip and the receiver on the other chip coupled to the transmitter through a capacitively coupling circuit formed by juxtaposed capacitor pads on the respective two chips. The impressed voltage is varied and the output of the receiver is monitored to determine an operational voltage margin. The floating inputs on the receiver may be continuously biased by connecting them to variable biasing supply voltages through high impedances. When the floating inputs are periodically refreshed to a refresh voltage during a quiescent data period, the refresh voltage is varied between successive refresh cycles. The variable test voltage may be applied to transmitter output when it is in a high-impedance state, and the output of the receiver is measured.

Abstract: Described embodiments provide for end-of-life (EOL) checking for NAND flash devices. An exemplary implementation of a computing environment comprises at least one NAND data storage device operative to store one or more data elements. In the illustrative implementation, the EOL data processing and storage management paradigm allows for the storage of data according using a selected EOL enforcement algorithm that can utilize current and/or historical correction levels. The NAND data storage EOL checking module can be operable to cooperate with one or more NAND data store components to execute one or more selected EOL operations to protect stored data.

Abstract: A process for a prognosis of faults in electronic circuits identifies parameters of a circuit under test. An upper and a lower limit is determined for one or more components of the circuit under test. A population of faulty and non-faulty circuits are generated for the circuit under test, and feature vectors are generated for each faulty and non-faulty circuit. The feature vectors are stored in a fault dictionary, and a feature vector for an implementation of the circuit under test in a field operation is generated. The feature vector for the implementation of the circuit under test in the field operation is compared to the feature vectors in the fault dictionary.

Abstract: An automatic test system that can be configured to perform any of a number of test processes. The test system contains multiple functional modules that are interconnected by a network. By using software to configure data flow between functional modules, combinations of modules can be made, thereby creating virtual instruments. As test requirements change, the test system can be reconfigured to contain other virtual instruments, eliminating or reducing the need to add instruments to meet changing test requirements. To ensure adequate performance of the test system, a proposed configuration may be simulated, and if a virtual instrument does not provide a required level of performance, the test system may be reconfigured.

Abstract: Improving statistical yield of a system-on-a-chip. The system-on-a-chip includes several memory systems. Each memory system includes a large number of memories. The memories are tested to identify any faulty memories. One or more margins of the faulty memories are then varied and the memories are then tested again.

Abstract: A structure and method for optimzing scan chain fail disgnosis. First, logic paths from target latches in a target scan chain to observation latches in at least one other observation scan chain are identified. Then, the locations of the observation latches within the other scan chains are optimized.

Abstract: Systems, controllers and methods are disclosed, such as an initialization system including a controller that receives patterns of read data coupled from a memory device through a plurality of read data lanes. The controller is operable to detect any lane-to-lane skew in the patterns of read data received through the read data lanes. The controller then adjusts the manner in which the read data received through the read data lanes during normal operation are divided into frames. The controller can also couple patterns of command/address bits to the memory device through a plurality of command/address lanes. The memory device can send the received command/address bits back to the controller through the read data lanes. The controller is operable to detect any lane-to-lane skew in the patterns of command/address bits received through the read data lanes to adjust the manner in which the command/address bits coupled through the command/address lanes during normal operation are divided into frames.

Abstract: A memory system and method using adaptive word line (WL) pulse widths, including a memory operating according to a wordline (WL) pulse with an associated WL pulse width, and a built-in self-test (BIST) unit that interfaces with the memory, the BIST unit being configured to run a self-test of the internal functionality of the memory and provide a signal indicating if the memory passed or failed the self-test. An adaptive WL control circuit that interfaces with the BIST unit and the memory, the adaptive WL control circuit being configured to adjust the WL pulse width of the memory based on the signal provided by the BIST unit.

Abstract: In one embodiment, the invention is a method and apparatus for computing margins for at-speed testing of integrated circuit chips. One embodiment of a method for computing a margin for at-speed testing of an integrated circuit chip design includes computing a statistical chip slack for the chip, computing a statistical test slack for the chip, and computing the margin from the chip slack and the test slack.

Abstract: A CPU voltage testing system and method uses a parameter storing unit to store a number of VID codes and a plurality of allowable voltage ranges. A number of VID code control signals corresponding to the number of the VID codes are sent to a VID code coding unit to control a voltage converting module to output corresponding voltage signals to a CPU. A voltage collecting unit collects CPU core voltages of the CPU and outputs the collected CPU core voltages to a data processing unit. The data processing unit can determine whether the collected CPU core voltages are within the plurality of allowable voltage ranges via comparing with a number of testing parameters stored in the parameter storing unit.

Abstract: Disclosed are embodiments of a system, method and service for detecting and analyzing systematic conditions occurring in manufactured devices. Each embodiment comprises generating a unique signature for each of multiple tested devices. The signatures are generated based on an initial set of signature definitions and the values for those signature definitions that are derived at least in part from selected testing data. A systematic condition is detected based on commonalities between the signatures. The systematic condition is then analyzed, alone or in conjunction with additional information, in order to develop a list of underlying similarities between the devices. The analysis results can be used to refine the systematic condition detection and analysis processes by revising the signature definitions set and/or by modifying data selection.

Abstract: An auto-trim circuit that sets trim bits for an integrated circuit includes a coarse bit calibration circuit for determining a first portion of the trim bits as a set of coarse bits, and a fine bit calibration circuit for determining a second portion of the trim bits as a set of fine bits wherein said fine bits.

Abstract: A system that detects degradation in an integrated circuit chip. During operation, the system monitors a pair of pins on the integrated circuit chip and in doing so, generates a time series of parameters for the pins. The system then determines whether the time series of parameters indicates that the integrated circuit chip has degraded. If so, the system generates a signal indicating that the integrated circuit chip has degraded.

Abstract: In some embodiments the continuous measuring of temperature in remote memory devices operating within an electrically noisy environment is facilitated by coordinating the progressive approximation of temperature within quiescent periods of non-activity as known by a memory controller.

Abstract: In a digital broadcast receiver, when a bit error rate (BER) is larger than a threshold in a BER determining part, power is supplied to a first tuner and a second tuner for diversity reception. When the BER is smaller than the threshold, power supply to one of the first tuner and the second tuner is stopped for single reception. This structure allows power supply to one of the tuners to be stopped in excellent reception environments, thus reducing power consumption.

Abstract: An integrated circuit contains within the chip one or more measuring devices that provide a digital value corresponding to respective physical operating parameters of the chip. The digital values can be communicated to other devices using an interrupt handler.

Abstract: A testing system for a device under test (DUT) includes a test parameter-generating device and a platform module. The test parameter-generating device stores test information, and is operable so as to execute a test algorithm, so as to generate a transmission signal upon execution of the test algorithm, and so as to generate a test environment with reference to the transmission signal. The platform module is operable so as to conduct testing of the DUT using the test information stored in the test parameter-generating device under the test environment generated by the test parameter-generating device.

Abstract: A method for testing an integrated circuit implemented in an electronic system. The method includes placing an integrated circuit (or portion thereof) that is implemented in an operational system (e.g., in a computer system) in an offline status. An electrical parameter of the integrated system (e.g., a voltage, clock frequency, etc.) is set, and a built-in self-test (BIST) is conducted. Any failures that occur during the BIST are recorded. Testing is then repeated for each of a plurality of predetermined values of the electrical parameter, recording any failures that occur. Once testing is complete a failure rate/range is determined for each of the predetermined values.

Abstract: A system that generates test patterns for detecting transition faults in an integrated circuit (IC). During operation, the system receives slack times for each net in the IC. Note that a slack time for a net is the minimum amount of delay that the given net can tolerate before violating a timing constraint. For each possible transition fault in the IC, the system uses the slack times for nets in the IC to generate a test pattern which exposes the transition fault by producing a transition that propagates along the longest path to the transition fault.

Abstract: Disclosed are embodiments of a method and an associated first system for extending product life of a second system in the presence of phenomena that cause the exhibition of both performance degradation and recovery properties within system devices. The first system includes duplicate devices incorporated into the second system (e.g., on a shared bus). These duplicate devices are adapted to independently perform the same function within that second system. Reference signal generators, a reference signal comparator, a power controller and a state machine, working in combination, can be adapted to seamlessly switch performance of that same function within the second system between the duplicate devices based on a measurement of performance degradation to allow for device recovery. A predetermined policy accessible by the state machine dictates when and whether or not to initiate a switch.

Abstract: According to embodiments of the present invention, an integrated circuit such as a processor includes a counter to count an actual number of unreliable storage locations in the processor cache, at least one register to store an acceptable number of unreliable storage locations for the cache, a detector to measure a thermal environment of the processor, and circuitry to raise an operating voltage of the processor if the actual number of unreliable storage locations exceeds the acceptable number of unreliable storage locations, and if the thermal environment is acceptable.

Abstract: A method includes retrieving a group test parameter determined based on test results associated with a plurality of integrated circuit devices. A particular integrated circuit device is tested using a test program and the group test parameter.

Abstract: A voltage identifier (VID) sorting system is provided that optimizes processor power and operating voltage guardband at a constant processor frequency. The VID sorting system determines a voltage versus current curve for the processor. The VID sorting system then uses the voltage versus current characteristics to calculate the power for each VID to determine an acceptable range of VIDs within the maximum power criteria. The VID sorting system then tests VIDs in the range and selects a VID from the range to optimize for minimum power and/or maximum voltage guardband at a constant processor frequency.

Abstract: A tester for testing a semiconductor device is disclosed. The tester for testing the semiconductor device employs a data selector for converting a logical test pattern data transmitted from a pattern generator into a physical test pattern data and an expected data based on the logical test pattern data, thereby generating various timings based on a time delay instead of using a plurality of clocks to improve a test efficiency and reduce a manufacturing cost.

Abstract: A semiconductor memory device, having a test mode and a normal mode, includes a frequency multiplier and a test command sequence generator. The frequency multiplier receives a test clock signal in the test mode and generates multiple internal test clock signals, each of which has a frequency equal to a frequency of an operation clock signal in the normal mode. The test clock signal has a frequency lower than the frequency of the operation clock signal. The test command sequence generator generates at least one command signal in response to the internal test clock signals in the test mode. The at least one command signal corresponds to at least one operation timing parameter of the semiconductor memory device that is to be measured. The frequency multiplier may include a Phase Locked Loop (PLL) or a Delay Locked Loop (DLL).

Abstract: A method of inspecting an electronic circuit that includes a first integrated circuit and a second integrated circuit formed on a circuit board. The first integrated circuit has a first power source, and an input circuit that has a test signal output section and the second integrated circuit has a second power source and an output circuit that has a signal input section. The method includes steps of: turning on the first and second power sources at prescribed voltage levels; changing voltage level of the first power source; applying a test signal to the signal input section of the second integrated circuit; detecting an output signal of the signal output section of the first integrated circuit; and examining whether there is a sufficient margin in the electronic circuit by comparing the test signal and the output signal.

Abstract: A test circuit arrangement for testing latch units is provided which includes a) a voltage generator configured to adjust a voltage potential difference between a first ground line and a second ground line of the latch units and/or to adjust a voltage potential difference between a first supply voltage line and a second supply voltage line of the latch units; b) combiner configured to combine logical outputs of the latch units; and c) determiner configured to determine the voltage potential difference between the first ground line and the second ground line and/or the voltage potential difference between the first supply voltage line and the second supply voltage line in a state when all of the latch units have identical logical outputs.

Abstract: A Built-In-Self-Test (BIST) state machine providing BIST testing operations associated with a thermal sensor device(s) located in proximity to the circuit(s) to which BIST testing operations are applied, and a design structure including the BIST state machine embodied in a machine readable medium are provided. The thermal sensor device compares the current temperature value sensed to a predetermined temperature threshold and determines whether the predetermined threshold is exceeded. A BIST control element suspends the BIST testing operation in response to meeting or exceeding said predetermined temperature threshold, and initiates resumption of BIST testing operations when the current temperature value normalizes or is reduced. A BIST testing methodology implements steps for mitigating the exceeded temperature threshold condition in response to determining that the predetermined temperature threshold is met or exceeded.

Abstract: A flash memory device is disclosed that comprises memory cells, a sense node connected to a selected bit line, a sense circuit configured to selectively provide a first voltage to a common node in accordance with a voltage level of the sense node, a first register connected to the sense node and the common node and configured to store data in accordance with a voltage level of the common node, a second register configured to store data in accordance with the voltage level of the sense node, a switch configured to provide a second voltage to the second register, and a discharge circuit configured to selectively discharge the sense node in accordance with the data stored in the second register.

Abstract: A timing generator that needs no analog circuit for adding jitters and allows the circuit scale and power consumption to be reduced.

Abstract: Embodiments of apparatuses, methods, and systems for in situ processor margin testing are disclosed. In one embodiment, an apparatus includes virtual machine control logic and operating point control logic. The virtual machine control logic is to transfer control of the apparatus between a virtual machine monitor and a guest. The operating point control logic is to set the operating point of the apparatus in connection with a transfer of control of the apparatus to the virtual machine monitor.

Abstract: An apparatus comprising a comparator circuit, a reference circuit, a plurality of elements and a logic circuit. The comparator circuit may be configured to generate a difference signal in response to (i) a reference signal and (ii) a test signal. The reference circuit configured to generate the reference signal in response to a first control signal. The plurality of elements may each be configured to generate an intermediate test signal. One of the intermediate test signals may be presented as the test signal by activating one of the test elements, in response to a second control signal. The logic circuit may be configured to generate (i) the first control signal and (ii) the second control signal, each in response to the difference signal.

Abstract: Methods and structures for performing field flawscan to reduce manufacturing costs of a dynamic mapped storage device. In a dynamic mapped storage device in which all user supplied logical blocks are dynamically mapped by the storage device controller to physical disk blocks, features and aspects hereof permit flawscan testing of a storage device to be completed substantially concurrently with processing write requests for its intended application. A fraction of the storage device may be certified by an initial flawscan performed during manufacturing testing. Statistical sampling sufficient to assure a high probability of achieving specified capacity may be performed to reduce manufacturing time and costs in testing. Final flawscan of the remainder of the storage locations may be performed substantially concurrently with processing of write requests after the device is installed for its intended application.

Abstract: There is implemented a semiconductor memory tester capable of efficiently conducting a test on a fast memory by programming according to parameters of a device without being attended by complex program handling. The semiconductor memory tester for determining pass/fail on a memory device under test is characterized in comprising a measurement division for comparing an output from the memory device under test with an expected value at timing on the basis of a clock outputted by the memory device under test.

Abstract: A semiconductor integrated circuit device includes a control circuit configured to generate a control code to control a parameter of a predetermined circuit and outputs the control code to the predetermined circuit; and a latch circuit connected with an output of the control circuit to latch the control code in response to a control signal. The latch circuit may be provided between the control circuit and the predetermined circuit to latch the control code or transfer the control code to the predetermined circuit, in response to the control signal.

Abstract: A method and an apparatus for allocating configuration inputs of a microcontroller, the apparatus being embodied in such a way that at each configuration input, one signal state of at least two possible signal states is to be set, wherein there is connected to each configuration input one respective energy source that can assume at least two states, in order to set the at least two signal states at each configuration input, a setting arrangement being provided with which the states of each energy source are controlled in such a way that the predefined signal state exists for each configuration input.

Abstract: A circuit for a multi-channel add-compare-select unit is disclosed. The circuit includes a compare unit and a datapath. The datapath is coupled to the compare unit, and includes a number of adder units, a selection unit (which is coupled to the adder units), and a number of clocked storage stages.

Abstract: Disclosed herein is a semiconductor test apparatus for simultaneously testing a plurality of semiconductor devices. The semiconductor test apparatus includes a plurality of pattern generation boards, a DUT board, a backplane board, and a power supply unit.

Abstract: A semiconductor device for testing a semiconductor process applied to manufacturing the semiconductor device is disclosed. The semiconductor device includes at least a testing group. The testing group includes a first testing block and a second testing block. The first testing block includes: a first input node; a first output node; a plurality of first selecting nodes; a first reference device, coupled to the first input node and the first output node; and a first target device, coupled to the first selecting nodes and the first output node. The second testing block includes: a second input node; a second output node; a plurality of second selecting nodes; a second reference device, coupled to the second input node and the second output node; and a second target device, coupled to the second selecting nodes and the second output node.

Abstract: An integrated circuit is provided with a test circuit element and one or more further circuit elements. The performance of the test circuit element at various settings of a performance controlling parameter is determined. That performance controlling parameter is then applied across the one or more further circuit elements. The integrated circuit may include memory banks and the performance controlling parameter can be sense amplifier timing, delay line length or another parameter such as operating voltage, operating frequency and circuit timing in general.