Layout Editor (with Eco, Reuse, Gui) Patents (Class 716/139)
  • Patent number: 12118283
    Abstract: Methods and systems are described herein relate to automatic channel identification of high-bandwidth memory channels and subchannel generation. An HBM channel identification system may perform a sequence of operations to identify HBM channels within a netlist of an interposer: channel dimension prediction, channel bounding box prediction, channel orientation derivation, subchannel partition, and subchannel routing region creation. In one example, an HBM channel identification method includes identifying candidate nets within a netlist. A bounding box that includes one or more nets of the candidate nets is determined. Once the bounding box is determined, the orientation of the box is determined and used to determine a pattern of bumps within the bounding box. Finally, a subchannel is generated based on the pattern of bumps.
    Type: Grant
    Filed: October 10, 2023
    Date of Patent: October 15, 2024
    Assignee: Synopsys, Inc.
    Inventors: Xun Liu, Gary K. Yeap
  • Patent number: 12085904
    Abstract: An engineering device, which is configured to set a higher-level control device capable of controlling a control device for one or more industrial machines, the engineering device including circuitry configured to: receive specification of a register number of the higher-level control device; determine, based on the specified register number, a register range to be used for control of the control device by the higher-level control device; and allocate the determined register range among registers of the higher-level control device, for the control of the control device.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: September 10, 2024
    Assignee: KABUSHIKI KAISHA YASKAWA DENKI
    Inventors: Hajime Kimura, Seishiro Sakaguchi, Hiromasa Shimizu
  • Patent number: 12080637
    Abstract: A through-hole electrode substrate includes a substrate including a through-hole extending from a first aperture of a first surface to a second aperture of a second surface, an area of the second aperture being larger than that of the first aperture, the through-hole having a minimum aperture part between the first aperture and the second aperture, wherein an area of the minimum aperture part in a planer view is smallest among a plurality of areas of the through-hole in a planer view, a filler arranged within the through-hole, and at least one gas discharge member contacting the filler exposed to one of the first surface and the second surface.
    Type: Grant
    Filed: April 21, 2022
    Date of Patent: September 3, 2024
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Satoru Kuramochi, Sumio Koiwa, Hidenori Yoshioka
  • Patent number: 12073166
    Abstract: A method that includes receiving an integrated circuit (IC) design layout including a layout block, where the layout block has a corner, adding first patterns along a first edge of the corner, adding second patterns along a second edge of the corner, moving a first column of the first patterns closest to the second edge horizontally toward the second edge, moving a second column of second patterns closest to the second edge horizontally toward the second edge, extending lengths of the first and second patterns in the first and second columns, and outputting a pattern layout in a computer-readable format, where the pattern layout includes the first patterns and the second patterns.
    Type: Grant
    Filed: December 30, 2021
    Date of Patent: August 27, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yung Feng Chang, Pi-Yun Sun, Tung-Heng Hsieh, Yu-Jung Chang, Bao-Ru Young
  • Patent number: 12050843
    Abstract: In certain embodiments, a selection of a first point and a second point within an infrastructure may be obtained via a user interface. A plurality of pathways, including a plurality of cable trays, between the first point and the second point may be determined. A first set of cable trays, having weights that do not exceed weight thresholds, may be identified. Images of the first set of cable trays may be obtained from a plurality of image sensors within the infrastructure. Fullness levels of the first set of cable trays may be determined based on the images. A second set of cable trays, having fullness levels that do not exceed fullness thresholds, may be identified from the first set of cable trays. One or more recommended pathways between the first point and the second point may be determined based on the identified second set of cable trays.
    Type: Grant
    Filed: July 3, 2023
    Date of Patent: July 30, 2024
    Assignee: CyberSecure IPS, LLC
    Inventors: Bobby Nakanelua, Scott Rye, Stephen Sohn
  • Patent number: 12046578
    Abstract: A smart network interface controller (NIC) implemented using a stacked die configuration is provided. The NIC may include user-customizable networking circuits formed in a top programmable die and primitive network function blocks formed in a bottom application-specific integrated circuit (ASIC) die. The top programmable die may provide a flexible packet processing pipeline to facilitate efficient control and data communication between the user-customizable networking circuits and the primitive network function blocks. The bottom ASIC die may also include an array of memory blocks operable as lookup tables and intermediate buffers for other network processing circuitry in the NIC. A NIC configured in this way provides both performance, power, and area benefits and superior customer configurability.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: July 23, 2024
    Assignee: Intel Corporation
    Inventors: Naveed Zaman, Aravind Dasu, Sreedhar Ravipalli, Rakesh Cheerla, Martin Horne
  • Patent number: 12046068
    Abstract: A method includes transmitting a request for a computer-readable routing diagram, such as a wiring diagram, a pneumatic or hydraulic line diagram, or an optical cable diagram. The method also includes receiving, in response to the request, a routing diagram including a connectable component and at least a portion of a routing set. The connectable component is associated with both a connectable component identifier and the routing set. The routing set contains one or more routable components, such as electrical circuits, pneumatic or hydraulic lines, or optical cables. Further, the method includes displaying, on a display, the routing diagram and at least the portion of the routing set highlighted. Displaying at least the portion of the routing set highlighted occurs in response to an occurrence of the connectable component being selected from the routing diagram displayed on the display or in response to the request including the connectable component identifier.
    Type: Grant
    Filed: July 2, 2019
    Date of Patent: July 23, 2024
    Assignee: Snap-on Incorporated
    Inventors: Michel B. Alberry, Lester B. Johnson, Michael S. Knize, John P. McGraw, Robert Pilz, Thomas A. Southward, Thomas W. Tipps, Eric J. Wade, Patrick S. Merg, Roy Steven Brozovich, Todd Mercer
  • Patent number: 12034279
    Abstract: A power conversion apparatus includes M first slots, wherein each of M first slots is electrically connected to an input side of one of N first bus bars, and a respective first slot of the M first slots is electrically connected to a first module that can supply an alternating current or a direct current to the first bus bar electrically connected to the first slot. The apparatus further includes P second slots, wherein each of the P second slots is electrically connected between an output side of one of the N first bus bars and an input side of one of second bus bars, and a respective second slot of the P second slots is electrically connected to a second module that converts an alternating current into a direct current or that converts a direct current into a direct current.
    Type: Grant
    Filed: August 18, 2021
    Date of Patent: July 9, 2024
    Assignee: Huawei Digital Power Technologies Co., Ltd.
    Inventors: Cheng Ma, Xiaoke Ran, Hongbing Wang, Wei Guo
  • Patent number: 12026053
    Abstract: An inter-die double data rate (DDR) data transfer scheme is provided. In particular, the data transfer scheme utilizes an error correction code (ECC) encoding scheme that exploits the DDR property that a single microbump defect can only yield four possible error scenarios. A specialized single error correcting, double error detecting, and double adjacent error correcting (SEC-DED-DAEC) encoding scheme that imposes at least four parity check matrix constraints may be used. Configured and operated in this way, a fewer number of parity check bits are required to detect data bit errors associated with a single defective microbump.
    Type: Grant
    Filed: July 20, 2023
    Date of Patent: July 2, 2024
    Assignee: Intel Corporation
    Inventors: Hwa Chaw Law, Kiun Kiet Jong
  • Patent number: 11983550
    Abstract: Disclosed are techniques to facilitate Customer Relationship Management (CRM) data utilization and display to suit organizational and team goals, methods, requirements, and more. A system can include a CRM page building engine, a layout building engine, a rendering engine, a request handing engine, a CRM datastore, a component datastore, and a layout datastore. For example, a design system can be implemented as a no-code builder that facilitates creation through a drag-and-drop interface, which is intuitive and user-friendly.
    Type: Grant
    Filed: November 17, 2022
    Date of Patent: May 14, 2024
    Assignee: ZOHO CORPORATION PRIVATE LIMITED
    Inventors: Muthuraja Sangilimuthu, Tamilarasan Selvaraj, Vijay Sekar, Senthilkumar Subramanian, Selvabharathy, Kowsik Samynathan, Gobinath Selvam
  • Patent number: 11979004
    Abstract: The present invention proposes a production support method and system for power control panel production automation, which enable an intention of a designer to be sufficiently reflected on a production site and an error occurred during production to be minimized and, in particular, includes the steps of: realizing, in a virtual environment, a power control panel designed in a 3D type and verifying an error by simulating wiring path information of designed components and electronic units; extracting production data for each process, including component information for each process, component and electronic unit arrangement information, assembly process information, and wiring information, by collecting information distributed to support production automation of the power control panel designed in the 3D type, which has been verified; and automating production by applying the production data to each interworking production facility to support the production automation of the power control panel.
    Type: Grant
    Filed: March 15, 2021
    Date of Patent: May 7, 2024
    Assignee: END ELECTRIC CO., LTD.
    Inventor: Jun Ho Lee
  • Patent number: 11947771
    Abstract: A client computing system (CCS) receives a download including (i) an image representative of at least one circuit in a vehicle, the at least one circuit including a first circuit configured for carrying a first signal within the vehicle, and (ii) symbol data associated with at least one symbol, the at least one symbol including a first symbol. After receiving the download, the CCS displays the image and the at least one symbol. The CCS then receives a first input corresponding to selection of the first symbol. The CCS then responsively receives, from the vehicle, data representing value(s) of the first signal. The CCS then determines a first display-location at which to display the data representing the value(s) of the first signal. While the image and the at least one symbol are displayed, the CCS then displays, at the first display-location, the data representing the value(s) of the first signal.
    Type: Grant
    Filed: May 3, 2021
    Date of Patent: April 2, 2024
    Assignee: Snap-on Incorporated
    Inventors: Patrick S. Merg, Todd Mercer, Roy Steven Brozovich, David Costantino
  • Patent number: 11928045
    Abstract: The present disclosure relates to a method for use with an electronic design. Embodiments may include simulating a processor model and a hardware model, each executed with a corresponding simulator thread on a simulation platform. Embodiments may also include simulating embedded software using the processor model. The simulating may include updating a given register of the processor model that stores a value that changes in response to switching between processes within the embedded software. Embodiments may further include setting a simulator breakpoint and a software breakpoint and enabling debugging of both non-virtual and virtual addresses at the software breakpoint without leaving the software breakpoint.
    Type: Grant
    Filed: April 21, 2021
    Date of Patent: March 12, 2024
    Assignee: Cadence Design Systems, Inc.
    Inventors: Bishnupriya Bhattacharya, Andrew Robert Wilmot, Zhiting Duan, Neeti Khullar Bhatnagar
  • Patent number: 11867419
    Abstract: A controller for a plurality of interconnected devices in a system is shown. The controller includes a processing circuit configured to detect that a first device of the plurality of interconnected devices is unavailable and identify a second device of the plurality of interconnected devices schematically dependent upon the first device by conducting a graph theory analysis on schematic relationships indicating connections among the plurality of interconnected devices. The processing circuit is further configured to, in response to identifying the second device schematically dependent upon the first device, generate a reduced subset of the plurality of interconnected devices that excludes the second device. The processing circuit is further configured to operate the reduced subset to transfer one or more resources among the reduced subset via the connections.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: January 9, 2024
    Assignee: JOHNSON CONTROLS TECHNOLOGY COMPANY
    Inventors: Matthew J. Asmus, Maxwell J. Neuman
  • Patent number: 11853680
    Abstract: The present disclosure relates to a chip design layout process. More specifically, the present disclosure is directed to an incremental routing-based pin assignment technique. One example method generally includes: performing routing and pin assignment for a chip design layout, one or more objects of the chip design layout being associated with a routing engine and a pin assignment engine stored in memory; detecting a change associated with the one or more objects of the chip design layout; updating, via one or more processors, at least one of the routing engine or the pin assignment engine stored in the memory in response to the detected change and based on the association between the one or more objects and the routing engine or pin assignment engine; and performing another routing and pin assignment based on the updated at least one of the routing engine or the pin assignment engine.
    Type: Grant
    Filed: July 2, 2021
    Date of Patent: December 26, 2023
    Assignee: Synopsys, Inc.
    Inventor: Zhengtao Yu
  • Patent number: 11853671
    Abstract: Vacant areas of a layer of an integrated circuit design are filled with shapes connected to the appropriate nets.
    Type: Grant
    Filed: June 8, 2021
    Date of Patent: December 26, 2023
    Assignee: Pulsic Limited
    Inventor: Graham Balsdon
  • Patent number: 11853679
    Abstract: A method includes reserving a routing track within a cell, wherein the cell comprises signal lines for connection to elements within the cell, the cell further comprises a plurality of routing tracks, the reserved routing track is one of the plurality of routing tracks, and the reserved routing track is free of the signal lines. The method further includes determining whether any power rails overlap with any of the plurality of routing tracks other than the reserved routing track. The method further includes adjusting a position of the cell in response to a determination that at least one power rail overlaps with at least one routing track of the plurality of routing tracks other than the reserved routing track.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jian-Sing Li, Jung-Chan Yang, Ting Yu Chen, Ting-Wei Chiang
  • Patent number: 11853675
    Abstract: A method is provided and includes several operations: arranging multiple channels extending in a first direction; arranging, in accordance with multiple weights of multiple macros, a first portion of the macro closer to a centroid of a core region of an integrated circuit than a second portion of the macros; and arranging the macros on opposite sides of the channels. The macros have multiple pins coupled to the channels interposed between the macros.
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: December 26, 2023
    Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., TSMC NANJING COMPANY LIMITED
    Inventors: Yi-Lin Chuang, Shi-Wen Tan, Song Liu, Shih-Yao Lin, Wen-Yuan Fang
  • Patent number: 11816405
    Abstract: Implementations of a method of designing a module semiconductor product may include receiving a selection of a module type, one or more die, a placement of one or more wires, clips, or pins; and generating, using a processor, a module configuration file. The method may include generating a module bonding diagram using a build diagram system module; selecting one or more SPICE models corresponding with the die; and generating a product SPICE model and a three dimensional model for the module semiconductor product. The method may include generating one or more datasheet characteristics of the module semiconductor product with at least the product SPICE model and the product simulation module, generating a product datasheet for the module semiconductor product using the datasheet formation module, and providing access to at least the module bonding diagram, the product SPICE model, the three dimensional model, and the product datasheet to the user.
    Type: Grant
    Filed: September 7, 2022
    Date of Patent: November 14, 2023
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: James Joseph Victory, Klaus Neumaier, YunPeng Xiao, Jonathan Harper, Vaclav Valenta, Stanley Benczkowski, Thierry Bordignon, Wai Lun Chu
  • Patent number: 11803687
    Abstract: Various embodiments provide for a cross-section parameterized cell, which can enable a user to visualize and interactively define or modify one or more wire instances and related elements/structure of a circuit design from an elevation view (or a side view).
    Type: Grant
    Filed: January 11, 2022
    Date of Patent: October 31, 2023
    Assignee: Cadence Design Systems, Inc.
    Inventors: Peter Herth, Thomas Burdick
  • Patent number: 11764739
    Abstract: In a radio frequency power amplifier with harmonic suppression, one end of an input matching circuit is connected with a radio frequency input end; and another end is connected with a base of a power amplification transistor having a collector connected with a power supply voltage through a first matching branch, and an emitter connected with a first connection point on a package substrate. The collector of the power amplification transistor is connected with a radio frequency output end through a second matching branch that is connected with the package substrate. A harmonic control circuit has a first end connected with the collector of the power amplification transistor, and a second end connected with a second connection point on the package substrate.
    Type: Grant
    Filed: December 27, 2020
    Date of Patent: September 19, 2023
    Assignee: SMARTER MICROELECTRONICS (GUANG ZHOU) CO., LTD.
    Inventors: Zhenfei Peng, Qiang Su
  • Patent number: 11748538
    Abstract: An automated analog layout tool creates not just one, but many electrically correct layouts from an input schematic. Designers can explore multiple layout options in a fraction of the time needed to produce just a single layout by hand. Because the tool produces layout results so quickly, parasitics are available for simulation early in the design process, further speeding the entire design cycle. The tool considers place and route concurrently.
    Type: Grant
    Filed: March 22, 2022
    Date of Patent: September 5, 2023
    Assignee: Pulsic Limited
    Inventors: Paul Clewes, Liang Gao, Jonathan Longrigg
  • Patent number: 11714942
    Abstract: A method to store the shapes of an electrical circuit design in a hierarchical set of arrays that inverts the layout size order by area includes defining a plurality of storage levels. Each level corresponds to a two-dimensional projection of the three-dimensional volume of the circuit layout. Accordingly, each level subsumes the entire physical space of the circuit layout. Each level may include a respective grid of slots. The slots may be rectangular. Each slot within any single level may be the same size and dimensions as every other slot in this level. Shapes are added to this storage technique based upon size, not based upon physical layer. Each slot can contain shapes from any physical layer as long as that shape fits entirely within the slot.
    Type: Grant
    Filed: August 18, 2021
    Date of Patent: August 1, 2023
    Assignee: FRONTIER DESIGN AUTOMATION, LLC
    Inventors: John Cooper, Edward Gernert
  • Patent number: 11714948
    Abstract: The present disclosure relates to a system and method for use in an electronic circuit design. Embodiments may include receiving, using a processor, one or more DFM rules files from at least one PCB fabricator and importing the one or more DFM rules files to a DFM rule aggregator database. Embodiments may also include grouping one or more rules associated with the one or more DFM rules files using an automated or manual operation. Embodiments may further include performing automatic or manual rule aggregation on the grouped rules based upon, at least in part, rules aggregation information including a DFM template file.
    Type: Grant
    Filed: January 28, 2021
    Date of Patent: August 1, 2023
    Assignee: Cadence Design Systems, Inc.
    Inventors: Utpal Bhattacharyya, Randall Scott Lawson, Edward Brian Acheson, Amit Sharma
  • Patent number: 11709767
    Abstract: A method and an apparatus for verifying an operation state of an application are provided. The method can include setting target verification operation information according to an operation verification item of an application to be verified; setting a verification process instruction for the target verification operation information; encapsulating the verification operation information and the verification process instruction as fault injection data, and sending the fault injection data to a data input port of the application to be verified; matching the process feedback information with the verification process instruction in response to receiving the process feedback information corresponding to the fault injection data, and determining executed target verification operation information.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: July 25, 2023
    Assignee: BEIJING BAIDU NETCOM SCIENCE AND TECHNOLOGY CO., LTD.
    Inventor: Hua Chen
  • Patent number: 11699016
    Abstract: A system and a method are disclosed for placing hardware components on a printed circuit board (“PCB”) in a way that enables all hardware components on the PCB to be passively cooled without using active cooling systems. Components are selected to be placed onto the PCB and heat metrics for each component is obtained (e.g., from a server). The components are ranked based on the amount of heat that each component generates. A corresponding position for each of the hardware components is determined based on the ranking of the components and the orientation of the PCB. The placement is based on the concept that air having higher temperature rises while air having cooler temperature falls. A representation of the PCB according to corresponding positions of the hardware components may be generated for display.
    Type: Grant
    Filed: April 21, 2022
    Date of Patent: July 11, 2023
    Assignee: Goldman Sachs & Co. LLC
    Inventor: Michael Mattioli
  • Patent number: 11693997
    Abstract: In certain embodiments, a selection of a first point and a second point within an infrastructure may be obtained via a user interface. A plurality of pathways, including a plurality of cable trays, between the first point and the second point may be determined. A first set of cable trays, having weights that do not exceed weight thresholds, may be identified. Images of the first set of cable trays may be obtained from a plurality of image sensors within the infrastructure. Fullness levels of the first set of cable trays may be determined based on the images. A second set of cable trays, having fullness levels that do not exceed fullness thresholds, may be identified from the first set of cable trays. One or more recommended pathways between the first point and the second point may be determined based on the identified second set of cable trays.
    Type: Grant
    Filed: October 3, 2022
    Date of Patent: July 4, 2023
    Assignee: CyberSecure IPS, LLC
    Inventors: Bobby Nakanelua, Scott Rye, Stephen Sohn
  • Patent number: 11675948
    Abstract: Methods and apparatus for performing profile-guided optimization of integrated circuit hardware are provided. Circuit design tools may receive a source code and compile the source code to generate a hardware description. The hardware description may include profiling blocks configured to measure useful information required for optimization. The hardware description may then be simulated to gather profiling data. The circuit design tools may then analyze the gathered profiling data to identify additional opportunities for hardware optimization. The source code may then be modified based on the analysis of the profiling data to produce a smaller and faster hardware that is better suited to the application.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: June 13, 2023
    Assignee: Intel Corporation
    Inventors: Byron Sinclair, John Freeman
  • Patent number: 11675631
    Abstract: In an approach for balancing mainframe and distributed workloads, a processor receives a request to allocate an application workload to a mainframe platform and a distributed computing platform. The application workload includes a plurality of work units. A processor collects performance and cost data associated with the application workload, the mainframe platform, and the distributed computing platform. A processor determines the mainframe platform and the distributed computing platform for the plurality of work units of the application workload, based on the analysis of the performance and cost data. A processor allocates the plurality of work units of the application workload to run on the mainframe platform and the distributed computing platform respectively to balance performance and cost in real time.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: June 13, 2023
    Assignee: Kyndryl, Inc.
    Inventors: Allan Douglas Moreira Martins, Tiago Battiva Ferreira, Jose Gilberto Biondo Junior, Tiago Dias Generoso, Robert Justiniano Ferreira
  • Patent number: 11662664
    Abstract: A method of fabricating a circuit element, such as a quantum computing circuit element, including obtaining a lithography mask write file that includes mask information characterizing one or more mask features, obtaining a uniformity function that is configured to modify the mask information to compensate for a non-uniform deposition process, applying the uniformity function to the lithography mask write to obtain a modified lithography mask write file, and performing lithography as directed by the modified lithography mask write file.
    Type: Grant
    Filed: July 1, 2022
    Date of Patent: May 30, 2023
    Assignee: Google LLC
    Inventors: Brian James Burkett, Rami Barends
  • Patent number: 11651194
    Abstract: A graph neural network to predict net parasitics and device parameters by transforming circuit schematics into heterogeneous graphs and performing predictions on the graphs. The system may achieve an improved prediction rate and reduce simulation errors.
    Type: Grant
    Filed: April 27, 2020
    Date of Patent: May 16, 2023
    Assignee: NVIDIA Corp.
    Inventors: Haoxing Ren, George Kokai, Ting Ku, Walker Joseph Turner
  • Patent number: 11615226
    Abstract: A recording medium includes simulation data input into a computing device executing a simulation of a semiconductor device, wherein the simulation data includes part shape information describing a shape of a part included in a simulation target circuit, model information describing operation and connection information of the simulation target circuit, and symbol information of the part included in the simulation target circuit, and the computing device causes the part shape information, the model information, and the symbol information to correspond to each other to execute the simulation of the semiconductor device.
    Type: Grant
    Filed: September 11, 2020
    Date of Patent: March 28, 2023
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventors: Hitoshi Imi, Motochika Okano, Yoshinori Fukuba
  • Patent number: 11609938
    Abstract: A system for element tracking in documents includes a memory device, a database, and a processor. The memory device is configured to store a mapping in a memory between a linked element within a document and a database object. The database is configured to store the database object. The processor is configured to in response to an update of the database object: a) cause storage in the database of an update event associated with the linked element; and b) provide an update indication that the update associated with the linked element has occurred.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: March 21, 2023
    Assignee: Workday, Inc.
    Inventors: Jay Schultz, Brian Lee Harper, Sayan Chakraborty, Andrew Kershaw, James Casey, Josh Lannin, Rhett DeWall
  • Patent number: 11586791
    Abstract: Approaches for visualizing data buses in a circuit design include determining ones of the data buses that satisfy selection criteria. For each element connected to a data bus of the ones of the data buses, a method and system determine whether the element is of interest or the element is not of interest. A graphical representation of the ones of the data buses and each element of interest is generated, and data buses of the circuit design determined to not satisfy the selection criteria and elements not of interest are excluded from the graphical representation. The graphical representation is displayed on a display device.
    Type: Grant
    Filed: September 21, 2021
    Date of Patent: February 21, 2023
    Assignee: XILINX, INC.
    Inventors: Anup Hosangadi, Aman Gayasen, Srinivasan Dasasathyan, Padmini Gopalakrishnan
  • Patent number: 11588801
    Abstract: Various embodiments provide for a pre-validation of various aspects of an application deployment before any resources are provisioned in a user account. Pre-validation can perform checks on aspects such as connectivity and credential-based access for instances to be provisioned in a user account. These checks can be performed through an application wizard or deployment service that can collect information though a single console, and can ensure that these checks succeed before the requested instances are provisioned in the user account.
    Type: Grant
    Filed: March 12, 2020
    Date of Patent: February 21, 2023
    Assignee: Amazon Technologies, Inc.
    Inventors: Savita Ganeshomal Manghnani, Ajay Narang, Gaurav Khanna, Pallavi Sharma
  • Patent number: 11573776
    Abstract: Data transformation in a distributed system of applications and data repositories is described. The subsystems for the overall framework are distributed, thereby allowing for customization to require only isolated changes to one or more subsystems. In one embodiment, a source code repository is used to receive and store source code. A build subsystem can retrieve source code from the source code repository and build it, using one or more criteria. By building the source code, the build subsystem can generate an artifact, which is executable code, such as a JAR or SQL file. Likewise, by building the source code, the build subsystem can generate one or more job specifications for executing the executable code. In one embodiment, the artifact and job specification may be used to launch an application server in a cluster. The application server can then receive data transformation instructions and execute the data transformation instructions.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: February 7, 2023
    Assignee: PALANTIR TECHNOLOGIES INC.
    Inventors: Robert Fink, Matthew Cheah, Mingyu Kim, Lynn Cuthriell, Divyanshu Arora, Justin Uang, Jared Newman, Jakob Juelich, Kevin Chen, Mark Elliot, Michael Nazario
  • Patent number: 11568119
    Abstract: A device is disclosed. The cell block includes a pin disposed at a Nth metal layer in a cell layout. The first metal interconnect is disposed at a (N+1)th metal layer above the Nth metal layer and stacked over the pin, and electrically coupled to the pin. The second interconnects are disposed at a (N+2)th metal layer and stacked over the first metal interconnect, and parallel to each other. The second metal interconnects are electrically coupled to the first metal interconnect, and forming an equivalent tapping point of the pin of the cell block. The equivalent tapping point and the pin are vertically overlapped with each other, and fabrication of the device is initiated after a DRC or a SEM simulation test is passed. A first via connects the first metal interconnect to the pin, and the at least one first metal interconnect is perpendicular to the pin.
    Type: Grant
    Filed: January 17, 2021
    Date of Patent: January 31, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yi-Lin Chuang, Huang-Yu Chen, Yun-Han Lee
  • Patent number: 11526335
    Abstract: A digital engineering (DE) platform configured to support space system development and acquisition. The DE platform includes a modular reference architecture models module configured to capture key modular system elements of interest using model-based system engineering (MBSE) and digital object oriented requirements system (DOORS) tools. The DE platform also includes a connectivity matrix module defining interface or specifications between one or more modular system elements. The DE platform is also configured to digitize the interface using a behavior model. The behavior model capturing required activity and/or sequence for a particular use case.
    Type: Grant
    Filed: February 11, 2021
    Date of Patent: December 13, 2022
    Assignee: THE AEROSPACE CORPORATION
    Inventors: Tien M. Nguyen, Andrew T. Guillen, Anh X. Dang, Thomas O. Freeze, Jake T. Singh, Alexander K. Chang, Faisal M. Zahidi, Hung H. Nguyen, Jonathan H. Lee, Vahe Y. Avedissian
  • Patent number: 11488335
    Abstract: A drawing management apparatus of the present disclosure includes a processor that generates a virtual plant based on various types of drawings of a plant, updates the virtual plant, when a change is made to a drawing among the various types of drawings, based on the change, and notifies a predetermined recipient, via a communication interface, of information related to a change made to the virtual plant by updating.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: November 1, 2022
    Assignee: YOKOGAWA ELECTRIC CORPORATION
    Inventors: Takahiro Kambe, Tatenobu Seki, Nobuaki Ema, Masato Annen
  • Patent number: 11449654
    Abstract: Embodiments include herein are directed towards a method for use in an electronic design environment is provided. Embodiments may include receiving, at a client electronic device, an image of an electronic circuit and storing an electronic circuit design file. Embodiments may further include identifying the electronic circuit design file based upon, at least in part, the image of the electronic circuit. Embodiments may also include displaying a graphical representation of the electronic circuit at a display screen associated with the client electronic device.
    Type: Grant
    Filed: January 11, 2021
    Date of Patent: September 20, 2022
    Assignee: Cadence Design Systems, Inc.
    Inventors: Nicholas Claude Warren, Matthew Noseworthy, Liam Cadigan, Darryl Frank Day, Mihir Milan Shah
  • Patent number: 11373027
    Abstract: The present disclosure relates to a method for use with an electronic design. Embodiments may include receiving, at a graphical user interface, an indication of a desired wire creation associated with an electronic design and determining a plurality of routing solutions, based upon, at least in part, the desired wire creation. Embodiments may further include simultaneously displaying the plurality of routing solutions at the graphical user interface, wherein a predicted preferred routing solution is graphically emphasized. Embodiments may also include receiving a selection from a user, at the graphical user interface, of one of the plurality of routing solutions and storing the selection for subsequent use.
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: June 28, 2022
    Assignee: Cadence Design Systems, Inc.
    Inventor: Laurent Rene Saint-Marcel
  • Patent number: 11361142
    Abstract: A computing system can implement a circuit verification tool to perform scaled sampling of parameter values in a foundry model describing parameter variations for a manufacturing process capable of fabricating an integrated circuit described in a circuit design. The computing system can simulate the circuit design with the scaled samples of the parameter values, and build a geometric model to describe a response of the circuit design to the scaled samples of the parameter values during the simulation. The geometric model can include one or more failure regions corresponding to geometric descriptions for failures of the circuit design to meet a specification during simulation with the scaled samples of the parameter values. The computing system can estimate a yield for an output of the integrated circuit described by the circuit design based on the failure regions in the geometric model.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: June 14, 2022
    Assignee: Siemens Industry Software Inc.
    Inventor: Joel Cooper
  • Patent number: 11341307
    Abstract: A system and a method are disclosed for placing hardware components on a printed circuit board (“PCB”) in a way that enables all hardware components on the PCB to be passively cooled without using active cooling systems. Components are selected to be placed onto the PCB and heat metrics for each component is obtained (e.g., from a server). The components are ranked based on the amount of heat that each component generates. A corresponding position for each of the hardware components is determined based on the ranking of the components and the orientation of the PCB. The placement is based on the concept that air having higher temperature rises while air having cooler temperature falls. A representation of the PCB according to corresponding positions of the hardware components may be generated for display.
    Type: Grant
    Filed: October 22, 2020
    Date of Patent: May 24, 2022
    Assignee: Goldman Sachs & Co. LLC
    Inventor: Michael Mattioli
  • Patent number: 11281828
    Abstract: An automated analog layout tool creates not just one, but many electrically correct layouts from an input schematic. Designers can explore multiple layout options in a fraction of the time needed to produce just a single layout by hand. Because the tool produces layout results so quickly, parasitics are available for simulation early in the design process, further speeding the entire design cycle. The tool considers place and route concurrently.
    Type: Grant
    Filed: September 22, 2020
    Date of Patent: March 22, 2022
    Assignee: Pulsic Limited
    Inventors: Paul Clewes, Liang Gao, Jonathan Longrigg
  • Patent number: 11270050
    Abstract: The present disclosure relates to a method for use with an electronic design. Embodiments may include displaying, at a graphical user interface, at least a portion of the electronic design and receiving a selection of a subcircuit at a first position of the graphical user interface. In response to a user input, embodiments may include transitioning the subcircuit from the first position to a second position of the graphical user interface and determining one or more direct and indirect connections resulting from a potential placement at the second position. Embodiments may include determining an influence metric by applying an optimized connectivity rules definition upon the potential placement at the second position and the one or more direct and indirect connections. Embodiments may also include displaying feedback at the graphical user interface based upon, at least in part, the influence metric.
    Type: Grant
    Filed: April 16, 2021
    Date of Patent: March 8, 2022
    Assignee: Cadence Design Systems, Inc.
    Inventors: Hitesh Mohan Kumar, Anuj Jain, Sahil Vij, Abhimanyu Bhowmik, Rahul Kumar
  • Patent number: 11112970
    Abstract: In some embodiments, a logging framework reserves space in an in-memory storage for a log entry upon receiving a first function call from an application being executed. Upon receiving a second function call from the application being executed, the framework writes the log entry in the space in the in-memory storage. Upon receiving a third function call from the application being executed, the framework selects a configuration for the application and comparing an indicator that is generated based on the executing of the application to the configuration. When the indicator meets a condition of the configuration, the framework copies the log entry from the space in the in-memory storage to a persistent storage space. The log entry is deleted from the space in the in-memory storage at a time after performing the comparing.
    Type: Grant
    Filed: June 12, 2017
    Date of Patent: September 7, 2021
    Assignee: SAP SE
    Inventor: Christian Martick
  • Patent number: 11099724
    Abstract: A medical imaging system (100) includes a user interface (110) and a magnifying view engine (130). The user interface displays a view of a medical image on a display device (114) and to provide a moveable indicator (116) identifying a moveable point positioned in the displayed medical image. The magnifying view engine (130) generates a localized enlargement of a region of interest within the displayed medical image in response to selection of an existing end point or an existing contour in the displayed medical image according to a first input by one or more input devices and indicated by a current position of the moveable indicator.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: August 24, 2021
    Assignee: KONINKLIJKE PHILIPS N.V.
    Inventors: Merlijn Sevenster, Thomas Andre Forsberg
  • Patent number: 11100271
    Abstract: Seamless transitions between routing modes are provided via providing a cursor in association with a design layout; in response to receiving a follow-the-cursor (FTC) command at a first position in the design layout, create a first trace in the design layout where the cursor is displayed; in response to receiving a start command for point-to-point routing at a second position in the design layout: complete the first trace at the second position; and provide an indicator at the second position; in response to receiving an end command for point-to-point routing at a third position in the design layout: create a second trace in the design layout where the cursor is displayed; and create a third trace in the design layout, wherein the third trace is routed from the first trace to the second trace.
    Type: Grant
    Filed: September 18, 2020
    Date of Patent: August 24, 2021
    Assignee: Synopsys, Inc.
    Inventors: Mysore Sriram, Praveeen Yadav, Philippe Aubert McComber
  • Patent number: 11092990
    Abstract: An apparatus including semiconductor dies in a stack. The semiconductor dies are configured to power-up in a staggered manner. Methods for powering up an electronic device include detecting a power-up event with the semiconductor dies in the stack, and responsive to the power-up event, powering up a first semiconductor die in the stack at a first time, and powering up a second semiconductor die in the stack at a second time that is different from the first time.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: August 17, 2021
    Assignee: Micron Technology, Inc.
    Inventor: Trismardawi Tanadi
  • Patent number: 11074390
    Abstract: A method includes reserving a routing track within a cell, the cell includes signal lines for connection to elements within the cell, the cell further includes a plurality of routing tracks, the reserved routing track is one of the plurality of routing tracks, and the reserved routing track is free of the signal lines. The method includes placing the cell in a chip-level layout, wherein the chip-level layout includes a plurality of power rails. The method includes determining whether any of the plurality of power rails overlaps with any of the plurality of routing tracks other than the reserved routing track. The method includes adjusting a position of the cell in the chip-level layout in response to a determination that at least one power rail of the plurality of power rails overlaps with at least one routing track of the plurality of routing tracks other than the reserved routing track.
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: July 27, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chien-Hsing Li, Ting-Wei Chiang, Jung-Chan Yang, Ting Yu Chen