With Substrate Carrier (e.g., Thin Film) Patents (Class 73/204.26)
  • Patent number: 10508941
    Abstract: The invention relates to a flow sensor (1), comprising: a semiconductor module (2) on which a temperature sensing means (13a, 13b) and a heat source (12) are arranged, a flow channel (6) for guiding the fluid medium in a flow direction (D), and a wall (W) delimiting the flow channel, wherein said heat source (12) and said temperature sensing means (13a, 13b) are configured such that they are in thermal contact with said wall (W). According to the invention, said wall (W) comprises a glass member (4) and a metal member (3a), wherein the glass member (4) is connected to the metal member (3a).
    Type: Grant
    Filed: December 27, 2016
    Date of Patent: December 17, 2019
    Assignee: SENSIRION AG
    Inventors: Stefan Kostner, Thomas Kiefer, Lukas Mahler
  • Patent number: 10488237
    Abstract: The invention relates to a measurement apparatus for measuring a flow rate of a fluid that flows with a main direction of flow in a circular line comprising an inlet section for conducting the fluid from the circular line into the measurement apparatus; an outlet section for conducting the fluid from the measurement apparatus into the circular line; a measurement section for connecting the inlet section to the outlet section; at least one ultrasound device for transmitting and/or receiving ultrasound waves, wherein the ultrasound device is arranged at a wall of the measurement section; and an evaluation unit for carrying out a time of flight difference measurement and for determining the flow rate, wherein the inlet section has a first superelliptic transitional shape and the outlet section has a second superelliptic transitional shape and the measurement section has a rectangular form, in particular having rounded corners.
    Type: Grant
    Filed: April 5, 2018
    Date of Patent: November 26, 2019
    Assignee: SICK ENGINEERING GMBH
    Inventors: Eric Starke, Christian Schulz, Mario Künzelmann
  • Patent number: 10429222
    Abstract: Embodiments relate generally to a system comprising a flow sensor assembly. The flow sensor assembly includes a housing defining a flow channel. The flow channel has an inlet serpentine portion fluidly coupled to an inlet port, and an outlet serpentine portion fluidly coupled to an outlet port. The housing further defines a sensor chamber fluidly coupling the inlet serpentine portion to the outlet serpentine portion, where the sensor chamber has a split planar region. The flow sensor assembly further includes a sensor die located proximate to the split planar region and configured to sense a measure related to a flow rate of a fluid.
    Type: Grant
    Filed: December 19, 2016
    Date of Patent: October 1, 2019
    Assignee: Honeywell International Inc.
    Inventors: Jamie Speldrich, Brian Speldrich
  • Patent number: 10371076
    Abstract: The present disclosure provides an intake air flow rate measuring device. The intake air flow rate measuring device includes a flange, a casing, a flow rate sensor, a humidity sensing element, an element terminal, and a humidity terminal. The humidity terminal is spaced away from the element terminal. A portion of the casing between the element terminal and the humidity terminal is defined as a suppressing portion, and a cross-section of the suppressing portion is defined as a suppressing portion cross-section. An end portion of the casing close to the flange is defined as a base portion, and a cross-section of the base portion is defined as a base portion cross-section. The suppressing portion cross-section is set to be smaller than the base portion cross-section.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: August 6, 2019
    Assignee: DENSO CORPORATION
    Inventor: Keisuke Itakura
  • Patent number: 10274353
    Abstract: A flow sensor includes a tube having a tube wall with a window in it. A thermally-conductive base covers the window and has mounted to it a heater and a sensor of a hot film anemometer flow sensor. The base is sealed to the window to resist leakage of fluid from the flow path through the window under normal operating pressures. The hot film anemometer flow sensor is used to measure fluid flow through the tube.
    Type: Grant
    Filed: March 22, 2017
    Date of Patent: April 30, 2019
    Assignee: A. O. SMITH CORPORATION
    Inventors: Matthew W. Critchley, Charles J. Koehler, III
  • Patent number: 10254142
    Abstract: The invention relates to a flow sensor (1) and a method for determining the presence of a gas bubble (G) in a liquid (L) flowing through the flow sensor (1).
    Type: Grant
    Filed: November 9, 2016
    Date of Patent: April 9, 2019
    Assignee: SENSIRION AG
    Inventors: Stefan Kostner, Lukas Mahler, Niculin Saratz
  • Patent number: 10189700
    Abstract: An integrated circuit (IC) chip with a self-contained fluid sensor and method of making the chip. The sensor is in a conduit formed between a semiconductor substrate and a non-conductive cap with fluid entry and exit points through the cap. The conduit may be entirely in the cap, in the substrate or in both. The conduit includes encased temperature sensors at both ends and a central encased heater. The temperature sensors may each include multiple encased diodes and the heater may include multiple encased resistors.
    Type: Grant
    Filed: September 28, 2016
    Date of Patent: January 29, 2019
    Assignee: The United States of America as represented by the Administrator of NASA
    Inventors: George Manos, Manuel A. Balvin, Michael P. Callahan
  • Patent number: 10139256
    Abstract: A MEMS flow sensor is provided having a micro flow channel etched in a silicon structure composed of two silicon substrates bonded or fused together. A heater and one or more temperature sensors are, in one embodiment, disposed around the perimeter of the flow channel and outside of the channel. In another embodiment, a heater and one or more temperature sensors are respectively disposed outside the flow channel at the top and bottom of the channel. In further embodiments, a heater and one or more temperature sensors are located inside the flow channel on one or more surfaces thereof or around the inside perimeter of the channel. The flow sensors in accordance with the invention are preferably fabricated using wafer scale fabrication techniques.
    Type: Grant
    Filed: August 3, 2015
    Date of Patent: November 27, 2018
    Assignee: ACEINNA, INC.
    Inventors: Yang Zhao, Ohlan Silpachai, Francis Man, Zhengxin Zhao
  • Patent number: 10078017
    Abstract: A radio circuit includes an adjustable RF front-end module on an IC die, a liquid MEMS component on a board, and a processing module on the IC die. The adjustable RF front-end module adjusts processing of an inbound or an outbound RF signal based on a compensation control signal. The liquid MEMS component changes an operational characteristic as temperature of the radio circuit varies. The processing module generates the compensation signal based on the changing of the operational characteristic of the liquid MEMS component. The liquid MEMS component includes a channel within the board, a liquid droplet contained within the channel, and one or more conductive elements proximal to the channel.
    Type: Grant
    Filed: July 28, 2015
    Date of Patent: September 18, 2018
    Assignee: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD
    Inventor: Ahmadreza Rofougaran
  • Patent number: 10077186
    Abstract: An integrated circuit (“IC”) package comprising an IC die having a top surface and a bottom surface, an elongate member having opposite first and second end portions and a mid portion. The mid portion is positioned proximate the top surface of the IC die. The IC package also includes an encapsulant block having a top surface, a bottom surface and opposite first and second lateral side surfaces. The encapsulant block encapsulates the IC die and the elongate member. Either or both of the first and second end portions of the elongate member are exposed.
    Type: Grant
    Filed: May 23, 2017
    Date of Patent: September 18, 2018
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Makoto Shibuya, Luu Nguyen, Noboru Nakanishi
  • Patent number: 10073921
    Abstract: A thermal air data (TAD) sensor comprising a heat dissipating plate including a first surface and a second surface, the heat dissipating plate having a temperature maintained at the constant temperature. The heat dissipating plate is configured to be located at a first location with the first surface flush with an exterior surface of a vehicle. A temperature controller is provided to control the temperature of the heat dissipating plate to maintain the constant temperature during flight of the vehicle and is configured to calculate a value of power to maintain the heat dissipating plate at the constant temperature. An ambient air temperature sensor is to be located at a second location flush with the exterior surface of the vehicle and being paired with the first location.
    Type: Grant
    Filed: July 10, 2017
    Date of Patent: September 11, 2018
    Assignee: LOCKHEED MARTIN CORPORATION
    Inventor: Nathan R. Richardson
  • Patent number: 10031003
    Abstract: A method for manufacturing a system in a wafer for measuring an absolute and a relative pressure includes etching a shallow and a deep cavity in the wafer. A top wafer is applied and the top wafer is thinned for forming a first respectively second membrane over the shallow respectively deep cavity, and for forming in the top wafer first respectively second bondpads at the first respectively second membrane resulting in a first respectively second sensor. Back grinding the wafer results in an opened deep cavity and a still closed shallow cavity. The first bondpads of the first sensor measure an absolute pressure and the second bondpads of the second sensor measure a relative pressure. The etching in the first step defines the edges of the first membrane and of the second membrane in respectively the sensors formed from the shallow and the deep cavity.
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: July 24, 2018
    Assignees: MELEXIS TECHNOLOGIES NV, X-FAB SEMICONDUCTOR FOUNDRIES AG
    Inventors: Appolonius Jacobus Van Der Wiel, Uwe Schwarz, Rudi De Winter
  • Patent number: 10012522
    Abstract: A thermal-type flowmeter includes a chip package. The chip package is formed through encapsulation with a resin of a sensor element, a drive circuit, a metal lead frame adapted to have mounted thereon the sensor element and the drive circuit, and a temperature detecting element. The chip package has an exposed structure in which a surface of the sensor element having the diaphragm is exposed. The temperature detecting element is mounted on the lead frame via an electrically conductive member.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: July 3, 2018
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Noboru Tokuyasu, Shinobu Tashiro, Keiji Hanzawa, Takeshi Morino, Ryosuke Doi
  • Patent number: 10006792
    Abstract: There is provided a thermal-type airflow meter that reduces the number of output signals of the sensor circuit and that can suppress the accuracy of flow rate detection from being deteriorated because due to a nonlinear sensor output characteristic and a response delay in the output signal, the output signal shifts toward the positive side or the negative side. A thermal-type airflow meter outputs one or both of a positive-side comparison signal that is at the positive side of a comparison threshold value and a negative-side comparison signal that is at the negative side of the comparison threshold value, outputs a coefficient multiplication signal obtained by multiplying an average signal acquired by averaging the comparison signal by an adjustment coefficient, and outputs, as a flow rate signal, a value obtained by applying the coefficient multiplication signal to increase correction or decrease correction of the amplitude increase signal.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: June 26, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventors: Naoki Morinaga, Masahiro Kawai, Yuji Ariyoshi, Shinichiro Hidaka
  • Patent number: 10001394
    Abstract: A thermal airflow sensor includes a semiconductor device, a protective film a bonding wire, and a resin. The resin covers over a part of the semiconductor device so that the bonding wire is covered with the resin and the region including a thin-wall portion is exposed. The protective film is not covered with the resin and has an outer peripheral edge located outside the thin-wall portion.
    Type: Grant
    Filed: April 24, 2017
    Date of Patent: June 19, 2018
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Ryosuke Doi, Hiroshi Nakano, Keiji Hanzawa
  • Patent number: 9976886
    Abstract: In order to provide a thermal flow meter capable of preventing adherence of contaminants to an air flow sensing portion, the thermal flow meter (300) of the invention includes a bypass passage for flowing a measurement target gas (30) received from a main passage (124) and an air flow sensing portion (602) for measuring a flow rate of the measurement target gas (30) by performing heat transfer with the measurement target gas (30) flowing through the bypass passage through a heat transfer surface (437). The air flow sensing portion (602) is provided to be exposed to an exposed surface (402) arranged along a flow direction of the measurement target gas (30) inside the bypass passage is embedded, the mount support surface (402) has a stage (407) formed to surround a periphery of the air flow sensing portion (602), and an inner portion surrounded by the stage protrudes more than an outer portion of the stage.
    Type: Grant
    Filed: January 29, 2014
    Date of Patent: May 22, 2018
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Noboru Tokuyasu, Shinobu Tashiro, Takeshi Morino, Akira Uenodan
  • Patent number: 9945826
    Abstract: A gas sensor which works according to the principle of thermal conductivity is functionally tested. In the method, a calibration cycle is conducted in which a membrane of the gas sensor is immersed in a fluid calibration medium having a known concentration of a target gas. After the calibration cycle, a measurement chamber of the gas sensor is purged with a purging gas. Then, a measuring cycle is conducted, using a thermal conductivity sensor to measure the target gas in the measurement chamber. Using a calibration baseline established from the calibration cycle and a measurement baseline in the measurement cycle, a baseline comparison value is obtained and compared to a predetermined baseline threshold value. An error message, indicating a malfunction in the purging gas supply, is generated when the baseline comparison value exceeds the predetermined baseline threshold value.
    Type: Grant
    Filed: August 26, 2014
    Date of Patent: April 17, 2018
    Assignee: Mettler-Toledo GmbH
    Inventors: René Oberlin, André Möbius
  • Patent number: 9933292
    Abstract: The present invention provides a thermal flow meter 300 which reduces a stress applied from a fixing portion 3721, which is used to hold and fix a circuit package 400 with respect to a housing 302, to the circuit package 400 and has high reliability. In the thermal flow meter of the invention, the circuit package 400 embedded with a flow rate measurement circuit is formed through a first resin molding process, the fixing portion 3721 is formed along with the housing 302 through a second resin molding process, and the circuit package 400 is enveloped by the fixing portion 3721, whereby the circuit package 400 is held by and fixed to the housing 302. In order to reduce the influence of a stress, generated based on a temperature change of the fixing portion 3721, on the circuit package 400, the fixing portion 3721 is constituted of a thick portion 4714 and a thin portion 4710.
    Type: Grant
    Filed: July 18, 2017
    Date of Patent: April 3, 2018
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Shinobu Tashiro, Keiji Hanzawa, Noboru Tokuyasu, Takeshi Morino, Ryosuke Doi, Akira Uenodan
  • Patent number: 9804009
    Abstract: The present invention provides a thermal flow meter which can suppress a degradation of measurement accuracy caused by deformation of a diaphragm and a stained rear surface thereof even in a case where a gap is provided in order to form the diaphragm in an air flow sensing element. The present invention relates to a thermal flow meter 300 which includes a bypass passage through which a measurement target gas 30 received from a main passage 124 flows, and an air flow sensing element which measures a flow rate of the measurement target gas 30 by performing heat transfer with the measurement target gas 30 flowing through the bypass passage. The thermal flow meter 300 includes at least a circuit package 400 which contains the air flow sensing element 602. A gap 674 is formed in a rear surface of the air flow sensing element 602 to form a diaphragm 672 in an air flow sensing area 437 of the air flow sensing element 602, and the gap 674 becomes a sealed space reduced in pressure compared to an atmospheric pressure.
    Type: Grant
    Filed: May 31, 2013
    Date of Patent: October 31, 2017
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Noboru Tokuyasu, Shinobu Tashiro, Keiji Hanzawa, Takeshi Morino, Ryosuke Doi, Akira Uenodan
  • Patent number: 9797345
    Abstract: A method for monitoring for a rupture in a storage element of a fuel tank system having a fuel tank includes: detecting, by a mass flow sensor, thermal conductivity of an unmoved air mass in a first line of the fuel tank system; and identifying a rupture in the storage element if the detecting by the mass flow sensor detects a change in the thermal conductivity of the unmoved air mass in the first line when a second valve is in a closed state and/or when an air pump is at a standstill.
    Type: Grant
    Filed: April 23, 2014
    Date of Patent: October 24, 2017
    Assignee: Continental Automotive GmbH
    Inventors: Manfred Weigl, Philippe Grass
  • Patent number: 9746361
    Abstract: A gas flow sensing device, and related method of manufacturing, comprising a conductive layer encapsulated in dielectric film, suspended over a cavity to form a diaphragm. The conductive layer functions as both a heating a sensing element and is patterned to provide uniform heat distribution across the diaphragm. The device is designed to sense flow from any direction relative to the device and the design of the dielectric film and diaphragm reduces sensor drift during prolonged operation.
    Type: Grant
    Filed: April 11, 2013
    Date of Patent: August 29, 2017
    Assignee: University of Virginia Patent Foundation
    Inventors: Jianzhong Zhu, Hilary Bart-Smith, Zheng Chen
  • Patent number: 9688530
    Abstract: An integrated circuit (“IC”) package comprising an IC die having a top surface and a bottom surface, an elongate member having opposite first and second end portions and a mid portion. The mid portion is positioned proximate the top surface of the IC die. The IC package also includes an encapsulant block having a top surface, a bottom surface and opposite first and second lateral side surfaces. The encapsulant block encapsulates the IC die and the elongate member. Either or both of the first and second end portions of the elongate member are exposed.
    Type: Grant
    Filed: May 27, 2015
    Date of Patent: June 27, 2017
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Makoto Shibuya, Luu Nguyen, Noboru Nakanishi
  • Patent number: 9664546
    Abstract: An object of the present invention is to improve the reliability of a product in which a semiconductor device is partially exposed when sealed with resin. In achieving the above object and according to this invention, there is provided a thermal airflow sensor including: a semiconductor substrate having a thin-wall portion, a heating resistor provided over the thin-wall portion, and resistance temperature detectors installed upstream and downstream of the heating resistor; a protective film provided over the semiconductor substrate; and a resin that seals the semiconductor substrate, the resin further including an exposure portion for partially exposing an area including the thin-wall portion. The protective film is provided in a manner seamlessly enclosing the heating resistor, the protective film having an outer peripheral edge located outside the thin-wall portion and over the exposure portion.
    Type: Grant
    Filed: June 10, 2013
    Date of Patent: May 30, 2017
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Ryosuke Doi, Hiroshi Nakano, Keiji Hanzawa
  • Patent number: 9618406
    Abstract: A sensor element (1) includes a substrate (2) and a strain-sensitive element (3) which is preferably applied to the substrate by means of thin-film technology and is used for measuring the deformation of the substrate (2) when pressure is applied or a force is introduced, the strain-sensitive element (3) including XAlOyN1-y, wherein X is a metal with a high melting temperature in the range of greater than 1400° C. and 0<y<0.4 applies. A passivation layer (5) can be applied to the strain-sensitive element (3).
    Type: Grant
    Filed: September 1, 2015
    Date of Patent: April 11, 2017
    Assignee: Piezocryst Advanced Sensories GmbH
    Inventors: Dietmar Kroeger, Peter Schmid, Ulrich Schmid, Alexander Schricker, Christof Zarfl
  • Patent number: 9599542
    Abstract: The present invention relates to a sample analyzing chip. The chip can prevent upper and lower substrates of a channel from being attached to each other due to deflection on a micro channel and can solve the problem of the sample drying up within a measuring time of a target. Also, the chip can prevent bubbles from being generated in a central portion of the micro channel.
    Type: Grant
    Filed: May 14, 2013
    Date of Patent: March 21, 2017
    Assignee: NANOENTEK, INC.
    Inventors: Dae Sung Hur, Jae Jeong Kim, Yu Rae Kim
  • Patent number: 9581480
    Abstract: A micro flow sensor includes: a flow path through which a fluid to be measured flows; a detection unit having a heater configured to heat the fluid to be measured in the flow path and temperature sensors configured to measure temperature of a fluid to be measured in the flow path; an arithmetic unit configured to measure a flow rate of the fluid to be measured flowing through the flow path based on the temperature of the fluid to be measured, measured by the temperature sensors; and a narrowed portion disposed on an upstream side of the detection unit in the flow path for narrowing the flow path.
    Type: Grant
    Filed: May 30, 2013
    Date of Patent: February 28, 2017
    Assignee: YOKOGAWA ELECTRIC CORPORATION
    Inventors: Yoshiaki Tanaka, Minako Terao, Hiroaki Tanaka
  • Patent number: 9574912
    Abstract: A sensor element may include a measuring element and a functional housing at least partially surrounding the measuring element including a plastic molded housing. The measuring element may include a hot plate mounted on a carrier substrate by means of narrow arms in a broadly thermally decoupled manner. The carrier substrate may be provided with contacts leading to the measuring element and terminating in contact/bonding points on the carrier substrate. The carrier substrate together with the contact/bonding points may be at least partially integrated into the plastic molded housing, leaving the hot plate exposed. The housing may include connection wiring for the contact/bonding points.
    Type: Grant
    Filed: October 14, 2014
    Date of Patent: February 21, 2017
    Assignee: CONTINENTAL AUTOMOTIVE GMBH
    Inventors: Willibald Reitmeier, Philippe Grass, Johannes Ante
  • Patent number: 9528969
    Abstract: A flash heater element includes a first surface having a central region and an electrical flow path disposed on the first surface. The electrical flow path includes a central portion disposed at least partially within the central region and a peripheral portion disposed peripherally outwardly from the central region. A width of the electrical flow path is greater within at least a portion of the central portion than within the peripheral portion.
    Type: Grant
    Filed: December 11, 2013
    Date of Patent: December 27, 2016
    Inventors: Bradley Douglas Shaw, Lyndon Karl Goedecke
  • Patent number: 9410908
    Abstract: A highly sensitive humidity measurement device is provided. The humidity measurement device has: a housing component integrally including a connector for performing input/output to/from the outside and a connector terminal component; an electronic circuit board mounted on the housing component and electrically connected to the connector terminal; and a humidity sensing element provided on the electronic circuit board. When the humidity measurement device is installed in an installation hole that is provided in a part of a main air flow passage through which suction air flows, apart of the housing component is exposed to the suction air flowing through the main air flow passage. The housing component is provided with a bypass passage to suction a part of the suction air. The bypass passage includes a bypass inlet opening that serves as a suction port of the suction air and a bypass outlet opening that discharges the suction air. The bypass outlet opening is exposed to the suction air.
    Type: Grant
    Filed: October 1, 2012
    Date of Patent: August 9, 2016
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Takayuki Saito, Keiji Hanzawa, Takayuki Yogo
  • Patent number: 9400198
    Abstract: In a flow sensor, an upstream heating element and a downstream heating element are disposed, respectively, upstream and downstream in a flow direction of a fluid so as to undergo mutual thermal interference. By controlling heating currents flown through the respective heating elements, an average temperature control portion maintains an average temperature of the two heating elements at a temperature predetermined degrees higher than a temperature of the fluid detected by a fluid temperature detection portion while a voltage ratio control portion performs control so that a temperature difference or a ratio of applied voltages between the two heating elements takes a predetermined value. A detection signal corresponding to a flow direction of the fluid is obtained from a state of the control on the heating currents and whether a flow direction of the fluid is forward or backward is determined.
    Type: Grant
    Filed: May 13, 2014
    Date of Patent: July 26, 2016
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kazuhiko Otsuka, Yuji Ariyoshi, Masahiro Kawai, Shinichiro Hidaka
  • Patent number: 9379302
    Abstract: In a thermal sensor with a detection part and a circuit part formed on the same substrate, an insulating film for protection of the circuit part causes problems of lowering in sensitivity of a heater, deterioration in accuracy due to variation of a residual stress in the detection part, etc. A layered film including insulating films is formed on a heating resistor, an intermediate layer is formed thereon, and a layered film including insulating films is formed further thereon. The intermediate layer is specified to be a layer made up of any one of aluminum nitride, aluminum oxide, silicon carbide, titanium nitride, tungsten nitride, and titanium tungsten. This configuration enables the layered film on the upper part of the detection part to be removed using the intermediate layer as an etch stop layer, which solves problems of lowering in sensitivity, a variation in residual stress, etc. resulting from these.
    Type: Grant
    Filed: April 16, 2014
    Date of Patent: June 28, 2016
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventor: Noriyuki Sakuma
  • Patent number: 9366557
    Abstract: Thermal flow sensors are disclosed. An example thermal flow sensor includes a chip substrate; a heater mounted to a first membrane on the chip substrate; and a temperature sensor mounted to a second membrane on the chip substrate, the second membrane being isolated from the first membrane by material of the chip substrate.
    Type: Grant
    Filed: December 4, 2013
    Date of Patent: June 14, 2016
    Assignee: ITRON, INC.
    Inventor: Ibne Soreefan
  • Patent number: 9360357
    Abstract: The design and manufacture method of a silicon mass flow sensor made with silicon micromachining (a.k.a. MEMS, Micro Electro Mechanical Systems) process for applications of gas flow measurement with highly humidified or liquid vapors is disclosed in the present invention. The said silicon mass flow sensor operates with an embedded heater and an adjacent control temperature sensor beneath the integrated calorimetric and thermal dissipative sensing thermistors. When the condensation takes place at the surface of the said silicon mass flow sensor, the embedded heater shall be turned on to elevate the temperature of the supporting membrane or substrate for the sensing thermistors. The elevated temperature shall be adjusted to above the vaporization temperature with the feedback data of the adjacent temperature sensor such that the surface condensation due to the presence of the liquid vapors in a gas flow can be effectively eliminated.
    Type: Grant
    Filed: March 19, 2013
    Date of Patent: June 7, 2016
    Assignee: Wisenstech Ltd.
    Inventors: Liji Huang, Chih-Chang Chen
  • Patent number: 9267907
    Abstract: A measurement arrangement includes four electrically heated resistors which are arranged in gas paths and are connected to form a Wheatstone bridge, where each of two resistors which are diagonally opposite each other in the Wheatstone bridge are contained in a respective component arranged on a common heated carrier, each respective component is assigned to one heating resistor arranged near the component on the carrier, and where an unbalanced state of the Wheatstone bridge is compensated for by variably energizing the heating resistors.
    Type: Grant
    Filed: January 18, 2012
    Date of Patent: February 23, 2016
    Assignee: Siemens Aktiengesellschaft
    Inventors: Frank Probst, Josef Richter
  • Patent number: 9255826
    Abstract: Apparatus and associated methods relate to a temperature-compensated drive for a heating element used in a micro-bridge flow sensor. In some embodiments, the heating element may be located substantially between two temperature sensors. The two temperature sensors may be convectively coupled to the heater by a fluid ambient. When the fluid ambient is flowing, one of the temperature sensors may be upstream of the heating element, and one of the temperature sensors may be downstream. The fluid may be heated by the heating unit, and this heated fluid may then flow past the downstream temperature sensor. The two temperature sensors may be used in a Wheatstone bridge configuration. In some embodiments, an output signal of the Wheatstone bridge may be indicative of a measure of fluid flow. The temperature-compensated drive for the heating element may enhance, for example, the flow meter's disturbance rejection of ambient temperature.
    Type: Grant
    Filed: July 16, 2013
    Date of Patent: February 9, 2016
    Assignee: Honeywell International Inc.
    Inventors: Andrew Joseph Milley, Lamar Floyd Ricks, Craig Scott Becke
  • Patent number: 9244031
    Abstract: A gas sensor on a semiconductor substrate. The gas sensor includes an elongate sensor element extending across an opening and has first and second opposed surfaces exposed for contact with a gas to be sensed. The first surface faces away from a major surface of the substrate. The second surface faces toward said major surface. The electrical conductivity of the elongate sensor element is sensitive to a composition and/or concentration of said gas to which the opposed first and second surfaces are exposable. The gas sensor further includes a support structure arranged to increase the mechanical robustness of the gas sensor by supporting the elongate sensor element in the opening.
    Type: Grant
    Filed: July 24, 2012
    Date of Patent: January 26, 2016
    Assignee: NXP, B.V.
    Inventors: Aurelie Humbert, David Tio Castro
  • Patent number: 9222813
    Abstract: Technique of suppressing performance variations for each flow sensor is provided. In a flow sensor FS1 of the present invention, a part of a semiconductor chip CHP1 is configured to be covered with resin (MR) in a state in which a flow sensing unit (FDU) formed on a semiconductor chip CHP1 is exposed. Since an upper surface SUR(MR) of the resin (MR) is higher than an upper surface SUR(CHP) of the semiconductor chip (CHP1) by sealing the resin (MR) on a part of the upper surface SUR(CHP) of the semiconductor chip CHP1 in a direction parallel to an air flow direction, the air flow around the flow sensing unit (FDU) can be stabilized. Further, interface peeling between the semiconductor chip (CHP1) and the resin (MR) can be prevented by an increase of contact area between the semiconductor chip (CHP1) and the resin (MR).
    Type: Grant
    Filed: December 30, 2013
    Date of Patent: December 29, 2015
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Tsutomu Kono, Keiji Hanzawa, Takeshi Morino, Yuki Okamoto, Noboru Tokuyasu, Shinobu Tashiro
  • Patent number: 9186609
    Abstract: A sensing system and method for use with a gas filter in a gas conduit attached to a gas blower, having a motor for producing a first gas flow blower speed, discards readings taken when the blower is off or during blower startup and shutdown, and recalculates a clog threshold in response to changes in the fan speed of a multi-speed blower.
    Type: Grant
    Filed: January 31, 2012
    Date of Patent: November 17, 2015
    Assignee: CLEANALERT, LLC
    Inventors: William Sherman, III, Richard Green
  • Patent number: 9188470
    Abstract: An object of the present invention is to provide a thermal type flow rate sensor that offers high sensitivity and improved reliability. A sensor element according to the present invention includes a semiconductor substrate, a cavity portion formed on the semiconductor substrate, a heating resistor formed on the cavity portion via an electrically insulating film, a heating temperature sensor for detecting heating temperature of the heating resistor, and a driving circuit for controlling the heating temperature of the heating resistor using the temperature detected by the heating temperature sensor. The heating temperature sensor comprises temperature-sensitive resistors having resistance values varying according to temperature and disposed upstream and downstream of a direction of flow of a fluid to be measured relative to the heating resistor and on upper and lower sides in a direction perpendicular to the direction of flow of the fluid to be measured relative to the heating resistor.
    Type: Grant
    Filed: July 28, 2011
    Date of Patent: November 17, 2015
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Hiroshi Nakano, Masahiro Matsumoto, Satoshi Asano, Keiji Hanzawa
  • Patent number: 9163964
    Abstract: A device for detecting at least one flow characteristic of a fluid medium, in particular for detecting an air mass flow in the intake air of a motor vehicle, includes at least one flow channel, through which the fluid medium may flow, and at least one sensor element, which is situated in the flow channel, for detecting the flow characteristic. The sensor element has at least one heating element. The device includes at least one bidirectional electrical interface. The device is configured to receive information and transmit information via the bidirectional electrical interface.
    Type: Grant
    Filed: January 2, 2013
    Date of Patent: October 20, 2015
    Assignee: ROBERT BOSCH GMBH
    Inventors: Norbert Schneider, Eckart Reihlen, Uwe Konzelmann, Michael Rittmann, Lutz Westenberger, Hans Beyrich
  • Patent number: 9087794
    Abstract: In a manufacturing method of a molded package, a lead frame including an island portion and a support portion is prepared. A circuit chip is mounted on the island portion, and the sensor chip is arranged such that a first end section having an electric connecting portion is adjacent to the circuit chip and a second end section having a sensing portion is supported by the support portion. The circuit chip and the electric connecting portion of the first end section is electrically connected through a connection member. The circuit chip, the island portion, the connection member and the first end section are sealed with a resin while maintaining the support state. After the sealing, the support portion is cut from the lead frame and separated from the second end section.
    Type: Grant
    Filed: June 29, 2012
    Date of Patent: July 21, 2015
    Assignee: DENSO CORPORATION
    Inventors: Masahiro Honda, Koutarou Andou, Shinpei Taga
  • Patent number: 9046397
    Abstract: A for operating a thermal, flow measuring device having a first sensor having a first heatable, resistance thermometer and at least one additional, second sensor having a second heatable, resistance thermometer, wherein a decision coefficient is calculated according to the formula DC=(PC1?PC2)/PC1, wherein PC1(t=t1)=P1,1(t1)/(T1,heated;actual(t=t1)?Tmedium;actual(t=t1)) and PC2(t=t2)=P2,2(t2)/(T2,heated;actual(t=t2)?Tmedium;actual(t=t2)), with P being the heating powers absorbed by the corresponding resistance thermometers at the points in time t and the temperature values T, wherein the value of the decision coefficient shows flow direction of a measured medium in the measuring tube.
    Type: Grant
    Filed: August 17, 2010
    Date of Patent: June 2, 2015
    Assignee: Enrdress + Hauser Flowtec AG
    Inventors: Axel Pfau, Vivek Kumar, Anastasios Badarlis
  • Patent number: 9038454
    Abstract: Measuring flow rate of gas based on amount of heat transfer from gas to temperature-sensing resistors, comprises: substrate having hollow space formed therethrough; an insulating film deposited on the substrate so as to cover the hollow space; a heat-generating resistor formed on the insulating film; temperature-sensing resistors arranged adjacent to the heat-generating resistor; electrodes arranged at an edge of the semiconductor substrate so electrodes are parallel to the edge; and wiring connecting the electrodes and heat-generating resistors. Thermal resistance of a first area is made almost equal to thermal resistance of a second area, first area is defined by the side of the heat-generating resistor closer to the electrodes and by the side of the hollow space closer to the electrodes, and the second area is defined by the opposite side of the heat-generating resistor and by the opposite side of the hollow space.
    Type: Grant
    Filed: September 6, 2011
    Date of Patent: May 26, 2015
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Satoshi Asano, Masahiro Matsumoto, Hiroshi Nakano
  • Patent number: 9030190
    Abstract: A measuring device (1) with a housing (2) and two electronic devices (3, 4). To provide a measuring device whose electronics are modular, enabling easy adaptation to self-protection, the measuring device is provided with at least one encapsulated contact element (5) that is designed separately from the electronic units (3, 4) and the housing (2) and is arranged between the two electronic units (3, 4). Furthermore, the contact element (5) has at least one electronic transmission element (6) for creating an electric connection between the two electronic units (3, 4).
    Type: Grant
    Filed: October 8, 2012
    Date of Patent: May 12, 2015
    Assignee: KROHNE Messtechnik GmbH
    Inventor: Achim Matt
  • Publication number: 20150107353
    Abstract: A technique capable of suppressing performance variation of every flow sensor and achieving performance improvement is provided. For example, in an arbitrary cross-sectional surface in parallel to a moving direction of a gas flowing on an exposed flow detecting unit FDU which is formed in a semiconductor chip CHP1, a sealing body is released from the lower mold BM by thrusting up, from a lower mold BM, an ejection pin EJPN arranged in an outer region of the semiconductor chip CHP1 so as not to overlap with the semiconductor chip CHP1 arranged in the vicinity of the center part. Thus, according to the first embodiment, the deformation applied to the sealing body at the time of mold releasing can be smaller than that in a case in which the sealing body is released from the lower mold BM by arranging the ejection pin EJPN in a region overlapping with the semiconductor chip CHP1.
    Type: Application
    Filed: April 11, 2013
    Publication date: April 23, 2015
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Tsutomu Kono, Keiji Hanzawa, Noboru Tokuyasu, Shinobu Tashiro
  • Patent number: 9003876
    Abstract: A thermal mass flowmeter with a metal-encapsulated sensor system is provided. The sensor system included at least one heating resistor having a platelet geometry, and a sensor cap surrounding the at least one heating resistor. At least one distal end area of the sensor cap is formed with a flat rectangular cross section corresponding to the platelet geometry of the heating resistor, such that the distal end area of the sensor cap surrounds the heating resistor closely with an accurate fit (e.g., with a predetermined gap therebetween).
    Type: Grant
    Filed: April 29, 2011
    Date of Patent: April 14, 2015
    Assignee: ABB Technology AG
    Inventors: Axel Kramer, Detlef Pape, Kai Hencken, Urs E. Meier
  • Patent number: 8969088
    Abstract: A substrate mimicking intercellular lipids in stratum corneum consisting of a substrate and a lipid membrane formed on the substrate, wherein the lipid membrane is formed from ceramide, palmitic acid and cholesterol, and the ceramide, palmitic acid and cholesterol are present at a mass ratio of 20-70%:10-60%:20-40% (ceramide:palmitic acid:cholesterol).
    Type: Grant
    Filed: September 1, 2009
    Date of Patent: March 3, 2015
    Assignee: Shiseido Company, Ltd.
    Inventors: Takuya Saiwaki, Takashi Oka, Yuichiro Mori, Toyoko Imae, Xiaojuan Wang, Masaki Ujihara
  • Patent number: 8966975
    Abstract: A crash sensor assembly including a printed circuit board and a crash sensor mounted on the printed circuit board, At least one connector pin is mounted to the printed circuit board so as to permit external electrical communication with the crash sensor. A first insert molded soft inner layer of material partially covers the printed circuit board and covers the crash sensor, and a second overmolded hard outer layer of material covers the first soft inner layer of material and bonded thereto and rigidly contacts the printed circuit board.
    Type: Grant
    Filed: July 27, 2009
    Date of Patent: March 3, 2015
    Assignee: TRW Automotive U.S. LLC
    Inventors: Curt Douglas Campbell, Neil Gordon Murray, Jr., Dion Parker
  • Patent number: 8939012
    Abstract: The present invention provides a thermal conductivity detector capable of realizing high detection performance even with the use of a miniaturized heating element, and expanding an effective applicable temperature range of a heating element, and to provide a gas chromatograph using the same. The thermal conductivity detector comprises a flow-path through which a measurement gas is caused to flow, a heating element disposed inside the flow-path, the heating element being formed on the substrate, for detecting thermal conductivity of the measurement gas according to magnitude of an amount of heat taken away from the heating element by the measurement gas, wherein said heating element is provided with a beam including a part where the beam is folded at a predetermined angle, the part being formed at the central part of the beam.
    Type: Grant
    Filed: August 17, 2011
    Date of Patent: January 27, 2015
    Assignee: Yokogawa Electric Corporation
    Inventors: Naoki Kishi, Hitoshi Hara, Tetsuya Watanabe, Kentaro Suzuki
  • Publication number: 20150000395
    Abstract: In order to provide a flow measuring device high in thermal responsiveness, the flow measuring device includes a temperature detecting element 2 for temperature detection, and a conductive metal lead frame 3 that supports and fixes the temperature detecting element. Of the metal lead frame, a part of the metal lead frame mounted with the temperature detecting element has a portion which is thinner than the thickness of the other metal lead frame or narrower than the width of the other metal lead frame.
    Type: Application
    Filed: January 21, 2013
    Publication date: January 1, 2015
    Inventors: Shinobu Tashiro, Keiji Hanzawa, Noboru Tokuyasu, Takeshi Morino, Ryosuke Doi