Abstract: A vacuum-cavity-insulated flow sensor and related fabrication method are described. The sensor comprises a porous silicon wall with numerous vacuum-pores which is created in a silicon substrate, a porous silicon membrane with numerous vacuum-pores which is surrounded and supported by the porous silicon wall, and a cavity with a vacuum-space which is disposed beneath the porous silicon membrane and surrounded by the porous silicon wall. The fabrication method includes porous silicon formation and silicon polishing in HF solution.

Abstract: A heat conduction-type sensor corrects (calibrate) effects of a temperature of a measurement target fluid and a type of the fluid on a measurement value in measurement of a flow velocity, a mass flow, or an atmospheric pressure. Also provided is a thermal flow sensor and a thermal barometric sensor with this correcting function, high sensitivity, simple configuration, and low cost. At least two thin films that are thermally separated from a substrate through the same cavity are provided, one thin film comprises a heater and a temperature sensor, and the other thin film comprises at least one temperature sensor, the temperature sensors being thin-film thermocouples. The thin film is arranged in proximity so that it is heated only through the measurement target fluid by heating of the heater. A calibration circuit calculates and compares quantities concerning heat transfer coefficients of a standard fluid and the unknown measurement target fluid.

Abstract: Technique of suppressing performance variations for each flow sensor is provided. In a flow sensor FS1 of the present invention, a part of a semiconductor chip CHP1 is configured to be covered with resin (MR) in a state in which a flow sensing unit (FDU) formed on a semiconductor chip CHP1 is exposed. Since an upper surface SUR(MR) of the resin (MR) is higher than an upper surface SUR(CHP) of the semiconductor chip (CHP1) by sealing the resin (MR) on a part of the upper surface SUR(CHP) of the semiconductor chip CHP1 in a direction parallel to an air flow direction, the air flow around the flow sensing unit (FDU) can be stabilized. Further, interface peeling between the semiconductor chip (CHP1) and the resin (MR) can be prevented by an increase of contact area between the semiconductor chip (CHP1) and the resin (MR).

Abstract: A thermal flow sensor includes a heater temperature controller that realizes stable startup characteristics and prevents degradation of a sensor element and can also accommodate a smaller heater. The sensor also includes a semiconductor substrate; a cavity portion provided in the semiconductor substrate; a dielectric film provided on the semiconductor substrate; a thin layer area formed as a result of the dielectric film covering the cavity portion; a heating resistor provided in the thin layer area on the dielectric film; a first temperature-sensitive resistor provided in the thin layer area on the dielectric film; a heating controller; a second temperature-sensitive resistor provided near the heating resistor; and a flow rate detector that detects a flow rate of a fluid on the basis of temperature of the second temperature-sensitive resistor. The heating controller controls the temperature of the heating resistor on the basis of first and second reference temperatures.

Abstract: A flow sensor includes a flow channel body in which a flow channel is formed, and an insertion hole that is communicated with the flow channel is formed from an outer surface, a base made of glass and inserted in the insertion hole of the flow channel body, an elastic gasket disposed between the insertion hole and the base, a substrate made of glass and disposed on an upper surface of the base, a flow velocity detection unit including an electrical resistance element, disposed on an upper surface of the substrate, and positioned in the flow channel, and an electrode that penetrates the substrate and is electrically connected to the electrical resistance element.

Abstract: A flow sensor includes a base made of glass, a substrate made of glass and disposed on an upper surface of the base, a flow velocity detection unit including an electrical resistance element and disposed on an upper surface of the substrate, and an electrode that penetrates the substrate and is electrically connected to the electrical resistance element.

Abstract: A flow meter includes a heater for heating a fluid flow along a membrane. A temperature difference is measured between and upstream point and a downstream point. There are additionally provided one or more strips of material having a relatively high heat conductivity. Strips that are substantially perpendicular to the flow direction direct heat from the heater to the sides of the membrane, causing a large proportion of the heat that would otherwise drive heat flows to be dispersed and decreases inaccuracies or bias in the measured flow rate. Strips of material that are provided parallel to the flow direction act to direct heat from the heater along the direction of flow. This increases the proportion of heat that flows along this axis and guides the flow and hence reduces the proportion of heat available to drive heat flows that cause inaccuracies and bias in the measured flow rates.

Abstract: A measurement transducer of a thermal mass flow meter for determining the flow rate of a medium that flows through a pipe, which comprises at least one thin film resistance thermometer, which is arranged in a sheath, wherein the sheath comprises a first open end, out of which at least one cable for electrical contact with the resistance thermometer is led out of the sheath, wherein the cable in the sheath is embedded in a first fill material, at least in sections, and wherein the thin film resistance thermometer is at least partially covered by a second fill material, which is a gaseous, liquid, semi-liquid, powder or solid and in the case cited last, comprises a hardness of at most Shore A 90, and that the first fill material comprises a hardness of at most Shore D 98.

Abstract: A thermal type fluid flow sensor includes an air flow detecting portion and a temperature detecting portion formed above the same substrate, capable of correcting a humidity, and having a high measuring accuracy at a low cost, and a heat generating resistor, a temperature measuring resistor for the heat detecting resistor, a temperature measuring resistor for detecting an air flow, and a heat generating resistor for detecting a humidity are arranged in a diaphragm formed above a semiconductor substrate, an air cavity layer, and a protecting film above the air cavity layer are formed above the heat generating resistor for detecting the humidity, and the protecting film is provided with plural holes reaching the air cavity layer.

Abstract: An apparatus integrated with micromachined (a.k.a. MEMS, Micro Electro Mechanical Systems) silicon sensor to measure air flow velocity on targeting correction for projectiles arms is disclosed in the present invention. The air flow velocity component perpendicular to the travel direction of bullets with respect to projectile arm body (e.g. bullets, shells, or arrows) has main effect to the targeting accuracy. Such effect is pretty much determined by the wind speed and the projectile travel distance. The integration with MEMS mass flow sensor has made the invented apparatus possible to be compact, low power consumption, low cost and high accuracy. The low power consumption characteristic of MEMS mass flow sensor is especially crucial for making the apparatus of present invention feasible by battery operated.

Abstract: A device for determining at least one parameter of a fluid medium, in particular an intake air mass of an internal combustion engine. The device comprises a sensor chip for measuring the parameter and a control and evaluation electronics having a circuit carrier. The sensor chip is situated on a chip carrier capable of being introduced into the fluid medium. The chip carrier comprises a projection of the circuit carrier developed in one piece with circuit carrier, the sensor chip being fixed in place on the projection.

Abstract: A thermal fluid flow sensor having a diaphragm structure body configured by an insulating film formed by stacking a film having compressive stress and a film having tensile stress on the top and bottom of a temperature-measuring resistive element and a heater resistive element which are processed by microprocessing is provided. The insulating film at a lower layer of the heater resistive element, a temperature-measuring resistive element for heater resistive element, upstream temperature-measuring resistive elements, and downstream temperature-measuring resistive elements, has films having compressive stress (a first insulating film, a third insulating film, and a fifth insulating film) and films having tensile stress (a second insulating film and a fourth insulating film) being alternately arranged, and two layers or more of the films having tensile stress are arranged.

Abstract: A corrosion resistant flow sensor apparatus includes a flow sensor including a micromachinable substrate mounted on a package substrate that includes electrically conductive traces and substrate bond pads. The flow sensor includes a MEMS sensing structure for sensing a mass flow parameter and sensor bond pads coupled to the sensing structure. The sensor bond pads include a top metal layer on a metal diffusion barrier layer including a metal diffusion barrier layer sidewall. Bond wires couple the sensor bond pads to the substrate bond pads. A housing including sides and a top portion is around the flow sensor and includes a flow channel having an inlet and an outlet. A multi-layer corrosion protection coating includes a nm scale adhesion layer and a self assembled monolayer (SAM) is on the adhesion layer. The protection coating covers the sensor bond pads including the metal diffusion barrier layer sidewall.

Abstract: A system includes a controller configured to receive a signal from a thermal radiation sensor indicative of a temperature of a region including at least one fluid passage. The controller is also configured to detect a leak within the at least one fluid passage based on the signal.

Abstract: Provided is a high-precision, mechanically robust thermal humidity sensor. A detecting element 1 of the thermal humidity sensor of the present invention has a diaphragm (a bridge structure) 2 formed on a planar substrate which is formed from a material with high thermal conductivity such as silicon or ceramic. Formed on the diaphragm 2 are temperature detecting resistors 4, 5, 6, and 7 and a heating resistor 3 arranged in a manner surrounding the temperature detecting resistors. Humidity is detected based on the outputs of the temperature detecting resistors 4, 5, 6, and 7. Accordingly, humidity measurement errors that can possibly occur due to the leakage of heat through the diaphragm 2 to the planar substrate can be reduced.

Abstract: Improved sensors are disclosed that include a heater resistor and/or one or more sensor resistors. In some instances, the heater resistor may be configured to have a zero or near-zero temperature coefficient of resistance (TCR), while one or more sensor resistors may be configured to have a non-zero higher TCR. In some instances, the heater resistor may include a polysilicon material that is doped with a first concentration of dopant, and the one or more sensing elements may include a polysilicon material that is doped with a second higher concentration of dopant. In some cases, the first concentration of dopant may be configured to provide a heater resistor that has a zero or near-zero temperature coefficient of resistance (TCR).

Abstract: With increasing demands on data communication and remote control in current industrial processes or gas measurement applications, development of new technologies would be necessary. The current invention presents a MEMS mass flow meter that are cost compatible with conventional variable area flow meters while providing all digital data process including accumulated flow rate measurements, user programmable flow rate alarm and flow data storage. These in-line meters provide packages in pipe diameter from 4 mm up to 100 mm. It is powered with battery and can be used as a stand-alone hand-held option. The meter is also equipped with the industrial standard RS485 Modbus communication interface for easy network and remote management.

Abstract: A flow meter includes a heater for heating a fluid flow along a membrane. A temperature difference is measured between and upstream point and a downstream point. There are additionally provided one or more strips of material having a relatively high heat conductivity. Strips that are substantially perpendicular to the flow direction direct heat from the heater to the sides of the membrane, causing a large proportion of the heat that would otherwise drive heat flows to be dispersed and decreases inaccuracies or bias in the measured flow rate. Strips of material that are provided parallel to the flow direction act to direct heat from the heater along the direction of flow. This increases the proportion of heat that flows along this axis and guides the flow and hence reduces the proportion of heat available to drive heat flows that cause inaccuracies and bias in the measured flow rates.

Abstract: A sensor having a sensor bridge supported above a substrate is disclosed. A number of thermally isolating apertures are provided in the sensor bridge to help increase the thermal isolation of the sensor bridge from the substrate. In one illustrative embodiment, a heater element, an upstream sensor element, and/or a downstream sensor element are provided on the sensor bridge. A plurality of apertures may extend through the sensor bridge to thermally isolate the heater element, the upstream and/or downstream sensor element from the substrate and/or from each other. In one illustrative embodiment, the plurality of apertures may be provided at spaced locations adjacent a first lateral side of the sensor bridge, adjacent the second lateral side of the sensor bridge, between the heater element and the upstream sensor element, and/or between the heater element and the downstream sensor element. In some cases, the plurality of apertures may be substantially round, oval, rectangular and/or any other suitable shape.

Abstract: A thermal flow sensor includes a heater temperature controller that realizes stable startup characteristics and prevents degradation of a sensor element and can also accommodate a smaller heater. The sensor also includes a semiconductor substrate; a cavity portion provided in the semiconductor substrate; a dielectric film provided on the semiconductor substrate; a thin layer area formed as a result of the dielectric film covering the cavity portion; a heating resistor provided in the thin layer area on the dielectric film; a first temperature-sensitive resistor provided in the thin layer area on the dielectric film; a heating controller; a second temperature-sensitive resistor provided near the heating resistor; and a flow rate detector that detects a flow rate of a fluid on the basis of temperature of the second temperature-sensitive resistor. The heating controller controls the temperature of the heating resistor on the basis of first and second reference temperatures.

Abstract: A thermal flow meter has a sensor chip, a heater, first and second flow rate calculators, and an output controller. The heater increases the ambient temperature in the vicinity of a pair of temperature-sensing elements on the sensor chip by a particular temperature above a temperature of a fluid flowing along the sensor chip. The first flow rate calculator calculates a flow rate of the fluid from a temperature difference detected by the pair of temperature-sensing elements. The second flow rate calculator calculates a flow rate of the fluid from a driving energy of the heater. The output controller outputs the flow rate calculated by the second flow rate calculator, instead of the flow rate calculated by the first flow rate calculator, when the flow rate calculated by the first flow rate calculator exceeds a flow rate threshold value that is set in advance.

Abstract: Improved sensors are disclosed that include a heater resistor and/or one or more sensor resistors. In some instances, the heater resistor may be configured to have a zero or near-zero temperature coefficient of resistance (TCR), while one or more sensor resistors may be configured to have a non-zero higher TCR. In some instances, the heater resistor may include a polysilicon material that is doped with a first concentration of dopant, and the one or more sensing elements may include a polysilicon material that is doped with a second higher concentration of dopant. In some cases, the first concentration of dopant may be configured to provide a heater resistor that has a zero or near-zero temperature coefficient of resistance (TCR).

Abstract: Although flow detection accuracy deterioration due to a subject fluid inflow into a gap between a sensor device and an engaging portion is prevented by an underflow inhibitor, the underflow inhibitor overflow to a sensor device surface results in the subject fluid turbulence, causing a flow element output fluctuation risk. One solution is a configuration comprising a sensor device made of a planar semiconductor material with a heating element and an intake air temperature detection element formed thereon, a support member containing an engaging portion the sensor device is engaged to, which is placed at a passage the subject fluid circulates and underflow inhibitor being filled into a void between the sensor device and the support member to prevent the subject fluid from flowing into the void, and a pooling portion being placed to prevent the under flow inhibitor from overflowing out of the void.

Abstract: The present invention provides a highly-sensitive thermal-type flow-rate sensor with enhanced reliability. Provided is a thermal-type flow-rate sensor including: a passage into which a measurement-target fluid is introduced; and a sensor element which is provided in the passage and which measures the flow rate of the measurement-target fluid. The sensor element 1 includes: a semiconductor substrate; a hollow portion formed in the semiconductor substrate; and a heating resistor formed on an electric insulating film above the hollow portion. The sensor element measures the flow rate of the measurement-target fluid by radiating heat from the heating resistor to the measurement-target fluid.

Abstract: A method for manufacturing or preparing thin-film stacks that exhibit moderate, finite, stress-dependent resistance and which can be incorporated into a transduction mechanism that enables simple, effective signal to be read out from a micro- or nano-mechanical structure. As the structure is driven, the resistance of the intermediate layers is modulated in tandem with the motion, and with suitable dc-bias, the motion is directly converted into detectable voltage. In general, detecting signal from MEMS or NEMS devices is difficult, especially using a method that is able to be integrated with standard electronics. The thin-film manufacturing or preparation technique described herein is therefore a technical advance in the field of MEMS/NEMS that could enable new applications as well as the ability to easily develop CMOS-MEMS integrated fabrication techniques.

Abstract: A flow measuring device includes a housing, a support, and a flow measurement element. The housing defines a passage therein and includes a passage narrowing part, which reduces a cross-sectional area of the passage, in a predetermined part of the passage. The support has a platy shape and is disposed along a flow direction of fluid flowing in the passage. The flow measurement element is located inside the passage narrowing part and is disposed on a surface of the support. The flow measurement element detects a flow rate of fluid flowing in the passage. The passage narrowing part has an inner wall surface that gradually reduces a width of the passage from a center side to both end sides of the passage in a height direction of the passage, which is perpendicular to a direction of the width of the passage.

Abstract: A flow sensor may be formed by bonding a sensor chip formed with a flow rate detecting part and a flow path-forming member that is provided on the sensor chip and is formed with a flow path for a fluid flowing in the flow rate detecting part to each other on the upper surface of a substrate. The flow path-forming member may be formed by bonding a transparent first flow path forming member and a second flow path-forming member to each other. The first flow path forming member has a plate shape, and is provided with an inflow port and a outflow port for the fluid to be measured, and the second flow path forming member has a plate shape, and is provided with a through hole that forms the flow path along the flow of the fluid flowing along the flow rate detecting part.

Abstract: A corrosion resistant flow sensor apparatus includes a flow sensor including a micromachinable substrate mounted on a package substrate that includes electrically conductive traces and substrate bond pads. The flow sensor includes a MEMS sensing structure for sensing a mass flow parameter and sensor bond pads coupled to the sensing structure. The sensor bond pads include a top metal layer on a metal diffusion barrier layer including a metal diffusion barrier layer sidewall. Bond wires couple the sensor bond pads to the substrate bond pads. A housing including sides and a top portion is around the flow sensor and includes a flow channel having an inlet and an outlet. A multi-layer corrosion protection coating includes a nm scale adhesion layer and a self assembled monolayer (SAM) is on the adhesion layer. The protection coating covers the sensor bond pads including the metal diffusion barrier layer sidewall.

Abstract: A sensor device for sensing air flow speed at the exterior of an aircraft, comprising a substrate having an upper side on which is mounted a diaphragm over an aperture or recess in the substrate, the diaphragm being thermally and electrically insulative, and mounting on its upper surface a heating element comprising a layer of resistive material, and wherein electrical connections to the heating element are buried in the diaphragm and/or the substrate, and provide electrical terminals at the lower side of the substrate. The heating element is exposed to the environment, but the remaining electrical parts of the device are not exposed.

Abstract: A micromachined thermal mass flow sensor comprises a high mechanical strength polyimide film as a supporting layer of suspending membrane. The polyimide film provides superior thermal insulating properties to reduce the power consumption of device. Due to the tendency of humidity absorption, the polyimide suspending membrane is double side passivated on both top and bottom surfaces to sustain its long term stability from rush and humid working environment. A thin layer of silicon dioxide deposited by plasma enhanced chemical vapor deposition is overlaid between the silicon nitride and polyimide film to enhance the adhesion property of passivation layers to polyimide surface. With such embodiments, a sturdy and robust micromachined thermal mass flow sensor with high measurement accuracy could be formed.

Abstract: With increasing demands on data communication and remote control in current industrial processes or gas measurement applications, development of new technologies would be necessary. The current invention presents a MEMS mass flow meter that are cost compatible with conventional variable area flow meters while providing all digital data process including accumulated flow rate measurements, user programmable flow rate alarm and flow data storage. These in-line meters provide packages in pipe diameter from 4 mm up to 100 mm. It is powered with battery and can be used as a stand-alone hand-held option. The meter is also equipped with the industrial standard RS485 Modbus communication interface for easy network and remote management.

Abstract: A simply configured thermal flowmeter can provide high measurement accuracy over a long period of time by suppressing the characteristics degradation due to adhering contaminants. On the surface of a diaphragm part, a heater resistor is formed. Temperature difference sensors through are disposed on the two sides of the heater resistor (upstream and downstream sides in the flow direction of an air stream). The temperature difference sensors are disposed upstream of the heater resistor while the temperature difference sensors are disposed downstream of the heater resistor. Outside the temperature difference sensors, heating temperature sensors are formed. Control is performed so that the temperature of the heating temperature sensors is set higher than the air stream temperature by a certain degree. Therefore, even if contaminants adhere to the sensor device, the temperature of the heating temperature sensors is held constant.

Abstract: A thermal mass flowmeter with a metal-encapsulated sensor system is provided. The sensor system included at least one heating resistor having a platelet geometry, and a sensor cap surrounding the at least one heating resistor. At least one distal end area of the sensor cap is formed with a flat rectangular cross section corresponding to the platelet geometry of the heating resistor, such that the distal end area of the sensor cap surrounds the heating resistor closely with an accurate fit (e.g., with a predetermined gap therebetween).

Abstract: The flow sensor comprises a heater arranged between two sensing thermopiles. In addition, at least one monitoring thermocouple is provided for measuring the temperature of the heater. The signal from the monitoring thermocouple can be used to improve the accuracy of the device in several ways. In particular, the signal from the monitoring thermocouple depends on changes of the Seeback constant and other inherent properties of the thermopiles in the same way as the signal from the sensing thermopiles, which allows a compensation of such effects. The signal from the monitoring thermocouple can also be used as a reference voltage to an A/D converter for converting the signals from the sensing thermopiles.

Abstract: A sensor includes: a silicon substrate having a hollow portion, which is arranged on a backside of the substrate; an insulation film disposed on a front side of the substrate and covering the hollow portion; a heater disposed on the insulation film, made of a semiconductor layer, and configured to generate heat; and an anti-stripping film for protecting the insulation film from being removed from the silicon substrate. The silicon substrate, the insulation film and the semiconductor layer provide a SOI substrate. The hollow portion has a sidewall and a bottom. The anti-stripping film covers at least a boundary between the sidewall and the bottom of the hollow portion.

Abstract: In a structure in which peripheral part of a diaphragm section of an electrical insulating film is covered with a protective film made of an organic material, the resistor wire on the diaphragm section crosses the peripheral part of the diaphragm section. At a place where a narrow wire of a resistance temperature detector and the like crosses the peripheral part of the diaphragm section, the protective film is thinner than the other part, and the dust impact resistance is reduced. At a place where a heating resistor wire connected to a heating resistor body or resistance temperature detector wires connected to resistance temperature detector bodies cross a periphery of the diaphragm section, a film component protruding from an electrical insulating film is arranged side by side with the heating resistor wire or the resistance temperature detector wires.

Abstract: A method is provided for operating a hot-film air-mass sensor, which can be used especially for measuring air mass flows in the intake tract of an internal combustion engine. The hot-film air-mass sensor has a sensor chip having a sensor frame and a sensor diaphragm having at least one heating element and at least two temperature sensors, a chip carrier for holding the sensor chip and at least one additional heating element. The sensor chip is able to be heated up using the at least one additional heating element. Immediately after shutting down the internal combustion engine, the at least one heating element of the sensor diaphragm is switched off, or is switched to a lower heating power. Furthermore, the at least one additional heating element is switched on for a specified postheating phase. The provided method is particularly suitable for avoiding oil contamination of the hot-film air-mass sensor.

Abstract: To determine air mass flows, especially for controlling internal combustion engines, a hot-film air-mass sensor is provided, which may be used especially for sensing air mass flows in the intake tract of an internal combustion engine. The hot-film air-mass sensor has a sensor chip having a sensor frame and a sensor diaphragm having at least one heating element and at least two temperature sensors. Furthermore, the hot-film air-mass sensor has a chip carrier for mounting the sensor chip, as well as at least one additional heating element. The sensor chip is able to be heated up using the at least one additional heating element, which is inserted into the chip carrier. Compared to the usual devices, the hot-film air-mass sensor has a lower susceptibility to contamination, especially by oil films.

Abstract: An object of the present invention is to provide a structure which prevents a particulate contaminant and a liquid contaminant on which centrifugal separation hardly works, from arriving at a sensor element part.

Abstract: A measurement device, particularly an anemometric measurement device, is provided for mounting in an exhaust-gas pipe, particularly an exhaust-gas recirculation pipe. The device includes a ceramic carrier embedded in an injection-molded housing made of plastic, with at least one film resistor mounted on the ceramic carrier on an end opposite the embedding. Electrical connections lead out from the film resistor to the embedded end of the ceramic carrier, and the electrical connections are passed through the injection molding, sealed and mounted within the injection-molded part. Additional components can be used for the sealing and mounting.

Abstract: The application is directed to methods, systems, procedures, networks and storage apparatus used to conduct conversions of data using remote conversion servers. In one embodiment of the present invention, recent query results may be stored and then used to solve subsequent conversions rather than querying a remote conversion server when the same conversion was previously completed. A counter may be referenced to determine if too much time has passed since the original query was stored in the buffer and, if too much time has passed, the buffer may be cleared and the remote conversion server may be queried to convert the pending data. The resulting conversion may be stored for subsequent use.

Abstract: There is provided a thermal type flow meter capable of accurately detecting a flow rate even when a fluid temperature varies rapidly or when the fluid temperature is high. A probe includes: a first main heating resistor; a second main heating resistor set at a temperature different from that of the first main heating resistor; and a sub-heating resistor for heating lead wires of the two main heating resistors. A CPU of a sensor control circuit finds a fluid temperature by using the two main heating resistors, and finds a fluid flow rate by using at least one of the two main heating resistors.

Abstract: An air flow measuring instrument, comprising: an auxiliary passage 8 arranged inside a main passage through which fluid flows, a tabular member 5 on which a pattern of a heating resistor for measuring an air flow is provided on one face 5a, the tabular member being disposed inside the auxiliary passage so that the one face 5a on which the heating resistor pattern of the tabular member is provided is disposed along a flow of fluid inside the auxiliary passage 8, a heating resistor pattern-side fluid passage 8a portion formed so that the fluid flows between the face 5a and a passage-forming surface 8d of the auxiliary passage, and a back-surface 8b side fluid passage portion formed so that fluid flows between a face 5b on a side opposite to the face of the tabular member and the passage-forming surface of the auxiliary passage. Guidance portion 13 guiding dust that collides against the end portion to back-surface side fluid passage portion 8b side is provided on upstream-side end of tabular member.

Abstract: A thermal type fluid flow sensor includes an air flow detecting portion and a temperature detecting portion formed above the same substrate, capable of correcting a humidity, and having a high measuring accuracy at a low cost, and a heat generating resistor, a temperature measuring resistor for the heat detecting resistor, a temperature measuring resistor for detecting an air flow, and a heat generating resistor for detecting a humidity are arranged in a diaphragm formed above a semiconductor substrate, an air cavity layer, and a protecting film above the air cavity layer are formed above the heat generating resistor for detecting the humidity, and the protecting film is provided with plural holes reaching the air cavity layer.

Abstract: Thermal, flow measuring device and method for operating a thermal, flow measuring device, wherein the thermal, flow measuring device has a first sensor with a first heatable resistance thermometer and at least an additional, second sensor with a second heatable resistance thermometer. A decision coefficient is calculated according to the formula DC=(PC1?PC2)/PC1, with PC1(t=t1)=P1,1(t1)/(T1,heated;actual(t=t1)?Tmedium;actual(t=t1)) and PC2(t=t2)=P2,2(t2)/(T2,heated;actual(t=t2)?Tmedium;actual(t=t2)), with P being the heating powers consumed by the corresponding resistance thermometers at the points in time t, and T being the temperature values; wherein the value of the decision coefficient indicates the flow direction of a measured medium in the measuring tube.

Abstract: A temperature of the heating resistor is set at a temperature equal to or higher than a temperature, at which liquid droplets contacting a surface of the heating resistor evaporate and disappear by film boiling. Alternatively, when a heating resistance type air flow rate measuring device starts to operate or stops operating, the temperature of the heating resistor may be set at a temperature equal to or higher than the temperature, at which liquid droplets contacting a surface of the heating resistor evaporate and disappear by film boiling. Moreover, a water-repellent and oil-repellent protective coating may be provided on the surface of the heating resistor.

Abstract: A channel substrate containing at least one channel for a fluid is provided. A sensor substrate carrying a thermal flow sensor is arranged adjacent to the channel substrate. The flow sensor contains at least one temperature sensor and at least one heater, which are integrated on the sensor substrate. The heater and the temperature sensor are in thermal contact with the channel in the channel substrate. This arrangement allows to measure the flow of the fluid in the channel, which provides an improved monitoring and control. The sensor substrate can have contact pads connected to bond wires or, using flip-chip technology, the contact pads can be connected to circuit paths to the channel substrate.

Abstract: Provided is a high-precision, mechanically robust thermal humidity sensor. A detecting element 1 of the thermal humidity sensor of the present invention has a diaphragm (a bridge structure) 2 formed on a planar substrate which is formed from a material with high thermal conductivity such as silicon or ceramic. Formed on the diaphragm 2 are temperature detecting resistors 4, 5, 6, and 7 and a heating resistor 3 arranged in a manner surrounding the temperature detecting resistors. Humidity is detected based on the outputs of the temperature detecting resistors 4, 5, 6, and 7. Accordingly, humidity measurement errors that can possibly occur due to the leakage of heat through the diaphragm 2 to the planar substrate can be reduced.

Abstract: Thermal flow measuring device and method for the manufacture of a thermal flow measuring device with a spacer having a first cavity for accommodating a resistance thermometer, wherein the spacer has at least a first planar area, which faces the first cavity, and a second cavity, through which the resistance thermometer can be pressed by means of a hold-down onto the first planar area of the spacer.

Abstract: The present invention provides a technology capable of achieving a highly-sensitive flow sensor, by forming a metal film having a relatively high TCR on a semiconductor substrate via an insulating film. A measurement device which is a thermal fluid flow sensor includes a heat element, resistance temperature detectors (upstream-side resistance temperature detector and downstream-side resistance temperature detector), and a resistance temperature detector for air which are all formed of a first metal film. The first metal film is formed of an ?-Ta film having a resistivity lower than three times the resistivity of a Ta ingot and obtained by deposition through sputtering on an amorphous film containing metal.