With Substrate Carrier (e.g., Thin Film) Patents (Class 73/204.26)
  • Publication number: 20090241660
    Abstract: In the thermal type flowmeter for measuring the flow rate by a measuring element with an exothermic resistor and a temperature measuring resistor being shaped in the side of the surface of a substrate, a facing wall facing the surface of the measuring element is arranged, cantilever plate parts protruding from the facing wall toward the measuring element side are arranged, a gap is provided between the tip of the cantilever plate parts and the measuring element, and the cantilever plate parts are extended from the upper stream to the down stream of the measuring element.
    Type: Application
    Filed: December 19, 2008
    Publication date: October 1, 2009
    Applicant: HITACHI, LTD.
    Inventors: Hiroshi NAKANO, Masahiro Matsumoto, Keiji Hanzawa
  • Publication number: 20090211355
    Abstract: To determine air mass flows, especially for controlling internal combustion engines, a hot-film air-mass sensor is provided, which may be used especially for sensing air mass flows in the intake tract of an internal combustion engine. The hot-film air-mass sensor has a sensor chip having a sensor frame and a sensor diaphragm having at least one heating element and at least two temperature sensors. Furthermore, the hot-film air-mass sensor has a chip carrier for mounting the sensor chip, as well as at least one additional heating element. The sensor chip is able to be heated up using the at least one additional heating element, which is inserted into the chip carrier. Compared to the usual devices, the hot-film air-mass sensor has a lower susceptibility to contamination, especially by oil films.
    Type: Application
    Filed: February 23, 2006
    Publication date: August 27, 2009
    Inventors: Erhard Renninger, Gerhard Hueftle, Joerg Brueckner, Bernhard Opitz, Bernd Kuenzl, Uwe Konzelmann, Ulrich Wagner, Henning Marberg, Christoph Gmelin, Matthias Illian
  • Publication number: 20090205417
    Abstract: A method is provided for operating a hot-film air-mass sensor, which can be used especially for measuring air mass flows in the intake tract of an internal combustion engine. The hot-film air-mass sensor has a sensor chip having a sensor frame and a sensor diaphragm having at least one heating element and at least two temperature sensors, a chip carrier for holding the sensor chip and at least one additional heating element. The sensor chip is able to be heated up using the at least one additional heating element. Immediately after shutting down the internal combustion engine, the at least one heating element of the sensor diaphragm is switched off, or is switched to a lower heating power. Furthermore, the at least one additional heating element is switched on for a specified postheating phase. The provided method is particularly suitable for avoiding oil contamination of the hot-film air-mass sensor.
    Type: Application
    Filed: February 23, 2006
    Publication date: August 20, 2009
    Inventors: Bernhard Opitz, Uwe Konzelmann, Christoph Gmelin, Araceli Pison
  • Patent number: 7574910
    Abstract: A disclosed detector element includes a substrate including a void, a heating unit including a heat generating electrode bridged across the void, and a temperature sensor including a temperature sensor electrode provided above the void. The heat generating electrode and the temperature sensor electrode are warped, cantilevered, and standing up in space. The temperature sensor measures heat quantity transported from the heating unit. Distribution of an atmosphere surrounding an object surface with respect to the object surface, and the transportation state of the atmosphere are measured by using at least one of temperature, humidity, a direction or velocity of flow, pressure, and composition of gas in the atmosphere. Behavior of the gas adhering and aggregating onto the object surface, and behavior of aggregated liquid undergoing transpiration from the object surface are detected, based on the distribution and the transportation state measured.
    Type: Grant
    Filed: February 28, 2008
    Date of Patent: August 18, 2009
    Assignee: Ricoh Company, Ltd.
    Inventors: Junji Manaka, Kazutoshi Nagai
  • Publication number: 20090199632
    Abstract: A sensor apparatus and a method of manufacturing the same are disclosed. The sensor apparatus includes: a sensor chip; a housing receiving the sensor chip; an electric conductive member connected with a terminal of the senor chip; and a molded member covering a covered portion including a connection portion where the terminal and the electric conductive member are connected. The senor chip is bonded to a bonding member of the housing via an adhesive member. A surface of the housing, a surface of the adhesive member, and a front surface of the sensor chip are in the same plane at a boundary part of the covered portion.
    Type: Application
    Filed: February 10, 2009
    Publication date: August 13, 2009
    Applicant: DENSO CORPORATION
    Inventor: Inao Toyoda
  • Patent number: 7568399
    Abstract: A microfluidic device a micromachined freestanding member adapted to sense one or more properties of a fluid flowing through the freestanding member. The freestanding member is supported by a substrate and spaced apart and separated from the substrate to enable the freestanding member to move relative to the substrate under the influence of a vibration-inducing element. Movement of the freestanding member relative to the substrate is then sensed by a sensing element. The freestanding member has an inlet, an outlet, an internal passage that fluidically couples the inlet and outlet, and a wall that defines and separates first and second passage portions of the internal passage that are arranged in fluidic series so that a fluid flowing through the internal passage flows through the first and second passage portions in opposite directions.
    Type: Grant
    Filed: January 5, 2007
    Date of Patent: August 4, 2009
    Assignee: Integrated Sensing Systems, Inc.
    Inventors: Douglas Ray Sparks, Nader Najafi
  • Publication number: 20090188314
    Abstract: There is a need for providing a flow sensor with metal film resistor that improves detection sensitivity using a metal film for a resistance heat detector and a resistance temperature detector. The flow sensor with metal film resistor is structured to form a resistance heat detector, a resistance temperature detector for resistance heat detector for measuring temperature of the resistance heat detector, an upstream resistance temperature detector, a downstream resistance temperature detector, and an air resistance temperature detector on a silicon substrate. Plural floating-island insulators are provided for the resistance heat detector and within wiring thereof.
    Type: Application
    Filed: January 27, 2009
    Publication date: July 30, 2009
    Inventor: Noriyuki Sakuma
  • Patent number: 7555944
    Abstract: A highly accurate physical quantity sensor which can ensure reliability in strength and reduce resistance changes caused by stresses. Assuming, with respect to stress ? imposed on a substrate in a predetermined direction (e.g., direction in which maximum stress is imposed), a parallel direction to be a horizontal direction and a perpendicular direction to be a vertical direction, each of resistors of the sensor has a horizontal resistance component Rl and a vertical resistance component Rt.
    Type: Grant
    Filed: February 15, 2006
    Date of Patent: July 7, 2009
    Assignee: Hitachi, Ltd.
    Inventors: Hiroshi Nakano, Masahiro Matsumoto, Masamichi Yamada, Keiichi Nakada, Izumi Watanabe
  • Patent number: 7536908
    Abstract: An integrated mass flow sensor is manufactured by a process of carrying out a micro-machining process on an N or P-type silicon substrate with orientation <100>. This mass flow sensor comprises a central thin-film heater and a pair of thin-film heat sensing elements, and a thermally isolated membrane for supporting the heater and the sensors out of contact with the substrate base. The mass flow sensor is arranged for integration on a same silicon substrate to form a one-dimensional or two-dimensional array in order to expand the dynamic measurement range. For each sensor, the thermally isolated membrane is formed by a process that includes a step of first depositing dielectric thin-film layers over the substrate and then performing a backside etching process on a bulk silicon with TMAH or KOH or carrying out a dry plasma etch until the bottom dielectric thin-film layer is exposed.
    Type: Grant
    Filed: June 21, 2005
    Date of Patent: May 26, 2009
    Assignee: Siargo, Ltd.
    Inventors: Gaofeng Wang, Chih-Chang Chen, Yahong Yao, Liji Huang
  • Patent number: 7533564
    Abstract: A micro sample heating apparatus has a substrate, a micro heating device disposed on a first surface of the substrate, a cavity having a vertical sidewall and corresponding to the micro heating device positioned in a second surface of the substrate, and an isolation structure positioned on the second surface of the substrate. The isolation structure has an opening corresponding to the cavity, and the cavity and the opening form a sample room.
    Type: Grant
    Filed: May 2, 2006
    Date of Patent: May 19, 2009
    Assignee: Touch Micro-System Technology INC.
    Inventors: Chin-Chang Pan, Yu-Fu Kang
  • Patent number: 7526955
    Abstract: The objects of the present invention are to provide a high-accuracy EGR sensor, and EGR system which adopts the above sensor to measure EGR rate. The gas flow meter comprises a sensor section for measuring fluid flow rate and controller for controlling signals transmitted into and out of the sensor section, and is controlled at a working temperature of 350 to 700° C., wherein a protective coat formed on the sensor section has resistance to temperature at which deposition of a PM component in exhaust gases can be prevented.
    Type: Grant
    Filed: April 12, 2007
    Date of Patent: May 5, 2009
    Assignee: Hitachi, Ltd.
    Inventors: Motoyuki Miyata, Noboru Tokuyasu, Katsuaki Fukatsu
  • Patent number: 7520051
    Abstract: A packing method and system for measuring multiple measurands including bi-directional flow comprises of sampling ports arranged within a flow tube in a symmetrical pattern. The ports are arranged symmetrically with respect to the X and Y centerlines of the flow tube. In addition, the ports are also arranged symmetrical to the restrictor to minimize the amount of turbulent flow within the flow tube.
    Type: Grant
    Filed: January 4, 2007
    Date of Patent: April 21, 2009
    Assignee: Honeywell International Inc.
    Inventors: Craig S. Becke, Lamar F. Ricks, Jamie W. Speldrich
  • Patent number: 7513149
    Abstract: A MEMS flow sensor has a flow channel that avoids wire bond pads and ancillary circuit elements. A fluid can move from the bottom of the sensor substrate, though an inlet hole, over a sensing element on the top of the substrate, and then through an outlet hole. The inlet hole and the outlet hole can pass from the substrate top to the substrate bottom. A top cap can be fixed to the top of the substrate such that it covers the sensing element, the inlet hole, and the outlet hole. The top cap constrains the flow channel and keeps fluid, either gaseous or liquid, from exiting the channel and contacting the wire bond pads or ancillary circuit elements.
    Type: Grant
    Filed: November 30, 2007
    Date of Patent: April 7, 2009
    Assignee: Honeywell International Inc.
    Inventor: Lamar F. Ricks
  • Publication number: 20090078040
    Abstract: A flow sensor may be formed by bonding a sensor chip formed with a flow rate detecting part and a flow path-forming member that is provided on the sensor chip and is formed with a flow path for a fluid flowing in the flow rate detecting part to each other on the upper surface of a substrate. The flow path-forming member may be formed by bonding a transparent first flow path forming member and a second flow path-forming member to each other. The first flow path forming member has a plate shape, and is provided with an inflow port and a outflow port for the fluid to be measured, and the second flow path forming member has a plate shape, and is provided with a through hole that forms the flow path along the flow of the fluid flowing along the flow rate detecting part.
    Type: Application
    Filed: August 14, 2008
    Publication date: March 26, 2009
    Applicant: Yamatake Corporation
    Inventors: Shinichi Ike, Hiroshi Hatakeyama, Satoshi Tsuchiya
  • Publication number: 20090078041
    Abstract: A flow sensor may be formed of a sensor chip in which a flow rate detecting section is formed on an electric insulating film applied to cover at least a part of a concave portion formed on an upper surface of a substrate and may also include a flow path forming member which is provided on the sensor chip and has a flow path of a fluid flowing through the flow rate detecting section formed therein.
    Type: Application
    Filed: August 14, 2008
    Publication date: March 26, 2009
    Applicant: Yamatake Corporation
    Inventors: Shinichi Ike, Shoji Kamiunten, Junji Kumasa
  • Patent number: 7500392
    Abstract: The invention is a solid state microanemometer and a method of making thereof. Specifically, the invention relates to a microanemometer including an electrically conductive resistor in the form of a semiconductor wafer doped with an impurity having an upper surface, a lower surface having a peripheral edge; a substrate bonded to the semiconductor wafer having an upper surface, a cavity having a peripheral edge and a peripheral margin defined on the upper surface and bounded by the peripheral edge of the cavity wherein the lower surface of the semiconductor wafer rests on and is supported by at least part of the peripheral edge of the cavity such that the semiconductor wafer is over the cavity; and a means for electrically connecting the resistor to a current source. The microanemometer also includes a plurality of metal conductors in contact with the resistor.
    Type: Grant
    Filed: October 11, 2007
    Date of Patent: March 10, 2009
    Assignee: Memsys, Inc.
    Inventors: Thomas E. Plowman, Warren R. Jewett
  • Publication number: 20090049907
    Abstract: This invention discloses a mass flow sensor manufactured by applying the micro-electromechanical system (MEMS) process to provide a new and improved mass flow sensor that is a self-calibrated in a time-of-flight manner with configuration to measure the flow velocity directly. The self-calibration of a mass flow rate sensor is achieved by providing an electric pulse to a heater in the flow and determining a temperature variations of the fluid. The method further includes a step of measuring a temperature variation by a temperature sensor disposed at a short distance from the heater. The method further includes a step of correlating the temperature variation measured at the temperature sensor with the temperature variation of the heater to determine a time delay and a corresponding flow velocity.
    Type: Application
    Filed: August 24, 2008
    Publication date: February 26, 2009
    Inventors: Xiaozhong Wu, Liji Huang
  • Patent number: 7490512
    Abstract: A detector for monitoring the low levels of differential pressures and the rate of mass flow rate of gas (air, e.g.) in a duct. The sensor's temperature is maintained at a constant gradient above temperature of the flowing gas, typically 4-7° C. higher. The detector consists of two thermally decoupled sensors—one is the air temperature sensor and the other is a temperature sensor coupled to a heater. The sensors are connected to an electronic servo circuit that controls electric power supplied to the heater. The sensors are positioned outside of the air duct and coupled to the duct via a relatively thin sensing tube protruding inside the duct. The end of the tube has an opening facing downstream of the gas flow, thus being exposed to a static gas pressure.
    Type: Grant
    Filed: August 31, 2007
    Date of Patent: February 17, 2009
    Inventor: Jacob Fraden
  • Patent number: 7487675
    Abstract: A micro-heater including a semiconductor substrate having a cavity; an insulating layer provided on an upper side of the semiconductor substrate and closing the cavity; and a heater element embedded in a portion of the insulating layer above the cavity and including a metallic material. The insulating layer includes: a compressive stress film made of silicon oxide; and a tensile stress film made of silicon nitride. The tensile stress film has a thickness not less than that of the compressive stress film.
    Type: Grant
    Filed: February 6, 2006
    Date of Patent: February 10, 2009
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Koichi Ikawa, Yoshinori Tsujimura, Takio Kojima
  • Patent number: 7478556
    Abstract: An apparatus for a rapid measurement of temperatures in a hot gas flow, in particular in a gas turbine. The apparatus includes a sensor having two two-dimensional, electrically conductive heating elements, which are attached to the surface of a common, electrically insulating sensor body.
    Type: Grant
    Filed: October 24, 2005
    Date of Patent: January 20, 2009
    Assignee: Alstom Technology Ltd
    Inventors: Paolo Ruffino, Hanspeter Zinn
  • Patent number: 7472592
    Abstract: An airflow meter includes a detecting element for detecting airflow rate, a control integrated circuit electrically coupled with the detecting element, a circuit board having a first surface and a second surface opposing each other, and having the control integrated circuit on the first surface, a heat sink arranged on a side of the second surface, and a shield part arranged between the circuit board and the heat sink. The heat sink has an electrically conductive property and is provided for removing heat from the control integrated circuit. In addition, the heat sink is floated from a ground. The shield part has an electrically conductive property and is electrically grounded.
    Type: Grant
    Filed: December 7, 2007
    Date of Patent: January 6, 2009
    Assignee: Denso Corporation
    Inventor: Takao Ban
  • Patent number: 7472591
    Abstract: An object of the invention is to realize a thermal gas flow sensor capable of reducing time fluctuation of a heating resistor. A heating resistor 3 and thermometric resistors 4 and 14 are formed on a surface of a thin-wall portion 2. Electrode drawn wires 18 to 23 and pad portions 8 to 13 are formed so as to draw signal lines from the heating resistor 3 and the thermometric resistors 4 and 14. Contact portions 24 to 29 are formed to come in contact with the heating resistor 3, the thermometric resistors 4 and 14, and the electrode drawn wires 18 to 23. The heating resistor 3 and the thermometric resistors 4 and 14 are covered with protective films 30a, 30b, and 31a and insulating films 31b and 30c. The protective films 31a and 31b are formed of a dense film formed of nitride or the like. A part coming in contact with a drawn wire portion 34 and the heating resistor 3 is covered with a contact barrier metal film 36 (titanium-based electrical conductor such as titanium nitride, titanium tungsten, and titanium).
    Type: Grant
    Filed: July 23, 2007
    Date of Patent: January 6, 2009
    Assignee: Hitachi, Ltd.
    Inventors: Yasuhiro Kanamaru, Keiji Hanzawa
  • Patent number: 7469583
    Abstract: A flow sensor readily obtains high sensitivity without errors due to tilting. The flow sensor includes a flow channel having a pair of parallel portions and temperature sensing resistors for heating a fluid to a preset temperature. The temperature sensing resistors are disposed on parts of the parallel portions of the flow channel, to detect a fluid flow rate based on a change in temperature distribution of a flow channel due to a change in flow rate of the fluid flowing through the flow channel. The temperature sensing resistors include a first upstream temperature sensing resistor and a first downstream temperature sensing resistor that are disposed in a line on upstream and downstream sides of one of the parallel portions, respectively; and a second upstream temperature sensing resistor and a second downstream temperature sensing resistor that are disposed in a line on upstream and downstream sides of the other parallel portion, respectively.
    Type: Grant
    Filed: February 21, 2007
    Date of Patent: December 30, 2008
    Assignee: MKS Japan, Inc.
    Inventor: Isao Suzuki
  • Publication number: 20080295590
    Abstract: A thermal type flow meter has a first heating resistor, a second heating resistor for blocking heat transfer from the first heating resistor to a console, a temperature measuring resistor interposed between the two heating resistors, and a controller for calculating a flow rate unrelated to temperatures of fluid from temperatures of the resistors and currents supplied to the heating resistors.
    Type: Application
    Filed: May 23, 2008
    Publication date: December 4, 2008
    Inventors: Yoshihiro Sukegawa, Noboru Tokuyasu, Hiroaki Hoshika
  • Publication number: 20080289413
    Abstract: According to a flow measuring device, first ranges formed by a first plurality of resistors form a single continuous value range on a flow direction coordinate axis. Thus, the first plurality of resistors is limited from being thermally insulated from one another in the flow direction, and thereby detectivity is improved. Also, second ranges formed by a second plurality of resistors form an other single continuous value range on a longitudinal direction coordinate axis. The other continuous value range includes a position that corresponds to a half length of a heating element in a longitudinal direction. As a result, detection difference is obtained at the position, at which a temperature is most optimally detected, and thereby detectivity is further improved.
    Type: Application
    Filed: May 14, 2008
    Publication date: November 27, 2008
    Applicant: DENSO CORPORATION
    Inventors: Junzo Yamaguchi, Yasushi Kohno
  • Patent number: 7451537
    Abstract: Method for fabricating a microscale anemometer on a substrate. A sacrificial layer is formed on the substrate, and a metal thin film is patterned to form a sensing element. At least one support for the sensing element is patterned. The sacrificial layer is removed, and the sensing element is lifted away from the substrate by raising the supports, thus creating a clearance between the sensing element and the substrate to allow fluid flow between the sensing element and the substrate. The supports are raised preferably by use of a magnetic field applied to magnetic material patterned on the supports.
    Type: Grant
    Filed: May 18, 2005
    Date of Patent: November 18, 2008
    Assignee: The Board of Trustees of the University of Illinois
    Inventors: Chang Liu, Jack Chen
  • Publication number: 20080264154
    Abstract: In a flow quantity measuring device, each of upstream side and downstream side sensing resistors, which are placed on an upstream side and a downstream side, respectively, of a heating resistor, includes resistor elements, each of which forms a folded path. The folded path has a generally constant width along an entire extent thereof and is returned at each of first and second longitudinal end edges of a sensing area. The heating resistor forms a folded path, which has a generally constant width along an entire extent thereof and is returned at the second longitudinal end edge of the heat generating area. First and second ends of the folded path of the heating resistor projects beyond the first longitudinal end edge of the sensing area on a first side of the flow quantity measuring device.
    Type: Application
    Filed: April 23, 2008
    Publication date: October 30, 2008
    Applicant: DENSO CORPORATION
    Inventors: Junzo Yamaguchi, Yasushi Kohno
  • Publication number: 20080264166
    Abstract: A flow sensor element and a method for self-cleaning of the flow sensor element are provided, in which a temperature-measuring element and a heating element are arranged on a carrier element, and these elements can form a multiple-part ceramic component. The temperature-measuring element has a platinum thin-film resistor on a ceramic substrate for the temperature measurement and is heated with an additional platinum thin-film resistor. A measurement device, in particular an anemometric measurement device of a flow sensor, contains film resistors mounted in at least one opening of a cover or a hollow body. Two of the film resistors have resistance values differing by one to three orders of magnitude. The anemometric measurement device has a temperature sensor and a heat output sensor set in a carrier element. The temperature sensor has a temperature-measuring resistor and a heat conductor, as platinum thin-film or thick-film resistors, on a ceramic substrate.
    Type: Application
    Filed: April 24, 2008
    Publication date: October 30, 2008
    Applicant: HERAEUS SENSOR TECHNOLOGY GMBH
    Inventors: Karlheinz WIENAND, Karlheinz ULLRICH, Matthias MUZIOL
  • Publication number: 20080250856
    Abstract: A flow rate sensor has a problem that a resistance value of a heat generating resistor itself varies and sensor characteristics are changed during use of the sensor for a long term. Also, the temperature of the heat generating resistor must be adjusted on a circuit substrate with a resistance constituting one side of a fixed temperature difference control circuit, and this has been one of factors pushing up the production cost. All resistances used for fixed temperature difference control are formed on the same substrate as temperature sensitive resistors of the same material. This enables all the resistances for the fixed temperature difference control to be exposed to the same environmental conditions. Hence, even when the resistances change over time, the changes over time occur substantially at the same tendency. Since the resistances for the fixed temperature difference control change over time essentially at the same rate, a resulting output error is very small.
    Type: Application
    Filed: June 16, 2008
    Publication date: October 16, 2008
    Inventors: Izumi WATANABE, Junichi Horie, Keiichi Nakada, Kei Ueyama, Masamichi Yamada
  • Publication number: 20080250855
    Abstract: A thermal-type fluid flow sensor comprises a heating resistor formed on a thin film of a substrate, and plural thermal sensitive resistors configuring a bridge circuit. The thermal sensitive resistors are disposed on the thin film of the substrate so as to be located on an adjacent upstream side and an adjacent downstream side of the heating resistor in a stream direction of fluid to be measured. Resistor traces for the thermal sensitive resistors are formed so that the respective thermal sensitive resistors exhibit substantially equal changes in resistance with each other to distortion caused in the thin film.
    Type: Application
    Filed: September 12, 2007
    Publication date: October 16, 2008
    Applicants: HITACHI, LTD., HITACHI CAR ENGINEERING CO., LTD.
    Inventors: Keiichi NAKADA, Junichi HORIE, Hiroshi NAKANO, Izumi WATANABE
  • Patent number: 7435614
    Abstract: A method for treating a structure, includes: providing an initial structure having at least one main part and a secondary part which have a contact interface with each other and elements constituting at least one zone to be treated capable of varying in thickness substantially perpendicularly to the interface under the effect of a treatment of its material; and applying the treatment to the zone of the initial structure so as to obtain a final structure such that the variation in the thickness of the zone forms an internal space extending between the parts over at least one zone of the interface and substantially parallel to the interface or within at least one of the parts, spaced apart and substantially parallel to the interface. The invention also concerns the structure with internal space resulting from the displacement of one part relative to another part of the structure.
    Type: Grant
    Filed: December 4, 2003
    Date of Patent: October 14, 2008
    Inventor: Michel Bruel
  • Publication number: 20080245145
    Abstract: A thermal flow sensor is equipped with a self-test unit that monitors the device and generates a fault signal in the presence of a malfunction. The self-test unit can e.g. monitor the integrity of a membrane carrying the heater and temperature sensors, or it can monitor various operational parameters of the device, thereby increasing the safety of the device.
    Type: Application
    Filed: January 21, 2008
    Publication date: October 9, 2008
    Inventors: Felix Mayer, Mark Hornung, Marc von Waldkirch, Marcel Pluss
  • Publication number: 20080236274
    Abstract: An airflow measuring device includes a sensing portion provided in a bypass passage, which perpendicularly deflects part of air from a main passage to therethrough bypass the part of air. The sensing portion includes a heating resistor energized and dissipate heat to airflow. The sensing portion is configured to measure airflow in the bypass passage based on the heat radiation. The sensing portion further includes a pair of support members erected in the bypass passage to support the heating resistor. The heating resistor of the sensing portion is inclined at a first inclination angle with respect to a direction, which is perpendicular to a flow direction of air in the bypass passage. The heating resistor is inclined toward downstream at an outer streamline of the airflow in the bypass passage.
    Type: Application
    Filed: March 27, 2008
    Publication date: October 2, 2008
    Applicant: DENSO CORPORATION
    Inventors: Yasushi kohno, Takao Ban
  • Publication number: 20080229818
    Abstract: To reduce power consumption by a thermal flowmeter while good flow-rate detection sensitivity is maintained, it is only necessary to reduce power consumption by a heat resistor under predetermined conditions. Specifically, provided that a width Wh of the heat resistor is between 100 micrometers and 400 micrometers inclusive (100?Wh?400), it is only necessary that a relationship among the length Lh of the heat resistor, a temperature increase ?Th for the heat resistor, and a maximum permissible power Phmax to be supplied to the heat resistor be set so as to satisfy a formula 1.4??Th·Lh/Phmax?2.8 in order to maintain good flow-rate detection sensitivity. Accordingly, the length of the heat resistor and the temperature increase in the heat resistor are set so that the maximum power consumption can be reduced within a range in which the formula is satisfied.
    Type: Application
    Filed: January 25, 2008
    Publication date: September 25, 2008
    Inventors: Hiroshi NAKANO, Masahiro Matsumoto, Keiji Hanzawa
  • Patent number: 7426857
    Abstract: Detection accuracy of flow rates is higher even when the temperature of fluid is varied or when there is any difference between temperature of fluid and that around a thermosensible flow sensor. A thermosensible detector element comprises an insulating support film formed on the surface of a plate-like substrate, a heat resistor and a fluid temperature-measuring resistor made of thermosensible resistive films formed on this support film, an insulating protective film formed on this thermosensible resistive film, and cavities and formed under respective thermosensible resistive films by removing partially the plate-like substrate, and in which flow velocity of fluid is measured on heat transfer phenomenon from the portion heated by the heat resistor to fluid, and top surface of the cavity located under the fluid temperature-measuring resistor is formed within the part where the fluid temperature-measuring resistor is located.
    Type: Grant
    Filed: November 29, 2006
    Date of Patent: September 23, 2008
    Assignee: Mitsubishi Electric Corporation
    Inventor: Masahiro Kawai
  • Publication number: 20080196494
    Abstract: A flow sensor that is designed to overcome problems of conventional flow sensors and can readily obtain high sensitivity without errors due to tilting. A flow sensor includes: a flow channel having a pair of parallel portions; and temperature sensing resistors for heating a fluid to a preset temperature, the temperature sensing resistors being disposed on parts of the parallel portions of the flow channel, to detect a fluid flow rate based on a change in temperature distribution of a flow channel due to a change in flow rate of the fluid flowing through the flow channel, the flow sensor comprising: a first upstream temperature sensing resistor and a first downstream temperature sensing resistor that are disposed in a line on upstream and downstream sides of one of the parallel portions, respectively; and a second upstream temperature sensing resistor and a second downstream temperature sensing resistor that are disposed in a line on upstream and downstream sides of the other parallel portion, respectively.
    Type: Application
    Filed: February 21, 2007
    Publication date: August 21, 2008
    Inventor: Isao Suzuki
  • Patent number: 7409859
    Abstract: A thermal type flow measuring apparatus includes a heating resistor provided in a thin part of a substrate and a bridge circuit for driving the heating resistor to have a preset heating temperature, wherein resistor elements on sides forming the bridge circuit are temperature sensitive resistors, a part or whole of at least one of the temperature sensitive resistors is placed in the thin part and near the heating resistor so that the temperature sensitive resistor is influenced by a heat of the heating resistor, and the preset heating temperature is increased as the flow of fluid is increased. This configuration introduces flow dependency into the heating temperature of the heating resistor.
    Type: Grant
    Filed: July 6, 2006
    Date of Patent: August 12, 2008
    Assignee: Hitachi, Ltd.
    Inventors: Izumi Watanabe, Junichi Horie, Keiichi Nakada
  • Publication number: 20080184775
    Abstract: A fluid identification device includes a fluid detection part which is equipped with a temperature detector for fluid detection and a heating element disposed in the vicinity of the temperature detector and disposed on the identification target fluid side, a fluid detection circuit connected to the fluid detection part and an identification operation part which performs identification of an identification target fluid based on the output of the fluid detection circuit are contained in an identification sensor module main body.
    Type: Application
    Filed: September 18, 2007
    Publication date: August 7, 2008
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Kiyoshi Yamagishi, Toshimi Nakamura, Kiyotaka Yanagi, Akiko Kubota
  • Patent number: 7404321
    Abstract: A method of manufacturing a sensor device includes a step of forming a sensor chip including a sensing element and a wiring portion connected to the sensing element on a substrate, a step of connecting the wiring portion to a lead, and a step of molding a member for covering a connecting portion between the wiring portion and the lead by injecting a molding material in a mold, while the sensing element is exposed. In the molding step, a buffering member is disposed between an area to be covered with the molded member and the sensing element. Furthermore, in the molding step, the buffering member is deformed by a pressure from the mold, and the molding material is injected in the deformed state of the buffering member so as to form the molded member.
    Type: Grant
    Filed: July 13, 2006
    Date of Patent: July 29, 2008
    Assignee: DENSO CORPORATION
    Inventors: Masaaki Tanaka, Tsutomu Onoue
  • Patent number: 7404320
    Abstract: The present invention provides a technology capable of achieving a highly-sensitive flow sensor, by forming a metal film having a relatively high TCR on a semiconductor substrate via an insulating film. A measurement device which is a thermal fluid flow sensor includes a heat element, resistance temperature detectors (upstream-side resistance temperature detector and downstream-side resistance temperature detector), and a resistance temperature detector for air which are all formed of a first metal film. The first metal film is formed of an ?-Ta film having a resistivity lower than three times the resistivity of a Ta ingot and obtained by deposition through sputtering on an amorphous film containing metal.
    Type: Grant
    Filed: January 13, 2006
    Date of Patent: July 29, 2008
    Assignee: Hitachi, Ltd.
    Inventors: Noriyuki Sakuma, Naoki Yamamoto, Kenichi Takeda, Hiroshi Fukuda
  • Patent number: 7401399
    Abstract: A manufacturing method for a substrate heating device comprises forming a base plate having a substrate heating surface in which a resistance heating element is buried, forming a tubular member, joining the tubular member to the base plate, measuring temperature distribution in the substrate heating surface by supplying power to the resistance heating element, and grinding the tubular member according to a grinding condition based on a measurement result of the temperature distribution.
    Type: Grant
    Filed: February 16, 2005
    Date of Patent: July 22, 2008
    Assignee: NGK Insulators, Ltd.
    Inventors: Yutaka Unno, Yoshinobu Goto, Taiji Kiku
  • Patent number: 7395706
    Abstract: A micro sample heating apparatus has a substrate, a micro heating device disposed on a first surface of the substrate, a cavity having an inclined sidewall and corresponding to the micro heating device positioned in a second surface of the substrate, and an isolation structure positioned on the second surface of the substrate. The isolation structure has an opening corresponding to the cavity, and the cavity and the opening form a sample room.
    Type: Grant
    Filed: June 23, 2006
    Date of Patent: July 8, 2008
    Assignee: Touch Micro-System Technology Inc.
    Inventors: Chin-Chang Pan, Yu-Fu Kang
  • Patent number: 7395707
    Abstract: A flow rate sensor has a problem that a resistance value of a heat generating resistor itself varies and sensor characteristics are changed during use of the sensor for a long term. Also, the temperature of the heat generating resistor must be adjusted on a circuit substrate with a resistance constituting one side of a fixed temperature difference control circuit, and this has been one of factors pushing up the production cost. All resistances used for fixed temperature difference control are formed on the same substrate as temperature sensitive resistors of the same material. This enables all the resistances for the fixed temperature difference control to be exposed to the same environmental conditions. Hence, even when the resistances change over time, the changes over time occur substantially at the same tendency. Since the resistances for the fixed temperature difference control change over time essentially at the same rate, a resulting output error is very small.
    Type: Grant
    Filed: August 18, 2006
    Date of Patent: July 8, 2008
    Assignees: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.
    Inventors: Izumi Watanabe, Junichi Horie, Keiichi Nakada, Kei Ueyama, Masamichi Yamada
  • Publication number: 20080148841
    Abstract: Disclosed is a thermal mass flowmeter, which comprises a heating unit disposed on an outer peripheral surface of a capillary tube, and a pair of temperature-sensing units each provided as a separate component from said heating unit. The temperature-sensing units are disposed on the outer peripheral surface of the capillary tube at respective positions equally distant from the heating unit toward an upstream side and a downstream side of the capillary tube. Each of the temperature-sensing units has a structure in which a temperature-sensing element is covered by a protective resin molded around the temperature-sensing element. The temperature-sensing element consists of a thermistor or a resistance temperature sensor. The temperature-sensing element is disposed to be displaced to a contact surface of the molded resin with the capillary tube relative to a center of the molded resin.
    Type: Application
    Filed: December 19, 2007
    Publication date: June 26, 2008
    Applicant: SHIMADZU CORPORATION
    Inventor: Masumi SAKAI
  • Publication number: 20080148842
    Abstract: A semiconductor device includes: a semiconductor substrate; a flow sensor having a first heater for detecting a flow rate of fluid; and a humidity sensor for detecting a humidity of the fluid. The flow sensor and the humidity sensor are disposed on the semiconductor substrate. The flow sensor is disposed around the humidity sensor. The humidity sensor is disposed on an upstream side of the first heater. Since the device includes the humidity sensor, moisture in the fluid is compensated so that detection accuracy of the flow rate is improved.
    Type: Application
    Filed: December 13, 2007
    Publication date: June 26, 2008
    Applicant: DENSO CORPORATION
    Inventor: Teruo Oda
  • Patent number: 7373816
    Abstract: The arrangement relates to a hot-film mass flow meter for recording the flow rate of a flowing medium in the intake tract or the charge air tract of an internal combustion engine. A substrate part is provided, that accommodates a sensor chip, which is allocated to a channel that has flowing through it at least one partial mass flow of the flowing medium. The sensor chip extends into channel that has flowing through it the partial mass flow of the flowing medium. The substrate part is formed either as a separately extruded plastic tongue or as a cavity extruded of plastic material. The sensor chip is integrated downstream with respect to a flow direction of the flowing medium, so as to lie behind a leading edge.
    Type: Grant
    Filed: September 3, 2004
    Date of Patent: May 20, 2008
    Assignee: Robert Bosch GmbH
    Inventors: Manfred Strohrmann, Rainer Schard
  • Patent number: 7363810
    Abstract: A corrosion resistant thermal type mass flow rate sensor, and a fluid supply device employing the sensor are provided thus allowing enhanced corrosion resistance of the thermal type mass flow rate sensor, improve responsiveness, to be achieved particle-free, and to prevent unevenness of product qualities. A thermal type mass flow rate sensor is constituted with a sensor part 1 comprising a corrosion resistant metal substrate 2 formed as a thin plate by applying electrolytic etching on the rear face side of a corrosion resistant metal material W, a thin film F forming a temperature sensor 3 and a heater 4 mounted on the rear face side of the corrosion resistant metal substrate 2, and a sensor base 13 hermetically fitted by welding to the outer periphery of the corrosion resistant metal substrate 2 of the afore-mentioned sensor part 1 fitted into a fixture groove 13a.
    Type: Grant
    Filed: February 12, 2004
    Date of Patent: April 29, 2008
    Assignee: Fujikin Incorporated
    Inventors: Nobukazu Ikeda, Kaoru Hirata, Kouji Nishino, Ryousuke Dohi
  • Patent number: 7360416
    Abstract: A disclosed detector element includes a substrate including a void, a heating unit including a heat generating electrode bridged across the void, and a temperature sensor including a temperature sensor electrode provided above the void. The heat generating electrode and the temperature sensor electrode are warped, cantilevered, and standing up in space. The temperature sensor measures heat quantity transported from the heating unit. Distribution of an atmosphere surrounding an object surface with respect to the object surface, and the transportation state of the atmosphere are measured by using at least one of temperature, humidity, a direction or velocity of flow, pressure, and composition of gas in the atmosphere. Behavior of the gas adhering and aggregating onto the object surface, and behavior of aggregated liquid undergoing transpiration from the object surface are detected, based on the distribution and the transportation state measured.
    Type: Grant
    Filed: July 6, 2006
    Date of Patent: April 22, 2008
    Assignee: Ricoh Company, Ltd.
    Inventors: Junji Manaka, Kazutoshi Nagai
  • Patent number: 7360415
    Abstract: A thermal type air flow meter that makes it possible to precisely and easily determine whether a sensor element is a non-defective or a defective by screening is provided. First and second diaphragm sections composed of an electrical insulating film are formed in a semiconductor substrate. A heating resistor and a resistor for intake air temperature sensor are disposed on them to obtain a sensor element for thermal type air flow meters. The length of the short sides W1 of the rectangular first diaphragm section is made substantially equal to the length of the short sides of the second diaphragm section rectangular as well. Thus, the pressures applied to each of the diaphragm sections are substantially identical with each other in pressurization during screening.
    Type: Grant
    Filed: August 12, 2005
    Date of Patent: April 22, 2008
    Assignee: Hitachi, Ltd.
    Inventors: Hiroshi Nakano, Izumi Watanabe, Masamichi Yamada, Masahiro Matsumoto
  • Patent number: 7337661
    Abstract: A low-cost thermal flow meter that has good temperature characteristics and little variations. The thermal flow meter includes a sensor element including a heat-generating resistor and at least two temperature-measuring resistors disposed downstream and upstream. The sensor element is positioned in the flow of a measured medium. It also includes an adjusting means for adjusting a excess temperature (?Th=Th?Ta) of the heat-generating resistor, which is the difference between the temperature (Ta) of the measured medium and the temperature (Th) of the heat-generating resistor. The adjusting means adjusts the excess temperature (?Th) of the heat-generating resistor depending on the temperature of the measured medium such that the excess temperature becomes smaller as the temperature of the measured medium increases.
    Type: Grant
    Filed: February 13, 2006
    Date of Patent: March 4, 2008
    Assignee: Hitachi, Ltd.
    Inventors: Masamichi Yamada, Masahiro Matsumoto, Hiroshi Nakano, Izumi Watanabe, Keiichi Nakada