Structural Installation Or Mounting Means Patents (Class 73/493)
  • Patent number: 11178766
    Abstract: An inner module with a retainer is installed primarily inside a wireless earphone, including a circuit loop, an insulation seat to fix the circuit loop, and at least a retainer. The circuit loop includes at least a first circuit board, and at least a second circuit board which is extended from the first circuit board. The insulation seat includes at least a base plate to enclose the first circuit board, and a first side wall which is extended from the base plate. The first side wall is provided with a first positioning slot to accommodate the second circuit board. The retainer is fixed on the first side wall to fix the second circuit board in the first positioning slot. Therefore, the inner module is formed into a modularized design to simplify the assembly procedure of the wireless earphone.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: November 16, 2021
    Assignee: CONCRAFT HOLDING CO., LTD.
    Inventors: Chin-Hsing Lee, Jin-Bo Peng, Chang-Hsien Tung
  • Patent number: 11125580
    Abstract: A MEMS inertial sensor may include drive electrodes that apply a drive signal to a suspended spring-mass system for measurement of an inertial linear or angular force and self-test electrodes that apply a self-test signal to the suspended spring-mass system for monitoring the characteristics of the suspended spring-mass system during operation. The self-test signal may be modulated by a spreading sequence that prevents interference with the self-test signal by vibrations and other disturbance signals. The self-test signals and drive signals may be modulated with CDMA code sequences to multiplex signals that are at least partially processed by a common sense path.
    Type: Grant
    Filed: May 14, 2020
    Date of Patent: September 21, 2021
    Assignee: InvenSense, Inc.
    Inventors: Vito Avantaggiati, Adolfo Giambastiani
  • Patent number: 11126164
    Abstract: In the embodiments of the disclosure, a target signal which is a signal of a part used for subsequent processing is acquired from signals output from a device with higher accuracy. A control apparatus includes a first acquisition part which acquires a first signal of a time series output from a first device, a recording part which records a part of the first signal acquired by the first acquisition part, and a determination part which determines a timing at which the recording part records the first signal based on a preset predetermined condition.
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: September 21, 2021
    Assignee: OMRON Corporation
    Inventors: Hitoshi Oba, Minoru Takahashi
  • Patent number: 11067967
    Abstract: In the embodiments of the disclosure, a target signal which is a signal of a part used for subsequent processing is acquired from signals output from a device with higher accuracy. A control apparatus includes a first acquisition part which acquires a first signal of a time series output from a first device, a recording part which records a part of the first signal acquired by the first acquisition part, and a determination part which determines a timing at which the recording part records the first signal based on a preset predetermined condition.
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: July 20, 2021
    Assignee: OMRON Corporation
    Inventors: Hitoshi Oba, Minoru Takahashi
  • Patent number: 11056411
    Abstract: A chip packaging structure with better reliability includes a first protective layer, a redistribution layer formed on the first protective layer, at least one chip electrically connected to the redistribution layer, and an encapsulating layer covering the redistribution layer, the chip, and the side surfaces of the first protective layer. The first protective layer comprises an exposed surface and at least four side surfaces each connected to the exposed surface. A plurality of second openings is defined in the second protective layer, and a portion of the redistribution layer is exposed from the plurality of second openings.
    Type: Grant
    Filed: April 30, 2019
    Date of Patent: July 6, 2021
    Assignee: SOCLE TECHNOLOGY CORP.
    Inventors: Ching-Yu Ni, Hsiang-Hua Lu, Young-Way Liu
  • Patent number: 11041962
    Abstract: A Global Navigation Satellite System (GNSS) device for adaptive multi-rate navigation includes detection of a first set of signal measurements and a second set of signal measurements from a plurality of received and acquired GNSS baseband signals. The detected second set of measurements corresponding to a plurality of measurements associated with signal blockage of the baseband signals, are eliminated. A plurality of tracking loop values are computed only from for the detected first set of signal measurements, at a defined tracking loop rate based on the received baseband signals. A motion-path of the device computed based on at least the computed plurality of tracking loop values for the detected first set of signal measurements.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: June 22, 2021
    Assignee: SONY CORPORATION
    Inventor: Mohamed Youssef
  • Patent number: 11000751
    Abstract: A game ball locating system includes a ball with in internal MEMS module that communicates with transceivers positioned about the periphery of a playing field. A wireless radio frequency barrier is positioned below the playing field boundary, i.e., the sidelines and goal lines. The MEMS module includes a gyrometer and accelerometer that determine when the base ceases motion. The MEMS further measures signal strength emanating from the radio frequency barrier to determine when the ball crosses the playing field boundary. In either event, a controlling computer activates the transceivers, which transmit a signal to the MEMS module and the computer calculates the exact position of the ball.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: May 11, 2021
    Inventor: Earle Eugene Baillie
  • Patent number: 10976162
    Abstract: There is provided an information processing apparatus including an absolute position acquiring section that acquires an absolute position of a user, an acquiring section that acquires a first value indicating a walking tempo of the user who is walking, a calculation section that calculates a second value indicating a step or a traveling speed of the user by using, as a trigger, movement of a predetermined distance based on the absolute position, and a learning section that learns a correspondence between the first value and the second value by using the second value calculated.
    Type: Grant
    Filed: June 25, 2012
    Date of Patent: April 13, 2021
    Assignee: Sony Corporation
    Inventor: Masato Kimishima
  • Patent number: 10914855
    Abstract: A geomorphological structure monitoring system is disclosed, which comprises a supporting base having an accommodating space and a plurality of through holes, and at least a portion of the supporting base is embedded under a ground; a plurality of sensing devices arranged in the accommodating space vertically and embedded under the ground, the sensing devices may generate a sensing signal when the sensing devices are exposed from the ground due to the structural change of the ground; a signal processing device receiving and processing the sensing signal; and a transmission device connecting the sensing devices in series and the signal processing device.
    Type: Grant
    Filed: August 20, 2018
    Date of Patent: February 9, 2021
    Assignee: NATIONAL APPLIED RESEARCH LABORATORIES
    Inventors: Yung-Bin Lin, Tai-Shan Liao, Kuo-Chun Chang
  • Patent number: 10906801
    Abstract: An integrated device includes: a first die; a second die coupled in a stacked way on the first die along a vertical axis; a coupling region arranged between facing surfaces of the first die and of the second die, which face one another along the vertical axis and lie in a horizontal plane orthogonal to the vertical axis, for mechanical coupling of the first and second dies; electrical-contact elements carried by the facing surfaces of the first and second dies, aligned in pairs along the vertical axis; and conductive regions arranged between the pairs of electrical-contact elements carried by the facing surfaces of the first and second dies, for their electrical coupling. Supporting elements are arranged at the facing surface of at least one of the first and second dies and elastically support respective electrical-contact elements.
    Type: Grant
    Filed: July 11, 2019
    Date of Patent: February 2, 2021
    Assignee: STMICROELECTRONICS S.r.l.
    Inventors: Enri Duqi, Lorenzo Baldo, Domenico Giusti
  • Patent number: 10871267
    Abstract: The lamp body structure for the saddle riding vehicle includes a taillight, and a cover covering the taillight from the periphery. The cover includes a pair of rear-side turn signal lamps fixed to the cover such as to be located on both left and right sides of the taillight. The rear-side turn signal lamp is provided with a fixture for fixing the rear-side turn signal lamp to the cover. The taillight is inserted into an opening provided in the cover, whereby a lens is exposed to outside and is covered by the cover from the periphery. The rear-side turn signal lamp includes a guard section covering the fixture.
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: December 22, 2020
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Takahiro Matsumoto, Tomohiro Kudo
  • Patent number: 10861798
    Abstract: Methods for an embedded vibration management system are disclosed and may include fabricating a semiconductor package that supports vibration management by forming an array of vibration absorbing structures, placing the array proximate to a leadframe comprising two-legged supported leads, placing a semiconductor device above the leadframe, and encapsulating the semiconductor device and the leadframe. Each vibration absorbing structure may comprise a mass element formed on a material with lower density than that of the mass element. The array may be placed on a top, a bottom, or both surfaces of the leadframe. Sections of the array may be placed symmetrically with respect to the semiconductor device. The vibration absorbing structures may be cubic in shape and may be enclosed in an encapsulating material. The two-legged supported leads may be formed by bending metal strips with holes. The vibration absorbing structures may be exposed to the exterior of the semiconductor package.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: December 8, 2020
    Assignee: Amkor Technology, Inc.
    Inventors: Bora Baloglu, Adrian Arcedera, Marc Alan Mangrum, Russell Shumway
  • Patent number: 10775402
    Abstract: An apparatus includes a sensor assembly and a housing assembly. The sensor assembly may have (i) a package surrounding a sensor and (ii) a plurality of terminals integrated with the package. The housing assembly may have (i) a first cavity configured to receive the sensor assembly, (ii) a second cavity configured to receive an electrical connector, (iii) a plurality of ports in communication between the first cavity and the second cavity and (iv) a location feature configured to orient the housing assembly while the housing assembly is mounted to a structure. At least one rib may apply at least one force on the sensor assembly to hold the sensor assembly in the first cavity. The sensor may be outside a plane of the force. The terminals may extend through the ports from the first cavity to the second cavity.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: September 15, 2020
    Assignee: VEONEER US INC.
    Inventors: Jacob Pusheck, Joshua R. Forwerck
  • Patent number: 10699542
    Abstract: An electronic motion detection device (1) comprises a support structure (2) adapted to be fixed to a wall and a spherical body (3), which is rotatably supported by the support structure (2) and adapted to be locked in a plurality of spatial orientations. A detection member (4) comprises a sensitive element such as a radar antenna and an interface (44) configured to exchange configuration data. Such member is adapted to be inserted into a seat (31) of the spherical body (3) in a direction of insertion (X-X), and may be locked to the seat (31) of the spherical body (3) in an operating position ad in a configuration position.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: June 30, 2020
    Assignee: INXPECT S.P.A.
    Inventors: Luca Salgarelli, Giuseppe Bellandi
  • Patent number: 10681821
    Abstract: Techniques for constructing a wafer based module are provided herein. For example, the techniques include providing a substrate, forming a pattern of conductive material relative to at least one of a surface plane of the substrate and an internal location within the substrate with the pattern of the conductive material including at least an exposed portion, mounting at least one electronic module to the exposed portion of the pattern of the conductive material, orienting the substrate orthogonal relative to a planar mounting surface such that the surface plane of the substrate is substantially orthogonal to the planar mounting surface, mounting one or more additional electronic modules on the planar mounting surface; and forming the semiconductor device by encapsulating the substrate, including the pattern of conductive material, the at least one electronic module and the one or more additional electronic modules within a mold compound.
    Type: Grant
    Filed: October 16, 2014
    Date of Patent: June 9, 2020
    Assignee: THE CHARLES STARK DRAPER LABORATORY, INC.
    Inventor: Maurice S. Karpman
  • Patent number: 10634526
    Abstract: A sensor module contains a sensor unit, a sensor cover, and a main body. The sensor unit has a sensor surface and a base surface. The sensor cover covers the sensor surface and at least a section of the base surface. The sensor cover is connected to the base surface and/or the main body by a fused connection. The main body is connected at least to the base surface of the sensor unit by a fused connection with a selectable relative position in relation to the sensor cover. Pre-mounting of the sensor unit in a sensor cover and advantageous encapsulation of a sensor can thus be achieved.
    Type: Grant
    Filed: June 24, 2015
    Date of Patent: April 28, 2020
    Assignee: Conti Temic microelectronic GmbH
    Inventors: Juergen Henniger, Matthias Keuten, Matthias Wieczorek
  • Patent number: 10627233
    Abstract: An inertia measurement unit including a housing assembly, a weight block assembly, a circuit board, and a signal line. The housing assembly includes a cavity and a first opening in communication with the cavity. The weight block assembly is arranged in the cavity of the housing assembly. The weight block assembly includes an inner chamber and a second opening in communication with the inner chamber. The circuit board is arranged in the inner chamber of the weight block assembly. The signal line is coupled to a first edge of the circuit board and extends out of the weight block assembly through the second opening and out of the housing assembly through the first opening. At least one of the first opening or the second opening is located proximal to a second edge of the circuit board that is different from the first edge of the circuit board.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: April 21, 2020
    Assignee: SZ DJI TECHNOLOGY CO., LTD.
    Inventors: Jiangang Feng, Yin Tang
  • Patent number: 10611629
    Abstract: A microelectromechanical device includes: a body accommodating a microelectromechanical structure; and a cap bonded to the body and electrically coupled to the microelectromechanical structure through conductive bonding regions. The cap including a selection module, which has first selection terminals coupled to the microelectromechanical structure, second selection terminals, and at least one control terminal, and which can be controlled through the control terminal to couple the second selection terminals to respective first selection terminals according, selectively, to one of a plurality of coupling configurations corresponding to respective operating conditions.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: April 7, 2020
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Giorgio Allegato, Barbara Simoni, Carlo Valzasina, Lorenzo Corso
  • Patent number: 10597953
    Abstract: A sensor unit for a fingerboard latch assembly comprising a latch bracket and a latch rotatably mounted on the latch bracket comprises a sensor arranged to sense the orientation of the latch and a wireless, optical or other communication unit arranged to communicate the orientation of the latch sensed by the sensor. The sensor unit may be mountable on the latch and comprise an orientation sensor arranged to take measurements that are dependent on the orientation of the sensor unit, and a processor arranged to derive an orientation signal representing the orientation of the latch from the measurements, the communication unit being arranged to communicate the orientation signal. A monitoring system receives the sensed orientations from plural sensor units.
    Type: Grant
    Filed: July 18, 2018
    Date of Patent: March 24, 2020
    Assignee: Salunda Limited
    Inventors: Alan Patrick John Finlay, John Mark Newton, Andrew Henry John Larkins, Mathew William Davis, Grant Nicholls
  • Patent number: 10509051
    Abstract: A physical quantity sensor includes: a detection element that outputs a sensor signal in accordance with a physical quantity; and a mount member. The detection element includes a sensor portion that has a first surface, includes a movable electrode, and a fixed electrode, and outputs the sensor signal, and a cap portion that has a first surface and is bonded with the sensor portion. Each of the first surface of the sensor portion and the first surface of the cap portion is mounted on the mount member, and the detection element detects the physical quantity. An electrode, which is connected with the movable electrode and connected with a circuit portion, and an electrode, which is connected with the fixed electrode and connected with the circuit portion, are provided on a side surface continued to the first surface of the cap portion.
    Type: Grant
    Filed: January 7, 2016
    Date of Patent: December 17, 2019
    Assignee: DENSO CORPORATION
    Inventors: Kiyomasa Sugimoto, Naoki Yoshida
  • Patent number: 10497586
    Abstract: A semiconductor device has a U terminal with an internal joint portion at one end that is joined to a circuit board, an intermediate portion that is embedded in a case, and an external joint portion at another end that is exposed from the case, the U terminal being provided with a shock absorbing portion that is positioned between an inner surface of the case and the internal joint portion and absorbing stress that acts upon the internal joint portion. Due to the presence of the shock absorbing portion, even when the entire semiconductor device deforms or there is local deformation such that stress becomes concentrated at the joined surfaces of the internal joint portion and the circuit board, the stress is absorbed by the shock absorbing portion.
    Type: Grant
    Filed: June 16, 2017
    Date of Patent: December 3, 2019
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Yuta Tamai, Fumihiko Momose
  • Patent number: 10472098
    Abstract: Embodiments of Reaction Wheel Assembly (RWA) systems are provided, which include multi-faceted bracket structures to which RWAs are mounted. In one embodiment, the RWA system includes a bracket structure, which is assembled from multiple (e.g., two to four) interchangeable panels. Each bracket panel may define or include a mount bracket to which an RWA is mounted. In certain embodiments, the bracket panels may include integral bearing cartridge features, which contain the spin bearings of the RWAs. The interchangeable panels may have interconnect features, which align and which possibly interlock to position the panels in a precise angular relationship when the multi-faceted bracket structure is assembled. In other embodiments wherein the bracket structure is assembled from two interchangeable panels or produced as a single piece, the multi-faceted bracket structure may have a peaked form factor supportive of two RWAs, which are mounted to the bracket structure in a back-to-back relationship.
    Type: Grant
    Filed: October 25, 2016
    Date of Patent: November 12, 2019
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Terence Marshall, Thom Kreider, Paul Buchele
  • Patent number: 10470328
    Abstract: In order to configure a housing (3) for a sensor received in the housing as deformation stable as possible the housing is made integrally in one piece from metal instead of being made from plastic and furthermore the pass through openings (6a, b) for attaching the sensor by bolting to another component are sized and positioned so that impartible forces are not able to deform the housing (3) which has a defined stability.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: November 5, 2019
    Assignee: ASM Automation Sensorik Messtechnik GmbH
    Inventor: Klaus Manfred Steinich
  • Patent number: 10375228
    Abstract: Methods and systems for improving signal reception and call quality by detecting a user's handedness of holding a mobile device during a call are described. Motion data of the mobile device can be collected by one or more motion sensor. A screen tilt angle can be determined and compared with a threshold tilt angle. A screen swivel angle can be determined and compared with a threshold swivel angle. A call handedness can be determined based on the screen swivel angle. One or more parameters of an antenna can be adjusted based on the call handedness.
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: August 6, 2019
    Assignee: Apple Inc.
    Inventors: Xiaoyuan Tu, Purvi J. Desai, Maulik V. Choksi, Anil Kandangath
  • Patent number: 10332318
    Abstract: To determine the extent of the damage to a vehicle after a crash, a vehicle treatment system may determine a change in position of a vehicle part based on one or more spatial sensors attached to the vehicle part. The change in position of the vehicle part may be compared to previous change in position data for the same or similar type of vehicle part, to determine the extent of the damage to the vehicle part. Additionally, the vehicle treatment system may determine the extent of the damage for all vehicle parts to determine an overall extent of the damage to the vehicle after the crash.
    Type: Grant
    Filed: April 26, 2016
    Date of Patent: June 25, 2019
    Assignee: STATE FARM MUTUAL AUTOMOBILE INSURANCE COMPANY
    Inventor: William J. Leise
  • Patent number: 10330695
    Abstract: A sensor unit for a vehicle includes a sensor circuit, a main part that supports the sensor circuit with at least one sensor contact, a connection cable, and a pot-shaped sleeve. The main part includes a sensor contact, a cable contact, and common contact support. The sensor contact is positioned on a first end of the contact support, and the cable contact is positioned on a second end of the contact support. The sensor contact is electrically connected to the at least one sensor contact via at least one sensor counter contact, and the cable contact is electrically connected to the connection cable via at least one cable contact. The sensor circuit is arranged on an end region of the contact support such that the sensor circuit is oriented in a predetermined detection direction. The detection direction is based on a bending angle of the end region relative to a longitudinal axis of the main part. The pot-shaped sleeve is fixed to the main part, and surrounds the sensor contact and the sensor circuit.
    Type: Grant
    Filed: December 4, 2014
    Date of Patent: June 25, 2019
    Assignee: Robert Bosch GmbH
    Inventors: Ronald Steinbrink, Stefan Ortmann, Conrad Haeussermann, Anwar Hegazi, Andreas Fink, Bernd Lutz, Mirko Scheer
  • Patent number: 10156445
    Abstract: An inertial measurement device comprising a housing, a plate connected to the housing via a first stage of suspension, an inertial measurement unit comprising vibrating sensors having predetermined first resonant modes of vibration and mounted on the plate via a second stage of suspension; the first stage has a resonant frequency lower than a bandwidth of the inertial measurement unit, and the second stage has a resonant frequency higher than a resonant frequency of the first stage and lower than the first resonant modes of the vibrating sensors, the first stage having four resilient suspension elements and a center of stiffness corresponding substantially to the center of gravity of the assembly formed by the plate, the second stage, and the inertial measurement unit; the second stage having one to three resilient suspension elements.
    Type: Grant
    Filed: July 26, 2016
    Date of Patent: December 18, 2018
    Assignee: SAFRAN ELECTRONICS & DEFENSE
    Inventors: Yannick Foloppe, Guillaume Giboury
  • Patent number: 10142718
    Abstract: Various embodiments provide for an integrated temperature sensor and microphone package where the temperature sensor is located in, over, or near an acoustic port associated with the microphone. This placement of the temperature sensor near the acoustic port enables the temperature sensor to more accurately determine the ambient air temperature and reduces heat island interference cause by heat associated with the integrated circuit. In an embodiment, the temperature sensor can be a thermocouple formed over a substrate, with the temperature sensing portion of the thermocouple formed over the acoustic port. In another embodiment, the temperature sensor can be formed on an application specific integrated circuit that extends into or over the acoustic port. In another embodiment, a thermally conductive channel in a substrate can be placed near the acoustic port to enable the temperature sensor to determine the ambient temperature via the channel.
    Type: Grant
    Filed: September 16, 2015
    Date of Patent: November 27, 2018
    Assignee: Invensense, Inc.
    Inventors: Anthony D. Minervini, Kieran Harney, Aleksey S. Khenkin, Baris Cagdaser
  • Patent number: 10131535
    Abstract: A method for fabricating a thermally isolated microelectromechanical system (MEMS) structure is provided. The method includes processing a first wafer of a first material with a glass wafer to form a composite substrate including at least one sacrificial structure of the first material and glass; forming a MEMS device in a second material; forming at least one temperature sensing element on at least one of: the composite substrate; and the MEMS device; and etching away the at least one sacrificial structure of the first material in the composite substrate to form at least one thermally isolating glass flexure. The MEMS device is thermally isolated on a thermal isolation stage by the at least one thermally isolating glass flexure. The at least one temperature sensing element in on a respective at least one of: the thermal isolation stage; and the MEMS device.
    Type: Grant
    Filed: July 22, 2015
    Date of Patent: November 20, 2018
    Assignee: Honeywell International Inc.
    Inventors: John R. Reinke, Grant H. Lodden
  • Patent number: 10047551
    Abstract: A door closer system having a door closer that includes at least one sensor configured to sense an operating characteristic or condition relating to the door closer including a position or speed of displacement of at least a portion of the door closer or an associated entryway device. The sensor(s) can also provide information relating to the performance or condition of one or more components of the door closer, such as the operation of a backcheck mechanism, as well as tracking the number of door cycles. Information obtained by the sensor(s) of the door closer system can be communicated to a lockset device of an entryway control system. The lockset device can be configured to communicate information received from the door closer system to an access control system, which can in turn provide the communicated information to a management system.
    Type: Grant
    Filed: May 15, 2017
    Date of Patent: August 14, 2018
    Assignee: Schlage Lock Company LLC
    Inventor: Brian C. Eickhoff
  • Patent number: 10041532
    Abstract: A sensor device for monitoring a component of interest, including at least one sensor for measuring at least one parameter indicative of condition of the component of interest, signal processing device for processing the signals of the sensor, a housing for at least the signal processing device and a mounting feature for mounting the sensor device close to the component of interest. The mounting feature can include a bolt and bracket having a first portion including an opening for inserting the bolt in an insertion direction and a second portion with a surface parallel to the insertion direction configured to mount the housing.
    Type: Grant
    Filed: December 7, 2015
    Date of Patent: August 7, 2018
    Assignee: AKTIEBOLAGET SKF
    Inventors: Andrew Campbell, Allan Thomson
  • Patent number: 10006929
    Abstract: A methods is provided for reliable and accurate detection of opening or closing of doors or drawers using output signals generated by a sensor, the output signals directly or indirectly representative of the acceleration of the sensor over time. Areas under a curve for acceleration, or representations thereof, are determined and occurrence of movement events identified through comparison of calculated areas with certain thresholds. Areas are considered which span between zero crossing points of the acceleration curve, such that all elements of the corresponding sum are of the same sign, and consequent area signals have maximal amplitude. Pairs of substantially equal and opposite area signals may be sought, occurring within a given time separation, these characteristic of an opening or closing motion, consisting of a first acceleration in a first direction followed by a second in an opposing direction. Apparatus for the reliable detection of opening or closing events is also provided.
    Type: Grant
    Filed: October 14, 2015
    Date of Patent: June 26, 2018
    Assignee: KONINKLIJKE PHILIPS N.V.
    Inventor: Warner Rudolph Theophile Ten Kate
  • Patent number: 9828241
    Abstract: A manufacturing method of a MEMS sensor includes forming a first substrate, wherein the first substrate includes a lower electrode provided at one surface thereof, forming a second substrate, wherein the second substrate includes a first concave-convex portion provided at one surface thereof, first-bonding one surface of the first substrate and one surface of the second substrate to face each other, forming a third substrate, wherein the third substrate includes an upper electrode provided at one surface thereof, second-bonding another surface of the second substrate and one surface of the third substrate to face each other, and forming an electrode line on another surface of the third substrate to be connected to the lower electrode and the upper electrode.
    Type: Grant
    Filed: June 29, 2016
    Date of Patent: November 28, 2017
    Assignee: HYUNDAI MOTOR COMPANY
    Inventor: Ilseon Yoo
  • Patent number: 9763344
    Abstract: An electronic module for a vehicle includes a covering element, a component-carrier printed circuit board element, a carrier element having a first side and a second side, a printed circuit board element, and at least one contact-connection element. The contact-connection element is configured to provide a conductive contact-connection between the component-carrier printed circuit board element and the printed circuit board element. The covering element and component-carrier printed circuit board element are positioned on the first side of the carrier element, and the printed circuit board element is positioned on the second side of the carrier element. The carrier element has at least one opening, and the contact-connection element is led through the opening.
    Type: Grant
    Filed: September 4, 2012
    Date of Patent: September 12, 2017
    Assignee: Robert Bosch GmbH
    Inventor: Harald Ott
  • Patent number: 9757051
    Abstract: At least one embodiment is directed to a tracking system for the muscular-skeletal system. The tracking system can identify position and orientation. The tracking system can be attached to a device or integrated into a device. In one embodiment, the tracking system couples to a handheld tool. The handheld tool with the tracking system and one or more sensors can be used to generate tracking data of the tool location and trajectory while measuring parameters of the muscular-skeletal system at an identified location. The tracking system can be used in conjunction with a second tool to guide the second tool to the identified location of the first tool. The tracking system can guide the second tool along the same trajectory as the first tool. For example, the second tool can be used to install a prosthetic component at a predetermined location and a predetermined orientation. The tracking system can track hand movements of a surgeon holding the handheld tool within 1 millimeter over a path less than 5 meters.
    Type: Grant
    Filed: December 7, 2015
    Date of Patent: September 12, 2017
    Assignee: ORTHOSENSOR INC.
    Inventors: Marc Stein, Glen Vaughn
  • Patent number: 9727134
    Abstract: An information handling system may have two display screens including a first integrated display device and a second integrated display device attached via a hinge. A processor determines a first relative orientation of the first integrated display device to the second integrated display device from a plurality of orientation sensors and further determines working software application context by detecting at least one software application running on the information handling system. The system further includes a controller module deploys a power savings strategy. For example, the controller may restrict power usage to the first or second integrated display device based on the first relative orientation and the working software application context.
    Type: Grant
    Filed: October 29, 2013
    Date of Patent: August 8, 2017
    Assignee: Dell Products, LP
    Inventors: Deeder M. Aurongzeb, Lawrence E. Knepper, Rex W. Bryan, Preeth K. Srinivasan
  • Patent number: 9717944
    Abstract: There is provided a health promotion system using a wireless and ropeless jump rope. When a plurality of users use a plurality of wireless and ropeless jump rope apparatuses, each wireless and ropeless jump rope apparatus transmits each user's weight, the number of jumps made by the user and the time of using the wireless and ropeless jump rope to an external health promotion server. The health promotion server analyzes the user's weight, the number of jumps made by the user and the time of using the wireless and ropeless jump rope as transmitted and provides an instructor with the information of the number of jumps made by the user and the analyzed health-relevant data. The instructor who receives the information of the number of jumps made by the user and the analyzed health-relevant data is able to improve the health of the user.
    Type: Grant
    Filed: August 27, 2015
    Date of Patent: August 1, 2017
    Assignee: FAMSPO CO. LTD.
    Inventor: Bong Sam Jeon
  • Patent number: 9689885
    Abstract: A sensor unit includes a sensor and a mount board on which the sensor is mounted. The mount board includes a mount terminal connected to a terminal provided in the sensor and a wiring extending from the mount terminal. The wiring is not provided in a region where the sensor and the mount board overlap each other when viewed in plan.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: June 27, 2017
    Assignee: Seiko Epson Corporation
    Inventors: Masayasu Sakuma, Taketo Chino
  • Patent number: 9685593
    Abstract: A housing for a semiconductor chip has a front side and a rear side opposite the front side, wherein the front side has a fastening area for the semiconductor chip; the rear side has a mounting area to mount the housing, wherein the mounting area runs obliquely to the fastening area; and the rear side has a resting area running parallel to the fastening area.
    Type: Grant
    Filed: November 13, 2014
    Date of Patent: June 20, 2017
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Stephan Haslbeck, Martin Haushalter
  • Patent number: 9664516
    Abstract: Improved sensing devices are provided for determining the spatial disposition of a movable object. In one aspect, an apparatus for determining a spatial disposition of a movable object comprises: a support base configured to be carried by a movable object; one or more accelerometers coupled to the support base via a first damping element configured to damp motion of the one or more accelerometers; and one or more gyroscopes coupled to the support base via a second damping element configured to damp motion of the one or more gyroscopes, wherein an amount of motion damping provided by the first damping element is greater than an amount of motion damping provided by the second damping element.
    Type: Grant
    Filed: April 25, 2014
    Date of Patent: May 30, 2017
    Assignee: SZ DJI TECHNOLOGY CO., LTD.
    Inventors: Jian yu Song, Ren li Shi, Tao Wang
  • Patent number: 9618532
    Abstract: An inertial sensor having a body with an excitation coil and a first sensing coil extending along a first axis. A suspended mass includes a magnetic-field concentrator, in a position corresponding to the excitation coil, and configured for displacing by inertia in a plane along the first axis. A supply and sensing circuit is electrically coupled to the excitation coil and to the first sensing coil, and is configured for generating a time-variable flow of electric current that flows in the excitation coil so as to generate a magnetic field that interacts with the magnetic-field concentrator to induce a voltage/current in the sensing coil. The integrated circuit is configured for measuring a value of the voltage/current induced in the first sensing coil so as to detect a quantity associated to the displacement of the suspended mass along the first axis.
    Type: Grant
    Filed: March 25, 2016
    Date of Patent: April 11, 2017
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Giulio Ricotti, Alberto Pagani, Fulvio Vittorio Fontana, Ubaldo Mastromatteo
  • Patent number: 9581445
    Abstract: A torsional gyroscope is provided that includes: a pickup tine and a drive tine of piezoelectric material, pickup electrodes disposed along the pickup tine, drive electrodes disposed along the drive tine, and a drive mass. The drive tine has a first end attached to the pickup tine and is transverse to the drive tine. The drive mass is attached to a second end of the drive tine opposite the first end of the drive tine. An electric field applied to the drive electrodes induces a rotational oscillation of the drive tine causing the drive tine to rotate about the first axis, inducing the drive mass to rotate about the first axis. Angular rotation of the drive mass along a third axis induces a torque in the pickup tine that induces an electric field in the pickup tine that induces an electrical charge to build up in the pickup electrodes.
    Type: Grant
    Filed: June 4, 2012
    Date of Patent: February 28, 2017
    Assignee: Systron Donner Inertial, Inc.
    Inventor: Chris Painter
  • Patent number: 9538939
    Abstract: A system for analyzing a user's strides has a first sensor assembly (EC1) furnished within a housing, with a triaxial magnetometer (3M) fixed to the housing (BT), which is associated with a moving frame (LF). First fixing means (MF1) fixes the first sensor assembly (EC1) to a leg segment of the user. Processing means (MT) calculates the angle of yaw (YawGF) and/or of pitch (PitchGF) and/or of roll (RollGF) of the first sensor assembly (EC1), and calculates the corresponding angular temporal variation or variations ( ? Yaw GF ? t , ? Pitch GF ? t , ? Roll GF ? t ) , in a fixed global frame (GF) relative to the terrestrial frame, on the basis of the measurements of the triaxial magnetometer (3M) delivered in the moving frame (LF).
    Type: Grant
    Filed: April 8, 2011
    Date of Patent: January 10, 2017
    Assignee: Movea
    Inventors: Cyrille Soubeyrat, Anne Frassati
  • Patent number: 9452922
    Abstract: A microelectromechanical device includes: a body accommodating a microelectromechanical structure; and a cap bonded to the body and electrically coupled to the microelectromechanical structure through conductive bonding regions. The cap including a selection module, which has first selection terminals coupled to the microelectromechanical structure, second selection terminals, and at least one control terminal, and which can be controlled through the control terminal to couple the second selection terminals to respective first selection terminals according, selectively, to one of a plurality of coupling configurations corresponding to respective operating conditions.
    Type: Grant
    Filed: June 19, 2013
    Date of Patent: September 27, 2016
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Giorgio Allegato, Barbara Simoni, Carlo Valzasina, Lorenzo Corso
  • Patent number: 9387096
    Abstract: Methods and systems are used for monitoring a global position or location of a prosthetic or orthotic device and to provide feedback control of the device. Certain methods may employ remote transmitting devices and receivers to recognize when a prosthetic or orthotic device user is in a moving vehicle and, therefore, initiate automatic shut-off, driving mode, or relaxed mode. Other methods may employ remote transmitting devices and receivers to identify the global position of the prosthetic or orthotic device, compare the global position to a stored terrain mapped database and output feedback control instructions and/or alerts to the prosthetic or orthotic device based at least in part on the stored terrain mapping information.
    Type: Grant
    Filed: June 16, 2010
    Date of Patent: July 12, 2016
    Assignee: Ossur HF
    Inventors: Ragnar Sverrisson, Arinbjörn V. Clausen
  • Patent number: 9351892
    Abstract: A sonic percussion therapy system includes a patient support apparatus and a control module. The sonic percussion structure is attached to the inflatable cell so that the sonic percussion structure moves in response to movement of the inflatable cell. The control module includes a sonic percussion control module and a position control module. The sonic percussion control module independently controls frequency and/or intensity of at least one of the plurality of sonic percussion structures. The position control module selectively raises and lowers at least one of the plurality of sonic percussion structures with respect to a patient surface.
    Type: Grant
    Filed: April 25, 2008
    Date of Patent: May 31, 2016
    Assignee: KAP Medical
    Inventors: Raj K. Gowda, Dan F. Rosenmayer, Richard Jeff Garcia
  • Patent number: 9206032
    Abstract: The present invention discloses a MEMS chip which includes a device wafer and a cap wafer. The device wafer includes a first substrate and a MEMS device. The MEMS device includes a movable structure. The cap wafer includes a second substrate, an elastic structure and a stopper. The stopper is connected to the second substrate by the elastic structure. The stopper constrains a movement of the movable structure, and when the movable structure contacts the stopper, the elastic structure provides a resilience force to the stopper.
    Type: Grant
    Filed: March 3, 2015
    Date of Patent: December 8, 2015
    Assignee: RICHTEK TECHNOLOGY CORPORATION
    Inventors: Yu-Fu Kang, Chiung-C. Lo
  • Patent number: 9146253
    Abstract: An acceleration sensor and an angular velocity sensor are sealed in respective pressure atmospheres suitable therefor in the process of a series of bonding steps, thereby improving the detection sensibilities of the sensors. A movable member 111 of an acceleration sensor 11 and a vibrator 121 of an angular velocity sensor 12 are fabricated on the same sensor wafer 10 with a wall 16 interposed therebetween. A cap wafer 20 is formed in which gaps 21, 22 corresponding to the movable member 111 of the acceleration sensor 11 and the vibrator 121 of the angular velocity sensor 12 are provided. Bumps 23 are disposed near the gap 22 of the angular velocity sensor 12. The acceleration sensor 11 is sealed at atmospheric pressure. Then, the angular velocity sensor 12 is subjected to high temperature and a high-load and is vacuum-sealed. Thereafter, cutting with a diamond grindstone and mounting of circuit substrates and a wiring substrate are performed to form a combined sensor.
    Type: Grant
    Filed: May 20, 2011
    Date of Patent: September 29, 2015
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Takanori Aono, Kengo Suzuki, Akira Koide, Masahide Hayashi
  • Patent number: 9140719
    Abstract: The terminal holding device includes an attaching unit to be attached to a vehicle, a holding unit which removably holds a terminal device in such a manner that a display unit of the terminal device is exposed and which includes a contact surface to be contact with the terminal device, an acceleration sensor which detects acceleration in a direction from a side of the contact surface to a side opposite to the contact surface, and a supplying unit which supplies a detection signal of the acceleration sensor to the terminal device.
    Type: Grant
    Filed: July 26, 2011
    Date of Patent: September 22, 2015
    Assignee: PIONEER CORPORATION
    Inventors: Yusuke Imasaka, Kenji Nakamura, Hideaki Takahashi, Yoshiaki Tsuchida, Hitoshi Yamazaki
  • Patent number: 9103930
    Abstract: A multiple axis sensor assembly includes an enclosure and encapsulated microelectromechanical system (MEMS) sensors. The encapsulated sensors are disposed inside the enclosure and are mounted in different orientations, which correspond to different axes of the sensor assembly. A controller of the sensor assembly is disposed in the enclosure and electrically coupled to the MEMS sensors.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: August 11, 2015
    Assignee: WESTERNGECO L.L.C.
    Inventors: Hans Paulson, Vidar A. Husom, Nicolas Goujon