Abstract: A micromechanical sensor having at least one movably mounted measuring element which is opposite at least one stationary electrode, the electrode being situated in a first plane, and being contacted by at least one printed conductor track which is situated in a second plane. A third plane is located between the first plane and the second plane, the third plane including an electrically conductive material.

Abstract: A door assembly includes a door panel connected to a door frame and pivotable about a pivot axis, a door latch coupled to the door panel and operable to selectively inhibit movement of the door from a closed position to an open position, and a sensor coupled to the door latch and operable to detect acceleration of the door and output acceleration data corresponding to the acceleration of the door panel in a first direction. A controller is coupled to the door latch and the sensor. The controller is operable to analyze the acceleration data to determine the cause of the acceleration.

Abstract: The first buffer portion provides a first base portion and a first outer wall provided on a peripheral edge of the first base portion. The second buffer portion provides a second base portion which provides a mounting surface outside to a measurement target, and a second outer wall provided on a peripheral edge of the second base portion. The buffer body provides the first base portion and a top surface of the second outer wall abutting against each other. A housing portion for the sensor portion is provided inside. A holding portion which holds the sensor portion is provided at least at a part of the top surface of at least one of the first buffer portion and the second buffer portion. The sensor portion is held by the holding portion.

Abstract: A device for electromechanical selection of an element from a plurality of elements, according to present invention has a housing in a form of a body of a regular shape, enabling the device to take N rest positions, where N is a natural number. Each of the rest positions corresponds to one element selected from N elements, wherein the device is adapted to electrically and optically transmit data regarding trajectory of its movement and rest positions, including indications of an accelerometer connected to a position analysis and identification module. At least one proximity sensor and at least one magnetometric sensor is further placed inside the housing, and filters are connected on the signal path between the accelerometer and the sensors and position analysis and identification module. The present invention is also directed to the method of electromechanical selection of an element from a plurality of elements.

Abstract: An electronic sensor has a sensor housing in which a chip module having a module housing is mounted. The module housing has terminal pins that protrude laterally outward, each having a tapering at its free end. In addition, at least one metallic bearer strip is provided that is fashioned, in a first end area, as a plug contact, and that has in a second end area for at least one terminal pin a respective spring-clamp contact point that forms a flexible press-in zone for the corresponding terminal pin.

Abstract: The present invention relates to an inertial sensor, preferably an acceleration sensor or multi-axis acceleration sensor as a microelectromechanical construction element, said sensor comprising a housing with at least one first gas-filled cavity in which a first detection unit is disposed moveably relative to the housing for detection of an acceleration to be detected, wherein the inertial sensor comprises a damping structure.

Abstract: An integrated inertial sensing device. The device includes a substrate member. The device also has a first inertial sensing device comprising at least a first material and configured to detect at least a first direction. The device has a second inertial sensing device comprising at least the first material and configured to detect at least a second direction. The device also has a third inertial sensing device comprising at least a quartz material and configured to detect at least a third direction. The three devices can be integrated to form an integrated inertial sensing device.

Abstract: A sensor unit includes a motion sensor which detects a motion of an object, outputs a detection value, and is mounted on the object through an attachment, a filter which receives the detection value, passes a given frequency band, and is able to change a cutoff frequency of the frequency band, and a control unit which controls the cutoff frequency, wherein the control unit determines the cutoff frequency in accordance with hardness of the attachment.

Abstract: This temporary support member for a sensor unit of a bearing assembly is stackable with a similar support member when a sensor unit is mounted on each one of the support member and the similar support member.

Abstract: A physical quantity sensor includes a sensing portion, a casing, a vibration isolating member, an electrically conductive portion, a pad and a bonding wire. The casing encases the sensing portion therein. The vibration isolating member is disposed between the sensing portion and the casing to reduce a relative vibration between the sensing portion and the casing. The bonding wire electrically connects the electrically conductive portion provided on the casing and the pad provided on a surface of the sensing portion. The bonding wire extends from the pad to the electrically conductive portion and includes a bend. The bonding wire is configured to satisfy a relation of 20×d?h, in which d is an outer diameter of the bonding wire, and h is a dimension of the bonding wire with respect to a direction perpendicular to the surface of the sensing portion.

Abstract: A sensor device includes: a sensor component including a package, connection terminals including first connection terminals on a terminal forming surface of the package and a sensor element housed in the package; and mounting leads including a one-end part coupled to one first connection terminal so that a main surface thereof faces a main surface of the one first connection terminal face; an intermediate part extending toward a mounting surface of the sensor device from the one-end part; and another-end part. The sensor component is tilted or orthogonal relative to the mounting surface. The connection terminals are provided along one of the sides forming an outline of the terminal forming surface, the one side being tilted or orthogonal with respect to the mounting surface. The intermediate part includes an angled part.

Abstract: A sensor for an intrusion detection fence of a taut wires type and a method implemented in its operation, wherein the sensor is a multi-axes accelerometer that is installed on the sensors' pole of the fence while inclined relative to the fence taut wire unto which it is connected, and the sensor is connected to fence taut wire via a movement converting means such that from an instant of loading the taut wire as happens when an intrusion attempt through it occurs, the movement converting means converts the movement of the taut wire unto a rotational movement of the sensor that is amenable to be sensed in at least two axes.

Abstract: A method for manufacturing a micromechanical component is described, the micromechanical component having a medium. The medium has settable and changeable volume-elastic properties and generally completely encloses a sensor module and/or a module housing. The medium preferably has a low-pass response.

Abstract: The present invention relates to a sensor apparatus (1) for determining both a cadence of a crank and a travelling speed of a bicycle. The sensor apparatus (1) comprises a housing (2), an accelerometer (4) with a first and second measurement axis (z, y) arranged substantially perpendicular to one another, capable of providing a first signal dependent on a first acceleration along the first measurement axis (z) and a second signal dependent on a second acceleration along the second measurement axis (y), a wireless transmitter (6), and a power source (8). The accelerometer (4), the wireless transmitter (6) and the power source (8) are contained in the housing (2) which comprises an attachment means (3) for attaching the housing (2) to a wheel of the bicycle.

Abstract: A mounting system for a MEMS device includes a proof mass selectively coupled to a substrate using a centrally located, single anchor mount that minimizes sensitivity to strain variations experienced by the MEMS device. The mounting system may include isolation cuts arranged in the proof mass to advantageously achieve a desired amount of strain isolation and to produce hinges that extend in opposite directions from the anchor mount. The single anchor mount is arranged to reduce a separation distance from a mid-point or centroid of the anchor mount to its perimeter as compared to conventional mounting schemes that have multiple anchor mounts positioned distally from a common mid-point.

Abstract: The present disclosure provides a method for fabricating a MEMS device including multiple bonding of substrates. In an embodiment, a method includes providing a micro-electro-mechanical systems (MEMS) substrate including a first bonding layer, providing a semiconductor substrate including a second bonding layer, and providing a cap including a third bonding layer. The method further includes bonding the MEMS substrate to the semiconductor substrate at the first and second bonding layers, and bonding the cap to the semiconductor substrate at the second and third bonding layers to hermetically seal the MEMS substrate between the cap and the semiconductor substrate. A MEMS device fabricated by the above method is also provided.

Abstract: The terminal holding device includes an attaching unit to be attached to a vehicle, a holding unit which removably holds a terminal device in such a manner that a display unit of the terminal device is exposed and which includes a contact surface to be contact with the terminal device, an acceleration sensor which detects acceleration in a direction from a side of the contact surface to a side opposite to the contact surface, and a supplying unit which supplies a detection signal of the acceleration sensor to the terminal device.

Abstract: An insert cover for a speed sensor module includes an elongated body having a length aligned along a longitudinal axis, the elongated body including a convex top surface and a uniform width along the length; a first portion emanating from the top surface at a first end of the elongated body; a second portion emanating from the top surface at a diametrically opposed second end of the elongated body; and a third portion emanating from the top surface between the first portion and the second portion; where each of the first, second, and third portions are orthogonal to the longitudinal axis.

Abstract: A microelectromechanical system device including anchors and mass is provided. Electrical interconnections are formed on the mass by using a insulation layer of mass, an electrical insulation trench and conductive through hole. The electrical interconnections replace the cross-line structure without adding additional processing steps, thereby reducing the use of the conductive layer and the electrical insulation layer. A method for fabricating the microelectromechanical system device is also provided.

Abstract: A sensor for an intrusion detection fence of a taut wires type and a method implemented in its operation, wherein the sensor is a tri-axes accelerometer that is installed on the sensors' pole of the fence while inclined relative to the fence taut wire unto which it is connected, and the sensor is connected to fence taut wire via a movement converting means such that from an instance of biasing the taut wire as happens when an intrusion attempt through it occurs, the movement converting means converts the movement of the taut wire unto a rotational movement of the sensor that is amenable to be sensed in all of its three axes.

Abstract: An angular rate sensor includes a metallic core board having a core meal layer made of a metal plate and a wiring layer including a wiring structure, a semiconductor device for detecting an angular rate fixed on the core metal layer, and a cap fixed to the wiring layer. The semiconductor device for detecting an angular rate is disposed in a hollow chamber formed by the cap and the metallic core board. The metallic core board, the semiconductor device, and the cap are molded with resin. Consequently, the angular rate sensor has a packaging structure in which electromagnetic noise resistance and moisture resistance are improved while stress applied to the semiconductor device for detecting an angular rate is reduced.

Abstract: Systems and methods for fabricating a multi-axis sensor are provided. In one implementation, a method comprises: fabricating a first die having a first active surface with first application electronics; fabricating a second die having a second active surface with second application electronics and a plurality of electrical connections that extend from the second application electronics to a side surface interface of the second die that is adjacent to the second active surface; aligning the side surface interface to be coplanar with the first active surface; and forming at least one electrical connection between the plurality of electrical connections and the first active surface.

Abstract: A stabilized field sensor apparatus collects field data, in particular magnetic field data, with reduced motion noise. The apparatus includes a tear drop shaped housing, a tow frame in the housing, a plurality of vibration isolating dampers spaced around the frame, a base assembly mounted to the dampers, a support pedestal having a bottom end fixed to the base assembly and an upper free end, a single spherical air bearing connected to the upper free end of the pedestal, an instrument platform with a lower hollow funnel having an upper inside apex supported on the air bearing for a one point support, principal and secondary gyro stabilizers for maintaining pivotal and rotational stability, and at least one field sensor mounted to the instrument platform for collecting the field data while being stabilized against motion noise including vibration, pivoting and rotation from the base assembly, from the tow frame and from the housing.

Abstract: A sensor system is provided having a base plate, a sensor module, a damping element and a support frame, the base plate having a main plane of extension and a recess that is perpendicular to the main plane of extension; the support frame being fastened in the recess; the damping element being situated between the support frame and the recess; and the sensor module further being pressed into the support frame in a form-locking and a force-locking manner.

Abstract: An inertial sensor capable of making pressure of a space in which an inertial sensor such as an acceleration sensor is placed to be higher than that during a sealing step and improving reliability is provided. The inertial sensor can be achieved by means of making an inertial sensor including a substrate, a movable portion on the substrate, a cap member which seals the movable portion so as to cover the movable portion, wherein a gas-generating material is applied to the movable portion side of the cap.

Abstract: A composite sensor includes: a package including a container and a lid; a plurality of spaces that is partitioned by at least the container and the lid, and has different pressures, the plurality of the spaces including a first space sealed at around an atmospheric pressure and a second space sealed at a depressurized state; an acceleration sensor element disposed in the first space; and a vibration type angular velocity sensor element disposed in the second space. In the sensor, the first space has a volume smaller than a volume of the second space.

Abstract: Sensor modules (12) including accelerometers (20) are placed on a physical structure (10) and tri-axial accelerometer data is converted to mechanical power (P) data (41) which then processed to provide a forewarning (57) of a critical event concerning the physical structure (10). The forewarning is based on a number of occurrences of a composite measure of dissimilarity (Ci) exceeding a forewarning threshold over a defined sampling time; and a forewarning signal (58) is provided to a human observer through a visual, audible or tangible signal. A forewarning of a structural failure can also be provided based on a number of occurrences of (Ci) above a failure value threshold.

Abstract: A substrate material having a mechanical filtering characteristic, the substrate material having at least one support region for supporting the substrate material. In addition, the substrate material includes a sensor region having sensor terminal contacts. Furthermore, the substrate material includes a separating region, which is coupled to the at least one support region and the sensor region and is situated between the at least one support region and the sensor region. In this context, the substrate material in the separating region has a structure different from the substrate material in the support region and/or in the sensor region, in order to form a mechanical filtering characteristic.

Abstract: Devices are provided which include a component assembly for detecting inward, outward and sideways door movement. A component of the assembly extending from a structure comprises a distal end for contacting a door face when the structure is arranged in proximity to the door face. Systems are provided which include a portable stand, a door movement sensor attached to the stand, a proximity sensor, and a user interface. The system is configured to transmit signals to the user interface when the proximity sensor has been placed a predetermined distance from a door face and when door movement occurs. Apparatuses are provided which include program instructions for receiving input regarding a number of entryways of a room and inhibiting commencement of a task for which an apparatus arranged in the room is configured to perform until a number of signals received from a door movement sensor equals the number of entryways.

Abstract: A composite sensor includes: a package including a container and a lid; a plurality of spaces that is partitioned by at least the container and the lid, and has different pressures, the plurality of the spaces including a first space sealed at around an atmospheric pressure and a second space sealed at a depressurized state; an acceleration sensor element disposed in the first space; and a vibration type angular velocity sensor element disposed in the second space. In the sensor, the first space has a volume smaller than a volume of the second space.

Abstract: A sensor device includes: a sensor component including a package, connection terminals including first connection terminals on a terminal forming surface of the package and a sensor element housed in the package; and mounting leads including a one-end part coupled to one first connection terminal so that a main surface thereof faces a main surface of the one first connection terminal face; an intermediate part extending toward a mounting surface of the sensor device from the one-end part; and another-end part. The sensor component is tilted or orthogonal relative to the mounting surface. The connection terminals are provided along one of the sides forming an outline of the terminal forming surface, the one side being tilted or orthogonal with respect to the mounting surface. The intermediate part includes an angled part.

Abstract: A method and apparatus for monitoring motion of a substantially rigid body relative to at a first location, in which linear and rotational motions are sensed by one or more motion sensors attached to the substantially rigid body at other locations. The sensed rotation is used to compensate for the angular and centripetal acceleration components in the sensed linear motion. In one embodiment, the components are estimated explicitly from the sensed rotation. In a further embodiment, the sensed rotations are used to estimate the relative orientations of two or more sensors, enabling the linear motions to be combined so as to cancel the angular and centripetal accelerations. A reference sensor may be used for in-situ calibration. When the substantially rigid body is a human head, the reference sensor may be coupled to a helmet or mouthguard.

Abstract: Systems and methods for potted shock isolation are provided. In once embodiment a shock isolation system comprises an isolator comprising an outer ring for mounting to an external housing, and an inner ring connected to the outer ring via an isolating element; and an inertial sensing assembly comprising: at least one circuit board secured to the inner ring of the isolator, the at least one circuit board further comprising a triad of gyroscopes and a triad of accelerometers; and a low durometer highly dampened supporting material encapsulating a first surface of the at least one circuit board.

Abstract: A system and method for analyzing a device that includes a mass configured for motion. The system includes a tri-axial accelerometer disposed to detect acceleration vectors of the device and to output three channels of acceleration data, and a user interface receiving the three channels of acceleration data. The user interface is configured to correlate the three channels of acceleration data with a reference frame defined by three orthogonal axes intersecting at a vertex, and includes a display and a selector. The display shows sets of options that represent dispositions of the device with respect to gravity, placements of the tri-axial accelerometer with respect to the device, and orientations of the tri-axial accelerometer with respect to the device. The selector selects one device disposition option, one tri-axial accelerometer placement option, and one tri-axial accelerometer orientation option.

Abstract: A sensor device includes: a sensor component including a package, connection terminals having first terminals on a terminal forming surface of the package, and a sensor element that has a detection axis and is housed in the package; a resin part covering the sensor component; and mounting leads, each of the mounting leads including, a one-end part formed by being folded so as to be coupled to one of the first connection terminals in the resin part so that a main surface of the one-end part and a main surface of the one of the first connection terminals face each other, an intermediate part extending toward a mounting surface of the sensor device from the one-end part, and an other-end part formed by being folded so as to be externally exposed from the resin part.

Abstract: A module operable to be mounted onto a surface of a board. The module includes a linear accelerometer to provide a first measurement output corresponding to a measurement of linear acceleration in at least one axis, and a first rotation sensor operable to provide a second measurement output corresponding to a measurement of rotation about at least one axis. The accelerometer and the first rotation sensor are formed on a first substrate. The module further includes an application specific integrated circuit (ASIC) to receive both the first measurement output from the linear accelerometer and the second measurement output from the first rotation sensor. The ASIC includes an analog-to-digital converter and is implemented on a second substrate. The first substrate is vertically bonded to the second substrate.

Abstract: A dynamic quantity sensor includes a sensor chip, a base member, and bumps. The sensor chip includes a semiconductor substrate, a sensor part, and sensor pads electrically coupled with the sensor part. The base member includes a base substrate and base pads disposed on the base substrate. The bumps mechanically and electrically couple the sensor pads and the base pads, respectively, in a state where the sensor chip is curved with respect to the base member. The sensor pads include input pads and output pads. The first surface of the semiconductor substrate includes a first portion and a second portion. The first portion is closer to the base substrate than the second portion is. At least one of the input pads is disposed on the first portion and at least one of the output pads is disposed on the second portion.

Abstract: Microstructures can be formed as patterned layers on a substrate and then erecting the microstructures out of the plane of the substrate. The microstructures may be formed over circuits in the substrate. In some embodiments the patterned layer provides resiliently-flexible members such as cantilevers or springs that can be buckled to permit an edge defined by the patterned layer to engage a surface of the substrate. In some embodiments deformation of the resiliently-flexible members results the edge being forced against the substrate. Such microstructures may be applied in a wide range of applications including supporting optical elements, sensors, antennas or the like out of the plane of a substrate. Examples of accelerometer structures are described.

Abstract: A microelectromechanical systems (MEMS) sensor device (184) includes a sensor portion (180) and a sensor portion (182) that are coupled together to form a vertically integrated configuration having a hermetically sealed chamber (270). The sensor portions (180, 182) can be formed utilizing different micromachining techniques, and are subsequently coupled utilizing a wafer bonding technique to form the sensor device (184). The sensor portion (180) includes one or more sensors (186, 188), and the sensor portion (182) includes one or more sensors (236, 238). The sensors (186, 188) are located inside the chamber (270) facing the sensors (236, 238) also located inside the chamber (270). The sensors (186, 188, 236, 238) are configured to sense different physical stimuli, such as motion, pressure, and magnetic field.

Abstract: An oscillating angular speed sensor includes a detector, a driving portion, and a separating portion. When an angular speed is generated while the detector is driven to oscillate by the driving portion, Coriolis force is applied to the detector. Therefore, the angular speed is detected based on a capacitance variation in accordance with a variation of an interval between a movable electrode and a fixed electrode of the detector. The separating portion is distanced from the detector and the driving portion, and is configured to separate a first space accommodating the detector and a second space accommodating the driving portion.

Abstract: An example geolocation system for mounting on a mammal incorporates simple sensing sleeves on the calves of the body support members, combined with an accelerometer based gravity direction and force sensing at the center of mass of the body. The example system is connected to a digital processing unit and a battery power supply to integrate the sensing to determine kinetic and potential energy of the body locomotion over time in a method that integrates out the aperiodic motion of the body about the center of mass, and uses the residual motion to measure the center of mass locomotion from a known point.

Abstract: A transducer (20) includes sensors (28, 30) that are bonded to form a vertically integrated configuration. The sensor (28) includes a proof mass (32) movably coupled to and spaced apart from a surface (34) of a substrate (36). The sensor (30) includes a proof mass (58) movably coupled to and spaced apart from a surface (60) of a substrate (56). The substrates (36, 56) are coupled with the surface (60) of substrate (56) facing the surface (34) of substrate (36). Thus, the proof mass (58) faces the proof mass (32). The sensors (28, 30) are fabricated separately and can be formed utilizing differing micromachining techniques. The sensors (28, 30) are subsequently coupled (90) utilizing a wafer bonding technique to form the transducer (20). Embodiments of the transducer (20) may include sensing along one, two, or three orthogonal axes and may be adapted to detect movement at different acceleration sensing ranges.

Abstract: Sensing a change in motion proximate to an arbitrarily-shaped surface via a single sensing element (e.g., a pressure sensor, an accelerometer) disposed on a flexible substrate having a sufficient mechanical coupling to the arbitrarily-shaped surface. The change in motion may include at least one of an acceleration, an orientation, a vibration shock and a falling process. In one example, the flexible substrate substantially conforms to the arbitrarily-shaped surface so as to facilitate intimate proximity to the arbitrarily-shaped surface. In another example, a coupling mechanism may mechanically couple the sensing element to the arbitrarily-shaped surface. One or more LEDs coupled to the sensing element may provide a visual cue representing impact or trauma to the surface based on different colors respectively corresponding to a degree of the impact or trauma.

Abstract: A capacitive semiconductor sensor includes a sensor chip, a circuit chip, a plurality of bumps, and a plurality of dummy bumps. The sensor chip includes a dynamic quantity detector, which has a detection axis in one direction. The circuit chip includes a signal processing circuit. The sensor chip and the circuit chip are coupled by flip-chip bonding through the plurality of bumps. Furthermore, the sensor chip and the circuit chip are mechanically coupled through the plurality of dummy bumps.

Abstract: A method for manufacturing a micromechanical component is described, the micromechanical component having a medium. The medium has settable and changeable volume-elastic properties and generally completely encloses a sensor module and/or a module housing. The medium preferably has a low-pass response.

Abstract: An electronic device includes a first electronic component having a terminal member and a second electronic component connected with the first electronic component. The terminal member includes a trunk portion, an external terminal portion that extends in a straight direction from the trunk portion to be connected with a lead wire at its connection end and a U-shaped internal terminal portion that has one side extending from the trunk portion and the other side extending in a direction opposite to the straight direction and connected with the second electronic component at its connection end.

Abstract: A bank angle detecting device includes an angular velocity sensor for detecting a roll rate and a yaw rate of the vehicle, a roll rate estimating circuit for calculating an estimated roll rate, which is an angular velocity about a forward and rearward axis, on the basis of the roll rate, the yaw rate and a travelling speed, a bank angle estimator for calculating an estimated bank angle from the estimated roll rate, a straightforward travel determiner for determining a straightforward travelling condition on the basis of the estimated roll rate and an estimated yaw rate, a time-of-straight-forward-travel drift amount estimator for estimating a time-of-straight-forward drift amount from an output of the angular sensor in the event that the straightforward travel determiner determines a straightforward travel, and an angular velocity corrector for correcting the output of the angular velocity sensor with the time-of-straight-forward drift amount.

Abstract: An electronic control unit includes a sensor circuit board 30 which is mounted with sensors 33, 34 for detecting a predetermined physical quantity; a control circuit board 20 which controls an operation of an electric component on the basis of the physical quantity detected by the sensors 33, 34; and a housing 40 which accommodates the sensor circuit board 30 and the control circuit board 20, wherein at least one of the sensor circuit board 30 and the control circuit board 20 is mounted to a circuit board support stepped portion 47 formed in an inner surface of the housing 40 so that the sensor circuit board 30 and the control circuit board 20 are arranged in a layered state.

Abstract: Systems and methods for forming an electronic assembly are provided. A first inertial sensor having a first sense axis is attached to a bracket. A second inertial sensor having a second sense axis is attached to the bracket such that the second sense axis is substantially orthogonal to the first sense axis. The bracket is attached to a circuit board having at least one microelectronic device mounted thereto.

Abstract: A MEMS sensor includes a substrate having a MEMS structure movably attached to the substrate, a cap attached to the substrate and encapsulating the MEMS structure, and an electrode formed on the cap that senses movement of the MEMS structure.