Structural Installation Or Mounting Means Patents (Class 73/493)
  • Patent number: 7540193
    Abstract: A triaxial acceleration sensor module 100 includes: a hollow housing 30 provided with a partition plate 31 having a through-hole 32; a triaxial acceleration sensor 1 provided inside the housing 30; and a sensor driving IC 40 for driving the triaxial acceleration sensor 1. The triaxial acceleration sensor 1 includes: a frame 23; a weight member 22 provided inside the frame 23; a weight member supporting portion 15 for supporting the weight member 22 in a freely suspended manner; and a plurality of flexible beams each having piezo resistance elements 13 thereon. In the triaxial acceleration sensor module 100, the through-hole 32 has a size through which the triaxial acceleration sensor 1 can pass. Further, the triaxial acceleration sensor 1 is directly bonded to the sensor driving IC 40 via the through-hole 32, and the sensor driving IC 40 is bonded to the partition plate 31 of the housing 30.
    Type: Grant
    Filed: December 28, 2005
    Date of Patent: June 2, 2009
    Assignee: Mitsumi Electric Co., Ltd.
    Inventors: Masahiro Sato, Takayuki Sugano
  • Patent number: 7536909
    Abstract: Devices for providing tri-axial measurements in an x-direction, a y-direction, and a z-direction and methods of their manufacture are disclosed. The devices comprise a leadframe, at least one X- and Y-axis sensor die, at least one integrated circuit, and a Z-axis sensor. The Z-axis sensor is encapsulated in a pre-molding before the leadframe, X- and Y-axis sensor die(s), integrated circuit(s), and the pre-molding are encapsulated to provide a final molding.
    Type: Grant
    Filed: January 20, 2006
    Date of Patent: May 26, 2009
    Assignee: Memsic, Inc.
    Inventors: Yang Zhao, Feiming Huang, Zongya Li
  • Patent number: 7513154
    Abstract: A semiconductor acceleration sensor device has an acceleration sensor chip and a hollow package to house the acceleration sensor chip. A concave section is formed in a predetermined area on a bottom face inside the package. The semiconductor acceleration sensor device also has a low elasticity element with adhesiveness. The low elasticity element is filled in the concave section. The acceleration sensor chip is mounted on the low elasticity element. The adhesive surface between the low elasticity element and the acceleration sensor chip is higher than the bottom face.
    Type: Grant
    Filed: May 19, 2006
    Date of Patent: April 7, 2009
    Assignee: Oki Semiconductor Co., Ltd.
    Inventor: Yoshihiko Ino
  • Publication number: 20090080607
    Abstract: Meat processing device having at least one comminution unit for comminution and/or mixing of fresh and/or frozen meat and having at least one transport means (2) on which the meat can be transported and which is arranged, in the direction of processing, downstream of the comminution unit (1), which has a fat analysis device (3) for determining the fat content, the density in the meat and/or the BEFFE (connective tissue protein free meat protein), and also process for fat analysis.
    Type: Application
    Filed: October 20, 2006
    Publication date: March 26, 2009
    Inventors: Hartmut Hoffmann, Stefan Linn
  • Publication number: 20090064779
    Abstract: The invention relates to a method for mounting sensors (40), e.g. rpm sensors, on a support plate (10) of a control module. Said method comprises the following steps: a cylindrical sensor (40) is oriented and is inserted into a tubular sensor dome (18) of the support plate (10) in the mounting direction (56). An assembly dimension (88) for the sensor is then set as the distance between the face of the sensor and a top side (16) of the support plate (10). A positive connection between the sensor (40) and the sensor dome (18) is established by introducing a fixing material (68) into a hollow space (64), and a positive or a bonding sensor contact (76) between the sensor (40) and contacts (70) located at the support plate end is created when the sensor (40) is inserted into the sensor dome (18).
    Type: Application
    Filed: July 27, 2006
    Publication date: March 12, 2009
    Inventor: Harald Ott
  • Patent number: 7500394
    Abstract: A fastener integrated sensor includes a fastener, an overmold, an electronic sensor, a printed circuit board, a plurality of circuit components, a plurality of signal terminals, and a connector shroud. The fastener integrated sensor mounts rigidly to the vehicle body to capture and provide structural information during a crash event.
    Type: Grant
    Filed: August 19, 2005
    Date of Patent: March 10, 2009
    Assignee: TK Holdings Inc.
    Inventor: Ryan N. Steele
  • Patent number: 7497117
    Abstract: An angular velocity mount arrangement includes an angular velocity sensor and a mount member. The angular velocity sensor includes an oscillator, an angular velocity sensing element, a package, and a plurality of lead frames. The angular velocity sensing element senses an angular velocity based on an oscillation of the oscillator in a first axis direction. The mount member is arranged relative to the angular velocity sensor in a second axis direction, which is generally orthogonal to the first axis direction. The angular velocity sensor is mounted to the mount member through the plurality of lead frames. At least one extending segment is a middle segment of each of the plurality of lead frames and extends toward the mount member in the second axis direction. The at least one extending segment of each of the plurality of lead frames is able to oscillate in the first axis direction.
    Type: Grant
    Filed: August 29, 2006
    Date of Patent: March 3, 2009
    Assignee: DENSO CORPORATION
    Inventor: Tameharu Ohta
  • Publication number: 20090029793
    Abstract: Apparatus and a method that enables an assistive energy type golf club to sense the approach of the club face toward a golf ball, and to trigger the release of the assistive energy at the optimum time to achieve the desired golf ball velocity and distance.
    Type: Application
    Filed: September 8, 2006
    Publication date: January 29, 2009
    Inventor: Donald R. Cage
  • Patent number: 7481116
    Abstract: An apparatus for measuring vibration of a fan includes a frame having an opening for enclosing a fan; a plurality of accelerometers disposed on the frame; and an elastic support for supporting the frame. An apparatus for measuring fan vibration includes a frame having an opening for enclosing a fan; a plurality of accelerometers disposed on the frame. The plurality of accelerometers output a signal to the signal-analyzing device and at least three of the plurality of accelerometers are disposed on a different surface of the frame from each other. The apparatus for measuring fan vibration includes a mounting block that allows the fan to be secured in the opening of the frame and an elastic support for supporting the frame. A method of measuring fan vibration includes disposing a plurality of accelerometers on a frame; mounting a fan within the frame; turning on the fan; and outputting a signal from each of the plurality of accelerometers to a signal-analyzing device.
    Type: Grant
    Filed: October 18, 2006
    Date of Patent: January 27, 2009
    Assignee: Sun Microsystems, Inc.
    Inventor: Jay K. Osborn
  • Patent number: 7472611
    Abstract: The present invention provides the stress detection method for force sensor device with multiple axis sensor device and force sensor device employing this method, whose installation angle is arbitrary. The stress detection method includes, first and second force sensors whose detection axes are orthogonal to each other. When the detection axis of first force sensor forms angle ? with direction of detected stress Ax, and the stress component of direction perpendicular to direction of the detected stress Ax is Az, output Apx of the axis direction of first force sensor is found as Apx=?x (Ax×cos ?+Az×sin ?), and output Apz of the axis direction of the second force sensor is found as Apz=?z (Ax×sin ?+Az×cos ?), and, when ?x and ?z are detection sensitivity coefficients of first and second force sensors respectively, the detection sensitivity coefficient ?z of second force sensor is set as ?z=?x tan ?, and the detected stress Ax is found as Ax=(Apx?Apz)/?x(cos ??tan ?×sin ?).
    Type: Grant
    Filed: December 11, 2007
    Date of Patent: January 6, 2009
    Assignees: Fujitsu Limited, Fujitsu Media Devices
    Inventors: Toshio Hanazawa, Masaaki Ono, Tsutomu Miyashita, Hiroshi Tokunaga, Hiroshi Ishikawa
  • Patent number: 7467552
    Abstract: A ceramic L-shaped or T-shaped packaging apparatus for a Micro Electro-Mechanical System (MEMS) inertial sensor die that translates the sensor sense axis perpendicular to the normal input plane for direct attachment to a system-level printed circuit board (PCB).
    Type: Grant
    Filed: November 10, 2005
    Date of Patent: December 23, 2008
    Assignee: Honeywell International Inc.
    Inventor: Douglas C. MacGugan
  • Patent number: 7458263
    Abstract: A dual-axis sensor for measuring X and Y components of angular velocity in an X-Y sensor plane is provided. The dual-axis sensor includes a first subsensor for measuring the X component of angular velocity, and a second subsensor for measuring the Y component of angular velocity. The first subsensor and the second subsensor are contained within a single hermetic seal within the dual-axis sensor.
    Type: Grant
    Filed: November 18, 2005
    Date of Patent: December 2, 2008
    Assignee: Invensense Inc.
    Inventors: Steven S. Nasiri, Joseph Seeger, Martin Lim, Anthony Francis Flannery, Jr., Alexander Castro
  • Patent number: 7453262
    Abstract: A rotational speed detecting sensor includes a detecting portion having a detecting member provided facing a magnetized portion to be detected, the detecting portion for detecting variations of a magnetic flux generated by a rotation of the portion to be detected, a fix portion for fixing the detecting member, the fix portion being formed by means of molding and a case, a first end of which is closed and a second end of which is opened. The case includes a housing portion recessed toward the first end of the case from an opening portion side of the case, the housing portion for housing the detecting member, and a positioning portion for restricting a movement of the case in a mold in a direction toward the opening portion side of the case from the first end of the case.
    Type: Grant
    Filed: January 9, 2006
    Date of Patent: November 18, 2008
    Assignee: Aisin Seiki Kabushiki Kaisha
    Inventors: Koji Kawasaki, Masahiro Kimura, Eiichiro Iwase
  • Patent number: 7428841
    Abstract: In an acceleration sensor detecting inclined displacement of a predetermined article from a basic position, the acceleration sensor (10) includes a sensor chip having a detection plane including one detection axis or two crossing detection axes detecting the inclined displacement. An axis orthogonal to the detection plane of the sensor chip is disposed in parallel with a standard plane of the article in the basic position. Then, the sensor chip obtains an output signal according to the inclined displacement of the standard plane.
    Type: Grant
    Filed: February 10, 2004
    Date of Patent: September 30, 2008
    Assignee: Tokyo Electron Limited
    Inventors: Muneo Harada, Naoki Ikeuchi, Hiroyuki Hashimoto
  • Patent number: 7418863
    Abstract: An angular rate sensor includes a base member serving as a base, an angular rate sensing element having a vibrating member, a wiring member having a flexible, electrical insulating tape portion and a electrical wire portion. The wiring member has end portions fixed to the base member and a middle portion positioned between the end portions. The middle portion is separated from the base member and the sensing element is mounted to the middle portion. Thus, due to an elasticity of the wiring member, the sensing element can be isolated from an external vibration.
    Type: Grant
    Filed: September 28, 2006
    Date of Patent: September 2, 2008
    Assignee: DENSO CORPORATION
    Inventor: Hirofumi Higuchi
  • Publication number: 20080190197
    Abstract: A mounting and suspension system for mounting non-contact sliding measurement devices to the side of objects that slide on snow or ice like skis, snowboards, sleds, luges, and ice skates. A base component permanently attached to the sliding object allows a quick disconnect of the rest of the device. A linkage component permits the retraction of the measurement device relative to the sliding object in such a way that the measurement device remains aligned with the surface being measured while minimizing lateral displacement and fully retracted vertical height such that accurate measurement is obtained at any angle of sliding object relative to the surface of snow or ice. A bias device keeps the measurement device in firm contact with the surface without interfering with the use of the sliding object. A safety device prevents injury to user and damage to measurement device in case of impact with an external obstacle or fall.
    Type: Application
    Filed: February 14, 2008
    Publication date: August 14, 2008
    Inventor: Richard A. Kirby
  • Patent number: 7404333
    Abstract: Sensor head or detector head (1) composed primarily of a protective casing that forms a hollow body (2) with an external surface, the so-called active surface (2?), and of a sensing or detection element mounted in the hollow body and adjacent to part of the front wall of the protective casing defining the active surface, at the level of the internal surface opposite the latter, the sensor head characterized in that the sensing element (3) is located at a distance from the internal surface (4?) of the part of the wall (4) of the hollow body (2) in such a way as to delineate an interstitial space (5) of small thickness (d) forming a mechanical and physical decoupling interface between the part of the wall (4) and the sensing element (3).
    Type: Grant
    Filed: March 24, 2005
    Date of Patent: July 29, 2008
    Assignee: Senstronic
    Inventors: Manuel Kesseler, Rémy Kirchdoerffer
  • Patent number: 7404324
    Abstract: An inertial measurement unit (IMU) is provided that includes a container that defines a cavity. A sensor suit or ISA having a housing is provided in the container of the IMU. A dampening material is provided between the housing of the ISA and the container of the IMU. The dampening material may be applied by coating, spraying, or dipping, or may be separately molded and then inserted, if desired. A sway space may also be provided between the ISA and the IMU container.
    Type: Grant
    Filed: August 19, 2005
    Date of Patent: July 29, 2008
    Assignee: Honeywell International Inc.
    Inventors: Todd L. Braman, Owen Grossman, Erik J. Hovland
  • Publication number: 20080165125
    Abstract: Movement of a cellular telephone is detected by an acceleration sensor fixed on a housing (substrate), the cellular telephone and user's operations are detected by an acceleration sensor semifixed on the housing (substrate) via a flexible member, and the user's operations are detected on the basis of a difference between these detection results and a display process corresponding to the user's operations is executed.
    Type: Application
    Filed: May 31, 2007
    Publication date: July 10, 2008
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventor: Masafumi HOSONO
  • Patent number: 7374508
    Abstract: A power transmitting device, such as a differential, having a housing, input and output shafts, which are rotatably disposed in the housing, a gear set, one or more actuators and/or one or more sensors disposed within the housing, and a connector having a fitting, a seal member and a locking member. The gear set is operable for transmitting rotary power between the input and output shafts. The fitting has a body that extends through a hole formed in the housing. The body includes a plurality of terminals that are electrically coupled to the at least one electrical components. The seal member is disposed between the fitting and the housing to form a seal therebetween. The locking member engages the body and the housing to retain the fitting to the housing. The fitting facilitates electrical connection of the electrical components within the housing with a wire harness that is external to the housing.
    Type: Grant
    Filed: March 28, 2007
    Date of Patent: May 20, 2008
    Assignee: American Axle & Manufacturing, Inc.
    Inventor: Bruce A. Duncan
  • Patent number: 7373828
    Abstract: A landform monitoring system includes a pressure sensing device mounted on a mounting frame, and including a housing unit configured with an accommodating space and having first and second openings in fluid communication with the accommodating space. A pressure sensor is attached to the housing unit, and seals the first opening. A flexible sheet is attached to the housing unit and seals the second opening. A fluid medium is filled fully in the accommodating space. When the sheet deforms as a result of an external pressure acting thereon, a pressure corresponding to the deformation of the sheet is transmitted to the pressure sensor via the fluid medium such that the pressure sensor generates a pressure sensing signal corresponding to the external pressure.
    Type: Grant
    Filed: February 15, 2007
    Date of Patent: May 20, 2008
    Assignee: National Applied Research Laboratories
    Inventors: Yung-Bin Lin, Chih-Chen Lee, Kuo-Chun Chang, Jihn-Sung Lai, Ping-Hsiung Wang, Chun-Chung Chen, Lu-Sheng Lee
  • Patent number: 7370530
    Abstract: A package for packaging one or more MEMS devices is disclosed. A package in accordance with an illustrative embodiment of the present invention can include a packaging structure having a base section, a top section, and an interior cavity adapted to contain a number of MEMS devices therein. In some embodiments, the packaging structure can include a first side, a second side, a third side, and a top end, which, in certain embodiments, may form a pinout plane surface that can be used to connect the packaging structure to other external components. In some embodiments, a number of MEMS-type inertial sensors contained within the interior cavity of the packaging structure can be used to detect and measure motion in multiple dimensions, if desired.
    Type: Grant
    Filed: September 1, 2004
    Date of Patent: May 13, 2008
    Assignee: Honeywell International Inc.
    Inventors: Jon B. DCamp, Harlan L. Curtis
  • Patent number: 7331414
    Abstract: A protective structure for an electrical circuit device attached to a vehicle includes a resin case, an electrical circuit, and a rigid body. The electrical circuit is contained in the resin case. The rigid body is contained in the resin case. The rigid body protrudes toward a collision-prone side of the vehicle beyond the resin case. The rigid body deforms or displaces to absorb collision energy when the vehicle is involved in a collision on the collision-prone side.
    Type: Grant
    Filed: November 26, 2004
    Date of Patent: February 19, 2008
    Assignee: Denso Corporation
    Inventor: Koichi Fujihara
  • Patent number: 7322249
    Abstract: A robust, easy to mount probe sensor includes an elongated body enclosing a sensor element and an integral flange extending away from the body. The body and flange are formed of material having a relatively low characteristic yield point. First and second generally parallel closely spaced through passages extend through the flange. An insert formed of material having a relatively high characteristic yield point is disposed in one of the passages. A fastener including a shank portion which extends through the other passageway includes an enlarged head which overlays the insert containing passageway and engages an attachment structure to effect directed compressive loading of the probe sensor flange.
    Type: Grant
    Filed: July 7, 2005
    Date of Patent: January 29, 2008
    Assignee: Delphi Technologies, Inc.
    Inventors: Stephen G Paddock, Leonel A. Barrera
  • Patent number: 7320253
    Abstract: The present invention provides the stress detection method for force sensor device with multiple axis sensor device and force sensor device employing this method, whose installation angle is arbitrary. The stress detection method includes, first and second force sensors whose detection axes are orthogonal to each other. When the detection axis of first force sensor forms angle ? with direction of detected stress Ax, and the stress component of direction perpendicular to direction of the detected stress Ax is Az, output Apx of the axis direction of first force sensor is found as Apx=?x (Ax×cos ?+Az×sin ?), and output Apz of the axis direction of the second force sensor is found as Apz=?z (Ax×sin ?+Az×cos ?), and, when ?x and ?z are detection sensitivity coefficients of first and second force sensors respectively, the detection sensitivity coefficient ?z of second force sensor is set as ?z=?x tan ?, and the detected stress Ax is found as Ax=(Apx?Apz)/?x(cos ??tan ?×sin ?).
    Type: Grant
    Filed: March 8, 2005
    Date of Patent: January 22, 2008
    Assignees: Fujitsu Media Devices Limited, Fujitsu Limited
    Inventors: Toshio Hanazawa, Masaaki Ono, Tsutomu Miyashita, Hiroshi Tokunaga, Hiroshi Ishikawa
  • Publication number: 20080000294
    Abstract: An inertial measurement unit is described that includes a first subassembly comprising one or more inertial sensors, a second subassembly comprising support electronics for the one or more inertial sensors, and at least one pair of mating connectors configured to provide an interface between the first subassembly and the second subassembly.
    Type: Application
    Filed: June 30, 2006
    Publication date: January 3, 2008
    Inventors: Peter J. Dukich, Gregory A. Miller
  • Publication number: 20070289380
    Abstract: A landform monitoring system includes a pressure sensing device mounted on a mounting frame, and including a housing unit configured with an accommodating space and having first and second openings in fluid communication with the accommodating space. A pressure sensor is attached to the housing unit, and seals the first opening. A flexible sheet is attached to the housing unit and seals the second opening. A fluid medium is filled fully in the accommodating space. When the sheet deforms as a result of an external pressure acting thereon, a pressure corresponding to the deformation of the sheet is transmitted to the pressure sensor via the fluid medium such that the pressure sensor generates a pressure sensing signal corresponding to the external pressure.
    Type: Application
    Filed: February 15, 2007
    Publication date: December 20, 2007
    Inventors: Yung-Bin Lin, Chih-Chen Lee, Kuo-Chun Chang, Jihn-Sung Lai, Ping-Hsiung Wang, Chun-Chung Chen, Lu-Sheng Lee
  • Patent number: 7290448
    Abstract: A physical quantity sensor is constituted using a lead frame having at least one stage and a plurality of leads whose bases are arranged in the same plane, wherein at least one physical quantity sensor chip having a plurality of electrode pads is mounted on the stage and is inclined so that the electrode pads are disposed in the inclination direction and are connected to the leads by use of wires whose lengths substantially match distances between the electrode pads and leads. This prevents the leads and wires from being unexpectedly broken, and it is possible to avoid the occurrence of separation of the leads from the physical quantity sensor chip. In addition, the tip ends of the leads are disposed along the surface of the inclined stage before wire bonding; hence, it is possible to easily connect the tip ends of the leads to the physical quantity sensor chip.
    Type: Grant
    Filed: September 8, 2005
    Date of Patent: November 6, 2007
    Assignee: Yamaha Corporation
    Inventors: Kenichi Shirasaka, Masayoshi Omura
  • Patent number: 7267003
    Abstract: An acceleration sensor unit including a board on which an acceleration sensor is mounted, a support part for supporting the board, and a housing in which the support part and the acceleration sensor are contained, the board is installed in the housing by means of the support part so as to swing with respect to the housing.
    Type: Grant
    Filed: August 11, 2004
    Date of Patent: September 11, 2007
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yuji Hiraoka, Tohru Matsumoto, Yukihiro Okimoto, Toshiyuki Yamashita, Shinichi Harase, Takashi Furui
  • Patent number: 7263883
    Abstract: Provided are a gyro-sensor including a plurality of component units and a method of fabricating the gyro-sensor. The gyro-sensor includes: a substrate; a micro electro mechanical system structure including a surface including a predetermined area in which a cavity is formed and connected to an upper surface of the substrate to output a vibration signal proportional to an external rotation force; and a circuit unit positioned in the cavity, converting the vibration signal into a predetermined electric signal proportional to a circular angular velocity, and outputting the predetermined electric signal.
    Type: Grant
    Filed: June 1, 2005
    Date of Patent: September 4, 2007
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Tae-sik Park, Moon-chul Lee, Chang-youl Moon
  • Patent number: 7263885
    Abstract: A physical quantity sensor includes: a circuit chip; and a sensor chip disposed on the circuit chip through an adhesive layer. The sensor chip includes: a support substrate; a movable electrode; and a pair of fixed electrodes facing the movable electrode with a detection distance therebetween. The movable electrode and the fixed electrodes are disposed on the substrate. The adhesive layer includes a non-adhesive region and a conductive member. The non-adhesive region is disposed on a region obtained by projecting the sensor chip to the circuit chip. The conductive member is disposed in the non-adhesive region for electrically connecting between the circuit chip and the substrate.
    Type: Grant
    Filed: February 8, 2005
    Date of Patent: September 4, 2007
    Assignee: DENSO CORPORATION
    Inventor: Keisuke Goto
  • Patent number: 7261006
    Abstract: Blast pressure gauges and methods for detecting blast pressure during a blast test. The gauges operate independently of power sources, are portable, and are used in harsh environments including test ranges. Each embodiment is constructed to detect blast pressures as required in the circumstances of a particular blast test.
    Type: Grant
    Filed: April 29, 2005
    Date of Patent: August 28, 2007
    Assignee: United States of America as represented by the Secretary of the Navy
    Inventor: Rex N. Randolph
  • Patent number: 7249509
    Abstract: An angular velocity detector includes an angular velocity detecting element having a vibrating body arranged in a base substrate to be vibrated on a surface horizontal with respect to the base substrate. The angular velocity detecting element detects an angular velocity around an axis perpendicular to the base substrate based on a vibration of the vibrating body. In the angular velocity detector, a circuit substrate is bonded to a first surface of the base substrate through an adhesive, and a second surface of the angular velocity detecting element is electrically connected to the circuit substrate through a bonding wire. Furthermore, the adhesive is partially arranged on the first surface of the base substrate at least at a portion corresponding to a bonding portion of the bonding wire on the second surface of the base substrate. Therefore, a wire bonding can be easily accurately performed.
    Type: Grant
    Filed: June 21, 2005
    Date of Patent: July 31, 2007
    Assignee: DENSO Corporation
    Inventor: Kenji Hirano
  • Patent number: 7240551
    Abstract: A sensor stem supporting a sensor element comprising a metal plate having a shape defined by press, the metal plate include a dent portion formed on a first surface of the metal plate, a step portion formed on a second surface of the metal plate facing the first surface, and a projection formed on the step portion for resistance welding. It is thus possible to obtain an excellent hermetic sealing of the sensor stem and a cap, which protects an oscillator, a circuit board and the like. The sensor stem can prevent a short circuit and can be lowered in height thereof.
    Type: Grant
    Filed: February 9, 2005
    Date of Patent: July 10, 2007
    Assignee: Fujitsu Media Devices Limited
    Inventors: Toshinobu Hosokawa, Masanori Yachi, Kazuhiro Ota
  • Patent number: 7237437
    Abstract: MEMS Sensor Systems and Methods are provided. In one embodiment, a method for producing a six degree of freedom inertial sensor is provided. The method comprises fabricating a first silicon wafer segment having at least one inertial sensor pair, the at least one inertial sensor pair comprising one or both of a pair of orthogonally oriented accelerometers and a pair of orthogonally oriented gyroscopes; fabricating a second silicon wafer segment having at least one inertial sensor, the at least one inertial sensor comprising one or both of an accelerometer and a gyroscope; assembling together the first silicon wafer segment and the second silicon wafer segment such that the at least one inertial sensor pair and the at least one inertial sensor are oriented orthogonal to each other; and bonding the first silicon wafer segment to the second silicon wafer segment.
    Type: Grant
    Filed: October 27, 2005
    Date of Patent: July 3, 2007
    Assignee: Honeywell International Inc.
    Inventor: Neal R. Fedora
  • Patent number: 7234352
    Abstract: An angular velocity sensor includes a tuning fork unit; a base block provided with a terminal for outputting an output signal from the tuning fork unit to the exterior; a cover for housing the tuning fork unit in a space defined by combination with the base block; a circuit board for fixing the terminal on the base block, the circuit board being provided with a processing circuit for processing the output signal from the tuning fork unit; and a casing for housing the base block, the cover, and the circuit board. The terminal on the base block is fixed to the circuit board, with a clearance being defined by the base block and the circuit board. The terminal on the base block in the clearance has a flexure portion, and the flexure portion absorbs a vibration of a high frequency applied from the exterior.
    Type: Grant
    Filed: October 6, 2005
    Date of Patent: June 26, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Tomohiro Mitani
  • Patent number: 7234351
    Abstract: An application of rate gyros and accelerometers allows electronic measurement of the motion of a rigid or semi-rigid body, such as a body associated with sporting equipment including a fly rod during casting, a baseball bat, a tennis racquet or a golf club during swinging. For instance, data can be collected by one gyro according to the present invention is extremely useful in analyzing the motion of a fly rod during fly casting instruction, and can also be used during the research, development and design phases of fly casting equipment including fly rods and fly lines. Similarly, data collected by three gyros and three accelerometers is extremely useful in analyzing the three dimensional motion of other sporting equipment such as baseball bats, tennis racquets and golf clubs. This data can be used to support instruction as well as design of the sporting equipment.
    Type: Grant
    Filed: March 27, 2006
    Date of Patent: June 26, 2007
    Assignee: The Regents of the University of Michigan
    Inventor: Noel C. Perkins
  • Patent number: 7222532
    Abstract: A packaging system in one example comprises an improved mechanical packaging system for a circuit board disposed between housing elements, the improvement comprising an upper housing member having a centrally disposed opening provided therethrough, a unitary electromagnetic shield disposed on at least an upper surface of the circuit board and secured to the circuit board, the unitary electromagnetic shield secured to the upper housing member, such that undesired mechanical vibration modes are substantially reduced.
    Type: Grant
    Filed: October 6, 2005
    Date of Patent: May 29, 2007
    Assignee: Northrop Grumman Corporation
    Inventor: Youngmin A. Choi
  • Patent number: 7194905
    Abstract: A three-axis acceleration sensor having a simple construction is provided for improving shock resistance without lowering sensor sensitivity. An acceleration sensor for detecting acceleration in three orthogonal directions comprises an electrode substrate pair including electrode substrates (4) opposed to each other, and each having fixed electrodes (4c, 4b, 4a) corresponding to three axes, respectively, a diaphragm (2) acting as a movable electrode, and an umbrella-like weight (3) mounted centrally of the diaphragm (2). Acceleration is detected based on variations in capacitance between the fixed electrodes (4c, 4b, 4a) and diaphragm (2). Each electrode substrate (4) has an electret layer (1) formed to cover surfaces of the fixed electrodes (4c, 4b, 4a). At least one of the electrode substrates defines, centrally thereof, a through hole (7). A shaft portion of the umbrella-like weight (3) extends through the through hole (7) from outside, and is connected to the diaphragm (2).
    Type: Grant
    Filed: September 12, 2005
    Date of Patent: March 27, 2007
    Assignee: Hosiden Corporation
    Inventors: Akira Yamamoto, Yasuo Sugimori
  • Patent number: 7194903
    Abstract: A suspension diaphragm (16) is configured to support a precision transducer (14) within a container (12). The suspension diaphragm (16) is buttressed by an underlying complaint preform (152) and an annular hybrid support (16B) disposed along the periphery of an opening of the container (12). The transducer (14) is affixed to the suspension diaphragm (16) using the compliant preform (152) and rigid epoxy in the securing channels (120). The annular hybrid support (16B) is affixed to the exterior of the container (12).
    Type: Grant
    Filed: December 14, 2004
    Date of Patent: March 27, 2007
    Assignee: Honeywell International Inc.
    Inventor: Paul Dwyer
  • Patent number: 7181968
    Abstract: An improved accelerometer assembly including a circuit board and an accelerometer is provided. The accelerometer is configured to sense acceleration along a sensing axis. The accelerometer is attached to the circuit board and configured to sense acceleration along a sensing axis. A housing is configured to receive the circuit board in a first and second orientation, wherein the sensing axis in the first orientation is rotated 90° from the sensing axis in the second orientation.
    Type: Grant
    Filed: August 25, 2004
    Date of Patent: February 27, 2007
    Assignee: Autoliv ASP, Inc.
    Inventor: Charles Still
  • Patent number: 7150191
    Abstract: An apparatus and method for flexibly suspending a sensing mechanism between a pair of cover plates, including a sensing mechanism formed in a crystalline silicon substrate; a pair of cover plates formed in crystalline silicon substrates; a first plurality of complementary interfaces in fixed relation between the sensing mechanism and a first one of the cover plates; and a second plurality of complementary interfaces flexibly suspended between the sensing mechanism and a second one of the cover plates with one or more of the flexibly suspended interfaces being a complementary male and female interface.
    Type: Grant
    Filed: February 6, 2006
    Date of Patent: December 19, 2006
    Assignee: Honeywell Int'l Inc.
    Inventors: Steven A. Foote, Paul H. Collins, J. Christopher Milne
  • Patent number: 7140248
    Abstract: A velocity measuring device is mounted to a support, optionally a wearable support such as a glove, watch, wrist or arm band, or the like. Alternatively, the support is a sports club or removably attaches to a sports club. The velocity measuring device includes a power supply, a velocimeter or accelerometer, and an output device for visually, aurally, or electrically outputting the measured velocity.
    Type: Grant
    Filed: March 6, 2003
    Date of Patent: November 28, 2006
    Inventor: Scott Brundage
  • Patent number: 7134334
    Abstract: A motion detector capable of sensing motion of an object includes a motion sensor secured to one of a plurality of surfaces of a fastener. The fastener is directly coupleable with the object.
    Type: Grant
    Filed: May 20, 2004
    Date of Patent: November 14, 2006
    Assignee: Analog Devices, Inc.
    Inventors: Mark L. Schirmer, Thomas W. Kelly
  • Patent number: 7127945
    Abstract: An angular velocity sensor comprises a receiving member receiving therein a case containing a vibration element and an IC, and having a hole usable in soldering one end of a terminal strip to a case electrode, whereby, after this soldering operation, a condition of a soldered region in a mounting portion can be checked through the hole. This prevents deficiency in a solder amount required for soldering between the case and the receiving member to ensure accuracy in an output signal of the angular velocity sensor.
    Type: Grant
    Filed: March 14, 2005
    Date of Patent: October 31, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Hideo Ookoshi
  • Patent number: 7107840
    Abstract: An apparatus and method for flexibly suspending a sensing mechanism between a pair of cover plates, including a sensing mechanism formed in a crystalline silicon substrate; a pair of cover plates formed in crystalline silicon substrates; a first plurality of complementary interfaces in fixed relation between the sensing mechanism and a first one of the cover plates; and a second plurality of complementary interfaces flexibly suspended between the sensing mechanism and a second one of the cover plates with one or more of the flexibly suspended interfaces being a complementary male and female interface.
    Type: Grant
    Filed: February 6, 2006
    Date of Patent: September 19, 2006
    Assignee: Honeywell International Inc.
    Inventors: Steven A. Foote, Paul H. Collins, J. Christopher Milne
  • Patent number: 7093505
    Abstract: A speed sensor (B, C) produces a signal that reflects the angular velocity of a shaft (4) which rotates in a case (2) having a mounting surface (10), beyond which the shaft projects to provide a target (6), and threaded holes (12) which open out of the mounting surface. The speed sensor includes a housing (20) and a sensing element (22) which is embedded in the housing. The housing, which is formed from a deformable material, has slots (44, 60) which align with the threaded holes in the case, and receive screws (24, 66) which thread into the holes to secure the speed sensor to the case. The speed sensor is positioned such that the proper air gap exists between its sensing element and the target. The screws, which extend through the slots, produce indentations (56, 74) in the deformable material of the housing, and these indentations receive the screws, so that the position of the sensor is fixed. Thus, the sensor, if removed, may be reinstalled in the same location.
    Type: Grant
    Filed: July 16, 2003
    Date of Patent: August 22, 2006
    Assignee: The Timken Company
    Inventors: Wayne V. Denny, Richard Smith, Kevin Rehfus
  • Patent number: 7081824
    Abstract: The alignment of railway tracks may be monitored using an accelerometer (36) mounted on a bogie (24) of a railway vehicle to detect lateral accelerations, and a displacement transducer (38) to monitor the lateral displacements of a wheelset (27) relative to the bogie. The acceleration signals are digitised, and processed corresponding to double integration, so as to deduce the lateral displacements of the bogie, and in conjunction with the signals from the displacement transducer hence to determine the effective lateral displacements of the track. This can provide a more useful indication of the lateral positions of the rails than measurements of the gauge faces. Such equipment (16) may be installed in a service vehicle, and operate automatically, downloading resulting data to a remote base station at regular intervals.
    Type: Grant
    Filed: June 17, 2002
    Date of Patent: July 25, 2006
    Assignee: AEA Technology PLC
    Inventor: David Gilbert
  • Patent number: 7073380
    Abstract: An apparatus and method for flexibly suspending a sensing mechanism between a pair of cover plates, including a sensing mechanism formed in a crystalline silicon substrate; a pair of cover plates formed in crystalline silicon substrates; a first plurality of complementary interfaces in fixed relation between the sensing mechanism and a first one of the cover plates; and a second plurality of complementary interfaces flexibly suspended between the sensing mechanism and a second one of the cover plates with one or more of the flexibly suspended interfaces being a complementary male and female interface.
    Type: Grant
    Filed: February 17, 2004
    Date of Patent: July 11, 2006
    Assignee: Honeywell International, Inc.
    Inventors: Steven A. Foote, Paul H. Collins, J. Christopher Milne
  • Patent number: RE39843
    Abstract: An apparatus for attaching sensors to rotating shafts on equipment includes a cup magnet and a housing for receiving the cup magnet. A target rotor is displaced within the housing which rotates when attached to a rotating shaft for the purpose of sensing the shaft rotation. Alternately, the cup magnet may be permanently attached to a rotating couple rather than a non-rotating housing. A preferred embodiment may have a dust cover.
    Type: Grant
    Filed: February 9, 2005
    Date of Patent: September 18, 2007
    Inventor: Gary W. Wineland