Capacitive Sensor Patents (Class 73/514.32)
  • Patent number: 12253356
    Abstract: A calibration circuit providing a programmable voltage generator that is selectively connectable to a first capacitor plate of a capacitive structure to supply a voltage thereto. A reference voltage generator is coupled to the output of the programmable voltage generator and generates a reference voltage. A comparator receives the reference voltage and a discharging voltage from the capacitive structure during a discharge period and, based on those inputs, generates a signal that is output to a digital controller. A constant current source is selectively connectable to the capacitive structure to generate a constant current. Based on the output of the comparator, the constant current, and a count representing a time during which the discharging voltage decreases, the digital controller measures capacitance to calibrate a movable mirror of the capacitive structure. During calibration, the digital controller controls the programmable voltage generator and a second capacitor plate of the capacitive structure.
    Type: Grant
    Filed: April 26, 2021
    Date of Patent: March 18, 2025
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Robert Floyd Payne, James Norman Hall
  • Patent number: 12216137
    Abstract: A physical quantity sensor includes: a first fixed electrode portion; a first movable electrode portion; a first fixed portion fixed to a substrate; a first support beam having one end coupled to the first fixed portion; a second support beam having one end coupled to the first fixed portion; and a first coupling portion coupling the other end of the first support beam and the other end of the second support beam to the first movable electrode portion. In a plan view in a third direction orthogonal to the substrate, the first movable electrode portion and the first fixed portion are disposed along a first direction, the first support beam and the second support beam are disposed along a second direction, and the first coupling portion includes a first portion disposed along the second direction side by side with the first support beam and the second support beam, and a second portion coupled to the first portion and the first movable electrode portion and disposed along the first direction.
    Type: Grant
    Filed: October 28, 2022
    Date of Patent: February 4, 2025
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Satoru Tanaka
  • Patent number: 12216016
    Abstract: Spatially-distributed resonant MEMS sensors are coordinated to generate frequency-modulated signals indicative of regional contact forces, ambient conditions and/or environmental composition.
    Type: Grant
    Filed: April 29, 2024
    Date of Patent: February 4, 2025
    Assignee: SiTime Corporation
    Inventors: Paul M. Hagelin, Charles I. Grosjean, Lev Goncharov
  • Patent number: 12181508
    Abstract: A method and apparatus for configuring a conductive plane for electromagnetic compatibility test of equipment or device. A positioning object is fixed above the plane of a conductive plane, the positioning object contacts an equipment under test (EUT), and the distance from the EUT to the conductive plane is equal to the distance from the positioning object to the conductive plane plus the thickness of the positioning object, thereby avoiding an error in measurement caused by a change in the distance from the conductive plane to the EUT during each test. In addition, the device is portable, and the conductive plane does not need to be grounded, and may be applied to a production site or field in which no grounding is available.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: December 31, 2024
    Inventor: Wei Wu
  • Patent number: 12174215
    Abstract: A microelectromechanical (MEMS) sensor, such as an accelerometer, has one more proof masses that respond to movement of the sensor, the movement of which is measured based on a distance between the one or more proof masses and on one or more sense electrodes. The accelerometer also has a plurality of auxiliary electrodes and a signal generator configured to apply an auxiliary signal having a first harmonic frequency to the plurality of auxiliary electrodes. Circuitry receives a sensed signal from the plurality of sense electrodes and identifies a portion of the sensed signal having the first harmonic frequency. Based on this identified portion of the sensed signal, the circuitry determines whether a residual voltage is present on the one or more proof masses or on the one or more sense electrodes, and the circuitry modifies the operation of the accelerometer when the residual voltage is determined to be present in order to compensate for the residual voltage.
    Type: Grant
    Filed: November 23, 2020
    Date of Patent: December 24, 2024
    Assignee: InvenSense, Inc.
    Inventors: Giacomo Gafforelli, Luca Coronato, Adolfo Giambastiani
  • Patent number: 12160186
    Abstract: This MEMS element comprising: a base; a movable portion; and an elastic portion, and a fixing portion; and a fixed portion body to which the elastic portion is fixed, wherein the elastic portion extends in a direction intersecting a moving direction of the movable portion, includes a central portion receiving a force of the movable portion, and one end and another end fixed to the fixed portion body, and includes thin portions respectively between the central portion and the one end and between the central portion and the other end, the thin portions being thinner than the central portion, the one end, and the other end.
    Type: Grant
    Filed: October 9, 2020
    Date of Patent: December 3, 2024
    Assignee: Saginomiya Seisakusho, Inc.
    Inventors: Hisayuki Ashizawa, Noriko Shimomura
  • Patent number: 12153064
    Abstract: A physical quantity sensor includes a substrate that has a first fixed electrode and a movable body that has a first mass portion facing the first fixed electrode. The first mass portion includes a first region, and a second region farther from the rotation axis than the first region, a first through-hole group is provided in the first region, and a second through-hole group is provided in the second region, and the movable body has a first surface on a substrate side, and a second surface. The first surface of the first mass portion is provided with a step or a slope such that a first gap distance of a first gap between the first mass portion and the first fixed electrode in the first region is smaller than a second gap distance of a second gap between the first mass portion and the first fixed electrode in the second region. A depth of through-holes of the first through-hole group and the second through-hole group is smaller than a maximum thickness of the movable body.
    Type: Grant
    Filed: October 27, 2021
    Date of Patent: November 26, 2024
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Satoru Tanaka
  • Patent number: 12146893
    Abstract: Microelectromechanical system (MEMS) accelerometers are described. The MEMS accelerometers may include multiple proof mass portions collectively forming one proof mass. The entirety of the proof mass may contribute to detection of in-plane acceleration and out-of-plane acceleration. The MEMS accelerometers may detect in-plane and out-of-plane acceleration in a differential fashion. In response to out-of-plane accelerations, some MEMS accelerometers may experience butterfly modes, where one proof mass portion rotates counterclockwise relative to an axis while at the same time another proof mass portion rotates clockwise relative to the same axis. In response to in-plane acceleration, the proof mass portions may experience common translational modes, where the proof mass portions move in the plane along the same direction.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: November 19, 2024
    Assignee: Analog Devices, Inc.
    Inventor: Xin Zhang
  • Patent number: 12140430
    Abstract: A sensor device includes a sensor element, a supporting member, a substrate, and a bonding wire. The supporting member is electrically connected to the sensor element. The substrate is electrically connected to the supporting member. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the supporting member together. The substrate and an installation member on which the sensor element is installed intersect with each other. The sensor element and the supporting member are separated from each other.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: November 12, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hideki Ueda, Yusuke Nakamura, Koichiro Nakashima, Takashi Uchida, Toshio Yamazaki, Hiroyuki Fujii, Chikara Nara
  • Patent number: 12139396
    Abstract: A microelectromechanical sensor device has a detection structure including: a substrate having a first surface; a mobile structure having an inertial mass suspended above the substrate at a first area of the first surface so as to perform at least one inertial movement with respect to the substrate; and a fixed structure having fixed electrodes suspended above the substrate at the first area and defining with the mobile structure a capacitive coupling to form at least one sensing capacitor. The device further includes a single monolithic mechanical-anchorage structure positioned at a second area of the first surface separate from the first area and coupled to the mobile structure, the fixed structure, and the substrate and connection elements that couple the mobile structure and the fixed structure mechanically to the single mechanical-anchorage structure.
    Type: Grant
    Filed: July 23, 2021
    Date of Patent: November 12, 2024
    Assignee: STMICROELECTRONICS S.r.l.
    Inventors: Francesco Rizzini, Carlo Valzasina, Gabriele Gattere
  • Patent number: 12129167
    Abstract: A microelectromechanical systems (MEMS) inertial sensing device having a large proof mass with interlocking tabs is disclosed. The interlocking tabs limit motion of the proof mass when subjected to large inertial forces. The interlocking tabs are formed around the periphery of the proof mass and interact with corresponding interlocking tabs formed in a frame to which the proof mass is tethered. The motion of the proof mass is limited by the interlocking tabs, which are formed during MEMS fabrication of the inertial sensing device rather than as part of the packaging process. With a large proof mass, the inertial sensing device can provide high sensitivity in low inertial force environments while the interlocking tabs protect the device when subjected to high inertial forces.
    Type: Grant
    Filed: April 25, 2022
    Date of Patent: October 29, 2024
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Paul J. Resnick, Brian D. Homeijer, Thomas A. Friedmann, Katherine M. Musick
  • Patent number: 12117464
    Abstract: An inertial structure is elastically coupled through a first elastic structure to a supporting structure so as to move along a sensing axis as a function of a quantity to be detected. The inertial structure includes first and second inertial masses which are elastically coupled together by a second elastic structure to enable movement of the second inertial mass along the sensing axis. The first elastic structure has a lower elastic constant than the second elastic structure so that, in presence of the quantity to be detected, the inertial structure moves in a sensing direction until the first inertial mass stops against a stop structure and the second elastic mass can move further in the sensing direction. Once the quantity to be detected ends, the second inertial mass moves in a direction opposite to the sensing direction and detaches the first inertial mass from the stop structure.
    Type: Grant
    Filed: December 28, 2022
    Date of Patent: October 15, 2024
    Assignee: STMicroelectronics S.r.l.
    Inventors: Gabriele Gattere, Francesco Rizzini, Alessandro Tocchio
  • Patent number: 12111434
    Abstract: The present disclosure is directed to a MEMS-based rotation sensor for use in seismic data acquisition and sensor units having same. The MEMS-based rotation sensor includes a substrate, an anchor disposed on the substrate and a proof mass coupled to the anchor via a plurality of flexural springs. The proof mass has a first electrode coupled to and extending therefrom. A second electrode is fixed to the substrate, and one of the first and second electrodes is configured to receive an actuation signal, and another of the first and second electrodes is configured to generate an electrical signal having an amplitude corresponding with a degree of angular movement of the first electrode relative to the second electrode. The MEMS-based rotation sensor further includes closed loop circuitry configured to receive the electrical signal and provide the actuation signal. Related methods for using the MEMS-based rotation sensor in seismic data acquisition are also described.
    Type: Grant
    Filed: October 27, 2022
    Date of Patent: October 8, 2024
    Assignee: SCHLUMBERGER TECHNOLOGY CORPORATION
    Inventors: Maxime Projetti, Olivier Vancauwenberghe, Nicolas Goujon, Hans Paulson
  • Patent number: 12072350
    Abstract: An anchor assembly for a microelectromechanical systems (MEMS) vibration sensor suspension comprises an anchor body and at least one spring integrally extending from the anchor body. Each spring comprises a first section integrally extending at a first end away from the anchor body to a second end, and first lateral portions of second and third sections extending in opposite lateral directions from the second end. Each of the second and third sections includes a first leg that extends at a first end from the first lateral portion toward the anchor body, a second lateral portion that extends from a second end of the first leg away from the first section, and a second leg that extends from the second lateral portion at a first end away from the anchor body, wherein second ends of the second legs extend farther from the anchor body than the first lateral portions.
    Type: Grant
    Filed: June 23, 2022
    Date of Patent: August 27, 2024
    Assignee: Knowles Electronics, LLC
    Inventors: Faisal Zaman, Shubham Shubham, Ken Deng
  • Patent number: 12038454
    Abstract: A MEMS inertial sensor includes a supporting structure and an inertial structure. The inertial structure includes at least one inertial mass, an elastic structure, and a stopper structure. The elastic structure is mechanically coupled to the inertial mass and to the supporting structure so as to enable a movement of the inertial mass in a direction parallel to a first direction, when the supporting structure is subjected to an acceleration parallel to the first direction. The stopper structure is fixed with respect to the supporting structure and includes at least one primary stopper element and one secondary stopper element. If the acceleration exceeds a first threshold value, the inertial mass abuts against the primary stopper element and subsequently rotates about an axis of rotation defined by the primary stopper element. If the acceleration exceeds a second threshold value, rotation of the inertial mass terminates when the inertial mass abuts against the secondary stopper element.
    Type: Grant
    Filed: November 16, 2022
    Date of Patent: July 16, 2024
    Assignee: STMicroelectronics S.r.l.
    Inventors: Francesco Rizzini, Gabriele Gattere, Sarah Zerbini
  • Patent number: 12031820
    Abstract: A micromechanical system which includes a movably suspended mass. The micromechanical system includes a damping system, the damping system including a movably suspended damping structure, the damping structure being deflectable by applying a voltage. The damping structure is designed in such a way that a frequency response and/or a damping of the movably suspended mass are/is changeable with the aid of a deflection of the damping structure.
    Type: Grant
    Filed: August 4, 2021
    Date of Patent: July 9, 2024
    Assignee: ROBERT BOSCH GMBH
    Inventors: Lars Tebje, Johannes Classen, Christof Schwenk, Holger Rumpf, Joerg Braeuer, Torsten Ohms
  • Patent number: 12019092
    Abstract: According to one embodiment, a sensor a sensor includes a base, a first support portion fixed to the base, and a first movable portion supported by the first support portion. The first movable portion includes first and second movable base portions, a connecting base portion, first and second movable beams, and first and second movable conductive portions. The first movable beam includes a first beam end portion, a first beam other end portion, and a first beam intermediate portion. The second movable beam includes a second beam end portion, a second beam other end portion, and a second beam intermediate portion. The first movable conductive portion includes a first crossing conductive portion, a first extending conductive portion, and a first other extending conductive portion. The second movable conductive portion includes a second crossing conductive portion, a second extending conductive portion, and a second other extending conductive portion.
    Type: Grant
    Filed: February 24, 2022
    Date of Patent: June 25, 2024
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kei Masunishi, Yasushi Tomizawa, Etsuji Ogawa, Ryunosuke Gando, Shiori Kaji, Hiroki Hiraga, Fumito Miyazaki, Daiki Ono, Kengo Uchida
  • Patent number: 12013414
    Abstract: A MEMS accelerometer includes a base, proof mass, at least one pair of seesaw structures, and an out-of-plane displacement detection component. The at least one pair of the seesaw structures are oppositely disposed and fixed on the base through anchor points, and the out-of-plane displacement detection component is configured to detect rotation of the at least one pair of the seesaw structures or out-of-plane linear motion of the proof mass. Linear displacement of the MEMS accelerometer is not only beneficial to improve linearity of a capacitive displacement detection, but also to other non-capacitive detection methods, such as optical displacement detection. In addition, a double coupling structure is adopted to jointly couple rotation of seesaws, and remaining translational and rotational modes of the seesaw structures are suppressed.
    Type: Grant
    Filed: August 3, 2022
    Date of Patent: June 18, 2024
    Assignee: AAC KAITAI TECHNOLOGIES (WUHAN) CO., LTD
    Inventors: Shitao Yan, Zhan Zhan, Shan Yang, Zhao Ma, Xiao Kan, Hongtao Peng, Yang Li, Veronica Tan, Yan Hong, Kahkeen Lai
  • Patent number: 12002812
    Abstract: A method of producing a semiconductor component includes: providing a silicon-based substrate; depositing an oxide layer on the silicon-based substrate; depositing a polycrystalline silicon layer on the oxide layer and simultaneously a crystalline silicon layer on the silicon-based substrate; producing an electronic component based on the polycrystalline silicon layer; and mounting a glass- or silicon-based lid on the crystalline silicon layer.
    Type: Grant
    Filed: February 23, 2022
    Date of Patent: June 4, 2024
    Assignee: Infineon Technologies Dresden GmbH & Co. KG
    Inventors: Dirk Meinhold, Steffen Bieselt
  • Patent number: 12000748
    Abstract: Spatially-distributed resonant MEMS sensors are coordinated to generate frequency-modulated signals indicative of regional contact forces, ambient conditions and/or environmental composition.
    Type: Grant
    Filed: July 11, 2023
    Date of Patent: June 4, 2024
    Assignee: SiTime Corporation
    Inventors: Paul M. Hagelin, Charles I. Grosjean, Lev Goncharov
  • Patent number: 11993512
    Abstract: A micro electro mechanical system (MEMS) includes a circuit substrate, a first MEMS structure disposed over the circuit substrate, and a second MEMS structure disposed over the first MEMS structure.
    Type: Grant
    Filed: March 14, 2022
    Date of Patent: May 28, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yang-Che Chen, Victor Chiang Liang, Chen-Hua Lin, Chwen-Ming Liu, Huang-Wen Tseng, Yi-Chuan Teng
  • Patent number: 11958740
    Abstract: A method for producing a microelectromechanical sensor. The microelectromechanical sensor is produced by connecting a cap wafer to a sensor wafer. The cap wafer has a bonding structure for connecting the cap wafer to the sensor wafer. The sensor wafer has a sensor core having a movable structure. The cap wafer has a stop structure for limiting an excursion of the movable structure. The method includes a first step and a second step following the first step, the stop surface of the stop structure being situated at the level of the original surface of the unprocessed cap wafer.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: April 16, 2024
    Assignee: ROBERT BOSCH GMBH
    Inventor: Achim Kronenberger
  • Patent number: 11933809
    Abstract: The present application discloses an inertial sensor comprising a proof mass, an anchor, a flexible member and several sensing electrodes. The anchor is positioned on one side of the sensing, mass block in a first axis. The flexible member is connected to the anchor point and extends along the first axis towards the proof mass to connect the proof mass, in which the several sensing electrodes are provided. In this way, the present application can effectively solve the problems of high difficulty in the production and assembly of inertial sensors and poor product reliability thereof.
    Type: Grant
    Filed: April 6, 2022
    Date of Patent: March 19, 2024
    Assignee: SENSORTEK TECHNOLOGY CORP.
    Inventors: Shih-Wei Lee, Chia-Hao Lin, Shih-Hsiung Tseng, Kuan-Ju Tseng, Chao-Shiun Wang
  • Patent number: 11920960
    Abstract: A capacitive measuring system includes capacitive sensors and an evaluation circuit having a multiplexer, a synchronous rectifier, a sinusoidal signal generator, and a reference voltage divider. The capacitive sensors are acted on by a mono-frequency voltage signal generated by the sinusoidal signal generator, output signals of the capacitive sensors are transmitted in alternation to the synchronous rectifier via the multiplexer, and signal amplification of output signals of the synchronous rectifier are calibrated as a function of an activatable reference impedance. The synchronous rectifier is formed by a MOS semiconductor switch. A source-drain section of the MOS semiconductor switch forms a shunt that is controlled by the mono-frequency voltage signal. A channel of the multiplexer is provided for transmitting a calibration signal, generated by the reference voltage divider, to the synchronous rectifier alternately with the output signals of the capacitive sensors.
    Type: Grant
    Filed: August 3, 2020
    Date of Patent: March 5, 2024
    Assignee: KOSTAL Automobil Elektrik GmbH & Co. KG
    Inventors: Torben Zeleny, Uwe Borgmann, Jan Freiwald
  • Patent number: 11916563
    Abstract: Provided are an analog-to-digital (AD) converter, a sensor processing circuit, and a sensor system capable of improving responsiveness of feedback control. AD converter includes input part, AD conversion part, first output part, and second output part. The analog signal output from sensor is input to input part. AD conversion part digitally converts an analog signal to generate first digital data and second digital data. First output part outputs the first digital data to control circuit. Second output part outputs the second digital data to sensor before first output part outputs the first digital data.
    Type: Grant
    Filed: March 9, 2020
    Date of Patent: February 27, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Jun'Ichi Naka, Koji Obata, Junji Nakatsuka, Hiroki Yoshino, Masaaki Nagai
  • Patent number: 11906539
    Abstract: An accelerometer sensor includes a casing, a pendulum fixed to the casing, a movable electrode carried by the pendulum and connected to a detection circuit, a first electrode and a second electrode rigidly attached to the casing to form, with the moving electrode, two capacitors of variable capacitance depending on a distance between the electrodes. The accelerometer sensor further includes a control unit that carries out detection operations to measure the variable capacitances of the capacitors. The control unit also performs a control operation of the movable electrode depending on the capacitances measured by applying a logic signal for controlling a switch for selective connection of the fixed electrodes to an excitation circuit delivering a control signal to the fixed electrodes in order to keep the pendulum in a predetermined position.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: February 20, 2024
    Assignee: SAFRAN ELECTRONICS & DEFENSE
    Inventors: Philippe Ullah, Vincent Ragot, Nicolas Bigourie
  • Patent number: 11906693
    Abstract: A gravimeter probe includes a spring structure, a proof mass, movable comb fingers, fixed comb fingers, and an outer frame. A fixed end of the spring structure is arranged on the outer frame and a free end thereof is connected to the proof mass. The movable comb fingers are arranged on upper and lower surfaces of the proof mass, and the fixed comb fingers are correspondingly arranged on the outer frame. Each of the movable comb fingers and the fixed comb fingers has a special-shaped comb finger structure. The special-shaped comb finger structure includes a comb finger bottom portion and a comb finger top portion, and the width of the comb finger bottom portion is smaller than the width of the comb finger top portion.
    Type: Grant
    Filed: August 29, 2022
    Date of Patent: February 20, 2024
    Assignee: HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Wenjie Wu, Bingyang Cai, Le Gao, Yuanlei Wang, Liangcheng Tu
  • Patent number: 11898845
    Abstract: In a general aspect, a micromachined gyroscope can include a substrate and a static mass suspended in an x-y plane over the substrate by a plurality of anchors attached to the substrate. The static mass can be attached to the anchors by anchor suspension flexures. The micromachined gyroscope can include a dynamic mass surrounding the static mass and suspended from the static mass by one or more gyroscope suspension flexures.
    Type: Grant
    Filed: August 9, 2021
    Date of Patent: February 13, 2024
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Cenk Acar, Brenton Simon, Sandipan Maity
  • Patent number: 11891297
    Abstract: The present invention provides a motion control structure and a actuator. The motion control structure includes a motion platform, a first actuator having a first execution unit arranged on opposite sides of the motion platform along an X-axis direction and a second execution unit arranged on opposite sides of the motion platform along a Y-axis direction. The first execution unit includes a first actuating element displaced along the X-axis direction. The second execution unit includes a second actuating element displaced along the Y-axis direction. A second actuator surrounds an inner periphery of the motion platform and includes a third execution unit having an assembly portion displaced along the Z-axis direction. The motion control structure of the invention has the advantages that the motion platform can be driven to realize motion in six degrees of freedom.
    Type: Grant
    Filed: August 17, 2020
    Date of Patent: February 6, 2024
    Assignee: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
    Inventors: Ze Tao, Wooicheang Goh, Zhan Zhan, Kahkeen Lai, Yang Li
  • Patent number: 11879907
    Abstract: The invention provides an acceleration sensor, including a sensing unit, a sensing unit includes a ring-shaped outer coupling unit; seesaw structures, including at least two and arranged on an inner side of the outer coupling unit; an inner coupling unit, including an inner coupling elastic beam connecting two adjacent seesaw structures; proof mass blocks fixed on the outer coupling unit or the inner coupling unit or the seesaw structures; an in-plane coupling elastic member elastically connecting the seesaw structures to the outer coupling unit; in-plane displacement detection devices arranged on the proof mass blocks and configured to detect movements of the proof mass blocks along the first direction and/or along the second direction; and out-of-plane displacement detection devices arranged on the outer coupling unit and/or the seesaw structures and/or the inner coupling unit configured to detect movements of the seesaw structures along the third direction.
    Type: Grant
    Filed: August 3, 2022
    Date of Patent: January 23, 2024
    Assignee: AAC Kaitai Technologies (Wuhan) CO., LTD
    Inventors: Shitao Yan, Zhan Zhan, Shan Yang, Zhao Ma, Hongtao Peng, Xiao Kan, Yang Li, Kahkeen Lai, Yan Hong, Veronica Tan
  • Patent number: 11858805
    Abstract: A micromechanical structure, including a substrate, a seismic mass movable with respect to the substrate, and first and second detectors. A first direction and a second direction perpendicular to the first direction define a main extension plane of the substrate. The first and second detectors respectively detect a translatory deflection, and a rotatory deflection. The seismic mass is connected to the substrate via an anchoring element and four torsion spring sections. The first detector include an electrode structure, including first electrodes attached at the seismic mass and second electrodes attached at the substrate. The first and second electrodes have a two-dimensional extension in the second direction and in a third direction perpendicular to the main extension plane. The anchoring element includes first and second sections with a gap between them. A connecting element connects two first electrodes and is guided through the gap.
    Type: Grant
    Filed: September 7, 2021
    Date of Patent: January 2, 2024
    Assignee: ROBERT BOSCH GMBH
    Inventors: Stefan Kiesel, Cristian Nagel, Sebastian Guenther
  • Patent number: 11852525
    Abstract: An ambient light sensor is provided that includes a sensor input having a delta-sigma analogue to digital converter. The delta-sigma analogue to digital converter includes a switched capacitor, a common mode voltage source, a reference voltage source, and a switch network. In a first clock phase, the switch network connects the switched capacitor to charge it to either a sum or difference voltage. In a second clock phase, the switch network connects the switched capacitor to transfer charge into a summing junction. A controller controls the switch network in response to a comparator output to connect the switched capacitor to either the common mode voltage or the reference voltage while in the first clock phase.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: December 26, 2023
    Assignees: PAX WATER TECHNOLOGIES INC., AMS INTERNATIONAL AG
    Inventors: Ravi Kumar Adusumalli, Rahul Thottathil, Gowri Krishna Kanth Avalur, Sudhakar Singamala
  • Patent number: 11852650
    Abstract: The present disclosure is directed to micro-electromechanical system (MEMS) accelerometers that are configured for a user interface mode and a true wireless stereo (TWS) mode of an audio device. The accelerometers are fabricated with specific electromechanical parameters, such as mass, stiffness, active capacitance, and bonding pressure. As a result of the specific electromechanical parameters, the accelerometers have a resonance frequency, quality factor, sensitivity, and Brownian noise density that are suitable for both the user interface mode and the TWS mode.
    Type: Grant
    Filed: February 18, 2022
    Date of Patent: December 26, 2023
    Assignee: STMICROELECTRONICS S.r.l.
    Inventors: Francesco Rizzini, Nicolo' Manca, Cristian Dall'Oglio
  • Patent number: 11854296
    Abstract: A fingerprint sensing system comprising a plurality of conductive selection lines; a plurality of conductive read-out lines crossing the selection lines; selection circuitry controllable to provide a selection signal on at least one selected selection line in the plurality of selection lines; a plurality of pixel elements formed at intersections between the selection lines and the read-out lines; read-circuitry coupled to each read-out line in the plurality of read-out lines, the read-out circuitry being configured to acquire a read-out signal via a read-out line connected to a selected pixel element, and calibration circuitry having an input for receiving a calibration input signal and an output for providing a calibration output signal, the calibration output signal being formed through interaction between the calibration input signal and the calibration circuitry.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: December 26, 2023
    Assignee: FINGERPRINT CARDS ANACATUM IP AB
    Inventors: Andreas Larsson, David Carling
  • Patent number: 11835541
    Abstract: A MEMS accelerometric sensor includes a bearing structure and a suspended region that is made of semiconductor material, mobile with respect to the bearing structure. At least one modulation electrode is fixed to the bearing structure and is biased with an electrical modulation signal including at least one periodic component having a first frequency. At least one variable capacitor is formed by the suspended region and by the modulation electrode in such a way that the suspended region is subjected to an electrostatic force that depends upon the electrical modulation signal. A sensing assembly generates, when the accelerometric sensor is subjected to an acceleration, an electrical sensing signal indicating the position of the suspended region with respect to the bearing structure and includes a frequency-modulated component that is a function of the acceleration and of the first frequency.
    Type: Grant
    Filed: February 4, 2020
    Date of Patent: December 5, 2023
    Assignee: STMICROELECTRONICS S.r.l.
    Inventors: Alessandro Tocchio, Gabriele Gattere
  • Patent number: 11767699
    Abstract: A system for avoiding pinching in vehicle doors includes capacitive proximity sensors for being mounted at each door along closing surfaces. The system also includes an accelerometer for being arranged in each door, a stopper bar, and a release mechanism for the stopper bar. The capacitive proximity sensors, the accelerometer, and the release mechanism are connected to a control unit arranged such that the stopper bar is moved to a blocking position when the capacitive proximity sensor for the same door senses an object and the door has stopped accelerating.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: September 26, 2023
    Assignee: Ningbo Geely Automobile Research & Development Co.
    Inventors: Magnus Nilsson, Måns Pihlsgård
  • Patent number: 11757378
    Abstract: A micromechanical arm array is provided. The micromechanical arm array comprises: a plurality of micromechanical arms spaced from each other in a first horizontal direction and extending in a second horizontal direction, wherein each micromechanical arm comprises a protrusion at a top of each micromechanical arm and protruding upwardly in a vertical direction; a plurality of protection films, each protection film encapsulating one of the plurality of micromechanical arms; and a metal connection structure extending in the first horizontal direction. The metal connection structure comprises: a plurality of joint portions, each joint portion corresponding to and surrounding the protrusion of one of the plurality of micromechanical arms; and a plurality of connection portions extending in the first horizontal direction and connecting two neighboring joint portions.
    Type: Grant
    Filed: June 6, 2022
    Date of Patent: September 12, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shih-Yu Liao, Tsai-Hao Hung
  • Patent number: 11754594
    Abstract: A gyro sensor includes: a spring having an inner span beam connected to an outer span beam via a turnaround beam; and a fixed driver that laterally faces the outer beam. A first beam is provided to the structure side of the outer beam so as to face the outer beam. T1 is a width of a space between the outer beam and the structure, T2 is a width of a space between the inner and outer beams, and T2<T1.
    Type: Grant
    Filed: July 16, 2021
    Date of Patent: September 12, 2023
    Inventor: Teruo Takizawa
  • Patent number: 11747229
    Abstract: Spatially-distributed resonant MEMS sensors are coordinated to generate frequency-modulated signals indicative of regional contact forces, ambient conditions and/or environmental composition.
    Type: Grant
    Filed: December 13, 2022
    Date of Patent: September 5, 2023
    Assignee: SiTime Corporation
    Inventors: Paul M. Hagelin, Charles I. Grosjean, Lev Goncharov
  • Patent number: 11719722
    Abstract: According to one embodiment, a sensor includes a base including a first face, and a first structure body fixed to the first face. The first structure body includes first and second support portions, a first movable portion, and a first fixed electrode. The first support portion is fixed to the first surface. The second support portion is fixed to the first face and provided around the first support portion. The first movable portion is supported by the first and second support portions and apart from the base. The first fixed electrode is fixed to the first face. The first movable portion includes a first movable electrode and a first conductive member. A first current is configured to flow the first conductive member. The first fixed electrode faces the first movable electrode. A first gap is provided between the first fixed electrode and the first movable portion.
    Type: Grant
    Filed: February 9, 2022
    Date of Patent: August 8, 2023
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Hiroaki Yamazaki
  • Patent number: 11691871
    Abstract: A MEMS vibration sensor includes a membrane having an inertial mass, the membrane being affixed to a holder of the MEMS vibration sensor; and a segmented backplate spaced apart from the membrane, the segmented backplate being affixed to the holder.
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: July 4, 2023
    Assignee: Infineon Technologies AG
    Inventors: Somu Goswami, Christian Bretthauer, Matthias Friedrich Herrmann, Gunar Lorenz
  • Patent number: 11661336
    Abstract: A method for manufacturing an electroacoustic transducer includes a frame; an element moveable with respect to the frame, the moveable element including a membrane and a structure for rigidifying the membrane; a first transmission arm, the moveable element being coupled to an end of the first transmission arm; wherein a shield is used to protect the rigidification structure during a step of etching a substrate, the etching of the substrate making it possible to delimit the first transmission arm and to lighten the moveable element.
    Type: Grant
    Filed: September 28, 2021
    Date of Patent: May 30, 2023
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventor: Loïc Joet
  • Patent number: 11662360
    Abstract: A physical quantity sensor includes a substrate, a movable body that faces the substrate, a fixed portion that is fixed to the substrate, and a support beam that couples the movable body to the fixed portion. The movable body is displaceable with the support beam as a rotation axis, and includes, in a plan view, a first mass that is located on one side of a second direction with respect to the rotation axis, and a second mass that is located on the other side. Each of the first mass and the second mass has a plurality of through-holes which penetrate through the movable body and each of which has a square shape as an opening shape. When damping is indicated by C, and a minimum value of the damping is indicated by Cmin, C?1.5?Cmin.
    Type: Grant
    Filed: September 15, 2020
    Date of Patent: May 30, 2023
    Inventor: Satoru Tanaka
  • Patent number: 11614328
    Abstract: A sensing device includes an anchor having a central axis that defines a first radial direction and a second radial direction, and a resonant member flexibly supported by the anchor that includes a main body made of a single-crystal solid. The main body has a first material stiffness in the first radial direction and a second material stiffness in the second radial direction that is less than the first material stiffness. Moreover, the main body has a first component stiffness in the first radial direction and a second component stiffness in the second radial direction that is substantially similar to the first component stiffness. Another sensing device includes a resonant member having a main body that defines an aperture extending through the main body, and an electrode located in the aperture such that a capacitive channel is defined between the electrode and the main body that circumscribes the electrode.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: March 28, 2023
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Sagnik Pal, Diego Emilio Serrano, Thomas Kieran Nunan
  • Patent number: 11609136
    Abstract: Spatially-distributed resonant MEMS sensors are coordinated to generate frequency-modulated signals indicative of regional contact forces, ambient conditions and/or environmental composition.
    Type: Grant
    Filed: April 2, 2022
    Date of Patent: March 21, 2023
    Assignee: SiTime Corporation
    Inventors: Paul M. Hagelin, Charles I. Grosjean, Lev Goncharov
  • Patent number: 11584634
    Abstract: A micromechanical component for a sensor device. The component includes a first seismic mass, the first seismic mass displaced out of its first position of rest by a first limit distance into a first direction along a first axis mechanically contacting a first stop structure, and including a second seismic mass which is displaceable out of its second position of rest at least along a second axis, the second axis lying parallel to the first axis or on the first axis, and a second stop surface of the second seismic mass, displaced out of its second position of rest into a second direction counter to the first direction along the second axis, mechanically contacting a first stop surface of the first seismic mass adhering to the first stop structure.
    Type: Grant
    Filed: July 21, 2021
    Date of Patent: February 21, 2023
    Assignee: Robert Bosch GmbH
    Inventor: Johannes Classen
  • Patent number: 11579028
    Abstract: MEMS force sensors for providing temperature coefficient of offset (TCO) compensation are described herein. An example MEMS force sensor can include a TCO compensation layer to minimize the TCO of the force sensor. The bottom side of the force sensor can be electrically and mechanically mounted on a package substrate while the TCO compensation layer is disposed on the top side of the sensor. It is shown the TCO can be reduced to zero with the appropriate combination of Young's modulus, thickness, and/or thermal coefficient of expansion (TCE) of the TCO compensation layer.
    Type: Grant
    Filed: October 17, 2018
    Date of Patent: February 14, 2023
    Assignee: Nextinput, Inc.
    Inventors: Julius Minglin Tsai, Dan Benjamin
  • Patent number: 11573246
    Abstract: An inertial sensor includes: a substrate; a fixing part arranged at one surface of the substrate; a moving element having an opening and configured to swing about a rotation axis along a first direction; a support beam supporting the moving element as the rotation axis in the opening of the moving element; and a support part supporting the support beam. The support part includes a first part fixed to the fixing part, and a second part formed only of a part not fixed to the fixing part. A length in the first direction of the second part is longer than a length in the first direction of the first part.
    Type: Grant
    Filed: July 30, 2021
    Date of Patent: February 7, 2023
    Inventor: Satoru Tanaka
  • Patent number: 11555848
    Abstract: A test circuit includes an oscillator configured to generate an oscillation signal, a device-under-test (DUT) configured to output an AC signal based on the oscillation signal, a first detection circuit configured to generate a first DC voltage having a first value based on the oscillation signal, and a second detection circuit configured to generate a second DC voltage having a second value based on the AC signal.
    Type: Grant
    Filed: July 15, 2021
    Date of Patent: January 17, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsieh-Hung Hsieh, Yen-Jen Chen, Tzu-Jin Yeh
  • Patent number: 11543428
    Abstract: An inertial structure is elastically coupled through a first elastic structure to a supporting structure so as to move along a sensing axis as a function of a quantity to be detected. The inertial structure includes first and second inertial masses which are elastically coupled together by a second elastic structure to enable movement of the second inertial mass along the sensing axis. The first elastic structure has a lower elastic constant than the second elastic structure so that, in presence of the quantity to be detected, the inertial structure moves in a sensing direction until the first inertial mass stops against a stop structure and the second elastic mass can move further in the sensing direction. Once the quantity to be detected ends, the second inertial mass moves in a direction opposite to the sensing direction and detaches the first inertial mass from the stop structure.
    Type: Grant
    Filed: June 10, 2020
    Date of Patent: January 3, 2023
    Assignee: STMICROELECTRONICS S.r.l.
    Inventors: Gabriele Gattere, Francesco Rizzini, Alessandro Tocchio