Abstract: A high-Q, mode-matched, vibratory tuning fork based MEMS device, capable of sensing rotational and translational motion around three axes, and processes of fabrication are disclosed herein. In one embodiment, a MEMS device has first and second proof masses actuated along a first axis, and a third and fourth proof masses actuated along a second orthogonal axis. Each of the proof masses includes an inner mass mechanically coupled to an outer frame. A plurality of electrodes sense rotational or translational motion along the three orthogonal axes.

Abstract: A physical quantity detection element includes: a substrate; first and second fixed electrode portions on the substrate; a movable body on the upper portion of the substrate; and a beam on the movable body, the movable body includes a first movable body on a first side of the beam, and a second movable body on a second side of the beam, the first movable body includes a first movable electrode portion facing the first fixed electrode portion and a first mass portion disposed in an opposite direction of the beam from the first movable electrode portion, the second movable body includes a second movable electrode portion facing the second fixed electrode portion, a mass of the first movable body is greater than a mass of the second movable body, and a mass of the first mass portion is greater than a mass of the first movable electrode portion.

Abstract: Various embodiments of the invention provide for stiction testing in MEMS devices, such as accelerometers. In certain embodiments, testing is accomplished by a high voltage smart circuit that enables an analog front-end circuit to accurately read the position of a movable proof-mass relative to a biased electrode in order to allow the detection of both contact and release conditions. Testing allows to detect actual or potential stiction failures and to reject defective parts in a Final Test stage of a manufacturing process where no other contributors to stiction issue can occur, thereby, minimizing stiction failure risks and extending the reliability of MEMS devices.

Abstract: According to a displacement amount monitoring electrode arrangement, there are a linear change region in which the change amount of capacitance changes linearly with the displacement of the movable electrode in the predetermined axis direction, and a nonlinear change region in which the change amount of the capacitance changes nonlinearly with the displacement of the movable electrode in the predetermined axis direction. The nonlinear change region includes a characteristic in which a change sensitivity of the change amount of the capacitance with respect to the displacement amount of the movable electrode in the predetermined axis direction is greater than that in the linear change region, and a target capacitance change amount of the capacitance when the displacement of the movable electrode in the predetermined axis direction reaches a target displacement amount corresponding to the target amplitude is set in the nonlinear change region.

Abstract: A motion sensing transducer includes an electrically conductive substrate having a major surface that defines a substrate plane, and a first compliant structure including a piezoelectric material and having greater compliance to inertial forces oriented out of the substrate plane than to inertial forces oriented in the substrate plane. The first compliant structure includes a piezoelectric material. The motion sensing transducer includes a second compliant structure having greater compliance to inertial forces oriented in the substrate plane than to inertial forces oriented out of the substrate plane. The second compliant structure includes a first surface that is electrically isolated from the substrate. The first surface faces a surface of the substrate. The motion sensing transducer includes a first electrically conductive lead that is electrically connected to the first surface, and a second electrically conductive lead that is electrically connected to the piezoelectric material.

Abstract: A multi-axis force-balance accelerometer has a proof mass included within an enclosure. An electrically conductive tether, flexible in 6 degrees of freedom, provides a compliant electrically conductive link between the proof mass and the enclosure. Mechanical stops limit a range of motion of the proof mass. The enclosure includes captive plates and force balancing control loops for positioning the proof mass in a null position within the enclosure for each of the 3 rectilinear reference axes, and in a null position within the enclosure for each of 3 angular reference axes. The electrically conductive tether is sufficiently mechanically compliant that, on deactivation of the force balancing control loops for the rectilinear axes, the proof mass falls so as to rest on the mechanical stops.

Abstract: A capacitive acceleration sensor with an “H”-shaped beam and a preparation method. The sensor at least includes: a first electrode structural layer, a middle structural layer and a second electrode structural layer; the first electrode structural layer and the second electrode structural layer are provided with electrode lead via holes, respectively; the middle structural layer includes: a frame formed at SOI silicon substrate having a double device layer, a seismic mass whose double sides are symmetrical, and an “H”-shaped elastic beam whose double sides are symmetrical, with one end connected to the frame and the other end connected to the seismic mass, there are anti-overloading bumps and damping grooves symmetrically provided on the two sides of the seismic mass, and the “H”-shaped elastic beam and a bulk silicon layer of the oxygen containing silicon substrate satisfy the requirements therebetween: ?{square root over (2)}(a+b+c)<h, ?{square root over (2)}d<h.

Abstract: A sensor device includes a semiconductor substrate and multiple sensing portions that are placed on one side of the semiconductor substrate and convert a physical quantity into an electrical signal. The one side is parallel to a reference plane defined by an X-direction and a Y-direction perpendicular to each other. The semiconductor substrate has a center point that is both a geometric center and a center of mass. The semiconductor substrate is axisymmetric with respect to each of a first reference line passing through the center point and parallel to the X-direction and a second reference line passing through the center point and parallel to the Y-direction. Each of the sensing portions is axisymmetric with respect to each of the first reference line and the second reference line.

Abstract: The present invention provides a capacitive acceleration sensor with a bending elastic beam and a preparation method. The sensor at least includes a first electrode structural layer, a middle structural layer and a second electrode structural layer; wherein the first electrode structural layer and the second electrode structural layer are provided with an electrode lead via-hole, respectively; the middle structural layer includes: a frame formed on a SOI silicon substrate with a double device layers, a seismic mass whose double sides are symmetrical and a bending elastic beam with one end connected to the frame and the other end connected to the seismic mass, wherein anti-overloading bumps and damping grooves are symmetrically provided on two sides of the seismic mass, and the bending elastic beams at different planes are staggered distributed and are not overlapped with each other in space.

Abstract: This document discusses among other things apparatus and methods for a proof mass including split z-axis portions. An example proof mass can include a center portion configured to anchor the proof-mass to an adjacent layer, a first z-axis portion configure to rotate about a first axis using a first hinge, the first axis parallel to an x-y plane orthogonal to a z-axis, a second z-axis portion configure to rotate about a second axis using a second hinge, the second axis parallel to the x-y plane, wherein the first z-axis portion is configured to rotate independent of the second z-axis portion.

Abstract: A functional device includes a movable member that can be displaced along a first axis, a movable electrode part extended from the movable member, a fixed electrode part provided to be opposed to the movable electrode part, and a stopper part that regulates displacement of the movable member. A projecting part projecting along the first axis is provided on the movable member, and a distance between an end of the projecting part and the stopper part is shorter than a distance between the movable electrode part and the fixed electrode part.

Abstract: An electronic device includes a substrate, a lid which is bonded to the substrate, and a functional element which is provided between the substrate and the lid, in which the lid includes a penetration hole which penetrates a portion between an inner surface and an outer surface, the penetration hole includes a first hole portion and a second hole portion, a flat area of the second hole portion is set to be smaller than a flat area of the first hole portion, at least a part of an inner wall surface of the second hole portion substantially forms a right angle with respect to a bottom surface of the first hole portion, and the penetration hole is sealed with a sealing member.

Abstract: In a method for fabricating an electrostatic capacitance-type acceleration sensor having a capacitor which electrostatic capacitance between a movable electrode and a fixed electrode changes according to the displacement of the movable electrode, the method includes: a step of forming a groove on at least one of the surface of an insulative substrate and the surface of a semiconductor substrate; a step of forming a hole in the semiconductor substrate so as to penetrate the semiconductor substrate at a position communicating with a passage formed by the groove; and a step of forming an electrode extraction hole in the insulative substrate so as to penetrate the insulative substrate, at a position communicating with the passage formed by the groove.

Abstract: A Micro-Electro-Mechanical System (MEMS) device includes a sensing element, and a proof mass over and overlapping at least a portion of the sensing element. The proof mass is configured to be movable toward the sensing element. A protection region is formed between the sensing element and the proof mass. The protection region overlaps a first portion of the sensing element, and does not overlap a second portion of the sensing element, wherein the first and the second portions overlap the proof mass.

Abstract: Sensors for measuring angular acceleration about three mutually orthogonal axes, X, Y, Z or about the combination of these axes are disclosed. The sensor comprises a sensor subassembly. The sensor subassembly further comprises a base which is substantially parallel to the X-Y sensing plane; a proof mass disposed in the X-Y sensing plane and constrained to rotate substantially about the X, and/or Y, and/or Z, by at least one linkage and is responsive to angular accelerations about the X, and/or Y, and/or Z directions. Finally, the sensor includes at least one electrode at the base plate or perpendicular to the base plate and at least one transducer for each sensing direction of the sensor subassembly responsive to the angular acceleration. Multi-axis detection is enabled by adjusting a configuration of flexures and electrodes.

Abstract: A physical quantity sensor according to the embodiment includes: a substrate; a movable body including a movable electrode portion; and a support which supports the movable body around a first shaft to be displaced, in which, when the movable body is divided into a first portion and a second portion with the first shaft as a boundary, the physical quantity sensor includes a first fixed electrode portion which is disposed on the substrate to oppose the first portion, and a second fixed electrode portion which is disposed on the substrate to oppose the second portion, and a guard portion which suppresses an electrostatic force generated between the movable body and the substrate is provided in an inter-electrode area between the first fixed electrode portion and the second fixed electrode portion, on the substrate.

Abstract: An inertial device that is integratable in a portable electronic device includes: an inertial sensor for generating at least one raw acceleration signal in response to accelerations caused by movements of walking and running of a user of the pedometer; and a processing unit, associated to the inertial sensor for counting a number of steps of the user of the pedometer on the basis of the raw acceleration signal. The inertial sensor and the processing unit are both encapsulated within a single package for integrated circuits, which can be coupled to a circuit board of an electronic device and is provided with at least one connection terminal for making the number of steps available to the outside world.

Abstract: The manufacturing of an element structure including two or more sensor element is to be facilitated. An element structure includes a first substrate including a first support layer and a first sensor element disposed on the first support layer and a second substrate including a second support layer and a second sensor element disposed on the second support layer, wherein the second substrate is disposed on the first substrate via a spacer member in a state in which the first sensor element and the second sensor element are disposed to face each other.

Abstract: A physical quantity detector includes a first displacement detector configured by a pair of capacitors, which are configured by first movable electrodes formed on a pendulum, and a pair of first fixed electrodes; a second displacement detector provided below the first displacement detector, and configured by a pair of capacitors, which are configured by second movable electrodes formed on the pendulum, and a pair of second fixed electrodes; a first detection circuit detecting a difference between capacitance values of each of the pair of capacitors of the first displacement detector; a second detection circuit detecting the difference between the capacitance values of each of the pair of capacitors of the second displacement detector; and an instrumentation amplifier calculating a difference between the differences in the capacitance values detected by the first detection circuit and the second detection circuit.

Abstract: A MEMS sensor includes a substrate and a MEMS structure coupled to the substrate. The MEMS structure has a mass movable with respect to the substrate. The MEMS sensor also includes a reference structure electrically coupled to the mass of the MEMS sensor. The reference structure is used to provide a reference to offset any environmental changes that may affect the MEMS sensor in order to increase the accuracy of its measurement.

Abstract: The present disclosure relates to a bump processing method and/or resulting MEMS-CMOS structure, in which one or more anti-stiction bumps are formed within a substrate prior to the formation of a cavity in which the one or more anti-stiction bumps reside. By forming the one or more anti-stiction bumps prior to a cavity, the sidewall angle and the top critical dimension (i.e., surface area) of the one or more anti-stiction bumps are reduced. The reduction in sidewall angle and critical dimension reduces stiction between a substrate and a moveable part of a MEMS device. By reducing the size of the anti-stiction bumps through a processing sequence change, lithographic problems such as reduction of the lithographic processing window and bump photoresist collapse are avoided.

Abstract: A functional device includes a movable body and a supporting section configured to support the movable body via coupling sections extending along a first axis. The supporting section includes a connection region connected to the coupling sections and provided along the first axis and contact regions provided on the outer side of the connection region in plan view and electrically connected to a wire provided on a substrate.

Abstract: A MEMS sensor (20, 86) includes a support structure (26) suspended above a surface (28) of a substrate (24) and connected to the substrate (24) via spring elements (30, 32, 34). A proof mass (36) is suspended above the substrate (24) and is connected to the support structure (26) via torsional elements (38). Electrodes (42, 44), spaced apart from the proof mass (36), are connected to the support structure (26) and are suspended above the substrate (24). Suspension of the electrodes (42, 44) and proof mass (36) above the surface (28) of the substrate (24) via the support structure (26) substantially physically isolates the elements from deformation of the underlying substrate (24). Additionally, connection via the spring elements (30, 32, 34) result in the MEMS sensor (22, 86) being less susceptible to movement of the support structure (26) due to this deformation.

Abstract: An acceleration measuring apparatus that can easily detect acceleration with high accuracy is provided. In the apparatus, positional displacement of a swingable pendulum member is detected, feedback control is performed to maintain the pendulum member in a stationary state using an actuator, and acceleration is measured by measuring the output of the actuator at this time. A movable electrode is provided to the pendulum member, and a loop is formed in which a fixed electrode provided to oppose the movable electrode, and an oscillating circuit, a crystal unit, and the movable electrode are electrically connected in series. By measuring an oscillating frequency of the oscillating circuit at this time, a change in the size of a variable capacitance formed between the movable electrode and the fixed electrode is detected, and thereby the positional displacement of the pendulum member is detected.

Abstract: One or more electrodes that interact with a movable mass in a MEMS device are anchored or otherwise supported from both the top and bottom and optionally also from one or more of the lateral sides other than the transduction side (i.e., the side of the electrode facing the mass) in order to severely restrict movement of the electrodes such as from interaction with the mass and/or external forces.

Abstract: An inertial sensor, comprising a substrate and a rocker that is connected to the substrate via a spring apparatus, the spring apparatus having at least two springs for suspending the rocker on the substrate, the two springs being disposed with an offset from one another with reference to their longitudinal axis.

Abstract: A capacitive accelerometer includes a substrate and a first semiconductor layer. The first semiconductor layer is disposed on the substrate and includes a first mass, first and second anchors, first and second elastic members, and first and second comb capacitor sets. The first and second anchors are disposed at positions corresponding to first and second axes respectively. The first elastic member is connected to the first mass and the first anchor in a manner of bending back and forth perpendicular to the first axis. The second elastic member is connected to the first mass and the second anchor in a manner of bending back and forth perpendicular to the second axis. The first and second comb capacitor sets are disposed at positions corresponding to the second and first axes respectively and connected to the first mass. The first axis is perpendicular to the second axis.

Abstract: Described herein is an accelerometer that can be sensitive to acceleration, but not anchor motion due to sources other than acceleration. The accelerometer can employ a set of electrodes and/or transducers that can register motion of the proof mass and support structure and employ and output-cancelling mechanism so that the accelerometer can distinguish between acceleration and anchor motion due to sources other than acceleration. For example, the effects of anchor motion can be cancelled from an output signal of the accelerometer so that the accelerometer exhibits sensitivity to only acceleration.

Abstract: A sensing apparatus includes an acceleration sensing unit, for measuring an acceleration applied to a proof mass, further including: a proof mass; a carrier signal source, for providing a carrier signal; a capacitive half-bridge, including a first and a second capacitor, wherein each capacitor is coupled to the proof mass and the carrier signal source, one with a positive electrode and the other one with a negative electrode, and the acceleration applied to the proof mass makes the carrier signal flow through the first and the second capacitor so that the first capacitor and the second capacitor respectively generates a first voltage and a second voltage variation which have opposite phases with each other; and an instrumentation amplifier, for receiving and amplifying the first voltage and the second voltage variation, whereby the magnitude and the direction of the acceleration applied to the proof mass is determined.

Abstract: A microelectromechanical systems (MEMS) accelerometer with extended operational capabilities beyond a closed-loop saturation. The present invention combines the closed-loop feedback signal and the measured proof-mass position into a hybrid acceleration measurement, which effectively provides an operating range equal to the traditional closed-loop operating range plus the sensor's mechanical open-loop range.

Abstract: A mechanism for recovering from stiction-related events in a MEMS device through application of a force orthogonal to the stiction force is provided. A small force applied orthogonal to the vector of a stiction force can release the stuck proof mass easier than a force parallel to the vector of the stiction force. Example embodiments provide a vertical parallel plate or comb-fingered lateral actuator to apply the orthogonal force. Alternate embodiments provide a proof mass of a second transducer to impact a stuck MEMS actuator to release stiction.

Abstract: A differential capacitance torque sensor utilizes multiple voltage sources in order to compensate for inherent electrical asymmetries in the sensor. A first voltage source having a voltage V1 is electrically connected across a longitudinally-extending, conductive proof mass, a first upper capacitor C1 and the second lower capacitor C4. A second voltage source having a voltage V2 is connected in series with the first voltage source, a second upper capacitor C3 and a first lower capacitor C2, such that the voltage V2 is given by V 2 = ? ? + 1 ? V 1 , where ? is a parameter defined as ? = C 2 + C 3 C 1 + C 4 - 1.

Abstract: A tri-axial MEMS accelerometer includes a top cap silicon wafer and a bottom cap silicon wafer coupled with a measurement mass. The measurement mass has a two level structure, each level having an inner frame coupled to an outer frame by a plurality of first elastic beams, a mass coupled to the inner frame by a plurality of second elastic beams, and a comb coupling structure between the mass and the inner frame. The comb coupling structures are arranged in an orthogonal orientation. The top level and bottom level measurement masses measure acceleration in perpendicular directions. The top level and bottom level measurement masses and the inner frame form an integral unit which moves along a third direction. Acceleration in the third direction is measured from the change in capacitance between the integral unit and the top cap silicon wafer and bottom cap silicon wafer.

Abstract: An acceleration sensor having a substrate and a seismic mass; the acceleration sensor has a main extension plane and includes a spring device, via which the substrate and the seismic mass are connected, such that in an acceleration in a detection direction that runs perpendicular to the main extension plane, the seismic mass is deflectable in the sense of a tilting motion about an axis of rotation running parallel to the main extension plane, the seismic mass furthermore being connected to the substrate via at least one first spring, the stiffness of the first spring in a deflection of the seismic mass in the sense of the tilting motion being lower in the detection direction than the stiffness of the first spring in a deflection in a primary direction extending parallel to the main extension plane.

Abstract: A sensor element includes: a detection electrode section; a movable body that is provided to face the detection electrode section; and a protruding section that is provided in a region where the detection electrode section is provided in a plan view of the detection electrode section seen in a vertical direction and protrudes toward the movable body. At least a part of a surface of the protruding section is made of an insulating material.

Abstract: A micromechanical system with a system that can vibrate, has a seismic mass and at least two spring elements. The spring elements are respectively fastened on one side externally to the seismic mass and on the other side to fixed anchor points of the micromechanical system such that the seismic mass can vibrate in a movement direction. In order to obtain a particularly large frequency spacing between the useful mode and further vibration modes of the system, at least one further spring element is provided in the inner region of the seismic mass. The further spring element the is fastened to a further anchor point of the micromechanical system. A method builds a micromechanical system with a system that can vibrate.

Abstract: An apparatus includes a microelectromechanical system (MEMS) device including a mass anchored to a substrate. The MEMS device is configured to generate an output signal indicative of motion of the mass with respect to the substrate. The MEMS device includes a feedback module configured to provide a control signal to the MEMS device. The control signal is based on the output signal. The MEMS device is configured to apply a damping force to the mass in response to the control signal.

Abstract: A micromechanical structure for a MEMS structure is provided with: a substrate; a single inertial mass having a main extension in a plane and arranged suspended above the substrate; and a frame element, elastically coupled to the inertial mass by coupling elastic elements and to anchorages, which are fixed with respect to the substrate by anchorage elastic elements. The coupling elastic elements and the anchorage elastic elements are configured so as to enable a first inertial movement of the inertial mass in response to a first external acceleration acting in a direction lying in the plane and also a second inertial movement of the inertial mass in response to a second external acceleration acting in a direction transverse to the plane.

Abstract: An accelerometer comprises a support (12), a proof mass (14) supported for movement relative to the support (12) by a plurality of mounting legs (16), a plurality of fixed capacitor fingers associated with the support (12) and a plurality of movable capacitor fingers associated with the proof mass (14), the fixed capacitor fingers being interdigitated with the movable capacitor fingers, the mounting legs (16) being of serpentine shape, each mounting leg (16) comprising at least a first generally straight section (16a), a second generally straight section (16a), and an end section (16b) of generally U-shaped form interconnecting the first and second generally straight sections (16a), wherein the thickness Te of the end section (16b) is greater than the thickness Tc of a central part (16c) of both of the first and second generally straight sections (16a).

Abstract: An apparatus for detecting mechanical displacement in a micro-electromechanical system includes a capacitor having first and second plates spaced from one another, the first and second plates having different work functions and being electrically connected with each other. The capacitor plates are movable with respect to one another such that a spacing between the plates changes in response to a force. A current through the capacitor represents a rate of change in the spacing between the plates at a given time.

Abstract: The present invention relates to a microelectromechanical structure, and more particularly, to systems, devices and methods of incorporating z-axis out-of-plane stoppers that are controlled to protect the structure from both mechanical shock and electrostatic disturbance. The z-axis out-of plane stoppers include shock stoppers and balance stoppers. The shock stoppers are arranged on a cap substrate that is used to package the structure. These shock stoppers are further aligned to a proof mass in the structure to reduce the impact of the mechanical shock. The balance stoppers are placed underneath the proof mass, and electrically coupled to a balance voltage, such that electrostatic force and torque imposed by the shock stoppers is balanced by that force and torque generated by the balance stoppers. This structure is less susceptible to mechanical shock, and shows a negligible offset that may be induced by electrostatic disturbance caused by the shock stoppers.

Abstract: The invention relates to a microelectromechanical structure, and more particularly, to systems, devices and methods of compensating the effect of the thermo-mechanical stress by incorporating and adjusting elastic elements that are used to couple a moveable proof mass to anchors. The proof mass responds to acceleration by displacing and tilting with respect to a moveable mass rotational axis. The thermo-mechanical stress is accumulated in the structure during the courses of manufacturing, packaging and assembly or over the structure's lifetime. The stress causes a displacement on the proof mass. A plurality of elastic elements is coupled to support the proof mass. Geometry and configuration of these elastic elements are adjusted to reduce the displacement caused by the thermo-mechanical stress.

Abstract: An inertial sensor includes a substrate, a mass element, and a detecting device for detecting a movement of the mass element relative to the substrate, the mass element being coupled to the substrate with the aid of a spring device, wherein the spring device has a T-shaped cross-sectional profile. A method for manufacturing an inertial sensor is also disclosed.

Abstract: An acceleration sensor includes: a rectangular moving electrode; a pair of beams which connect to centers of two opposite sides of the moving electrode, and support the moving electrode freely swingably; and first and second fixed electrodes which are provided on one side and other side of a boundary line, respectively, and are arranged to be opposed to a front surface of the moving electrode at a predetermined interval. A straight line that connects the pair of beams to each other is taken as the boundary line. Then, on a back surface of the moving electrode, first and second recessed portions are formed on one side of the boundary line and the other side thereof, respectively.

Abstract: A micromechanical component having a fixing point and a seismic weight, which is connected to the fixing point by at least one spring and is made at least partially out of a first material, the first material being a semiconductor material, the seismic weight being additionally made out of at least one second material, and the second material having a higher density than the first material. In addition, a manufacturing method for a micromechanical component is provided, having the steps of forming a seismic weight at least partially out of a first material, the first material being a semiconductor material, connecting the seismic weight to a fixing point of the micromechanical component, using at least one spring, and forming the seismic weight from the first material and at least one second material, which has a higher density than the first material.

Abstract: A three-dimensional microelectromechanical systems (MEMS) structure includes a substrate and having a height extending outwardly from the substrate and a largest lateral dimension orthogonal to the height. The largest lateral dimension is smaller than the height. A transducing element is operatively connected to the hair-like core and embedded within, formed on an outer surface of, or disposed at a root of the hair-like core. The transducing element is to receive an electrical core signal or a non-electrical core signal conveyed by the hair-like core. The transducing element is to convert the non-electrical core signal to an electrical output signal, convert the electrical core signal to an electrical output signal in a different format, convert the non-electrical core signal to a different non-electrical output signal, or convert the electrical core signal to a non-electrical output signal.

Abstract: A z-axis micro-electro-mechanical detection structure, having a substrate defining a plane and a suspended mass carried by two anchorage elements. The suspended mass includes a translating mass, suspended over the substrate, mobile in a transverse direction to the plane and arranged between the anchorage elements and two tilting masses, each of which is supported by the anchorage elements through respective elastic anchorage elements so as to be able to rotate with respect to respective oscillation axes. The oscillation axes are parallel to each other to enable a translation movement of the translating mass. Fixed electrodes face at a distance the tilting masses or the translating mass so as to be able to detect displacement of the suspended mass as a result of external forces. Elastic supporting elements are arranged between the translating mass and the tilting masses to enable relative rotation between the translating mass and the tilting masses.

Abstract: Described herein is an accelerometer that can be sensitive to acceleration, but not anchor motion due to sources other than acceleration. The accelerometer can employ a set of electrodes and/or transducers that can register motion of the proof mass and support structure and employ and output-cancelling mechanism so that the accelerometer can distinguish between acceleration and anchor motion due to sources other than acceleration. For example, the effects of anchor motion can be cancelled from an output signal of the accelerometer so that the accelerometer exhibits sensitivity to only acceleration.

Abstract: A MEMS device (40) includes a base structure (42) and a microstructure (44) suspended above the structure (42). The base structure (42) includes an oxide layer (50) formed on a substrate (48), a structural layer (54) formed on the oxide layer (50), and an insulating layer (56) formed over the structural layer (54). A sacrificial layer (112) is formed overlying the base structure (42), and the microstructure (44) is formed in another structural layer (116) over the sacrificial layer (112). Methodology (90) entails removing the sacrificial layer (112) and a portion of the oxide layer (50) to release the microstructure (44) and to expose a top surface (52) of the substrate (48). Following removal, a width (86) of a gap (80) produced between the microstructure (44) and the top surface (52) is greater than a width (88) of a gap (84) produced between the microstructure (44) and the structural layer (54).

Abstract: A sensor system having a substrate and a mass which is movably suspended relative to the substrate is described, the sensor system including detection arrangement for detecting a deflection of the seismic mass relative to the substrate along a deflection direction, the detection arrangement including a first measuring electrode affixed to the substrate and a second measuring electrode affixed to the substrate, and a first overlap, which is perpendicular to the deflection direction, between the first measuring electrode and the seismic mass along the deflection direction is greater than a second overlap, which is perpendicular to the deflection direction, between the second measuring electrode and the seismic mass.