Abstract: A capacitive MEMS gyroscope and a method of making the same are disclosed. The capacitive MEMS gyroscope comprises a semiconductor substrate and a suspended composite wheel.

Abstract: A semiconductor mechanical sensor having a new structure in which a S/N ratio is improved. In the central portion of a silicon substrate 1, a recess portion 2 is formed which includes a beam structure. A weight is formed at the tip of the beam, and in the bottom surface of the weight in the bottom surface of the recess portion 2 facing the same, an electrode 5 is formed. An alternating current electric power is applied between the weight portion 4 and the electrode 5 so that static electricity is created and the weight is excited by the static electricity. In an axial direction which is perpendicular to the direction of the excitation of the weight, an electrode 6 is disposed to face one surface of the weight and a wall surface of the substrate which faces the same. A change in a capacitance between the facing electrodes is electrically detected, and therefore, a change in a physical force acting in the same direction is detected.

Abstract: A bi-directional, out-of-plane electrostatic comb drive apparatus including two electrically independent sets of stator comb tines; and a method for fabricating an out-of-plane comb drive with stacked sets of stator comb tines. A first set of stator comb tines is offset from a second set of stator comb tines. A set of rotor comb tines interleaves with both sets of stator comb tines. A first voltage applied to the first set of stator comb tines operates to pull the rotor tines toward the first set of stator comb tines. A second voltage applied to the second set of stator comb tines operates to pull the rotor tines toward the second set of stator comb tines, enabling bi-directional operation. A fabrication method is disclosed that enables fabrication of the first and second sets of stator comb tines that are mechanically and electrically independent and interleaved by the rotor comb tines.

Abstract: Disclosed is a vehicle sensor (4) for detecting impact sound, including a measured-value sensor (4.1) for detecting an impact sound. The measured-value sensor (4.1) includes several individual, separate measured-value sensing elements (4.1.x), each of which is coupled to a vehicle structure (5) in such a way that impact sound waves are transmitted by the vehicle structure (5) to the measured-value sensing elements (4.1.x).

Abstract: A MEMS device capable of detecting external force with high sensitivity is disclosed.

Abstract: An out-of-plane sensing device is provided. A proof mass is movable with respect to a substrate. A frame is positioned on the substrate and encloses the proof mass. At least one spring connects the proof mass to the frame so that the spring will exert a force on the proof mass to make the proof mass move back to its equilibrium position when the proof mass moves perpendicularly to the substrate. An electrode extends from the proof mass toward the frame. A counter electrode extends from the frame toward the proof mass, wherein the projection of the electrode onto the substrate overlaps with that of the counter electrode onto the substrate.

Abstract: A sensor includes an acceleration detector, an angular velocity detector, a driver, and first to fourth springs. Each detector includes a pair of fixed electrodes, a pair of movable electrodes, and a pair of supporting members for supporting the movable electrodes. The driver causes the supporting members to vibrate in opposite phases in a first direction. The first spring couples the supporting members of the acceleration detector and has elasticity in a second direction perpendicular to the first direction. The second spring couples the supporting members of the acceleration detector to a base and has elasticity in both directions. The third spring couples the supporting members of the acceleration detector to the supporting members of the angular velocity detector and has elasticity in both directions. The fourth spring couples the supporting members to the movable electrodes of the angular velocity detector and has elasticity in the second direction.

Abstract: A micromechanical acceleration sensor includes a substrate with a substrate surface arranged in one plane, a first counter-electrode arranged on the substrate surface, a second counter-electrode arranged on the substrate surface, and a rocking mass arranged above the first counter-electrode and the second counter-electrode. The rocking mass is in this case connected to the substrate via a torsion spring which permits tilting of the rocking mass about an axis of rotation. Further provided are a first compensation counter-electrode arranged on the substrate surface and a second compensation counter-electrode arranged on the substrate surface. In addition, a first compensation electrode is arranged above the first compensation counter-electrode and a second compensation electrode is arranged above the second compensation counter-electrode.

Abstract: An exemplary capacitive sensor includes a casing, a fixed electrode, a spring, a moveable electrode, and a capacitance measuring circuit. The casing includes a base and a cylindrical wall. The fixed electrode is disposed on the cylindrical wall and includes a fixed arm section and at least one fixed prong section, wherein at least one fixed prong section is curved and extends outwards from one side of the fixed arm section. The spring is disposed on the base. The moveable electrode is attached to the spring and includes a movable electrode section and at least one movable prong section, wherein at least one movable prong section is curved and extends outwards from one side of the movable arm section, and the movable prong section and the fixed prong section oppose each other. The capacitance measuring circuit is configured for measuring the capacitance between the fixed electrode and the movable electrode.

Abstract: An oscillating circuit includes an analog oscillation element. The oscillating circuit includes at least one analog-to-digital conversion device. A method is for operating an oscillating circuit, in which a mechanical oscillator oscillates at a natural frequency. The oscillation amplitude is measured and digitized. A digital control signal is generated from this with the aid of a digital amplitude controller. A driving signal is generated, in turn, from the digital control signal, the driving signal driving the mechanical oscillator with the aid of a drive unit. This control loop stabilizes the oscillation amplitude.

Abstract: A MEMS sensor includes: a supporting portion; a movable weight portion; a connecting portion that couples the supporting portion with the movable weight portion and is elastically deformable; a first fixed electrode portion protruding from the supporting portion; and a first movable electrode portion protruding from the movable weight portion and disposed so as to face the first fixed electrode portion, wherein the movable weight portion is formed by stacking a conductive layer and an insulating layer in a first direction, plugs having a larger specific gravity than the insulating layer are embedded in the insulating layer, the conductive layer is connected to the first movable electrode portion, and one of the first fixed electrode portion and the first movable electrode portion has a first electrode portion and a second electrode portion in the first direction.

Abstract: A physical quantity sensor includes a support substrate, anchor portions fixed to a top surface of the support substrate, a movable portion positioned above the support substrate and supported by the anchor portions with support portions provided therebetween such that the movable portion is movable in a height direction, and detection portions for detecting a displacement of the movable portion. The support portions include beam portions provided between the movable portion and the anchor portions such that spring portions are provided between the beam portions and each of the movable portion and the anchor portions, the beam portions having a rigidity higher than a rigidity of the spring portions. The movable portion translates in the height direction owing to twisting of the spring portions and displacements in the height direction of distal ends of the beam portions, the movable portion being supported at the distal end.

Abstract: An accelerometer module for measuring acceleration in a stabilized platform system includes a power supply configured to accept an input AC reference signal and to generate a regulated DC signal and a reference signal in phase with the input AC reference signal; an accelerometer configured to receive the regulated DC signal from said power supply and to generate an output signal in response to an external force acting on the accelerometer module and an analog multiplier unit configured to receive the output signal from the accelerometer and the reference signal from the power supply, and to modulate the reference signal with the output signal so as to output a modulated accelerometer signal. A method for servicing a stabilized platform system comprising is also provided.

Abstract: A vibration measuring system for the frequency-selective measuring of especially low-frequency vibrations relevant in the area of automation and motive power engineering is disclosed which allows an economical vibration analysis of frequencies in the range of from 0 to 1 kHz. For this purpose, a broad-band transmitting structure which is directly induced by the excitation signal to be determined is coupled to a receiving structure by an electrostatic or inductive force. This force coupling brings about an amplitude modulation of a carrier signal inducing the receiving structure. The spectrum of the amplitude-modulated carrier signal can then be used to extract the actual excitation signal, e.g. by suitably choosing the frequency of the carrier signal.

Abstract: The present invention provides a micromachined sensor. The micromachined sensor includes a proof mass movable with respect to a substrate. The proof mass includes a first portion, a second portion separated from the first portion and a third portion connecting the first portion to the second portion. A frame is positioned on the substrate and encloses the proof mass. A plurality of springs connects the proof mass to the frame. A plurality of first and second electrodes extends from the frame. A plurality of third electrodes extends from the first portion of the proof mass and is interleaved with the first electrodes. A plurality of fourth electrodes extends from the second portion of the proof mass and is interleaved with the second electrodes. A first support beam extends from the frame to the area between the first and second portions of the proof mass. A plurality of seventh and eighth electrodes extends from the first support beam.

Abstract: A micromachined sensor having a capacitive sensing structure. The sensor includes a first substrate with first and second conductive layers separated by a buried insulator layer, and a member defined by the first and second conductive layers and the buried insulator layer. A first set of elements defined with the first conductive layer is connected to the member and includes first and second elements that are electrically isolated from each other by the buried insulator layer. A second set of elements is defined with the first conductive layer and capacitively coupled with the first set of elements. A second substrate is bonded to the first substrate so that the member and the first set of elements are movably supported above the second substrate. The second set of elements is anchored to the second substrate, and the first and second sets of elements are physically interconnected through the second substrate.

Abstract: A transducer (20) includes sensors (28, 30) that are bonded to form a vertically integrated configuration. The sensor (28) includes a proof mass (32) movably coupled to and spaced apart from a surface (34) of a substrate (36). The sensor (30) includes a proof mass (58) movably coupled to and spaced apart from a surface (60) of a substrate (56). The substrates (36, 56) are coupled with the surface (60) of substrate (56) facing the surface (34) of substrate (36). Thus, the proof mass (58) faces the proof mass (32). The sensors (28, 30) are fabricated separately and can be formed utilizing differing micromachining techniques. The sensors (28, 30) are subsequently coupled (90) utilizing a wafer bonding technique to form the transducer (20). Embodiments of the transducer (20) may include sensing along one, two, or three orthogonal axes and may be adapted to detect movement at different acceleration sensing ranges.

Abstract: A microelectromechanical systems (MEMS) sensor device (184) includes a sensor portion (180) and a sensor portion (182) that are coupled together to form a vertically integrated configuration having a hermetically sealed chamber (270). The sensor portions (180, 182) can be formed utilizing different micromachining techniques, and are subsequently coupled utilizing a wafer bonding technique to form the sensor device (184). The sensor portion (180) includes one or more sensors (186, 188), and the sensor portion (182) includes one or more sensors (236, 238). The sensors (186, 188) are located inside the chamber (270) facing the sensors (236, 238) also located inside the chamber (270). The sensors (186, 188, 236, 238) are configured to sense different physical stimuli, such as motion, pressure, and magnetic field.

Abstract: A process for fabricating a capacitance type tri-axial accelerometer comprises of preparing a wafer having an upper layer, an intermediate layer and a lower layer, etching the lower layer of the wafer to form an isolated proof mass having a core and four segments extending from the core, etching the upper layer of the wafer to form a suspension and four separating plates, etching away a portion of the intermediate layer located between the four segments of the proof mass and the plates of the upper layer, and disposing an electrical conducting means to pass through the intermediate layer from the suspension to the core of the proof mass.

Abstract: A free-fall detector device includes an inertial sensor, a detection circuit associated to the inertial sensor, and a signal source for supplying a read signal to the inertial sensor. The device moreover includes: a storage element, selectively connectable to the detection circuit for storing a feedback signal generated by the detection circuit in response to the read signal supplied to the inertial sensor; and a feedback circuit coupled to the storage element for supplying the feedback signal to the inertial sensor so that the detection circuit generates at least one detection signal in response to the feedback signal supplied to the inertial sensor.

Abstract: The invention relates to an accelerometer comprising a moving mass (5) and a fixed part (2), which uses variations in capacitance (3, 4) in order to detect the movement of the mass (5). The inventive accelerometer comprises a first series of electrodes (4) which are solidly connected to the mass (5) and which are interdigitated with a series of electrodes (3, 7) which are solidly connected to the fixed part (2). According to the invention, each moving electrode (4), together with an adjacent fixed electrode (3), forms a capacitance which varies according to the position of the moving mass (5). The accelerometer further comprises an electronic circuit which is used to detect the variation in at least one capacitance between the moving mass (5) and the fixed part (2), in the form of a moving mass displacement indicator.

Abstract: A capacitive physical quantity detection device comprising a plurality of capacitive physical quantity sensors, wherein each sensor includes: a detection unit having a movable electrode and a fixed electrode; a C-V conversion circuit having a differential amplifier circuit, wherein a first input terminal of the differential amplifier circuit is coupled with the movable electrode, a second input terminal of the differential amplifier circuit inputs a reference voltage and a self-diagnosis voltage therein during a normal operation and a self-diagnosis operation, respectively, and the C-V conversion circuit outputs an output voltage; and a signal processing circuit that performs a signal processing of the output voltage, wherein the reference voltage in each sensor is substantially the same, the plurality of sensors performs the self-diagnosis operation simultaneously, and the self-diagnosis voltage in one of the sensors is a first self-diagnosis voltage that is different in magnitude from the self-diagnosis vol

Abstract: A three-axis MEMS transducer featuring a caddie-corner proof mass comprises a planar main body portion of conductive material and a planar extra mass caddie-corner feature. The main body portion includes a width, length, and at least four side edges. An x-axis sense direction is defined from a first side edge to an opposite first side edge and a y-axis sense direction is defined from a second side edge to an opposite second side edge. The x-axis sense direction is perpendicular to the y-axis sense direction. The main body portion further includes at least two corners. The caddie-corner feature is positioned about at least one of the two corners of the main body portion. The caddie-corner feature and the main body portion comprise a single proof mass having a z-sense pivot axis disposed at an angle of ninety degrees to a diagonal extending from the caddie-corner feature to an opposite corner of the main body portion.

Abstract: An inertial sensor provided with a detection structure sensitive to a first, a second and a third component of acceleration along respective directions of detection, and generating respective electrical quantities as a function of said components of acceleration. The detection structure supplies at output a resultant electrical quantity obtained as combination of said electrical quantities, and correlated to the value of a resultant acceleration acting on the inertial sensor, given by a vector sum of the components of acceleration. In particular, the detection structure is of a microelectromechanical type, and comprises a mobile portion made of semiconductor material forming with a fixed portion a first, a second and a third detection capacitor, and an electrical-interconnection portion, connecting the detection capacitors in parallel; the resultant electrical quantity being the capacitance obtained from said connection in parallel.

Abstract: A broadband weak-motion inertial sensor includes a frame, a movable inertial mass, a forcing transducer for keeping the inertial mass stationary relative to the frame during operation, and a flexure for suspending the movable mass in the frame. Two or more closely spaced, substantially parallel capacitor plates, at least one attached to the frame, and one attached to the movable inertial mass, form a capacitive displacement transducer. The capacitor plates have a plurality of apertures with dimensions and arrangement chosen to simultaneously minimize damping induced thermal noise and give a high spatial efficiency. In an implementation, three capacitor plates are provided. The capacitor plates each have a same hexagonal pattern of circular holes; the holes are aligned on all included capacitor plates. Radius and spacing of the holes are dictated by a relationship that determines the minimum damping per unit capacitively effective area for a desired spatial efficiency, gap height and capacitor plate thickness.

Abstract: An accelerometer (50, 100, 120, 130) includes a substrate (58) and a proof mass (54) spaced apart from a surface (56) of the substrate (58). Compliant members (62) are coupled to the proof mass (54) and enable the proof mass (54) to move parallel to the surface (56) of the substrate (58) in a sense direction (68). Proof mass anchors (60) interconnect the compliant members (62) with the surface (56). The accelerometer (50, 100, 120, 130) includes an over-travel stop structure (52, 102, 122, 132) having stop anchors (70, 72) coupled to the substrate (58). The stop anchors (70, 72) are coupled to the substrate (58) at positions (76) on the surface (56) residing at least partially within an anchor attach area (71) bounded in the sense direction (68) by locations (78) of the proof mass anchors (60) on the surface (56).

Abstract: Apparatus, methods, and systems for sensing acceleration and magnetic fields in all three axes from a first capacitive bridge sensor having a first proof mass; and a second capacitive bridge sensor having a second proof mass located within the first proof mass. The second proof mass is coupled to the first proof mass by springs that permit movement in the second axis. Sensing of the remaining axis of interest may be done by a third and fourth capacitive bridge configured similar to that of the first and second capacitive bridge sensors. The third and fourth capacitive bridge sensors may be oriented 90 degrees off of the first and second capacitive bridge. An alternative is to locate a third capacitive bridge within the second proof mass.

Abstract: An acceleration sensor includes: a support member; a fixed electrode provided on the support member; a movable unit; a movable electrode provided on the movable unit and disposed opposed to the fixed electrode to generate capacity; and a projection extending from the opposed surface of at least either the fixed electrode or the movable electrode in one direction within the surface.

Abstract: Disclosed is a novel three-axis capacitive-type accelerometer implemented on SOI wafer. The accelerometer consists of four springs, one proof mass, four pairs of gap-closing sensing electrodes (each pair of gap-closing sensing electrode containing one movable electrode and one stationary electrode), and several metal-vias as the electrical interconnections. The movable electrodes are on the proof mass, whereas the stationary electrodes are fixed to the substrate. The three-axis accelerometer has five merits.

Abstract: A transducer package 20 includes a substrate 32 having a first axis of symmetry 36 and a second axis of symmetry 38 arranged orthogonal to the first axis of symmetry 36. At least a first sensor 50 and a second sensor 52 each of which are symmetrically arranged on the substrate 32 relative to one of the first and second axes of symmetry 36 and 38.The first and second sensors 50 and 52 are adapted to detect movement parallel to the other of the first and second axes of symmetry 36 and 38. The first sensor 50 is adapted to detect movement over a first sensing range and the second sensor 52 is adapted to detect movement over a second sensing range, the second sensing range differing from the first sensing range.

Abstract: A sensor element is provided for sensing accelerations in three spatial directions, which furnishes reliable measurement results and moreover can be implemented economically and with a small configuration. The sensor element encompasses at least one seismic mass deflectable in three spatial directions, a diaphragm structure that functions as a suspension mount for the seismic mass, and at least one stationary counterelectrode for capacitive sensing of the deflections of the diaphragm structure. According to the exemplary embodiments and/or exemplary methods of the present invention, the diaphragm structure encompasses at least four electrode regions, electrically separated from one another, that are mechanically coupled via the seismic mass.

Abstract: A semiconductor device includes a semiconductor substrate and a semiconductor mass element configured to move in response to an applied acceleration. The mass element is defined by trenches etched into the semiconductor substrate and a cavity below the mass element. The semiconductor device includes a sensing element configured to sense movement of the mass element and a complementary metal-oxide-semiconductor (CMOS) circuit formed on the substrate.

Abstract: Disclosed are moveable microstructures comprising in-plane capacitive microaccelerometers, with submicro-gravity resolution (<200 ng/?Hz) and very high sensitivity (>17 pF/g). The microstructures are fabricated in thick (>100 ?m) silicon-on-insulator (SOI) substrates or silicon substrates using a two-mask fully-dry release process that provides large seismic mass (>10 milli-g), reduced capacitive gaps, and reduced in-plane stiffness. Fabricated devices may be interfaced to a high resolution switched-capacitor CMOS IC that eliminates the need for area-consuming reference capacitors. The measured sensitivity is 83 mV/mg (17 pF/g) and the output noise floor is ?91 dBm/Hz at 10 Hz (corresponding to an acceleration resolution of 170 ng/?Hz). The IC consumes 6 mW power and measures 0.65 mm2 core area.

Abstract: Microelectromechanical (MEMS) accelerometer and acceleration sensing methods. An example MEMS accelerometer includes a housing, a proof mass suspended within the housing by at least one torsional flexure, at least one planar coil on the proof mass that extends on both sides of an axis of rotation of the proof mass, at least one magnet oriented such that a north-south axis of the at least one magnet is oriented approximately orthogonal to the rotational axis of the proof mass, at least one pole piece located outside the coil, and at least one magnetic flux concentrator located inside the coil opposite the at least one of the at least one pole pieces. A method includes sensing a change in capacitance of a pickoff in the MEMS accelerometer and rebalancing the MEMS accelerometer by sending a current through the planar coil between the magnetic flux concentrator and the pole piece.

Abstract: The MEMS Sensor Suite on a Chip provides the capability, monolithically integrated onto one MEMS chip, to sense temperature, humidity, and two axes of acceleration. The device incorporates a MEMS accelerometer, a MEMS humidity sensor, and a MEMS temperature sensor on one chip. These individual devices incorporate proof masses, suspensions, humidity sensitive capacitors, and temperature sensitive resistors (thermistors) all fabricated in a common fabrication process that allows them to be integrated onto one micromachined chip. The device can be fabricated in a simple micromachining process that allows its size to be miniaturized for embedded and portable applications. During operation, the sensor suite chip monitors temperature levels, humidity levels, and acceleration levels in two axes. External circuitry allows sensor readout, range selection, and signal processing.

Abstract: An angular velocity sensor device includes a structure having an angular velocity detecting element and a vibration body formed thereon. The structure is mounted on the case and the angular velocity detecting element is isolated from external vibrations without the need for rubber and gel vibration dampening materials. Permanent magnets of the same polarity are mounted opposite one another on the structure and the case. The magnetic repulsion is generated between the structure and the case to cause the structure to be housed within the case in a levitated state.

Abstract: Provided is a micro-electromechanical-system (MEMS) device including a substrate; at least one semiconductor layer provided on the substrate; a circuit region including at least one chip containing drive/sense circuitry, the circuit region provided on the at least one semiconductor layer; a support structure attached to the substrate; at least one elastic device attached to the support structure; a proof-mass suspended by the at least one elastic device and free to move in at least one of the x-, y-, and z-directions; at least one top electrode provided on the at least one elastic device; and at least one bottom electrode located beneath the at least one elastic device such that an initial capacitance is generated between the at least one top and bottom electrodes, wherein the drive/sense circuitry, proof-mass, supporting structure, and the at least one top and bottom electrodes are fabricated on the at least one semiconductor layer.

Abstract: Exemplary embodiments relate to a sensor for detecting an acceleration acting on the sensor, having: a substrate, a mass unit, which acts as an inert mass in the event of the presence of an acceleration, a fixing structure, wherein the mass unit is articulated on the substrate in such a way that at least one pivot axis is defined, about which the mass unit can perform a rotation relative to the substrate as a result of an acceleration acting on the sensor, and the mass unit has an interial center of gravity, which is at a distance from the respective pivot axis, and at least one detection unit, with which a change in position between the mass unit and the substrate may be detected. The detection unit is arranged with respect to the mass unit in such a way that a deformation of the mass unit cannot be transferred to the detection unit.

Abstract: An acceleration sensor includes a seismic mass which is suspended on springs above a substrate and is deflectable in a direction perpendicular to a surface of the substrate. In order to reduce deflections of the seismic mass along the surface of the substrate because of interference accelerations, which lead to a falsification of the measurements of the deflection of the seismic mass perpendicular to the surface of the substrate, the springs include two bending bars which are interconnected via crosspieces.

Abstract: Provided is a high-sensitivity MEMS-type z-axis vibration sensor, which may sense z-axis vibration by differentially shifting an electric capacitance between a doped upper silicon layer and an upper electrode from positive to negative or vice versa when center mass of a doped polysilicon layer is moved due to z-axis vibration. Particularly, since a part of the doped upper silicon layer is additionally connected to the center mass of the doped polysilicon layer, and thus an error made by the center mass of the doped polysilicon layer is minimized, it may sensitively respond to weak vibration of low frequency such as seismic waves. Accordingly, since the high-sensitivity MEMS-type z-axis vibration sensor sensitively responds to a small amount of vibration in a low frequency band, it can be applied to a seismograph sensing seismic waves of low frequency which have a very small amount of vibration and a low vibration speed.

Abstract: A method and a switch arrangement for operating a micromechanical capacitive sensor having at least one and at most two fixed electrodes and one differential capacitor formed by a movable central electrode that can be deflected by an external force, wherein the deflection of the electrode is measured. A fraction of the force acting on the central electrode, corresponding to the electrostatic restorative force, is compensated. Under closed-loop operation, a selection signal is influenced by a regulator supplementing a restore crosstalk signal so that the created capacitive restorative force acts in a compensatory manner against deflection of the central electrode.

Abstract: A method for testing a variable capacitance measurement system including a fixed voltage source, a variable capacitance sensor, and a circuit to process information output by this sensor. The method connects an electrically controllable electronic simulation device to replace the variable capacitance sensor, models the electrophysical behaviour of the sensor, and tests the system.

Abstract: A micromechanical inertial sensor having at least one seismic mass which may be deflected relative to a substrate, and at least one electrode surface which in terms of circuitry, together with at least portions of the seismic mass forms at least one capacitor having a capacitance which is dependent on the deflection of the seismic mass. At least one additional auxiliary electrode is included which is located outside the region which forms the capacitor and which may be set at a potential that deviates from the potential of the seismic mass.

Abstract: A micromechanical component for detecting an acceleration. The component includes a conductive layer having a first and a second electrode and a rotatable flywheel mass in the form of a rocker having a first and a second lever arm. The first lever arm is situated opposite the first electrode, and the second lever arm is situated opposite the second electrode. The first lever arm has a first hole structure having a number of first cut-outs, and the second lever arm has a second hole structure having a number of second cut-outs. The first and the second lever arm have different masses. The component is characterized by the fact that the outer dimensions of the first and second lever arms correspond, and the first hole structure of the first lever arm differs from the second hole structure of the second lever arm. Furthermore, a method for manufacturing such a micromechanical component is provided.

Abstract: A multi-axis accelerometer is consisted of a substrate with sensing electrodes and a structure layer. The structure layer includes anchor bases fixed on the substrate. A first proof mass is disposed over the substrate and has a first opening and a second opening symmetric to each other. The first proof mass is suspended to the anchor bases. Fixed sensing blocks are disposed on the substrate, and capacitors are formed between each fixed sensing block and the first proof mass for sensing acceleration along two in-plane directions. A second proof mass and a third proof mass are disposed in the first opening and the second opening and are asymmetrically suspended. Separate electrodes are disposed on the substrate and form two differential capacitors with the second proof mass and the third proof mass for sensing the out-of-plane acceleration.

Abstract: The invention relates to measuring devices used in the measuring of acceleration and, more specifically, to capacitive acceleration sensors. The capacitive acceleration sensor according to the present invention contains a movable electrode (5) supported at an axis of rotation (7). The capacitance change in the pair of electrodes of the acceleration sensor, according to the present invention, is enhanced. The acceleration sensor structure, according to the present invention, enables improving the capacitance sensitivity of the pair of electrodes based on rotational motion and measuring acceleration with good performance in capacitive acceleration sensor designs.

Abstract: The present invention discloses a micro-electro-mechanical system (MEMS) device, comprising: a substrate with at least one opening; and a membrane supported on the substrate, the membrane including at least two thin segments and a thick segment connected together, wherein the two thin segments are not at the same level, and the thick segment is formed by a plurality of layers including at least two metal layers and a via layer, such that the membrane has a curve cross section.

Abstract: The present invention discloses a micro-electro-mechanical system (MEMS) device, comprising: a mass including a main body and two capacitor plates located at the two sides of the main body and connected with the main body, the two capacitor plates being at different elevation levels; an upper electrode located above one of the two capacitor plates, forming one capacitor therewith; and a lower electrode located below the other of the two capacitor plates, forming another capacitor therewith, wherein the upper and lower electrodes are misaligned with each other in a horizontal direction.

Abstract: An apparatus includes a seismic acquisition system that includes an accelerometer. The accelerometer includes a capacitive MEMS-based sensor, a controller and a charge amplifier. The sensor includes a proof mass; input terminals to receive a first signal; and an output terminal that is electrically connected to the proof mass to provide a second signal. The first signal, which is regulated by the controller, controls an equilibrium restoring force for the sensor and causes the sensor to provide the second signal. The charge amplifier provides a third signal, which is indicative of a position of the proof mass.

Abstract: A movable mass forming a seismic mass is formed starting from an epitaxial layer and is covered by a weighting region of tungsten which has high density. To manufacture the mass, buried conductive regions are formed in the substrate. Then, at the same time, a sacrificial region is formed in the zone where the movable mass is to be formed and oxide insulating regions are formed on the buried conductive regions so as to partially cover them. An epitaxial layer is then grown, using a nucleus region. A tungsten layer is deposited and defined and, using a silicon carbide layer as mask, the suspended structure is defined. Finally, the sacrificial region is removed, forming an air gap.