Abstract: A system for determining in-plane acceleration of an object. The system includes an in-plane accelerometer with a substrate rigidly attached to an object, and a proof mass—formed from a single piece of material—movably positioned a predetermined distance above the substrate. The proof mass includes a plurality of electrode protrusions extending downward from the proof mass to form a gap of varying height between the proof mass and the substrate. The proof mass is configured to move in a direction parallel to the upper surfaces of each of the plurality of substrate electrodes when the object is accelerating, which results in a change in the area of the gap, and a change in capacitance between the substrate and the proof mass. The in-plane accelerometer can be fabricated using the same techniques used to fabricate an out-of-plane accelerometer and is suitable for high-shock applications.

Abstract: An acceleration sensor of the present invention comprises a first mass body which is held by first beams and can be displaced by acceleration, fixed electrodes which are so arranged as to convert the displacement of the first mass body into the quantity of electricity, and a displaceability changing member for changing the displaceability of the first mass body when the displacement of the first mass body exceeds a predetermined range.

Abstract: A multi-axis accelerometer is consisted of a substrate with sensing electrodes and a structure layer. The structure layer includes anchor bases fixed on the substrate. A first proof mass is disposed over the substrate and has a first opening and a second opening symmetric to each other. The first proof mass is suspended to the anchor bases. Fixed sensing blocks are disposed on the substrate, and capacitors are formed between each fixed sensing block and the first proof mass for sensing acceleration along two in-plane directions. A second proof mass and a third proof mass are disposed in the first opening and the second opening and are asymmetrically suspended. Separate electrodes are disposed on the substrate and form two differential capacitors with the second proof mass and the third proof mass for sensing the out-of-plane acceleration.

Abstract: Disclosed herein is an inertial sensor. There is provided an inertial sensor 100, including: a plate-like substrate layer 110, a mass body 130, a post 140, a support part 150 extending in the central direction of the mass body 130 from the post 140, and a detection unit 170 detecting the displacement of the displacement part 113. The inertial sensor adopts the support part 150 limiting the downward displacement of the mass body 130 to prevent the support portion of the mass body 130 from being damaged.

Abstract: According to one example of the invention, a drill rod handler includes a movable clamp. A position sensor system for the drill rod handler includes a level sensor that is configured to detect a position of the moveable clamp with respect to gravity. The position sensor system further includes a rotation sensor configured to detect a rotational position of the moveable clamp with respect to a defined axis that runs parallel to gravity. Furthermore, the position sensor system includes a control center that is communicably connected to the level sensor and the rotation sensor.

Abstract: A transducer (20) includes sensors (28, 30) that are bonded to form a vertically integrated configuration. The sensor (28) includes a proof mass (32) movably coupled to and spaced apart from a surface (34) of a substrate (36). The sensor (30) includes a proof mass (58) movably coupled to and spaced apart from a surface (60) of a substrate (56). The substrates (36, 56) are coupled with the surface (60) of substrate (56) facing the surface (34) of substrate (36). Thus, the proof mass (58) faces the proof mass (32). The sensors (28, 30) are fabricated separately and can be formed utilizing differing micromachining techniques. The sensors (28, 30) are subsequently coupled (90) utilizing a wafer bonding technique to form the transducer (20). Embodiments of the transducer (20) may include sensing along one, two, or three orthogonal axes and may be adapted to detect movement at different acceleration sensing ranges.

Abstract: An accelerometer (50, 100, 120, 130) includes a substrate (58) and a proof mass (54) spaced apart from a surface (56) of the substrate (58). Compliant members (62) are coupled to the proof mass (54) and enable the proof mass (54) to move parallel to the surface (56) of the substrate (58) in a sense direction (68). Proof mass anchors (60) interconnect the compliant members (62) with the surface (56). The accelerometer (50, 100, 120, 130) includes an over-travel stop structure (52, 102, 122, 132) having stop anchors (70, 72) coupled to the substrate (58). The stop anchors (70, 72) are coupled to the substrate (58) at positions (76) on the surface (56) residing at least partially within an anchor attach area (71) bounded in the sense direction (68) by locations (78) of the proof mass anchors (60) on the surface (56).

Abstract: Described herein are processing techniques for fabrication of stretchable and/or flexible electronic devices using laser ablation patterning methods. The laser ablation patterning methods utilized herein allow for efficient manufacture of large area (e.g., up to 1 mm2 or greater or 1 m2 or greater) stretchable and/or flexible electronic devices, for example manufacturing methods permitting a reduced number of steps. The techniques described herein further provide for improved heterogeneous integration of components within an electronic device, for example components having improved alignment and/or relative positioning within an electronic device. Also described herein are flexible and/or stretchable electronic devices, such as interconnects, sensors and actuators.

Abstract: An acceleration and angular velocity detection device includes a first oscillation element and a second oscillation element that are movable in a direction along a first axis and a direction along a second axis, an oscillating portion oscillating the first and second oscillation elements in opposite directions along the first axis, a first detection capacitance element and a second detection capacitance element whose capacitances change in a complementary way in accordance with a displacement of the first oscillation element, a third detection capacitance element and a fourth detection capacitance element whose capacitances change in a complementary way in accordance with a displacement of the second oscillation element, a charge amplifier having a fully differential structure, and a detecting portion detecting an acceleration and an angular velocity of a rotation.

Abstract: An acceleration sensor includes a driver circuit for outputting a biased alternating-current (AC) voltage having a variable bias voltage, a detector element having a capacitance provided between a fixed electrode and a movable electrode changing depending on acceleration applied to the detector element, a current-voltage (C/V) converter for converting a current output from the movable electrode of the detector element into a voltage and outputting the voltage, a first operational amplifier outputting a voltage depending on the input voltage, a synchronous demodulator for synchronously detecting the voltage output from the first operational amplifier, and a defect detector for outputting a defect detection signal when the defect detector determines that the voltage output from the first operational amplifier is out of a predetermined range while the biased AC voltage output from the driver circuit is a predetermined voltage. This acceleration sensor can have a small size.

Abstract: A Z-axis capacitive accelerometer includes a substrate, a capacitance sensing plate, a proof mass and at least one pair of spring beams. The capacitance sensing plate includes two symmetrical sense areas to create differential capacitive measurement. A decoupling structure separates the proof mass and the capacitance sensing plate and their rotational motions from each other. In the proposed Z axis capacitive accelerometer, the distance of the capacitance sensing plate relative to its rotation axis is considerably increased, thereby effectively enhancing the sensitivity when measuring the Z-axis acceleration.

Abstract: Described herein is an accelerometer that can be sensitive to acceleration, but not anchor motion due to sources other than acceleration. The accelerometer can employ a set of electrodes and/or transducers that can register motion of the proof mass and support structure and employ and output-cancelling mechanism so that the accelerometer can distinguish between acceleration and anchor motion due to sources other than acceleration. For example, the effects of anchor motion can be cancelled from an output signal of the accelerometer so that the accelerometer exhibits sensitivity to only acceleration.

Abstract: The present invention discloses a micro-electro-mechanical system (MEMS) device, comprising: a mass including a main body and two capacitor plates located at the two sides of the main body and connected with the main body, the two capacitor plates being at different elevation levels; an upper electrode located above one of the two capacitor plates, forming one capacitor therewith; and a lower electrode located below the other of the two capacitor plates, forming another capacitor therewith, wherein the upper and lower electrodes are misaligned with each other in a horizontal direction.

Abstract: An acceleration sensor having a mass which is movably supported outside its center of gravity, first electrodes on the mass and second electrodes located at a distance therefrom forming a capacitive sensor in order to determine a change in position of the mass as a function of time. At least one spring element which generates a restoring force when the mass is deflected from its neutral position is provided on the side of the mass facing the capacitive sensor. The mass may be obtained by being exposed from a material layer, and the mass is surrounded, at least at its side faces, by this material.

Abstract: A capacitive sensor includes a fixed electrode and a movable electrode that is movably supported by an anchor portion through a beam portion. The fixed electrode and the movable electrode are opposed to each other with a gap interposed therebetween, thereby constituting a detecting unit. A capacitance suitable for a size of the gap is detected to detect a predetermined physical value. At least one of an end of the beam portion connected to the anchor portion and an end of the beam portion connected to the movable electrode is provided with a stress moderating unit that moderates a stress.

Abstract: A method and a switch arrangement for operating a micromechanical capacitive sensor having at least one and at most two fixed electrodes and one differential capacitor formed by a movable central electrode that can be deflected by an external force, wherein the deflection of the electrode is measured. A fraction of the force acting on the central electrode, corresponding to the electrostatic restorative force, is compensated. Under closed-loop operation, a selection signal is influenced by a regulator supplementing a restore crosstalk signal so that the created capacitive restorative force acts in a compensatory manner against deflection of the central electrode.

Abstract: Systems and methods sense out-of-plane linear accelerations. In an exemplary embodiment, the out-of plane linear accelerometer is accelerated in an out-of-plane direction, wherein the acceleration generates a rotational torque to an unbalanced proof mass. A rebalancing force is applied to at least one plurality of interleaved rotor comb tines and stator comb tines, wherein the rebalancing force opposes the rotational torque, wherein the rotor comb tines are disposed at an end of the unbalanced proof mass, and wherein the stator comb tines are disposed on a stator adjacent to the end of the unbalanced proof mass. An amount of acceleration is then determined based upon the applied rebalancing force.

Abstract: A capacitive semiconductor sensor includes a sensor chip, a circuit chip, a plurality of bumps, and a plurality of dummy bumps. The sensor chip includes a dynamic quantity detector, which has a detection axis in one direction. The circuit chip includes a signal processing circuit. The sensor chip and the circuit chip are coupled by flip-chip bonding through the plurality of bumps. Furthermore, the sensor chip and the circuit chip are mechanically coupled through the plurality of dummy bumps.

Abstract: An error-correction method for an acceleration sensor having a plurality of electrodes and a seismic mass. The error-correction method which makes it possible to correct systematic errors at low expense includes the following steps: applying a voltage in order to deflect the seismic mass; measuring a first current caused by the deflection of the seismic mass; measuring a second current caused by the deflection of the seismic mass; and determining a correction variable on the basis of the first current and the second current.

Abstract: Various systems and methods for sensing are provided. In one embodiment, a sensing system is provided that includes a first electrode array disposed on a proof mass, and a second electrode array disposed on a planar surface of a support structure. The proof mass is attached to the support structure via a compliant coupling such that the first electrode array is positioned substantially parallel to and faces the second electrode array and the proof mass is capable of displacement relative to the support structure. The first electrode array includes a plurality of first patterns of electrodes and the second electrode array includes a plurality of second patterns of electrodes. The sensing system further includes circuitry configured to provide an input voltage to each of the second patterns of electrodes to produce an electrical null position for the first electrode array.

Abstract: A physical sensor includes: a substrate having a silicon layer, an oxide film and a support layer; and a sensor portion having movable and fixed electrodes and a lower electrode. The movable electrode is supported by a beam on the support layer. The fixed electrode faces the movable electrode. The lower electrode is disposed on the support layer and faces the movable electrode. The physical sensor detects horizontal physical quantity based on a capacitance between the movable and fixed electrodes, and vertical physical quantity based on a capacitance between the movable and lower electrodes. The beam includes vertical and horizontal beams. The thickness of the vertical beam is smaller than the thickness of the horizontal beam.

Abstract: A MEMS sensor includes a substrate and a MEMS structure coupled to the substrate. The MEMS structure has a mass movable with respect to the substrate. The MEMS sensor also includes a reference structure positioned radially outward from the MEMS structure. The reference structure is used to provide a reference to offset any environmental changes that may affect the MEMS sensor in order to increase the accuracy of its measurement.

Abstract: In various embodiments, a microelectromechanical system may include a mass element; a substrate; a signal generator; and a fixing structure configured to fix the mass element to the substrate; wherein the mass element is fixed in such a way that, upon an acceleration of the microelectromechanical system, the mass element can be moved relative to the substrate in at least two spatial directions, and wherein a signal is generated by the movement of the mass element by means of the signal generator.

Abstract: A displacement measurement apparatus for a microstructure according to the present invention measures a displacement of the microstructure having a fixed portion electrode including a first electrode and a second electrode and a movable portion electrode located oppositely to the fixed portion electrode. A bias generating circuit applies a bias signal to between the first electrode and the movable portion electrode so that influence of a noise signal on a detection signal picked up from between the second electrode and the movable portion electrode may be reduced. A C/V converting circuit converts a capacitance change that is picked up from between the second electrode and the movable portion electrode into a voltage. A detecting circuit detects a displacement of the movable portion electrode based on the voltage.

Abstract: A physical quantity sensor includes an anchor portion, a movable portion displaceable in a height direction, a supporting portion rotatably connected to the anchor portion and the movable portion, and a detection portion. The supporting portion includes a first connection arm connecting the anchor portion and the movable portion to each other and a leg portion extending from the anchor portion in a direction opposite to the first connection arm, the leg portion being displaced in a direction opposite to a displacement direction of the movable portion when the supporting portion rotates. A stopper surface is disposed at a position to which a distal end portion of the leg portion is contactable when the leg portion is displaced in the direction opposite to the displacement direction of the movable portion. Displacement of the movable portion is restricted when the distal end portion of the leg portion contacts the stopper surface.

Abstract: Micro-machined capacitive sensors implemented in micro-electro-mechanical system (MEMS) processes that have higher sensitivity, while providing an increased linear capacitive sensing range. Capacitive sensing is achieved via variable-area sensing, which employs a transduction mechanism in which the relationship between changes in the capacitance of variable, parallel-plate capacitors and displacements of a proof mass is generally linear. Each respective variable, parallel-plate capacitor is formed by a finger/electrode pair, in which both the finger and the electrode have rectangular tooth profiles that include a plurality of rectangular teeth.

Abstract: In a method for regulating an excited oscillation of a system to a resonance case of the system, instantaneous values of the oscillating quantity are discretely recorded using one sampling frequency, and the sampling frequency is selected to be below twice a maximum frequency of the system. In addition, the following steps are provided: ascertaining an oscillation amplitude from the instantaneous values; regulating a control amplitude on the basis of the ascertained oscillation amplitude; specifying a control frequency on the basis of the control amplitude; generating a control oscillation in consideration of the control frequency; combining the oscillation amplitude and the control oscillation to form a control signal; and exciting the system in consideration of the control signal.

Abstract: The present invention discloses a MEMS (Micro-Electro-Mechanical System, MEMS) accelerator with enhanced structural strength. The MEMS accelerator is located on a substrate, and it includes: multiple springs, wherein each spring includes: an anchor, fixed on the substrate; an extensible part, which has a fixed end fixed on the anchor, and a free end floating above the substrate; a proof mass, connected to the free ends of the springs; and multiple in-plane sense electrodes, wherein the extensible part is folded back and forth to form a substantially polygon shape as a whole, in which the fixed end is located within the middle one third length of one side of the substantially polygon shape, and the free end is located within the middle one third length of an opposite side of the substantially polygon shape.

Abstract: A micro-electro-mechanical transducer (such as a cMUT) is disclosed. The transducer has a substrate, a top plate, and a middle spring layer therebetween. The substrate and the middle spring layer define cavities therebetween sidewalled by standing features. The middle spring layer is anchored by the standing features to create cantilevers over the cavities to enable a vertical displacement of connectors placed on the middle spring layer. The connectors define a transducing space between the middle spring layer and the top plate. The top plate is transported by the vertical displacement of the connectors in a piston-like motion to change the transducing space and to effectuate energy transformation. Various configurations of cantilevers, including single cantilevers, back-to-back double cantilevers and head-to-head double cantilevers (bridges) are possible.

Abstract: A sensor system having a substrate and a mass which is movably suspended relative to the substrate is described, the sensor system including detection arrangement for detecting a deflection of the seismic mass relative to the substrate along a deflection direction, the detection arrangement including a first measuring electrode affixed to the substrate and a second measuring electrode affixed to the substrate, and a first overlap, which is perpendicular to the deflection direction, between the first measuring electrode and the seismic mass along the deflection direction is greater than a second overlap, which is perpendicular to the deflection direction, between the second measuring electrode and the seismic mass.

Abstract: A protrusion formation hole is provided so as to pierce a support substrate. A polysilicon film as an electrical conducting material is embedded in the protrusion formation hole through an oxide silicon film. The polysilicon film partially bulges out of the protrusion formation hole toward a movable section to form a protruding section. In other words, the polysilicon film bulges out of the protrusion formation hole toward the movable section to form the protruding section. Thereby, a movable section included in MEMS can be prevented from sticking to other members.

Abstract: A technique includes using an accelerometer to provide an output signal indicative of an acceleration experienced by a movable mass of a sensor of the accelerometer. The technique includes testing the accelerometer, and the testing includes using a closed loop including the sensor to provide the output signal of the accelerometer; injecting a test signal into the loop between an output terminal of the sensor and an output terminal of the accelerometer; and indicating a performance of the accelerometer based on a response of the accelerometer to the injection of the test signal.

Abstract: Substantially hemispherical concave first and second surfaces of substantially equal radius and surface area face each other about a proof mass supported for movement between the surfaces. The surfaces and proof mass have electrically conductive portions allowing assessment of differential capacitance for measurement of acceleration. Electrically conductive portions are connected to a conditioning circuit in an embodiment.

Abstract: A conventional capacitive accelerometer has a limitation in reducing a distance between a sensing electrode and a reference electrode, and requires a complex process and a separate method of correcting a clearance difference caused by a process error. However, the capacitive accelerometer of the present invention has high sensitivity, can be simply manufactured by maintaining a very narrow distance between a reference electrode and a sensing electrode, and can make it unnecessary to individually correct each manufactured accelerometer by removing or drastically reducing a functional difference due to a process error.

Abstract: An inertial sensor includes a substrate, a mass element, and a detecting device for detecting a movement of the mass element relative to the substrate, the mass element being coupled to the substrate with the aid of a spring device, wherein the spring device has a T-shaped cross-sectional profile. A method for manufacturing an inertial sensor is also disclosed.

Abstract: A system includes a capacitance adjustment module and a control module. The capacitance adjustment module is configured to connect one or more of N capacitors in parallel with one of a first and second capacitance. The control module identifies the smaller of the first and second capacitances and identifies the larger of the first and second capacitances. Subsequently, the control module, during each of M iterations, instructs the capacitance adjustment module to connect at least one of the N capacitors across a set of nodes in parallel with the smaller identified capacitance, and determines whether the capacitance associated with the set of nodes is greater than the larger identified capacitance. After the M iterations, the control module approximates the difference between the first and second capacitances based on which of the N capacitors are connected across the nodes. M and N are integers greater than or equal to 1.

Abstract: An apparatus includes a seismic acquisition system that includes an accelerometer. The accelerometer includes a capacitive MEMS-based sensor, a controller and a charge amplifier. The sensor includes a proof mass; input terminals to receive a first signal; and an output terminal that is electrically connected to the proof mass to provide a second signal. The first signal, which is regulated by the controller, controls an equilibrium restoring force for the sensor and causes the sensor to provide the second signal. The charge amplifier provides a third signal, which is indicative of a position of the proof mass. The charge amplifier has an input terminal to continuously receive the second signal during a time in which the first signal controls the equilibrium restoring force and causes the sensor to provide the second signal.

Abstract: A MEMS sensor includes a substrate having a MEMS structure movably attached to the substrate, a cap attached to the substrate and encapsulating the MEMS structure, and an electrode formed on the cap that senses movement of the MEMS structure.

Abstract: A microelectromechanical systems (MEMS) capacitive sensor (52) includes a movable element (56) pivotable about a rotational axis (68) offset between ends (80, 84) thereof. A static conductive layer (58) is spaced away from the movable element (56) and includes electrode elements (62, 64). The movable element (56) includes a section (74) between the rotational axis (68) and one end (80) that exhibits a length (78). The movable element (56) further includes a section (76) between the rotational axis (68) and the other end (84) that exhibits a length (82) that is less than the length (78) of the section (74). The section (74) includes slots (88) extending through movable element (56) from the end (80) toward the rotational axis (68). The slots (88) provide stress relief in section (74) that compensates for package stress to improve sensor performance.

Abstract: The systems and methods described herein provide for the early detection of wire/cable faults. For example, a system may detect electrical/electronic faults with power lines, data lines, communication lines, coaxial cables, and the like (generally referred to herein as “lines”, “wires”, and “cables”) by providing sacrificial materials including a conductive material external to the lines. A processor may be coupled to the conductive material to transmit a control signal along the conductive material of the line to determine whether the line is degrading. That is, when the sacrificial material wears away and exposes the conductive sacrificial material in the line, that conductive material may begin to experience faults. The faults in the external conductive material may serve as precursors to the overall degradation of the line. Thus, the line may be repaired or replaced prior to the degradation of the line itself.

Abstract: A micromechanical structure for a MEMS three-axis capacitive accelerometer is provided with: a substrate; a single inertial mass having a main extension in a plane and arranged suspended above the substrate; and a frame element, elastically coupled to the inertial mass by coupling elastic elements and to anchorages, which are fixed with respect to the substrate by anchorage elastic elements. The coupling elastic elements and the anchorage elastic elements are configured so as to enable a first inertial movement of the inertial mass in response to a first external acceleration acting in a direction lying in the plane and also a second inertial movement of the inertial mass in response to a second external acceleration acting in a direction transverse to the plane.

Abstract: The present invention provides a device for in-situ monitoring of material, process and dynamic properties of a MEMS device. The monitoring device includes a pair of comb drives, a cantilever suspension comprising a translating shuttle operatively connected with the pair of comb drives, structures for applying an electrical potential to the comb drives to displace the shuttle, structures for measuring an electrical potential from the pair of comb drives; measuring combs configured to measure the displacement of the shuttle, and structures for measuring an electrical capacitance of the measuring combs. Each of the comb drives may have differently sized comb finger gaps and a different number of comb finger gaps. The shuttle may be formed on two cantilevers perpendicularly disposed with the shuttle, whereby the cantilevers act as springs to return the shuttle to its initial position after each displacement.

Abstract: A pendulous capacitive accelerometer including a substrate having a substantially planar upper surface with an electrode section, and a sensing plate having a central anchor portion supported on the upper surface of the substrate to define a hinge axis. The sensing plate includes a solid proof mass on a first side of the central anchor portion and a substantially hollow proof mass on a second side of the central anchor portion, providing for reduced overall chip size and balanced gas damping. The solid proof mass has a first lower surface with a first electrode element thereon, and the substantially hollow proof mass has a second lower surface with a second electrode element thereon. Both the solid proof mass and the hollow proof mass have the same capacitive sensing area. The sensing plate rotates about the hinge axis relative to the upper surface of the substrate in response to an acceleration.

Abstract: An tri-axis accelerometer is disclosed. The tri-axis accelerometer includes a mass, a first group of capacitance, a third group of capacitance being neighbor to the first group of capacitance. The mass defines an upper surface, a lower surface parallel to the upper surface and a side wall connecting the upper surface and the lower surface. The first group of capacitance includes a first movable electrode and the third group of capacitance includes a third movable electrode. The first movable electrode is perpendicular to the third movable electrode.

Abstract: A MEMS three-axis accelerometer includes a silicon substrate, a first electrode and a second electrode etched in the same silicon substrate. The first electrode is constituted by a mobile mass fitted with a plurality of mobile fingers extending laterally. The second electrode is composed of two conductive parts located on two opposite sides of the mobile mass. Each conductive part comprises a plurality of fixed fingers formed parallel to the mobile fingers. Each mobile finger is positioned between two contiguous fixed fingers to cooperatively form a microstructure with interdigital combs. The mobile mass is connected to the substrate by a spring.

Abstract: A accelerometer includes a substrate define a stationary electrode thereon, a first moveable mass defining a conductive-layer thereon facing the stationary electrode, a plurality of first elastic elements coupled with a peripheral side of the first moveable mass, a first fixed element surrounding the first moveable mass and fixedly attached to the substrate, a plurality of first fixed electrodes extending outwardly from the first fixed element, a second moveable mass surrounding the first fixed electrodes, a plurality of first moveable electrodes extending inwardly from the second moveable mass toward the first fixed to element and parallel to the first fixed electrodes, respectively, a plurality of second elastic elements coupled with a peripheral side of the second moveable mass, and a second fixed element surrounding the second moveable mass and fixedly attached to the substrate.

Abstract: A accelerometer includes a base, a pair of fixed sensing blocks anchored to the base, a plurality of elastic linkages connected to the base, and a movable sensing block sandwiched between the pair of fixed sensing blocks and suspended in the base by the elastic linkages for moving either along a first or a second axes or shifting along a third axes. Each fixed sensing block defines four fixed sensing sections and each fixed sensing section sets in space with respect to the other fixed sensing sections. A projection of each fixed sensing section along a third axes exceeds the movable sensing block in a direction of the first and second axis, respectively.

Abstract: A micromechanical component is described including a substrate having a spacer layer and a test structure for ascertaining the thickness of the spacer layer. The test structure includes a seismic mass, which is elastically deflectable along a measuring axis parallel to the substrate, a first electrode system and a second electrode system for deflecting the seismic mass along the measuring axis, having a mass electrode, which is produced by a part of the seismic mass, and a substrate electrode, which is situated on the substrate in each case, the first electrode system being designed to be thicker than the second electrode system by the layer thickness of the spacer layer.

Abstract: The manufacturing of an element structure including two or more sensor element is to be facilitated. An element structure includes a first substrate including a first support layer and a first sensor element disposed on the first support layer and a second substrate including a second support layer and a second sensor element disposed on the second support layer, wherein the second substrate is disposed on the first substrate via a spacer member in a state in which the first sensor element and the second sensor element are disposed to face each other.

Abstract: A microelectromechanical systems (MEMS) sensor (52) includes a substrate (62) a movable element (58) spaced apart from the substrate (62), suspension anchors (66, 68, 70, 72) formed on the substrate (62), and compliant members (74) interconnecting the movable element (58) with the suspension anchors. The MEMS sensor (52) further includes fixed fingers (76) and fixed finger anchors (78) attaching the fixed fingers (76) to the substrate (62). The movable element (58) includes openings (64). At least one of the suspension anchors resides in at least one of the multiple openings (64) and pairs (94) of the fixed fingers (76) reside in other multiple openings (64). The MEMS sensor (52) is symmetrically formed, and a location of the fixed finger anchors (78) defines an anchor region (103) within which the suspension anchors (66, 68, 70, 72) are positioned.