Including An Elastic Support For An Inertial Element (e.g., Spring) Patents (Class 73/514.38)
  • Patent number: 10429186
    Abstract: A microelectromechanical device that comprises a first structural layer, and a movable mass suspended to a primary out-of plane motion relative the first structural layer. A cantilever motion limiter structure is etched into the movable mass, and a first stopper element is arranged on the first structural layer, opposite to the cantilever motion limiter structure. Improved mechanical robustness is achieved with optimal use of element space.
    Type: Grant
    Filed: February 25, 2015
    Date of Patent: October 1, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Ville Ahtee, Ville Pekka Rytkönen
  • Patent number: 10131533
    Abstract: A MEMS device includes a first structure including at least one first bump over a surface of the first structure, a second structure including a first side facing the surface of the first bump and a second side opposite to the first side, and a gap between the first structure and the second structure. The first structure and the second structure are configured to move in relation to each other. The first bump includes a plurality of first teeth over a stop surface of the first bump.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: November 20, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Shang-Ying Tsai, Kuei-Sung Chang, Yueh Kang Lee
  • Patent number: 9580300
    Abstract: Systems and methods with the ability to raise the set point temperature immediately after a temperature increase due to radiation exposure, thereby reducing T-dot (rate of change in temperature) errors when trying to cool the inertial system back to its original set point temperature. An example system includes an inertial instrument, a sensor that senses if an increased temperature event has been experienced by the inertial instrument, and a controller device that will increase the set point temperature of the inertial instrument based on the determined increase in temperature. The controller device will also maintain the inertial instrument at a temperature associated with at least one of the sensed increased temperature event or the increased set point temperature.
    Type: Grant
    Filed: February 7, 2008
    Date of Patent: February 28, 2017
    Assignee: Honeywell International Inc.
    Inventor: Robert Meyer
  • Patent number: 9527722
    Abstract: A MEMS sensor including: a base structure; at least one component formed from the base structure which moves relative to the base structure; and one or more locking mechanisms for locking the at least one component in a predetermined stationary position in response to external stimuli exceeding predetermined thresholds in at least first and second directions, where the first direction is different from the second direction.
    Type: Grant
    Filed: June 11, 2013
    Date of Patent: December 27, 2016
    Assignee: OMNITEK PARTNERS LLC
    Inventor: Jahangir S Rastegar
  • Patent number: 9508515
    Abstract: In an electrostatic relay in which a moving contact and a movable electrode are displaced in parallel with a base substrate, an opening force is increased when the movable electrode is separated from a fixed electrode, and a structure is simplified to enhance a degree of freedom of design. A fixed contact portion and a fixed electrode portion are fixed to the base substrate. The fixed electrode portion and a movable electrode portion constitute an electrostatic actuator that displaces the movable electrode portion and a moving contact portion. A movable spring provided in a spring supporting portion retains the movable electrode portion in a displaceable manner. A cantilever secondary spring is provided in the spring supporting portion, and a projection portion is provided in a front end face of the movable electrode portion.
    Type: Grant
    Filed: February 27, 2015
    Date of Patent: November 29, 2016
    Assignee: OMRON Corporation
    Inventors: Takahiro Masuda, Junya Yamamoto
  • Patent number: 9212909
    Abstract: Disclosed herein is a method of manufacturing an inertial sensor. The method includes: (A) preparing a base substrate; (B) forming a depressed first concave part in one surface of the base substrate; (C) forming a mass body in the first concave part by filling a metal or a combination of a metal and a polymer (or a polymer matrix composite) therein; and (D) forming a depressed second concave part in one surface of the base substrate at an outer side of the mass body and forming a flexible part on an upper portion of the second concave part in the base substrate. The mass body formed of the metal or the combination of the metal and the polymer (or the polymer matrix composite) has high density, thereby making it possible to improve sensitivity of the inertial sensor.
    Type: Grant
    Filed: July 3, 2012
    Date of Patent: December 15, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jong Woon Kim, Jung Won Lee
  • Patent number: 9157927
    Abstract: A physical quantity sensor includes a first rocking body and a second rocking body. Each of the rocking bodies is supported on a substrate by a first supporting portion and a second supporting portion. The first rocking body is partitioned into a first region and a second region by a first axis (supporting axis) when viewed in plane, and the second rocking body is partitioned into a third region and a fourth region by a second axis (supporting axis) when viewed in plane. The mass of the second region is larger than the mass of the first region, and the mass of the third region is larger than the mass of the fourth region. An arranged direction of the first region and the second region is the same as an arranged direction of the third region and the fourth region.
    Type: Grant
    Filed: April 14, 2014
    Date of Patent: October 13, 2015
    Assignee: Seiko Epson Corporation
    Inventor: Kei Kanemoto
  • Patent number: 9052334
    Abstract: In an acceleration sensor, a sensor unit includes a weight portion having a recess section with one open surface and a solid section one-piece formed with the recess section, beam portions for rotatably supporting the weight portion such that the recess section and the solid section are arranged along a rotation direction, a movable electrode, fixed electrodes, detection electrodes electrically connected to the fixed electrodes to detect a capacitance between the movable electrode and the fixed electrodes. A fixed plate is arranged in a spaced-apart relationship with a surface of the weight portion on which the movable electrode is provided, and embedment electrodes are embedded in the fixed plate to extend along a thickness direction of the fixed plate, the embedment electrodes having one end portions facing the movable electrode to serve as the fixed electrodes and the other end portions configured to serve as the detection electrodes.
    Type: Grant
    Filed: November 17, 2010
    Date of Patent: June 9, 2015
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hitoshi Yosida, Yuji Suzuki
  • Patent number: 9003885
    Abstract: A tri-axis accelerometer includes a proof mass, at least four anchor points arranged in at least two opposite pairs, a first pair of anchor points being arranged opposite one another along a first axis, a second pair of anchor points being arranged opposite one another along a second axis, the first axis and the second axis being perpendicular to one another, and at least four spring units to connect the proof mass to the at least four anchor points, the spring units each including a pair of identical springs, each spring including a sensing unit.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: April 14, 2015
    Assignee: Robert Bosch GmbH
    Inventors: Zhiyu Pan, Christoph Lang, Gary Yama, Matthias Metz, Markus Ulm
  • Patent number: 8997570
    Abstract: An acceleration sensor having a high impact resistance to prevent breakage under excessive acceleration, but can stably exert a sensing performance. The acceleration sensor is formed of an SOI substrate of a three-layered structure including a silicon layer (active layer silicon), a silicon oxide layer, and a silicon layer (substrate silicon). The acceleration sensor includes frame parts, a plurality of beam parts, the beam parts projecting inward from the frame part, and a weight part supported by the beam parts. A strain sensing part is provided on each of the beam parts. A width W of each of the beam parts, a length I of each of the beam parts, and an inner frame length L of the frame part satisfy the following relationships of Expressions (1) and (2). 2<L/I?2.82??Expression (1) I/W?3.
    Type: Grant
    Filed: October 5, 2011
    Date of Patent: April 7, 2015
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventor: Shinji Maekawa
  • Patent number: 8978475
    Abstract: This document discusses among other things apparatus and methods for a proof mass including split z-axis portions. An example proof mass can include a center portion configured to anchor the proof-mass to an adjacent layer, a first z-axis portion configure to rotate about a first axis using a first hinge, the first axis parallel to an x-y plane orthogonal to a z-axis, a second z-axis portion configure to rotate about a second axis using a second hinge, the second axis parallel to the x-y plane, wherein the first z-axis portion is configured to rotate independent of the second z-axis portion.
    Type: Grant
    Filed: February 1, 2012
    Date of Patent: March 17, 2015
    Assignee: Fairchild Semiconductor Corporation
    Inventor: Cenk Acar
  • Patent number: 8950258
    Abstract: A micromechanical angular acceleration sensor for measuring an angular acceleration is disclosed. The sensor includes a substrate, a seismic mass, at least one suspension, which fixes the seismic mass to the substrate in a deflectable manner, and at least one piezoresistive and/or piezoelectric element for measuring the angular acceleration. The piezoresistive and/or piezoelectric element is arranged in a cutout of the seismic mass. A corresponding method and uses of the sensor are also disclosed.
    Type: Grant
    Filed: May 24, 2012
    Date of Patent: February 10, 2015
    Assignee: Robert Bosch GmbH
    Inventors: Reinhard Neul, Torsten Ohms, Mirko Hattass, Daniel Christoph Meisel
  • Patent number: 8887568
    Abstract: A micromechanical system with a system that can vibrate, has a seismic mass and at least two spring elements. The spring elements are respectively fastened on one side externally to the seismic mass and on the other side to fixed anchor points of the micromechanical system such that the seismic mass can vibrate in a movement direction. In order to obtain a particularly large frequency spacing between the useful mode and further vibration modes of the system, at least one further spring element is provided in the inner region of the seismic mass. The further spring element the is fastened to a further anchor point of the micromechanical system. A method builds a micromechanical system with a system that can vibrate.
    Type: Grant
    Filed: April 7, 2009
    Date of Patent: November 18, 2014
    Assignee: Siemens Aktiengesellschaft
    Inventors: Roman Forke, Dirk Scheibner, Alexey Shaporin
  • Patent number: 8887569
    Abstract: Disclosed herein an inertial sensor and a method of manufacturing the same. An inertial sensor 100 according to a preferred embodiment of the present invention is configured to include a plate-shaped membrane 110, a mass body 120 that includes an adhesive part 123 disposed under a central portion 113 of the membrane 110 and provided at the central portion thereof and a patterning part 125 provided at an outer side of the adhesive part 123 and patterned to vertically penetrate therethrough, and a first adhesive layer 130 that is formed between the membrane 110 and the adhesive part 123 and is provided at an inner side of the patterning part 125. An area of the first adhesive layer 130 is narrow by isotropic etching using the patterning part 125 as a mask, thereby making it possible to improve sensitivity of the inertial sensor 100.
    Type: Grant
    Filed: July 6, 2011
    Date of Patent: November 18, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jong Woon Kim, Won Kyu Jeung
  • Patent number: 8863575
    Abstract: A micromechanical structure for a MEMS structure is provided with: a substrate; a single inertial mass having a main extension in a plane and arranged suspended above the substrate; and a frame element, elastically coupled to the inertial mass by coupling elastic elements and to anchorages, which are fixed with respect to the substrate by anchorage elastic elements. The coupling elastic elements and the anchorage elastic elements are configured so as to enable a first inertial movement of the inertial mass in response to a first external acceleration acting in a direction lying in the plane and also a second inertial movement of the inertial mass in response to a second external acceleration acting in a direction transverse to the plane.
    Type: Grant
    Filed: June 15, 2011
    Date of Patent: October 21, 2014
    Assignee: STMicroelectronics S.R.L.
    Inventors: Attilio Frangi, Biagio De Masi, Barbara Simoni
  • Patent number: 8839670
    Abstract: Described herein is an accelerometer that can be sensitive to acceleration, but not anchor motion due to sources other than acceleration. The accelerometer can employ a set of electrodes and/or transducers that can register motion of the proof mass and support structure and employ and output-cancelling mechanism so that the accelerometer can distinguish between acceleration and anchor motion due to sources other than acceleration. For example, the effects of anchor motion can be cancelled from an output signal of the accelerometer so that the accelerometer exhibits sensitivity to only acceleration.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: September 23, 2014
    Assignee: Invensense, Inc.
    Inventors: Jin Qiu, Joe Seeger, Alexander Castro, Igor Tchertkov, Richard Li
  • Patent number: 8826736
    Abstract: A micromechanical sensor comprising a substrate (5) and at least one mass (6) which is situated on the substrate (5) and which moves relative to the substrate (5) is used to detect motions of the sensor due to an acceleration force and/or Coriolis force which occur(s). The mass (6) and the substrate (5) and/or two masses (5, 7) which move toward one another are connected by at least one bending spring device (6). The bending spring device (6) has a spring bar (9) and a meander (10), provided thereon, having a circle of curvature (K1; K6; K8; K9; K11) whose midpoint (MP1; MP6; MP8; MP9; MP11) and radius of curvature (r1; r6; r8; r9; r11) are inside the meander (10). For reducing stresses that occur, in addition to the radius of curvature (r1; r6; r8; r9; r11) having the inner midpoint (MP1; MP6; MP8; MP9; MP11), the meander (10) has at least one further radius of curvature (r2; r3; r4; r5; r7; r10) having a midpoint (MP2; MP3; MP4; MP5; MP7; MP10) outside the meander (10).
    Type: Grant
    Filed: April 27, 2010
    Date of Patent: September 9, 2014
    Assignee: Maxim Integrated Products, Inc.
    Inventor: Hanno Hammer
  • Patent number: 8820161
    Abstract: A MEMS detection structure is provided with: a substrate having a top surface, on which a first fixed-electrode arrangement is set; a sensing mass, extending in a plane and suspended above the substrate and above the first fixed-electrode arrangement at a separation distance; and connection elastic elements that support the sensing mass so that it is free to rotate out of the plane about an axis of rotation, modifying the separation distance, as a function of a quantity to be detected along an axis orthogonal to the plane. The MEMS detection structure also includes: a coupling mass, suspended above the substrate and connected to the sensing mass via the connection elastic elements; and an anchoring arrangement, which anchors the coupling mass to the substrate with a first point of constraint, set at a distance from the axis of rotation and in a position corresponding to the first fixed-electrode arrangement.
    Type: Grant
    Filed: May 6, 2013
    Date of Patent: September 2, 2014
    Assignee: STMicroelectronics S.r.l.
    Inventors: Gabriele Cazzaniga, Luca Coronato, Barbara Simoni
  • Publication number: 20140174183
    Abstract: A detection structure for a z-axis resonant accelerometer is provided with an inertial mass anchored to a substrate by means of elastic anchorage elements so as to be suspended above the substrate and perform an inertial movement of rotation about a first axis of rotation belonging to a plane of main extension of the inertial mass, in response to an external acceleration acting along a vertical axis transverse with respect to the plane; and a first resonator element and a second resonator element, which are mechanically coupled to the inertial mass by respective elastic supporting elements, which enable a movement of rotation about a second axis of rotation and a third axis of rotation, in a resonance condition. In particular, the second axis of rotation and the third axis of rotation are parallel to one another, and are moreover parallel to the first axis of rotation of the inertial mass.
    Type: Application
    Filed: February 28, 2014
    Publication date: June 26, 2014
    Inventors: Claudia Comi, Alberto Corigliano, Sarah Zerbini
  • Patent number: 8746067
    Abstract: A tunneling accelerometer includes a proof mass that moves laterally with respect to a cap wafer. Either the proof mass or the cap wafer includes a plurality of tunneling tips such that the remaining one of proof mass and the cap wafer includes a corresponding plurality of counter electrodes. The tunneling current flowing between the tunneling tips and the counter electrodes will thus vary as the proof mass laterally displaces in response to an applied acceleration.
    Type: Grant
    Filed: January 8, 2013
    Date of Patent: June 10, 2014
    Assignee: Tialinx, Inc.
    Inventors: Hector J. De Los Santos, Farrokh Mohamadi
  • Patent number: 8739628
    Abstract: An inertial sensor includes a plate-like substrate layer, a mass body, a support frame, a limit stop extending in the central direction of the mass body from the support frame, and a detection unit detecting the displacement of the displacement part. The inertial sensor adopts the limit stop limiting the downward displacement of the mass body to prevent the support portion of the mass body from being damaged.
    Type: Grant
    Filed: June 21, 2011
    Date of Patent: June 3, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd
    Inventors: Jong Woon Kim, Liwei Lin, Minyao Mao, Heung Woo Park
  • Publication number: 20140083190
    Abstract: An acceleration sensor has a substrate, a seismic mass and a detection unit. The seismic mass is configured to be deflected based on an external acceleration acting on the acceleration sensor, the deflection being in the form of a deflection motion with respect to the substrate along a deflection direction. The detection unit is configured to be deflected for the detection of a deflection of the seismic mass, the detection being in the form of a detection motion with respect to the substrate along a detection direction. The detection unit is connected to the seismic mass in such a way that the amplitude of the deflection motion along the deflection direction is greater than the amplitude of the detection motion along the detection direction.
    Type: Application
    Filed: September 26, 2012
    Publication date: March 27, 2014
    Inventors: Rolf Kaack, Dietrich Schubert, Harald Emmerich, Patrick Wellner
  • Patent number: 8671756
    Abstract: A microelectromechanical detection structure for a MEMS resonant biaxial accelerometer is provided with: an inertial mass, anchored to a substrate by elastic elements to be suspended above the substrate. The elastic elements enabling inertial movements of the inertial mass along a first axis of detection and a second axis of detection that belong to a plane of main extension of said inertial mass, in response to respective linear external accelerations. At least one first resonant element and one second resonant element have a respective longitudinal extension, respectively along the first axis of detection and the second axis of detection, and are mechanically coupled to the inertial mass through a respective one of the elastic elements to undergo a respective axial stress when the inertial mass moves respectively along the first axis of detection and the second axis of detection.
    Type: Grant
    Filed: November 22, 2011
    Date of Patent: March 18, 2014
    Assignee: STMicroelectronics S.r.l.
    Inventors: Claudia Comi, Alberto Corigliano, Barbara Simoni
  • Publication number: 20140041453
    Abstract: An inertial sensing device is provided. The inertial device includes a mass proof, a sensing electrode layer to sense the motion of the mass proof, and a spring coupled and to support the mass proof. Wherein, the single-material mass proof can perform multi degree-of freedom inertial sensing.
    Type: Application
    Filed: September 11, 2012
    Publication date: February 13, 2014
    Inventors: Jux WIN, Wei-Leun FANG
  • Patent number: 8646334
    Abstract: A sensor including: a base; at least one component which moves relative to the base; and one or more locking mechanisms for locking the at least one component in a predetermined stationary position in response to external stimuli exceeding predetermined thresholds in at least first and second directions, where the first direction is different from the second direction.
    Type: Grant
    Filed: July 11, 2011
    Date of Patent: February 11, 2014
    Assignee: Omnitek Partners LLC
    Inventor: Jahangir S. Rastegar
  • Patent number: 8621929
    Abstract: A micromechanical component comprising a displaceable mass made of a substrate material having at least one actuator plate electrode and one first insulating layer between the displaceable mass and the at least one actuator plate electrode, a mounting having a frame, which at least partially encloses the displaceable mass, at least one contact terminal of the at least one actuator plate electrode, and at least one stator plate electrode, and at least one spring component, via which the displaceable mass is connected to the mounting, one of the actuator plate electrodes being connected to the assigned contact terminal in each case via the assigned spring component, wherein the frame of the mounting is made of the substrate material of the displaceable mass and wherein one of the actuator plate electrodes is configured in one piece with the assigned contact terminal and the assigned spring component in each case.
    Type: Grant
    Filed: October 5, 2010
    Date of Patent: January 7, 2014
    Assignee: Robert Bosch GmbH
    Inventors: Stefan Weiss, Arnim Hoechst
  • Patent number: 8596122
    Abstract: A micromechanical component comprising a substrate, a seismic mass, and first and second detection means, the substrate having a main extension plane and the first detection means being provided for detection of a substantially translational first deflection of the seismic mass along a first direction substantially parallel to the main extension plane, and the second detection means further being provided for detection of a substantially rotational second deflection of the seismic mass about a first rotation axis parallel to a second direction substantially perpendicular to the main extension plane. The seismic mass can be embodied as an asymmetrical rocker, with the result that accelerations can be sensed as rotations. Detection can be accomplished via capacitive sensors.
    Type: Grant
    Filed: April 1, 2009
    Date of Patent: December 3, 2013
    Assignee: Robert Bosch GmbH
    Inventors: Johannes Classen, Lars Tebje
  • Patent number: 8596123
    Abstract: A microelectromechanical systems (MEMS) device (20) includes a substrate (24) and a movable element (22) adapted for motion relative to the substrate (24). A secondary structure (58) extends from the movable element (22). The secondary structure (58) includes a secondary mass (70) and a spring (68) interconnected between the movable element (22) and the mass (70). The spring (68) is sufficiently stiff to prevent movement of the mass (70) when the movable element (22) is subjected to force within a sensing range of the device (20). However, the spring (68) deflects when the device (20) is subjected to mechanical shock (86), and the spring (68) rebounds thus causing the mass (70) to impact the movable element (22) in a direction that would be likely to dislodge a potentially stuck movable element (22).
    Type: Grant
    Filed: May 5, 2011
    Date of Patent: December 3, 2013
    Assignee: Freescale Semiconductor, Inc.
    Inventor: Peter S. Schultz
  • Patent number: 8584525
    Abstract: A sensor component having a housing and a sensor chip situated in it. The sensor chip is connected mechanically to the housing via at least one elastomer element. In addition, the sensor chip is also connected electrically to the housing via the at least one elastomer element.
    Type: Grant
    Filed: February 18, 2010
    Date of Patent: November 19, 2013
    Assignee: Robert Bosch GmbH
    Inventor: Klaus Offterdinger
  • Patent number: 8584524
    Abstract: The invention is a frequency modulated (FM) inertial sensing device and method which, in one embodiment, comprises an accelerometer having a proof mass coupled to a nano-resonator element. The nano-resonator element is oscillated at a first predetermined frequency, which may be a first resonant frequency, and is altered to oscillate at a second frequency, which may be a second resonant frequency, in response to a resultant force produced by the acceleration of the proof mass. The degree of change in nano-resonator element output frequency is sensed and processed using suitable processing circuitry as a change in acceleration.
    Type: Grant
    Filed: December 13, 2011
    Date of Patent: November 19, 2013
    Assignee: ISC8 Inc.
    Inventor: Ying Hsu
  • Publication number: 20130285790
    Abstract: A motion sensing device includes a sensing chamber including at least one group of sensing surfaces, a signal generator, a sensing body and at least one elastic assembly corresponding to each group of the sensing surfaces. Each group of sensing surfaces includes two opposite sensing surfaces. The signal generator is electrically connected to the sensing surfaces and transmits different control signals to each sensing surface. Each elastic assembly includes two elastic members. One end of each elastic member secured to the sensing surfaces, and another end of each elastic member secured to the sensing body. The motion sensing device is shaken, the sensing body contacts with the corresponding sensing surface and transmits the control signal.
    Type: Application
    Filed: August 1, 2012
    Publication date: October 31, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: TEN-CHEN HO, XIAO-LIAN HE
  • Patent number: 8563344
    Abstract: A method for producing microelectromechanical structures in a substrate includes: arranging at least one metal-plated layer on a main surface of the substrate in a structure pattern; leaving substrate webs open beneath a structure pattern region by introducing first trenches into the substrate perpendicular to a surface normal of the main surface in a region surrounding the structure pattern; coating the walls of the first trenches perpendicular to the surface normal of the main surface with a passivation layer; and introducing cavity structures into the substrate at the base of the first trenches in a region beneath the structure pattern region.
    Type: Grant
    Filed: November 17, 2011
    Date of Patent: October 22, 2013
    Assignee: Robert Bosch GmbH
    Inventors: Jochen Reinmuth, Heiko Stahl
  • Patent number: 8555720
    Abstract: A MEMS device (20) includes a substrate (24) and a movable element (22) adapted for motion relative to the substrate (24). A secondary structure (46) extends from the movable element (22). The secondary structure (46) includes a secondary mass (54) and a spring (56) interconnected between the movable element (22) and the mass (54). The spring (56) is sufficiently stiff to prevent movement of the mass (54) when the movable element (22) is subjected to force within a sensing range of the device (20). When the device (20) is subjected to mechanical shock (66), the spring (56) deflects so that the mass (54) moves counter to the motion of the movable element (22). Movement of the mass (54) causes the movable element (22) to vibrate to mitigate stiction between the movable element (22) and other structures of the device (20) and/or to prevent breakage of components within the device (22).
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: October 15, 2013
    Assignee: Freescale Semiconductor, Inc.
    Inventor: Peter S. Schultz
  • Patent number: 8555719
    Abstract: A microelectromechanical systems (MEMS) sensor (40) includes a substrate (46) and a suspension anchor (54) formed on a planar surface (48) of the substrate (46). A first folded torsion spring (58) and a second folded torsion spring (60) interconnect the movable element (56) with the suspension anchor (54) to suspend the movable element (56) above the substrate (46). The folded torsion springs (58, 60) are each formed from multiple segments (76) that are linked together by bar elements (78) in a serpentine fashion. The folded torsion springs (58, 60) have an equivalent shape and are oriented relative to one another in rotational symmetry about a centroid (84) of the suspension anchor (54).
    Type: Grant
    Filed: January 24, 2011
    Date of Patent: October 15, 2013
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Andrew C. McNeil, Gary G. Li
  • Publication number: 20130247669
    Abstract: An in-plane, monolithically-integrated, inertial device comprising: a support structure and first and second spring mass systems springedly coupled to the support structure. The first spring mass system comprises first and second time domain digital triggers configured to measure rotation and displacement respectively of the support structure about a first axis and along an orthogonal second axis respectively. The second spring mass system comprises third and fourth time domain digital triggers configured to measure acceleration and displacement respectively of the support structure about the second axis and along the first axis respectively.
    Type: Application
    Filed: March 21, 2012
    Publication date: September 26, 2013
    Inventors: Paul D. Swanson, Richard L. Waters
  • Publication number: 20130239686
    Abstract: A MEMS detection structure is provided with: a substrate having a top surface, on which a first fixed-electrode arrangement is set; a sensing mass, extending in a plane and suspended above the substrate and above the first fixed-electrode arrangement at a separation distance; and connection elastic elements that support the sensing mass so that it is free to rotate out of the plane about an axis of rotation, modifying the separation distance, as a function of a quantity to be detected along an axis orthogonal to the plane. The MEMS detection structure also includes: a coupling mass, suspended above the substrate and connected to the sensing mass via the connection elastic elements; and an anchoring arrangement, which anchors the coupling mass to the substrate with a first point of constraint, set at a distance from the axis of rotation and in a position corresponding to the first fixed-electrode arrangement.
    Type: Application
    Filed: May 6, 2013
    Publication date: September 19, 2013
    Applicant: STMicroelectronics S.r.I.
    Inventors: Gabriele Cazzaniga, Luca Coronato, Barbara Simoni
  • Patent number: 8522613
    Abstract: There is provided an acceleration sensor including: a weight portion; plural fixed portions formed above a bottom plate around a periphery of the weight portion; a beam portion coupling the fixed portions and the weight portion, and holding the weight portion at a position separated from the bottom plate; a detection portion provided at the beam portion and detecting deformation of the beam portion; a frame portion provided so as to project out from the bottom plate and surround the fixed portions at a position separated from the fixed portions; and a lid portion of plate shape that seals an opening of the frame portion.
    Type: Grant
    Filed: November 9, 2010
    Date of Patent: September 3, 2013
    Assignee: Oki Semiconductor Co., Ltd.
    Inventor: Takeharu Suzuki
  • Patent number: 8516889
    Abstract: A MEMS resonant accelerometer is disclosed, having: a proof mass coupled to a first anchoring region via a first elastic element so as to be free to move along a sensing axis in response to an external acceleration; and a first resonant element mechanically coupled to the proof mass through the first elastic element so as to be subject to a first axial stress when the proof mass moves along the sensing axis and thus to a first variation of a resonant frequency. The MEMS resonant accelerometer is further provided with a second resonant element mechanically coupled to the proof mass through a second elastic element so as to be subject to a second axial stress when the proof mass moves along the sensing axis, substantially opposite to the first axial stress, and thus to a second variation of a resonant frequency, opposite to the first variation.
    Type: Grant
    Filed: September 2, 2010
    Date of Patent: August 27, 2013
    Assignee: STMicroelectronics S.r.l.
    Inventors: Barbara Simoni, Claudia Comi, Alberto Corigliano
  • Patent number: 8516891
    Abstract: A MEMS sensing system includes a movable mass having at least one contact surface, a stopper system for stopping the movement of the mass, the stopper system having at least one contact surface that contacts a corresponding contact surface of the mass if a sufficient movement of the mass occurs in a direction, at least one stopper gap formed between the at least one contact surface of the stopper system and the corresponding contact surface of the mass, and a spring system in communication with the at least one stopper gap.
    Type: Grant
    Filed: January 16, 2008
    Date of Patent: August 27, 2013
    Assignee: Analog Devices, Inc.
    Inventors: Xin Zhang, Michael W. Judy
  • Patent number: 8505381
    Abstract: A capacitive acceleration sensor includes an acceleration sensor moving part and an acceleration sensor stationary part together forming a capacitor for detecting acceleration, a sealing structure hermetically enclosing but not contacting the acceleration sensor moving part, and at least one support pillar enclosed by but not directly contacted by the acceleration sensor moving part, both ends of the at least one support pillar being in contact with inside walls of the sealing structure. The acceleration sensor moving part is electrically connected to the at least one support pillar.
    Type: Grant
    Filed: April 12, 2010
    Date of Patent: August 13, 2013
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yasuo Yamaguchi, Makio Horikawa
  • Publication number: 20130186202
    Abstract: A device for measuring acceleration includes a base plate and mass elements connected to the base plate via elastic support elements having measuring points. The support elements of a first and a second mass element are constructed such that the support element of the first and the second mass element have at the measuring points an identical response characteristic for a first acceleration component in a first direction, and mutually different response characteristics for a second acceleration component perpendicular to the first component. The deflection of the measurement points is measured and evaluated. The component in the first and second directions is stepwise eliminated, and the result adjusted for the eliminated component is used for recovering these two components. The result adjusted for the eliminated component is measured as static acceleration and the component acting in the first and the second direction is measured as dynamic acceleration.
    Type: Application
    Filed: July 25, 2011
    Publication date: July 25, 2013
    Applicant: FIRST SENSOR AG
    Inventor: Jens Hansen
  • Publication number: 20130186200
    Abstract: A micromechanical structure includes: a substrate which has a main plane of extension; and a mass which is movable relative to the substrate, the movable mass being elastically suspended via at least one coupling spring. A first subregion of the movable mass is situated, at least partially, between the substrate and the coupling spring along a vertical direction which is essentially perpendicular to the main plane of extension.
    Type: Application
    Filed: January 16, 2013
    Publication date: July 25, 2013
    Inventor: Johannes CLASSEN
  • Patent number: 8453506
    Abstract: A spring mounting element is provided having an inner ring with an inner radial circumference and an outer radial circumference, and an outer ring having an inner radial circumference and an outer radial circumference. A plurality of supporting elements are attached to and symmetrically disposed around the outer radial circumference of the inner ring, and attached to the inner radial circumference of the outer ring. The plurality of supporting elements allow the inner ring to move in three dimensions.
    Type: Grant
    Filed: November 29, 2010
    Date of Patent: June 4, 2013
    Assignee: General Electric Company
    Inventor: Dan Tho Lu
  • Patent number: 8429971
    Abstract: A micromechanical acceleration sensor includes a substrate, an elastic diaphragm which extends parallel to the substrate plane and which is partially connected to the substrate, and which has a surface region which may be deflected perpendicular to the substrate plane, and a seismic mass whose center of gravity is situated outside the plane of the elastic diaphragm. The seismic mass extends at a distance over substrate regions which are situated outside the region of the elastic diaphragm and which include a system composed of multiple electrodes, each of which together with oppositely situated regions of the seismic mass forms a capacitor in a circuit. In its central region the seismic mass is attached to the elastic diaphragm in the surface region of the elastic diaphragm which may be deflected perpendicular to the substrate plane.
    Type: Grant
    Filed: November 14, 2007
    Date of Patent: April 30, 2013
    Assignee: Robert Bosch GmbH
    Inventors: Johannes Classen, Axel Franke, Dietrich Schubert, Kersten Kehr, Ralf Reichenbach
  • Publication number: 20130098155
    Abstract: A physical quantity sensor includes a sensor portion, a casing, and a vibration isolator. The casing includes a supporting portion with a supporting surface that is located to face an end surface of the sensor portion. The vibration isolator is located between the end surface of the sensor portion and the supporting surface of the casing to join the sensor portion to the casing. The vibration isolator reduces a relative vibration between the sensor portion and the casing.
    Type: Application
    Filed: December 12, 2012
    Publication date: April 25, 2013
    Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, DENSO CORPORATION
    Inventors: Denso Corporation, Toyota Jidosha Kabushiki Kaisha
  • Patent number: 8424383
    Abstract: A 3-dimensional MEMS sensor, comprising: a first axis fixed electrode; a second axis fixed electrode; a third axis fixed electrode; a movable electrode frame including a first axis movable electrode, a second axis movable electrode, a third axis movable electrode, and a connection part connecting the movable electrodes, wherein the first axis movable electrode and the first axis fixed electrode form a first capacitor along the first axis, the second axis movable electrode and the second axis fixed electrode form a second capacitor along the second axis, and the third axis movable electrode and the third axis fixed electrode form a third capacitor along the third axis, the connection part including a center mass, wherein the center mass is at least connected with one of the first, second and third axis movable electrodes, and has an outer periphery and a first interconnecting segment connecting at least two adjacent sides of the outer periphery; at least one spring connecting with the movable electrode frame;
    Type: Grant
    Filed: January 5, 2010
    Date of Patent: April 23, 2013
    Assignee: Pixart Imaging Incorporation
    Inventors: Chuan-Wei Wang, Sheng-Ta Lee
  • Patent number: 8418558
    Abstract: A covered acceleration sensor element includes a support frame portion surrounding a weight portion, a plurality of flexible beam portions for connecting the weight portion to the support frame portion, and piezoresistance elements provided on the beam portions. An upper cover and a lower cover enclosing the periphery of the weight portion together with the support frame portion are joined to the face and back of the support frame portion. The support frame portion is separated by separation grooves into an inner frame and an outer frame. The plurality of inner frame support portions has flexibility. The beam portions are connected to both sides of the weight portion along the second axis and the third axis. The inner frame support portions are connected to both sides of the inner frame in a direction in which they are rotated nearly 45 degrees from the second axis and the third axis.
    Type: Grant
    Filed: May 28, 2010
    Date of Patent: April 16, 2013
    Assignee: Torex Semiconductor Ltd.
    Inventors: Atsushi Kazama, Masakatsu Saitoh, Ryoji Okada, Yasuhiro Hamaguchi
  • Patent number: 8413509
    Abstract: A device (96) includes a microelectromechanical (MEMS) sensor (40). The sensor (40) includes a movable element (42) adapted for motion in a direction (44) and an anchor (46) coupled to a substrate (48). The MEMS sensor (40) further includes spring members (50) interconnected between the movable element (42) and the anchor (46). Each of the spring members (50) includes beams (56, 58, 60) arranged in substantially parallel alignment, with the beam (60) positioned between the other beams (56, 58). Each of the beams (56, 58) is coupled to the anchor (46) and the beam (60) is coupled to the movable element (42). Each of the spring members (50) further includes a support structure (64) joined with the beams (56, 58) to provide vertical stiffness to the beams (56, 58) of the spring member (50).
    Type: Grant
    Filed: April 14, 2008
    Date of Patent: April 9, 2013
    Assignee: Freescale Semiconductor, Inc.
    Inventor: Aaron A. Geisberger
  • Publication number: 20130062868
    Abstract: An acceleration sensor (40R) for detecting a side surface collision which occurs in a vehicle is mounted on a beam (112) of a door via a support member (50). When a force due to a collision acts on the beam (112), this force is dampened by the support member (50) and thereafter transmitted to the acceleration sensor (40R). As a result, even if the beam (112) moves at an acceleration exceeding the rated input of the acceleration sensor (40R), the acceleration of the acceleration sensor (40R) is suppressed to a level not greater than the rated input. Accordingly, the side surface collision can be detected with high accuracy without using a sensor having a high rated input.
    Type: Application
    Filed: September 7, 2012
    Publication date: March 14, 2013
    Inventors: Yasuo ITOGA, Kazuya OOI, Atsushi Mihara, Atsuhiko Oigawa, Hiroo Kawaguchi
  • Patent number: 8393215
    Abstract: A micromechanical acceleration sensor having a substrate, a suspension, a seismic mass, and stationary capacitive electrodes, in which the seismic mass is suspended over the substrate with the help of the suspension, the seismic mass has a mass center of gravity, the suspension has at least two anchors on the substrate, the two anchors are situated on opposite sides of the mass center of gravity, the distance between the two anchors being small compared to a horizontal extension of the seismic mass, the two anchors determine a central axis, the seismic mass have recesses which are situated on opposite sides of the central axis and are laterally open outward on the sides facing away from the central axis, and the stationary electrodes at least engage in the recesses of the seismic mass.
    Type: Grant
    Filed: May 19, 2009
    Date of Patent: March 12, 2013
    Assignee: Robert Bosch GmbH
    Inventors: Heiko Stahl, Dietrich Schubert, Lars Tebje