Including An Elastic Support For An Inertial Element (e.g., Spring) Patents (Class 73/514.38)
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Patent number: 11768220Abstract: A microelectromechanical systems (MEMS) accelerometer comprises a compliant spring structure with a first beam, a second beam, and a rigid structure. One end of the first beam and one end of the second beam are coupled to the rigid structure and a proof mass is coupled to another end of the second beam. Further, a spring anchor is coupled to another end of the first beam. In response to the proof mass moving, an extension coupled to the rigid structure moves in an opposite direction to motion of the proof mass to contact the proof mass and stop the movement of the proof mass.Type: GrantFiled: September 9, 2021Date of Patent: September 26, 2023Assignee: NXP USA, Inc.Inventors: Aaron A. Geisberger, Jun Tang
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Patent number: 11619647Abstract: A micromechanical sensor system, in particular, an acceleration sensor, including a substrate having a main extension plane, the sensor system including a first mass and a second mass. The first and second masses are each designed to be at least partially movable in a vertical direction, perpendicular to the main extension plane of the substrate. The first mass includes a stop structure, wherein the stop structure has an overlap with the second mass in the vertical direction.Type: GrantFiled: April 21, 2021Date of Patent: April 4, 2023Assignee: ROBERT BOSCH GMBHInventor: Johannes Classen
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Patent number: 10996237Abstract: A physical quantity sensor includes a movable flat plate having a plurality of openings passing therethrough that is swingable around an axis of rotation, a support substrate linked to the flat plate via a column to suspend the movable flat plate over the support substrate via a gap, and a protrusion protruding toward the movable element. In a plan view, the openings are excluded from a D/2-width annular range surrounding the outer circumference of the protrusion, where D is the maximum outer diametrical dimension of the protrusion.Type: GrantFiled: August 29, 2018Date of Patent: May 4, 2021Inventor: Satoru Tanaka
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Patent number: 10429186Abstract: A microelectromechanical device that comprises a first structural layer, and a movable mass suspended to a primary out-of plane motion relative the first structural layer. A cantilever motion limiter structure is etched into the movable mass, and a first stopper element is arranged on the first structural layer, opposite to the cantilever motion limiter structure. Improved mechanical robustness is achieved with optimal use of element space.Type: GrantFiled: February 25, 2015Date of Patent: October 1, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Ville Ahtee, Ville Pekka Rytkönen
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Patent number: 10131533Abstract: A MEMS device includes a first structure including at least one first bump over a surface of the first structure, a second structure including a first side facing the surface of the first bump and a second side opposite to the first side, and a gap between the first structure and the second structure. The first structure and the second structure are configured to move in relation to each other. The first bump includes a plurality of first teeth over a stop surface of the first bump.Type: GrantFiled: June 29, 2017Date of Patent: November 20, 2018Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Shang-Ying Tsai, Kuei-Sung Chang, Yueh Kang Lee
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Patent number: 9580300Abstract: Systems and methods with the ability to raise the set point temperature immediately after a temperature increase due to radiation exposure, thereby reducing T-dot (rate of change in temperature) errors when trying to cool the inertial system back to its original set point temperature. An example system includes an inertial instrument, a sensor that senses if an increased temperature event has been experienced by the inertial instrument, and a controller device that will increase the set point temperature of the inertial instrument based on the determined increase in temperature. The controller device will also maintain the inertial instrument at a temperature associated with at least one of the sensed increased temperature event or the increased set point temperature.Type: GrantFiled: February 7, 2008Date of Patent: February 28, 2017Assignee: Honeywell International Inc.Inventor: Robert Meyer
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Patent number: 9527722Abstract: A MEMS sensor including: a base structure; at least one component formed from the base structure which moves relative to the base structure; and one or more locking mechanisms for locking the at least one component in a predetermined stationary position in response to external stimuli exceeding predetermined thresholds in at least first and second directions, where the first direction is different from the second direction.Type: GrantFiled: June 11, 2013Date of Patent: December 27, 2016Assignee: OMNITEK PARTNERS LLCInventor: Jahangir S Rastegar
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Patent number: 9508515Abstract: In an electrostatic relay in which a moving contact and a movable electrode are displaced in parallel with a base substrate, an opening force is increased when the movable electrode is separated from a fixed electrode, and a structure is simplified to enhance a degree of freedom of design. A fixed contact portion and a fixed electrode portion are fixed to the base substrate. The fixed electrode portion and a movable electrode portion constitute an electrostatic actuator that displaces the movable electrode portion and a moving contact portion. A movable spring provided in a spring supporting portion retains the movable electrode portion in a displaceable manner. A cantilever secondary spring is provided in the spring supporting portion, and a projection portion is provided in a front end face of the movable electrode portion.Type: GrantFiled: February 27, 2015Date of Patent: November 29, 2016Assignee: OMRON CorporationInventors: Takahiro Masuda, Junya Yamamoto
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Patent number: 9212909Abstract: Disclosed herein is a method of manufacturing an inertial sensor. The method includes: (A) preparing a base substrate; (B) forming a depressed first concave part in one surface of the base substrate; (C) forming a mass body in the first concave part by filling a metal or a combination of a metal and a polymer (or a polymer matrix composite) therein; and (D) forming a depressed second concave part in one surface of the base substrate at an outer side of the mass body and forming a flexible part on an upper portion of the second concave part in the base substrate. The mass body formed of the metal or the combination of the metal and the polymer (or the polymer matrix composite) has high density, thereby making it possible to improve sensitivity of the inertial sensor.Type: GrantFiled: July 3, 2012Date of Patent: December 15, 2015Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jong Woon Kim, Jung Won Lee
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Patent number: 9157927Abstract: A physical quantity sensor includes a first rocking body and a second rocking body. Each of the rocking bodies is supported on a substrate by a first supporting portion and a second supporting portion. The first rocking body is partitioned into a first region and a second region by a first axis (supporting axis) when viewed in plane, and the second rocking body is partitioned into a third region and a fourth region by a second axis (supporting axis) when viewed in plane. The mass of the second region is larger than the mass of the first region, and the mass of the third region is larger than the mass of the fourth region. An arranged direction of the first region and the second region is the same as an arranged direction of the third region and the fourth region.Type: GrantFiled: April 14, 2014Date of Patent: October 13, 2015Assignee: Seiko Epson CorporationInventor: Kei Kanemoto
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Patent number: 9052334Abstract: In an acceleration sensor, a sensor unit includes a weight portion having a recess section with one open surface and a solid section one-piece formed with the recess section, beam portions for rotatably supporting the weight portion such that the recess section and the solid section are arranged along a rotation direction, a movable electrode, fixed electrodes, detection electrodes electrically connected to the fixed electrodes to detect a capacitance between the movable electrode and the fixed electrodes. A fixed plate is arranged in a spaced-apart relationship with a surface of the weight portion on which the movable electrode is provided, and embedment electrodes are embedded in the fixed plate to extend along a thickness direction of the fixed plate, the embedment electrodes having one end portions facing the movable electrode to serve as the fixed electrodes and the other end portions configured to serve as the detection electrodes.Type: GrantFiled: November 17, 2010Date of Patent: June 9, 2015Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Hitoshi Yosida, Yuji Suzuki
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Patent number: 9003885Abstract: A tri-axis accelerometer includes a proof mass, at least four anchor points arranged in at least two opposite pairs, a first pair of anchor points being arranged opposite one another along a first axis, a second pair of anchor points being arranged opposite one another along a second axis, the first axis and the second axis being perpendicular to one another, and at least four spring units to connect the proof mass to the at least four anchor points, the spring units each including a pair of identical springs, each spring including a sensing unit.Type: GrantFiled: March 14, 2013Date of Patent: April 14, 2015Assignee: Robert Bosch GmbHInventors: Zhiyu Pan, Christoph Lang, Gary Yama, Matthias Metz, Markus Ulm
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Patent number: 8997570Abstract: An acceleration sensor having a high impact resistance to prevent breakage under excessive acceleration, but can stably exert a sensing performance. The acceleration sensor is formed of an SOI substrate of a three-layered structure including a silicon layer (active layer silicon), a silicon oxide layer, and a silicon layer (substrate silicon). The acceleration sensor includes frame parts, a plurality of beam parts, the beam parts projecting inward from the frame part, and a weight part supported by the beam parts. A strain sensing part is provided on each of the beam parts. A width W of each of the beam parts, a length I of each of the beam parts, and an inner frame length L of the frame part satisfy the following relationships of Expressions (1) and (2). 2<L/I?2.82??Expression (1) I/W?3.Type: GrantFiled: October 5, 2011Date of Patent: April 7, 2015Assignee: Dai Nippon Printing Co., Ltd.Inventor: Shinji Maekawa
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Patent number: 8978475Abstract: This document discusses among other things apparatus and methods for a proof mass including split z-axis portions. An example proof mass can include a center portion configured to anchor the proof-mass to an adjacent layer, a first z-axis portion configure to rotate about a first axis using a first hinge, the first axis parallel to an x-y plane orthogonal to a z-axis, a second z-axis portion configure to rotate about a second axis using a second hinge, the second axis parallel to the x-y plane, wherein the first z-axis portion is configured to rotate independent of the second z-axis portion.Type: GrantFiled: February 1, 2012Date of Patent: March 17, 2015Assignee: Fairchild Semiconductor CorporationInventor: Cenk Acar
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Patent number: 8950258Abstract: A micromechanical angular acceleration sensor for measuring an angular acceleration is disclosed. The sensor includes a substrate, a seismic mass, at least one suspension, which fixes the seismic mass to the substrate in a deflectable manner, and at least one piezoresistive and/or piezoelectric element for measuring the angular acceleration. The piezoresistive and/or piezoelectric element is arranged in a cutout of the seismic mass. A corresponding method and uses of the sensor are also disclosed.Type: GrantFiled: May 24, 2012Date of Patent: February 10, 2015Assignee: Robert Bosch GmbHInventors: Reinhard Neul, Torsten Ohms, Mirko Hattass, Daniel Christoph Meisel
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Patent number: 8887569Abstract: Disclosed herein an inertial sensor and a method of manufacturing the same. An inertial sensor 100 according to a preferred embodiment of the present invention is configured to include a plate-shaped membrane 110, a mass body 120 that includes an adhesive part 123 disposed under a central portion 113 of the membrane 110 and provided at the central portion thereof and a patterning part 125 provided at an outer side of the adhesive part 123 and patterned to vertically penetrate therethrough, and a first adhesive layer 130 that is formed between the membrane 110 and the adhesive part 123 and is provided at an inner side of the patterning part 125. An area of the first adhesive layer 130 is narrow by isotropic etching using the patterning part 125 as a mask, thereby making it possible to improve sensitivity of the inertial sensor 100.Type: GrantFiled: July 6, 2011Date of Patent: November 18, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jong Woon Kim, Won Kyu Jeung
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Patent number: 8887568Abstract: A micromechanical system with a system that can vibrate, has a seismic mass and at least two spring elements. The spring elements are respectively fastened on one side externally to the seismic mass and on the other side to fixed anchor points of the micromechanical system such that the seismic mass can vibrate in a movement direction. In order to obtain a particularly large frequency spacing between the useful mode and further vibration modes of the system, at least one further spring element is provided in the inner region of the seismic mass. The further spring element the is fastened to a further anchor point of the micromechanical system. A method builds a micromechanical system with a system that can vibrate.Type: GrantFiled: April 7, 2009Date of Patent: November 18, 2014Assignee: Siemens AktiengesellschaftInventors: Roman Forke, Dirk Scheibner, Alexey Shaporin
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Patent number: 8863575Abstract: A micromechanical structure for a MEMS structure is provided with: a substrate; a single inertial mass having a main extension in a plane and arranged suspended above the substrate; and a frame element, elastically coupled to the inertial mass by coupling elastic elements and to anchorages, which are fixed with respect to the substrate by anchorage elastic elements. The coupling elastic elements and the anchorage elastic elements are configured so as to enable a first inertial movement of the inertial mass in response to a first external acceleration acting in a direction lying in the plane and also a second inertial movement of the inertial mass in response to a second external acceleration acting in a direction transverse to the plane.Type: GrantFiled: June 15, 2011Date of Patent: October 21, 2014Assignee: STMicroelectronics S.R.L.Inventors: Attilio Frangi, Biagio De Masi, Barbara Simoni
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Patent number: 8839670Abstract: Described herein is an accelerometer that can be sensitive to acceleration, but not anchor motion due to sources other than acceleration. The accelerometer can employ a set of electrodes and/or transducers that can register motion of the proof mass and support structure and employ and output-cancelling mechanism so that the accelerometer can distinguish between acceleration and anchor motion due to sources other than acceleration. For example, the effects of anchor motion can be cancelled from an output signal of the accelerometer so that the accelerometer exhibits sensitivity to only acceleration.Type: GrantFiled: September 30, 2011Date of Patent: September 23, 2014Assignee: Invensense, Inc.Inventors: Jin Qiu, Joe Seeger, Alexander Castro, Igor Tchertkov, Richard Li
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Patent number: 8826736Abstract: A micromechanical sensor comprising a substrate (5) and at least one mass (6) which is situated on the substrate (5) and which moves relative to the substrate (5) is used to detect motions of the sensor due to an acceleration force and/or Coriolis force which occur(s). The mass (6) and the substrate (5) and/or two masses (5, 7) which move toward one another are connected by at least one bending spring device (6). The bending spring device (6) has a spring bar (9) and a meander (10), provided thereon, having a circle of curvature (K1; K6; K8; K9; K11) whose midpoint (MP1; MP6; MP8; MP9; MP11) and radius of curvature (r1; r6; r8; r9; r11) are inside the meander (10). For reducing stresses that occur, in addition to the radius of curvature (r1; r6; r8; r9; r11) having the inner midpoint (MP1; MP6; MP8; MP9; MP11), the meander (10) has at least one further radius of curvature (r2; r3; r4; r5; r7; r10) having a midpoint (MP2; MP3; MP4; MP5; MP7; MP10) outside the meander (10).Type: GrantFiled: April 27, 2010Date of Patent: September 9, 2014Assignee: Maxim Integrated Products, Inc.Inventor: Hanno Hammer
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Patent number: 8820161Abstract: A MEMS detection structure is provided with: a substrate having a top surface, on which a first fixed-electrode arrangement is set; a sensing mass, extending in a plane and suspended above the substrate and above the first fixed-electrode arrangement at a separation distance; and connection elastic elements that support the sensing mass so that it is free to rotate out of the plane about an axis of rotation, modifying the separation distance, as a function of a quantity to be detected along an axis orthogonal to the plane. The MEMS detection structure also includes: a coupling mass, suspended above the substrate and connected to the sensing mass via the connection elastic elements; and an anchoring arrangement, which anchors the coupling mass to the substrate with a first point of constraint, set at a distance from the axis of rotation and in a position corresponding to the first fixed-electrode arrangement.Type: GrantFiled: May 6, 2013Date of Patent: September 2, 2014Assignee: STMicroelectronics S.r.l.Inventors: Gabriele Cazzaniga, Luca Coronato, Barbara Simoni
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Publication number: 20140174183Abstract: A detection structure for a z-axis resonant accelerometer is provided with an inertial mass anchored to a substrate by means of elastic anchorage elements so as to be suspended above the substrate and perform an inertial movement of rotation about a first axis of rotation belonging to a plane of main extension of the inertial mass, in response to an external acceleration acting along a vertical axis transverse with respect to the plane; and a first resonator element and a second resonator element, which are mechanically coupled to the inertial mass by respective elastic supporting elements, which enable a movement of rotation about a second axis of rotation and a third axis of rotation, in a resonance condition. In particular, the second axis of rotation and the third axis of rotation are parallel to one another, and are moreover parallel to the first axis of rotation of the inertial mass.Type: ApplicationFiled: February 28, 2014Publication date: June 26, 2014Inventors: Claudia Comi, Alberto Corigliano, Sarah Zerbini
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Patent number: 8746067Abstract: A tunneling accelerometer includes a proof mass that moves laterally with respect to a cap wafer. Either the proof mass or the cap wafer includes a plurality of tunneling tips such that the remaining one of proof mass and the cap wafer includes a corresponding plurality of counter electrodes. The tunneling current flowing between the tunneling tips and the counter electrodes will thus vary as the proof mass laterally displaces in response to an applied acceleration.Type: GrantFiled: January 8, 2013Date of Patent: June 10, 2014Assignee: Tialinx, Inc.Inventors: Hector J. De Los Santos, Farrokh Mohamadi
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Patent number: 8739628Abstract: An inertial sensor includes a plate-like substrate layer, a mass body, a support frame, a limit stop extending in the central direction of the mass body from the support frame, and a detection unit detecting the displacement of the displacement part. The inertial sensor adopts the limit stop limiting the downward displacement of the mass body to prevent the support portion of the mass body from being damaged.Type: GrantFiled: June 21, 2011Date of Patent: June 3, 2014Assignee: Samsung Electro-Mechanics Co., LtdInventors: Jong Woon Kim, Liwei Lin, Minyao Mao, Heung Woo Park
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Publication number: 20140083190Abstract: An acceleration sensor has a substrate, a seismic mass and a detection unit. The seismic mass is configured to be deflected based on an external acceleration acting on the acceleration sensor, the deflection being in the form of a deflection motion with respect to the substrate along a deflection direction. The detection unit is configured to be deflected for the detection of a deflection of the seismic mass, the detection being in the form of a detection motion with respect to the substrate along a detection direction. The detection unit is connected to the seismic mass in such a way that the amplitude of the deflection motion along the deflection direction is greater than the amplitude of the detection motion along the detection direction.Type: ApplicationFiled: September 26, 2012Publication date: March 27, 2014Inventors: Rolf Kaack, Dietrich Schubert, Harald Emmerich, Patrick Wellner
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Patent number: 8671756Abstract: A microelectromechanical detection structure for a MEMS resonant biaxial accelerometer is provided with: an inertial mass, anchored to a substrate by elastic elements to be suspended above the substrate. The elastic elements enabling inertial movements of the inertial mass along a first axis of detection and a second axis of detection that belong to a plane of main extension of said inertial mass, in response to respective linear external accelerations. At least one first resonant element and one second resonant element have a respective longitudinal extension, respectively along the first axis of detection and the second axis of detection, and are mechanically coupled to the inertial mass through a respective one of the elastic elements to undergo a respective axial stress when the inertial mass moves respectively along the first axis of detection and the second axis of detection.Type: GrantFiled: November 22, 2011Date of Patent: March 18, 2014Assignee: STMicroelectronics S.r.l.Inventors: Claudia Comi, Alberto Corigliano, Barbara Simoni
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Publication number: 20140041453Abstract: An inertial sensing device is provided. The inertial device includes a mass proof, a sensing electrode layer to sense the motion of the mass proof, and a spring coupled and to support the mass proof. Wherein, the single-material mass proof can perform multi degree-of freedom inertial sensing.Type: ApplicationFiled: September 11, 2012Publication date: February 13, 2014Inventors: Jux WIN, Wei-Leun FANG
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Patent number: 8646334Abstract: A sensor including: a base; at least one component which moves relative to the base; and one or more locking mechanisms for locking the at least one component in a predetermined stationary position in response to external stimuli exceeding predetermined thresholds in at least first and second directions, where the first direction is different from the second direction.Type: GrantFiled: July 11, 2011Date of Patent: February 11, 2014Assignee: Omnitek Partners LLCInventor: Jahangir S. Rastegar
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Patent number: 8621929Abstract: A micromechanical component comprising a displaceable mass made of a substrate material having at least one actuator plate electrode and one first insulating layer between the displaceable mass and the at least one actuator plate electrode, a mounting having a frame, which at least partially encloses the displaceable mass, at least one contact terminal of the at least one actuator plate electrode, and at least one stator plate electrode, and at least one spring component, via which the displaceable mass is connected to the mounting, one of the actuator plate electrodes being connected to the assigned contact terminal in each case via the assigned spring component, wherein the frame of the mounting is made of the substrate material of the displaceable mass and wherein one of the actuator plate electrodes is configured in one piece with the assigned contact terminal and the assigned spring component in each case.Type: GrantFiled: October 5, 2010Date of Patent: January 7, 2014Assignee: Robert Bosch GmbHInventors: Stefan Weiss, Arnim Hoechst
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Patent number: 8596122Abstract: A micromechanical component comprising a substrate, a seismic mass, and first and second detection means, the substrate having a main extension plane and the first detection means being provided for detection of a substantially translational first deflection of the seismic mass along a first direction substantially parallel to the main extension plane, and the second detection means further being provided for detection of a substantially rotational second deflection of the seismic mass about a first rotation axis parallel to a second direction substantially perpendicular to the main extension plane. The seismic mass can be embodied as an asymmetrical rocker, with the result that accelerations can be sensed as rotations. Detection can be accomplished via capacitive sensors.Type: GrantFiled: April 1, 2009Date of Patent: December 3, 2013Assignee: Robert Bosch GmbHInventors: Johannes Classen, Lars Tebje
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Patent number: 8596123Abstract: A microelectromechanical systems (MEMS) device (20) includes a substrate (24) and a movable element (22) adapted for motion relative to the substrate (24). A secondary structure (58) extends from the movable element (22). The secondary structure (58) includes a secondary mass (70) and a spring (68) interconnected between the movable element (22) and the mass (70). The spring (68) is sufficiently stiff to prevent movement of the mass (70) when the movable element (22) is subjected to force within a sensing range of the device (20). However, the spring (68) deflects when the device (20) is subjected to mechanical shock (86), and the spring (68) rebounds thus causing the mass (70) to impact the movable element (22) in a direction that would be likely to dislodge a potentially stuck movable element (22).Type: GrantFiled: May 5, 2011Date of Patent: December 3, 2013Assignee: Freescale Semiconductor, Inc.Inventor: Peter S. Schultz
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Patent number: 8584524Abstract: The invention is a frequency modulated (FM) inertial sensing device and method which, in one embodiment, comprises an accelerometer having a proof mass coupled to a nano-resonator element. The nano-resonator element is oscillated at a first predetermined frequency, which may be a first resonant frequency, and is altered to oscillate at a second frequency, which may be a second resonant frequency, in response to a resultant force produced by the acceleration of the proof mass. The degree of change in nano-resonator element output frequency is sensed and processed using suitable processing circuitry as a change in acceleration.Type: GrantFiled: December 13, 2011Date of Patent: November 19, 2013Assignee: ISC8 Inc.Inventor: Ying Hsu
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Patent number: 8584525Abstract: A sensor component having a housing and a sensor chip situated in it. The sensor chip is connected mechanically to the housing via at least one elastomer element. In addition, the sensor chip is also connected electrically to the housing via the at least one elastomer element.Type: GrantFiled: February 18, 2010Date of Patent: November 19, 2013Assignee: Robert Bosch GmbHInventor: Klaus Offterdinger
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Publication number: 20130285790Abstract: A motion sensing device includes a sensing chamber including at least one group of sensing surfaces, a signal generator, a sensing body and at least one elastic assembly corresponding to each group of the sensing surfaces. Each group of sensing surfaces includes two opposite sensing surfaces. The signal generator is electrically connected to the sensing surfaces and transmits different control signals to each sensing surface. Each elastic assembly includes two elastic members. One end of each elastic member secured to the sensing surfaces, and another end of each elastic member secured to the sensing body. The motion sensing device is shaken, the sensing body contacts with the corresponding sensing surface and transmits the control signal.Type: ApplicationFiled: August 1, 2012Publication date: October 31, 2013Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.Inventors: TEN-CHEN HO, XIAO-LIAN HE
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Patent number: 8563344Abstract: A method for producing microelectromechanical structures in a substrate includes: arranging at least one metal-plated layer on a main surface of the substrate in a structure pattern; leaving substrate webs open beneath a structure pattern region by introducing first trenches into the substrate perpendicular to a surface normal of the main surface in a region surrounding the structure pattern; coating the walls of the first trenches perpendicular to the surface normal of the main surface with a passivation layer; and introducing cavity structures into the substrate at the base of the first trenches in a region beneath the structure pattern region.Type: GrantFiled: November 17, 2011Date of Patent: October 22, 2013Assignee: Robert Bosch GmbHInventors: Jochen Reinmuth, Heiko Stahl
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Patent number: 8555720Abstract: A MEMS device (20) includes a substrate (24) and a movable element (22) adapted for motion relative to the substrate (24). A secondary structure (46) extends from the movable element (22). The secondary structure (46) includes a secondary mass (54) and a spring (56) interconnected between the movable element (22) and the mass (54). The spring (56) is sufficiently stiff to prevent movement of the mass (54) when the movable element (22) is subjected to force within a sensing range of the device (20). When the device (20) is subjected to mechanical shock (66), the spring (56) deflects so that the mass (54) moves counter to the motion of the movable element (22). Movement of the mass (54) causes the movable element (22) to vibrate to mitigate stiction between the movable element (22) and other structures of the device (20) and/or to prevent breakage of components within the device (22).Type: GrantFiled: February 24, 2011Date of Patent: October 15, 2013Assignee: Freescale Semiconductor, Inc.Inventor: Peter S. Schultz
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Patent number: 8555719Abstract: A microelectromechanical systems (MEMS) sensor (40) includes a substrate (46) and a suspension anchor (54) formed on a planar surface (48) of the substrate (46). A first folded torsion spring (58) and a second folded torsion spring (60) interconnect the movable element (56) with the suspension anchor (54) to suspend the movable element (56) above the substrate (46). The folded torsion springs (58, 60) are each formed from multiple segments (76) that are linked together by bar elements (78) in a serpentine fashion. The folded torsion springs (58, 60) have an equivalent shape and are oriented relative to one another in rotational symmetry about a centroid (84) of the suspension anchor (54).Type: GrantFiled: January 24, 2011Date of Patent: October 15, 2013Assignee: Freescale Semiconductor, Inc.Inventors: Andrew C. McNeil, Gary G. Li
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Publication number: 20130247669Abstract: An in-plane, monolithically-integrated, inertial device comprising: a support structure and first and second spring mass systems springedly coupled to the support structure. The first spring mass system comprises first and second time domain digital triggers configured to measure rotation and displacement respectively of the support structure about a first axis and along an orthogonal second axis respectively. The second spring mass system comprises third and fourth time domain digital triggers configured to measure acceleration and displacement respectively of the support structure about the second axis and along the first axis respectively.Type: ApplicationFiled: March 21, 2012Publication date: September 26, 2013Inventors: Paul D. Swanson, Richard L. Waters
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Publication number: 20130239686Abstract: A MEMS detection structure is provided with: a substrate having a top surface, on which a first fixed-electrode arrangement is set; a sensing mass, extending in a plane and suspended above the substrate and above the first fixed-electrode arrangement at a separation distance; and connection elastic elements that support the sensing mass so that it is free to rotate out of the plane about an axis of rotation, modifying the separation distance, as a function of a quantity to be detected along an axis orthogonal to the plane. The MEMS detection structure also includes: a coupling mass, suspended above the substrate and connected to the sensing mass via the connection elastic elements; and an anchoring arrangement, which anchors the coupling mass to the substrate with a first point of constraint, set at a distance from the axis of rotation and in a position corresponding to the first fixed-electrode arrangement.Type: ApplicationFiled: May 6, 2013Publication date: September 19, 2013Applicant: STMicroelectronics S.r.I.Inventors: Gabriele Cazzaniga, Luca Coronato, Barbara Simoni
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Patent number: 8522613Abstract: There is provided an acceleration sensor including: a weight portion; plural fixed portions formed above a bottom plate around a periphery of the weight portion; a beam portion coupling the fixed portions and the weight portion, and holding the weight portion at a position separated from the bottom plate; a detection portion provided at the beam portion and detecting deformation of the beam portion; a frame portion provided so as to project out from the bottom plate and surround the fixed portions at a position separated from the fixed portions; and a lid portion of plate shape that seals an opening of the frame portion.Type: GrantFiled: November 9, 2010Date of Patent: September 3, 2013Assignee: Oki Semiconductor Co., Ltd.Inventor: Takeharu Suzuki
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Patent number: 8516891Abstract: A MEMS sensing system includes a movable mass having at least one contact surface, a stopper system for stopping the movement of the mass, the stopper system having at least one contact surface that contacts a corresponding contact surface of the mass if a sufficient movement of the mass occurs in a direction, at least one stopper gap formed between the at least one contact surface of the stopper system and the corresponding contact surface of the mass, and a spring system in communication with the at least one stopper gap.Type: GrantFiled: January 16, 2008Date of Patent: August 27, 2013Assignee: Analog Devices, Inc.Inventors: Xin Zhang, Michael W. Judy
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Patent number: 8516889Abstract: A MEMS resonant accelerometer is disclosed, having: a proof mass coupled to a first anchoring region via a first elastic element so as to be free to move along a sensing axis in response to an external acceleration; and a first resonant element mechanically coupled to the proof mass through the first elastic element so as to be subject to a first axial stress when the proof mass moves along the sensing axis and thus to a first variation of a resonant frequency. The MEMS resonant accelerometer is further provided with a second resonant element mechanically coupled to the proof mass through a second elastic element so as to be subject to a second axial stress when the proof mass moves along the sensing axis, substantially opposite to the first axial stress, and thus to a second variation of a resonant frequency, opposite to the first variation.Type: GrantFiled: September 2, 2010Date of Patent: August 27, 2013Assignee: STMicroelectronics S.r.l.Inventors: Barbara Simoni, Claudia Comi, Alberto Corigliano
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Patent number: 8505381Abstract: A capacitive acceleration sensor includes an acceleration sensor moving part and an acceleration sensor stationary part together forming a capacitor for detecting acceleration, a sealing structure hermetically enclosing but not contacting the acceleration sensor moving part, and at least one support pillar enclosed by but not directly contacted by the acceleration sensor moving part, both ends of the at least one support pillar being in contact with inside walls of the sealing structure. The acceleration sensor moving part is electrically connected to the at least one support pillar.Type: GrantFiled: April 12, 2010Date of Patent: August 13, 2013Assignee: Mitsubishi Electric CorporationInventors: Yasuo Yamaguchi, Makio Horikawa
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Publication number: 20130186202Abstract: A device for measuring acceleration includes a base plate and mass elements connected to the base plate via elastic support elements having measuring points. The support elements of a first and a second mass element are constructed such that the support element of the first and the second mass element have at the measuring points an identical response characteristic for a first acceleration component in a first direction, and mutually different response characteristics for a second acceleration component perpendicular to the first component. The deflection of the measurement points is measured and evaluated. The component in the first and second directions is stepwise eliminated, and the result adjusted for the eliminated component is used for recovering these two components. The result adjusted for the eliminated component is measured as static acceleration and the component acting in the first and the second direction is measured as dynamic acceleration.Type: ApplicationFiled: July 25, 2011Publication date: July 25, 2013Applicant: FIRST SENSOR AGInventor: Jens Hansen
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Publication number: 20130186200Abstract: A micromechanical structure includes: a substrate which has a main plane of extension; and a mass which is movable relative to the substrate, the movable mass being elastically suspended via at least one coupling spring. A first subregion of the movable mass is situated, at least partially, between the substrate and the coupling spring along a vertical direction which is essentially perpendicular to the main plane of extension.Type: ApplicationFiled: January 16, 2013Publication date: July 25, 2013Inventor: Johannes CLASSEN
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Patent number: 8453506Abstract: A spring mounting element is provided having an inner ring with an inner radial circumference and an outer radial circumference, and an outer ring having an inner radial circumference and an outer radial circumference. A plurality of supporting elements are attached to and symmetrically disposed around the outer radial circumference of the inner ring, and attached to the inner radial circumference of the outer ring. The plurality of supporting elements allow the inner ring to move in three dimensions.Type: GrantFiled: November 29, 2010Date of Patent: June 4, 2013Assignee: General Electric CompanyInventor: Dan Tho Lu
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Patent number: 8429971Abstract: A micromechanical acceleration sensor includes a substrate, an elastic diaphragm which extends parallel to the substrate plane and which is partially connected to the substrate, and which has a surface region which may be deflected perpendicular to the substrate plane, and a seismic mass whose center of gravity is situated outside the plane of the elastic diaphragm. The seismic mass extends at a distance over substrate regions which are situated outside the region of the elastic diaphragm and which include a system composed of multiple electrodes, each of which together with oppositely situated regions of the seismic mass forms a capacitor in a circuit. In its central region the seismic mass is attached to the elastic diaphragm in the surface region of the elastic diaphragm which may be deflected perpendicular to the substrate plane.Type: GrantFiled: November 14, 2007Date of Patent: April 30, 2013Assignee: Robert Bosch GmbHInventors: Johannes Classen, Axel Franke, Dietrich Schubert, Kersten Kehr, Ralf Reichenbach
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Publication number: 20130098155Abstract: A physical quantity sensor includes a sensor portion, a casing, and a vibration isolator. The casing includes a supporting portion with a supporting surface that is located to face an end surface of the sensor portion. The vibration isolator is located between the end surface of the sensor portion and the supporting surface of the casing to join the sensor portion to the casing. The vibration isolator reduces a relative vibration between the sensor portion and the casing.Type: ApplicationFiled: December 12, 2012Publication date: April 25, 2013Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, DENSO CORPORATIONInventors: Denso Corporation, Toyota Jidosha Kabushiki Kaisha
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Patent number: 8424383Abstract: A 3-dimensional MEMS sensor, comprising: a first axis fixed electrode; a second axis fixed electrode; a third axis fixed electrode; a movable electrode frame including a first axis movable electrode, a second axis movable electrode, a third axis movable electrode, and a connection part connecting the movable electrodes, wherein the first axis movable electrode and the first axis fixed electrode form a first capacitor along the first axis, the second axis movable electrode and the second axis fixed electrode form a second capacitor along the second axis, and the third axis movable electrode and the third axis fixed electrode form a third capacitor along the third axis, the connection part including a center mass, wherein the center mass is at least connected with one of the first, second and third axis movable electrodes, and has an outer periphery and a first interconnecting segment connecting at least two adjacent sides of the outer periphery; at least one spring connecting with the movable electrode frame;Type: GrantFiled: January 5, 2010Date of Patent: April 23, 2013Assignee: Pixart Imaging IncorporationInventors: Chuan-Wei Wang, Sheng-Ta Lee
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Patent number: 8418558Abstract: A covered acceleration sensor element includes a support frame portion surrounding a weight portion, a plurality of flexible beam portions for connecting the weight portion to the support frame portion, and piezoresistance elements provided on the beam portions. An upper cover and a lower cover enclosing the periphery of the weight portion together with the support frame portion are joined to the face and back of the support frame portion. The support frame portion is separated by separation grooves into an inner frame and an outer frame. The plurality of inner frame support portions has flexibility. The beam portions are connected to both sides of the weight portion along the second axis and the third axis. The inner frame support portions are connected to both sides of the inner frame in a direction in which they are rotated nearly 45 degrees from the second axis and the third axis.Type: GrantFiled: May 28, 2010Date of Patent: April 16, 2013Assignee: Torex Semiconductor Ltd.Inventors: Atsushi Kazama, Masakatsu Saitoh, Ryoji Okada, Yasuhiro Hamaguchi