Abstract: A MEMS sensor includes a substrate and a MEMS structure coupled to the substrate. The MEMS structure has a mass movable with respect to the substrate. The MEMS sensor also includes a reference structure positioned radially outward from the MEMS structure. The reference structure is used to provide a reference to offset any environmental changes that may affect the MEMS sensor in order to increase the accuracy of its measurement.

Abstract: A weight of an inertial sensor if formed from a plurality of divided weights, and the divided weights are connected to each other by elastically deformable beams. A movable range and a mass of each of the divided weights and a rigidity of each of the beams are adjusted and a plurality of deformation modes having different sensitivity ranges with respect to the acceleration are used in combination. By this means, it is possible to improve a detecting sensitivity of an acceleration and widen an acceleration response range.

Abstract: An acceleration sensor has a semiconductor acceleration sensor chip and a case. The semiconductor acceleration sensor chip has a fixed portion, a plummet portion surrounding the fixed portion without contacting the fixed portion, and a beam portion connecting the fixed portion and the plummet portion, the thickness of the beam portion being thinner than the thickness of the fixed portion. The case has a cavity housing the semiconductor acceleration sensor chip, and a projection portion formed on the bottom face of the cavity, the bottom face of the fixed portion being fixed to the top face of the projection portion.

Abstract: A semiconductor sensor of the present invention is capable of preventing a diaphragm portion of the sensor from being damaged if a weight collides against a semiconductor integrated circuit substrate of the sensor and is further capable of preventing the diaphragm portion from being bent significantly even when a semiconductor sensor element of the sensor is disposed inside a distorted or deformed casing. A rear surface of the semiconductor integrated circuit substrate 7 is joined onto a wall surface of the casing 9 that defines a receiving chamber of the casing. A support portion of the semiconductor sensor element is joined onto a front surface 7a of the semiconductor integrated circuit substrate 7.

Abstract: A MEMS device that has a sensitivity to a stimulus in at least one sensing direction includes a substrate, a movable mass with corner portions suspended in proximity to the substrate, at least one suspension structure coupled approximately to the corner portions of the movable mass for performing a mechanical spring function, and at least one anchor for coupling the substrate to the at least one suspension structure. The at least one anchor is positioned approximately on a center line in the at least one sensing direction.

Abstract: An acceleration sensor includes a base having an XY-substrate surface which is parallel to an XY plane, a beam portion having a frame shape which is arranged in a floating state above the XY-substrate surface of the base, a beam-supporting fixed portion which supports the beam on the base via supporting units like a beam supported by its both ends, weight portions 7 which are arranged so as to float above the XY-substrate surface of the base, and connecting portions which support the weight portions 7 to the beam portion in a cantilever manner. The weight portions are displaceable in the X-axis direction, the Y-axis direction, and the Z-axis direction by the bending deformation of the frame-shaped beam portion. The beam portion is provided with an X-axis direction acceleration detecting portion, a Y-axis direction acceleration detecting portion, and a Z-axis direction acceleration detecting portion.

Abstract: A MEMS device includes a substrate; a movable mass suspended in proximity to the substrate; and at least one suspension structure coupled to the movable mass for performing a mechanical spring function. The at least one suspension structure has portions that move in tandem when the MEMS device is subject to at least one stimulus in a sensing direction, and further includes at least one link between the portions that move in tandem.

Abstract: An acceleration sensor having a high impact resistance to prevent breakage under excessive acceleration, but can stably exert a sensing performance. The acceleration sensor is formed of an SOI substrate of a three-layered structure including a silicon layer (active layer silicon), a silicon oxide layer, and a silicon layer (substrate silicon). The acceleration sensor includes frame parts, a plurality of beam parts, the beam parts projecting inward from the frame part, and a weight part supported by the beam parts. A strain sensing part is provided on each of the beam parts. A width W of each of the beam parts, a length I of each of the beam parts, and an inner frame length L of the frame part satisfy the following relationships of Expressions (1) and (2). 2<L/I?2.82??Expression (1) I/W?3.

Abstract: According to the present invention, an in-plane sensor comprises: a fixed structure including a fixed finger and a fixed column connected to each other, the fixed finger having a supported end supported by the fixed column and a suspended end which is unsupported; and a movable structure including at least one mass body and an extending finger connected to each other; wherein the supported end of the fixed finger is closer to the mass body than the suspended end is.

Abstract: An acceleration sensor chip package includes an acceleration sensor chip formed of a frame portion with an opening portion, a movable structure, a detection element, and an electrode pad. The movable structure has a beam portion and a movable portion supported on the beam portion to be movable. The acceleration sensor chip package further includes a re-wiring layer with a wiring portion having one end connected to the electrode pad; an outer terminal connected to the other end of the wiring portion; a first sealing portion for sealing the electrode pad and the re-wiring layer; and a substrate for sealing the opening portion of the frame portion.

Abstract: The invention relates to accelerometer structures micro-machined according to micro-electronics technologies. The accelerometer according to the invention comprises a substrate, an elastically deformable thin-layer membrane suspended above the substrate and secured to the substrate at its periphery, a proof mass suspended above the membrane and linked to the latter by a central stud, and capacitive interdigitated combs distributed about the mass, having movable plates secured to the mass and fixed plates secured to the substrate. The fixed plates and movable plates of the various combs are of differentiated heights to help in the discrimination of the upward and downward vertical accelerations.

Abstract: A vibration piezoelectric acceleration sensor including a pair of beam shaped members linearly and oppositely disposed on a frame, a support body supporting the beam shaped member, and a holding part holding the support body moveably in a linear direction, and another pair of beam shaped members disposed linearly and oppositely crossing the pair of beam shaped members detecting acceleration in two axes, i.e. X and Y directions. The beam shaped members are extended and retracted by the acceleration transmitted to the support body through the holding part, changing a natural oscillation frequency. Accordingly, a high change ratio of resonance frequency can be provided with the detection of the acceleration, and the acceleration in the direction of two axes can be detected without being affected by a change in temperature.

Abstract: An acceleration sensor includes a frame-shaped beam portion disposed above an XY substrate surface of a base in a floating state and a beam-portion supporting/fixing unit arranged to attach the beam portion to the base with support portions so as to be supported on two sides. The acceleration sensor also includes weight portions disposed above the XY substrate surface of the base in a floating state and connecting portions for attaching the weight portions to the beam portion in a cantilever state. The weight portions are movable in three axial directions including an X-axis direction, a Y-axis direction, and a Z-axis direction when the beam portion is deflected.

Abstract: An acceleration sensor, which has realized such a high impact-resistance that a weight bottom surface of an acceleration sensor element does not directly collide with an inner bottom plate of a protection case made of ceramic, glass or silicon to avoid edges and corners of the weight bottom surface of the acceleration sensor element chipping, even when an excessive acceleration or impact is applied to the acceleration sensor. The acceleration sensor comprises the acceleration sensor element having in a center a weight that works as a pendulum when acceleration is applied, and the protection case housing the acceleration sensor element. The inner bottom plate of the protection case works as a regulation plate to prevent the weight from excessively swing downwards. An impact buffer material of a metal layer or a resin layer is provided on the weight bottom surface or the inner bottom plate of the protection case.

Abstract: An inertial shock bandpass filter for detecting a shock event between first and second acceleration levels. The inertial shock bandpass filter includes a primary inertial element and at least one secondary inertial element supported by respective spring arrangements. The inertial elements include complementary engageable gripping surfaces, which engage in response to an acceleration above the second acceleration level to prevent movement of the primary inertial element and prevent latch engagement. The primary inertial element will, in response to an acceleration between the first and second acceleration levels, engage the latch. An acceleration level below the first acceleration level is insufficient to cause either an engagement of the gripping surfaces or a latching of the primary inertial element.

Abstract: A three-axis MEMS transducer featuring a caddie-corner proof mass comprises a planar main body portion of conductive material and a planar extra mass caddie-corner feature. The main body portion includes a width, length, and at least four side edges. An x-axis sense direction is defined from a first side edge to an opposite first side edge and a y-axis sense direction is defined from a second side edge to an opposite second side edge. The x-axis sense direction is perpendicular to the y-axis sense direction. The main body portion further includes at least two corners. The caddie-corner feature is positioned about at least one of the two corners of the main body portion. The caddie-corner feature and the main body portion comprise a single proof mass having a z-sense pivot axis disposed at an angle of ninety degrees to a diagonal extending from the caddie-corner feature to an opposite corner of the main body portion.

Abstract: An acceleration sensor has a mass movably linked to a peripheral attachment section to which at least one stopper is attached to stop the motion of the mass in a certain direction. In the absence of acceleration, the mass rests at a distance from a first surface of the stopper. A quantity of a curable elastic adhesive on a second surface of the stopper absorbs impact of the mass on the first surface, enabling the acceleration sensor to survive mechanical shock. The curable elastic adhesive may adhere to the cover of a package in which the acceleration sensor is enclosed. The curable elastic adhesive may be applied as a drop or swath from a dispenser, which simplifies the manufacturing process and reduces the manufacturing cost.

Abstract: A MEMS inertial delay device having a substrate layer, an intermediate layer and a device layer. A plurality of freely moveable interlocking masses are formed in the device layer along with springs which connect the masses to first and second supports. Movement of a first one of the interlocked masses, due to a shock event, allows subsequent masses to move, with a last mass including an activation member, movement of which causes operation of a mechanism, such as movement of a lock in a safe/arm arrangement in a munition round.

Abstract: The present invention relates to a micromechanical rotational rate sensor with a substrate (9), at least one base element (1) that is suspended by at least one spring element (11, 11?) on the substrate (9), which base element comprises at least one seismic or inertial mass (3), an excitation means (8) and with a read-out arrangement (15). According to the invention, the spring element (11, 11?) is movable perpendicularly to the motion direction (X, Y) of the base element (1).

Abstract: A disclosed semiconductor sensor includes a proof-mass, a frame disposed around the proof-mass and including at least a silicon layer, a beam for supporting the proof-mass, the beam being disposed at a first surface side of the frame between the proof-mass and the frame, a piezoresistor disposed on the beam, a metal wiring pattern and a pad electrode formed on the first surface of the frame and electrically connected to the piezoresistor, a cover plate disposed above and spaced apart from the proof-mass and the beam at the first surface side of the frame and fixed to a cover plate fixing area disposed on the first surface of the frame, and a projection disposed on the proof-mass at the first surface side to prevent the proof-mass from sticking to the cover plate.

Abstract: A Micro-Electro-Mechanical System closed-loop (MEMS) inertial device having a vertical comb drive that exhibits improved performance under vibration. The device includes one or more stator tines extending from a housing into a cavity formed by the housing. One or more rotor tines extend from a proof mass located in the cavity. The proof mass is joined to the housing by flexures which allow movement in the vertical direction. The rotor tines have a first length value in the direction of movement and the stator tines have a second length value in the direction of movement. The second length value is greater than the first length value. Also, the stator tines include two electrically separated portions. The lesser length of the rotor tines relative to the stator tines causes the attractive force between the rotor tines and either the upper or lower half of the stator tines to be relatively independent of rotor vertical position. This, in turn, produces better accelerometer accuracy in vibration environments.

Abstract: In a sensing unit according to the present invention, a spring portion having a support portion and a movable portion is conductive. A signal of a sensor portion provided on the movable portion of the spring portion is transmitted via the spring portion. Hence, the sensing unit according to the present invention has a simple constitution with a small number of components, and a wire does not necessarily have to be provided for each sensor portion. As a result, a reduction in manufacturing cost, simplification of the manufacturing process, and so on are achieved.

Abstract: A semiconductor acceleration sensor having beam parts formed in substantially L-shape to surround a weight part, wherein formed to surround a square part, as seen in plan view and constituting the weight part, are two elongated L-shaped beam parts, at locations close to proximal end portions of which are formed protruding portions protruding from a fixed part toward the weight part, and receiving recessed portions protruding from the weight part toward the fixed part to surround the protruding portions. The protruding portions have an outer shape substantially the same as an inner wall surface of the receiving recessed portions so that movements of the weight part in any directions in a horizontal direction perpendicular to an up and down direction are limited as a result of reception of the protruding portions by the receiving recessed portions.

Abstract: In an embodiment of the present invention there is provided a micro-electromechanical (MEMS) accelerometer, including a substrate, a first sensor and a second sensor. The first sensor is configured to measure an acceleration along a first axis parallel to a plane of the substrate. The second sensor is configured to measure an acceleration along an axis perpendicular to the plane of the substrate. The second sensor comprises a first beam, a second beam and a single support structure. The single support structure supports the first and second beams relative to the substrate, wherein the first and second beams circumscribe the first sensor.

Abstract: An acceleration sensor includes: a semiconductor substrate including a support layer and a semiconductor layer, which are stacked in a first direction; a movable electrode and a fixed electrode; and a trench. The movable electrode separately faces the fixed electrode by sandwiching the trench along with a second direction. The trench has a detection distance in the second direction. The movable electrode is movable along with the first direction when acceleration is applied. The movable electrode has a bottom apart from the support layer. The width of the movable electrode along with the second direction is smaller than the width of the fixed electrode. The thickness of the movable electrode along with the first direction is smaller than the thickness of the fixed electrode.

Abstract: A weight of an inertial sensor if formed from a plurality of divided weights, and the divided weights are connected to each other by elastically deformable beams. A movable range and a mass of each of the divided weights and a rigidity of each of the beams are adjusted and a plurality of deformation modes having different sensitivity ranges with respect to the acceleration are used in combination. By this means, it is possible to improve a detecting sensitivity of an acceleration and widen an acceleration response range.

Abstract: A semiconductor sensor is disclosed that includes a proof mass, a frame that is arranged around the proof mass, a beam that is arranged at the surface side of the frame and is configured to support the proof mass, plural piezo-resistive elements arranged on the beam, plural metal wiring patterns and pad electrodes that are arranged on the surface of the frame and are electrically connected to the piezo-resistive elements, a cover plate that is fixed to the surface of the frame and is arranged to be spaced apart from the proof mass and the beam, and a cover plate fixing region for fixing the cover plate to the surface of the frame, the cover plate fixing region including a formation region for the metal wiring patterns.

Abstract: A semiconductor sensor is disclosed that includes a substrate including at least a semiconductor layer. The substrate includes a weight arranging part in the vicinity of the center of the substrate, a flexible part around the weight arranging part, and supporting parts provided around the flexible part. The semiconductor sensor further includes a weight arranged on the weight arranging part. The weight is made of a material different from that of the weight arranging part and the flexible parts.

Abstract: A long-period weak-motion inertial sensor includes a frame having a frame mounting surface, a movable mass having a movable mass mounting surface, a transducer for sensing displacements of the movable mass with respect to the frame, and a monolithic flexure element for suspending the movable mass in the frame. The monolithic flexure element includes: a stiff frame integral clamp attachable to the frame mounting surface of the frame, a stiff movable mass integral clamp attachable to the movable mass mounting surface of the movable mass, and a stiffest flexible region for operatively connecting the frame integral clamp to the movable mass integral clamp. The frame and movable mass mounting surfaces do not overlap the stiffest flexible region, thereby minimizing the generation of creep and hysteresis noise. The variation in stiffness of the monolithic flexure element is controlled by varying thickness along the length of the flexure element.

Abstract: An acceleration sensor includes a seismic mass which is suspended on springs above a substrate and is deflectable in a direction perpendicular to a surface of the substrate. In order to reduce deflections of the seismic mass along the surface of the substrate because of interference accelerations, which lead to a falsification of the measurements of the deflection of the seismic mass perpendicular to the surface of the substrate, the springs include two bending bars which are interconnected via crosspieces.

Abstract: An acceleration sensor includes a base portion shaped into the form of a frame, a weight portion located inside the base portion and disposed away from the base portion, a flexible beam portion disposed over an upper portion of the base portion and an upper portion of the weight portion and a stopper portion disposed above the base portion and disposed over the weight portion away from the weight portion, wherein the stopper portion restricts an amount of displacement of the weight portion in the direction of the stopper portion.

Abstract: A micro-electro-mechanical system (MEMS) device includes an oscillating body and a beam connected to the oscillating body. The beam has a proximal end connected to the oscillating body, a distal end spaced from the oscillating body, and rotational comb teeth extending from the beam. Springs couple the beam to stationary pads to allow the oscillating body to rotate about a rotational axis. The springs are arranged along the rotation axis so at least one spring is located between another spring and the oscillating body. Stationary comb teeth extend from a stationary pad to be interdigitated with the rotational comb teeth extending from the beam. A voltage difference is applied between the stationary and rotational comb teeth to rotate the oscillating body about the rotation axis. A bottom layer includes mounting pads for supporting the stationary pads. An electrode is formed on a surface of the bottom layer.

Abstract: An acceleration sensor chip package includes an acceleration sensor chip; a sensor control chip; a re-wiring layer; an outer terminal; a sealing portion; and a substrate. The acceleration sensor chip includes a frame portion; a movable structure; a detection element; and an electrode pad electrically. The re-wiring layer has a wiring portion connected to the electrode pad. The electrode pad is electrically connected to a conductive bump. The sensor control chip has a sensor control electrode pad electrically connected to the conductive bump. The outer terminal is connected to the wiring portion and disposed in the outer region. The sealing portion seals the sensor control chip, the electrode pad, and the re-wiring layer, so that the movable structure is movable. The substrate is attached to the acceleration sensor chip to seal an opening portion.

Abstract: The invention relates to micromechanical components whose operating stability is increased with respect to known solutions. It can be a matter of sensors or also actuators in which a deflectable element can be deflected in at least one dimension. It is the object of the invention to provide micromechanical components which achieve an increased operating stability, in particular with increased electrical voltages and other external disturbances. In components in accordance with the invention, a deflectable element having at least one spring is held at a frame part. The deflectable element is electrically separated from the frame part by grooves and an electrical insulation. An electrical voltage can be applied between the deflectable element and the frame part for the deflection. Path limitation elements are moreover present between regions which are at the same electrical voltage potential or where a negligible current flow occurs on a touching contacting of such regions.

Abstract: In a micro-electromechanical structure, a rotor has a centroidal axis and includes a suspended structure which carries mobile electrodes. A stator carries fixed electrodes facing the mobile electrodes. The suspended structure is connected to a rotor-anchoring region via elastic elements. The stator includes at least one stator element, which carries a plurality of fixed electrodes and is fixed to a stator-anchoring region. One of the rotor-anchoring regions and stator-anchoring regions extends along the centroidal axis and at least another of the rotor-anchoring regions and stator-anchoring regions extends in the proximity of the centroidal axis.

Abstract: A semiconductor device includes a lead frame. The lead frame has a chip mounting section and a plurality of leads. The chip mounting section has a base section, an insulation film covering the base section, a plurality of inter-connect sections, and a chip mounting area. The leads surround the chip mounting section. The semiconductor device also includes a first semiconductor chip having a plurality of first electrode pads. The semiconductor device also includes first bonding wires for connecting the first electrode pads to the inter-connect sections. The semiconductor device also includes a second semiconductor chip which has a cavity and a plurality of second electrode pads. The first semiconductor chip and the first bonding wires are received in the cavity. Second bonding wires connect the inter-connect sections exposed from the second semiconductor chip to the leads. Third bonding wires connect the second electrode pads to the leads. The semiconductor device also includes a sealing section.

Abstract: 3D accelerometer for measuring three components of inertial force (or acceleration) vector with respect to an orthogonal coordinate system, which has high sensitivity due to a big proof mass located within a cavity beneath the surface of the sensor die. The size of the cavity and the size of the proof mass exceed the corresponding overall dimensions of the elastic element. The sensor structure occupies a very small area at the surface of the die increasing the area for ICs need to be integrated on the same chip.

Abstract: The semiconductor inertial sensor is formed by a rotor element and a stator element electrostatically coupled together. The rotor element is formed by a suspended mass and by a plurality of mobile electrodes extending from the suspended mass. The stator element is formed by a plurality of fixed electrodes facing respective mobile electrodes. The suspended mass is supported by elastic suspension elements. The suspended mass has a first, larger, thickness, and the elastic suspension elements have a second thickness, smaller than the first thickness.

Abstract: An acceleration sensing device includes a movable sensing member, a frame member and a supporting member. The supporting member is coupled between the movable sensing member and the frame member so as to support the movable sensing member. The acceleration sensing device further includes a covering member disposed above the movable sensing member, with a gap between the covering member and the movable sensing member. The acceleration sensing device still further includes internal electrodes, interconnection films, external electrodes and a resin film. The internal electrodes are arranged around the covering member. The interconnection films are disposed on the frame member so as to be coupled to the internal electrodes. The external electrodes are disposed on the interconnection films. The resin film is disposed on the frame member so as to seal the covering member. Also, there is provided a manufacturing method of the acceleration sensing device.

Abstract: The accelerometer has a base (2), an outer planar ring-like support frame (17) fixedly bonded to the base (2), and an inner planar ring-like support frame (18) flexibly suspended within the outer frame (17) by mounts (19) connecting the inner frame (18) to the outer frame (17) so that the inner frame (18) is spaced from the base (2), co-planar with the outer support fram (17) so as to provide flexible suspension for the inner support frame (18) reducing compressive and/or tensile forces on mounting legs (4) flexibly mounting a proof mass (3) in the inner support frame (18).

Abstract: A sensor for measuring acceleration in three mutually orthogonal axes, X, Y and Z is disclosed. The sensor comprises a sensor subassembly. The sensor subassembly further comprises a base which is substantially parallel to the X-Y sensing plane; a proof mass disposed in the X-Y sensing plane and constrained to move substantially in the X, Y, and Z, about by at least one linkage and is responsive to accelerations in the X, Y and Z directions. The sensor includes at least one paddle disposed in the sensing plane; and at least one pivot on the linkage. Finally, the sensor includes at least one electrode at the base plate and at least one transducer for each sensing direction of the sensor subassembly responsive to the acceleration.

Abstract: An acceleration sensor chip has a frame portion having a frame body portion and protruding portions. The acceleration sensor chip also includes a mobile structure having a central weight portion supported movably by four beam portions. The mobile structure also has four rectangular parallelepiped-form protruding weight portions The acceleration sensor chip also includes a plurality of stoppers extending above the protruding weight portions.

Abstract: A physical quantity sensor detects physical quantity. The sensor includes a plurality of springs, which have different spring constants, respectively. The sensor has a wide detection range of the physical quantity without assembling multiple sensors. Therefore, the sensor can be minimized. Further, since the sensor has an excellent linearity of the output characteristics, the sensor has a wide dynamic range and a high sensitivity.

Abstract: An angular rate sensor includes: a circuit board; a package including an angular rate sensor chip and a connection terminal; and a conductive member. The angular rate sensor chip is accommodated in the package. The package is disposed on the circuit board through the conductive member. The package further includes a first electrode disposed on a bottom of the package, the first electrode connecting to the connection terminal. The circuit board includes a second electrode disposed on a top of the circuit board. The angular rate sensor chip in the package is electrically connected to the circuit board through the connection terminal, the first and the second electrodes and the conductive member. The circuit board and the package are electrically and elastically connected by the conductive member.

Abstract: A precision flexure plate includes a flat disk positioned between two capacitor plates and supported by S-shaped beams. Deflection of the disk due to gravitational loads and resulting capacitance change is used to measure the accelerations in the direction perpendicular to the disk.

Abstract: A semiconductor dynamic quantity sensor includes moving parts displaceable in a predetermined direction over a supporting substrate and a beam portion for connecting said supporting substrate and said moving parts. The beam portion includes beams arranged in parallel and connected together at first end portions by a connecting portion. The beams bend in a direction perpendicular to the longitudinal direction of said beams. Outer side beams have an equal length and are fixed at other end portions to said supporting substrate. The moving parts are connected to the other end portion of another beam. The outer side beams and connecting portion have a parameter (A/B)/(T/L) equal to at least 20.

Abstract: A teeter-totter apparatus uses a curved beam to generate a differential output which may be indicative of an acceleration applied to the apparatus. The curved-beam teeter-totter apparatus can be combined with an x-axis and y-axis accelerometer, to produce a tri-axis accelerometer which is sensitive to an acceleration applied in any direction. Damping plates may be added to the accelerometers to reduce unwanted motion.

Abstract: A suspension diaphragm (16) is configured to support a precision transducer (14) within a container (12). The suspension diaphragm (16) is buttressed by an underlying complaint preform (152) and an annular hybrid support (16B) disposed along the periphery of an opening of the container (12). The transducer (14) is affixed to the suspension diaphragm (16) using the compliant preform (152) and rigid epoxy in the securing channels (120). The annular hybrid support (16B) is affixed to the exterior of the container (12).

Abstract: A multi-directional shock sensor having a central post surrounded by an omnidirectionally moveable toroidal mass. A plurality of anchor members surrounds the mass and carries one arm of a latching arm assembly. The other arm of each latching arm assembly is carried by, and radially extends from the mass to oppose a respective first arm. A shock event will cause the mass to move in a certain direction to an extent where one or more of the arm assemblies will latch. The latching may be determined by an electrical circuit connected to contact pads on the central post and on the anchor members.

Abstract: An apparatus and method for force sensing device having a pendulous mechanism proof mass formed in a silicon semiconductor substrate and structured for rotation about an intermediate rotational axis, the proof mass being substantially rectangular in shape with opposing first and second lateral peripheral edges and opposing first and second endwise peripheral edges. A plurality of capacitor comb teeth are formed symmetrically along the opposing first and second endwise peripheral proof mass edges and along the opposing first and second lateral peripheral proof mass edges adjacent to the first and second endwise peripheral edges, and one or more mass reduction apertures are formed in an interior portion of the proof mass on one side of the intermediate hinge axis.