Abstract: The disclosure describes a soft-matter electronic device having micron-scale features, and methods to fabricate the electronic device. In some embodiments, the device comprises an elastomer mold having microchannels, which are filled with an eutectic alloy to create an electrically conductive element. The microchannels are sealed with a polymer to prevent the alloy from escaping the microchannels. In some embodiments, the alloy is drawn into the microchannels using a micro-transfer printing technique. Additionally, the molds can be created using soft-lithography or other fabrication techniques. The method described herein allows creation of micron-scale circuit features with a line width and spacing that is an order-of-magnitude smaller than those previously demonstrated.

Abstract: A touch sensor is provided which includes one or more liquid metal wires and detection circuitry to detect a change in an electrical attribute of the one or more liquid metal cavities based on a depression of the one or more liquid metal cavities, and indicate a touch event corresponding to the depression of the one or more liquid metal cavities based on the change in the electrical attribute.

Abstract: An apparatus includes a chamber, a valve coupled to the chamber, a pump coupled to the chamber, a control circuit coupled to the pump, and a lever coupled to the valve, the pump, and the control circuit. Operation of the valve and the pump is controlled based on a position of the lever.

Abstract: Methods and apparatus for a semiconductor strain gauge pressure sensor. An apparatus includes a sense element configured to be exposed to a pressure environment, the sense element including at least one highly doped semiconductor strain gauge, the highly doped semiconductor strain gauge including a five pad single full Wheatstone bridge, an electronics package disposed on a carrier and electrically coupled to the sense element, the carrier disposed on a port that comprises the sense element, a housing disposed about the sense element and electronics package, and a connector joined to the housing and electrically connected to the electronics package, the connector including an external interface.

Abstract: A sensor assembly for a vortex flowmeter having a flowtube, a bluff body in the flowtube, and a sensor that detects vortices. The sensor assembly extends into contact with the process fluid through a process penetration opening. A sensor body seals the process penetration opening to limit flow of process fluid out of the flowmeter through the process penetration opening. A vortex sensor housing is secured to the sensor body. The vortex sensor housing has a pair of pressure-responsive diaphragms facing outwardly from opposite sides of the vortex sensor housing. A vortex sensor is positioned to detect motion of at least one of the pressure-responsive diaphragms to detect vortices formed in the process fluid. A temperature sensor senses a temperature of the process fluid.

Abstract: An elastomeric particle (1, 1, 1?) comprises a non-conducting elastomeric body (2) having an electrically conducting surface (4a, 4b, 6). Pressure sensor elements (20, 20?, 20?; 30, 30?, 30?, 30??) comprising such elastomeric particles are disclosed, as well as sensor clusters (50?, 50??, 50IV, 50V, 50VI, 50VII, 70) comprising such sensor elements. There is also disclosed a pressure sensor element (40, 40?, 40?, 40??, 40IV, 40V, 40VI, 40VII), comprising a resistive element (44, 44?, 44?) providing a conduction path, a first electrode (42a, 42a-1, 42a-2, 42a-3, 42a-4, 42a-5, 42a-6), connected to the resistive element, a second electrode (42b, 42b?), which in a quiescent state is spaced from said first electrode, wherein the second electrode, when the pressure sensor element is subjected to a pressure, is arranged to contact said first electrode or said resistive element. Systems comprising such sensor elements and sensor clusters are disclosed, as well as methods of their fabrication.

Abstract: One or more techniques and/or systems are disclosed for generating a linearized pressure sensor pattern for a pressure sensor. Force may be applied to a pressure sensor sample, comprising the pressure sensor without conductors. A patch, comprising an area of contact between a top and bottom surface of the sensor sample, can be measured, which corresponds to the applied force. Patch measurements can be made for respective applied force intervals, resulting in one or more indications of applied force, respectively corresponding to an indication of a patch measurement. The linearized pressure sensor pattern can be generated using the one or more force indications and corresponding patch measurement indications.

Abstract: A gage/differential pressure transducer assembly having enhanced output capabilities, comprising a first pressure port adapted to communicate a first pressure to a first sensor, the first sensor comprising a first Wheatstone bridge adapted to output a first signal indicative of the first pressure, wherein the first pressure is a main pressure; and a second pressure port adapted to communicate a second pressure to a second sensor, the second sensor comprising a second Wheatstone bridge adapted to output a second signal indicative of the second pressure, wherein the second pressure is a reference pressure; and an output port connected to the first Wheatstone bridge and the second Wheatstone bridge for outputting a third signal representative of the difference between the first and second pressures.

Abstract: A measurement system for measuring a pressure of a fluid is provided. The measurement system includes a sensing module and a liquid electrical circuit. The sensing module includes a flexible film and a liquid electronic device. The flexible film has a first side and a second side opposite to the first side. The fluid is disposed on the first side of the flexible film, and the liquid electronic device is disposed on the second side of the flexible film. The flexible film converts the pressure of the fluid into a parameter of the liquid electronic device. The liquid electrical circuit is electrically coupled to the liquid electronic device. The liquid electronic device and the liquid electrical circuit output a measurement signal corresponding to the parameter in response to an applied electrical energy. A manufacture method of a measurement system is also provided.

Abstract: A catheter die is provided and includes an elongate body having first and second opposing end portions and an end face at the first one of the first and second opposing end portions. The elongate body defines a cavity within the first end portion with an interior facing surface of the cavity disposed to extend alongside at least a portion of the first end face. At least one or more piezoresistive pressure sensors are operably disposed proximate to the cavity.

Abstract: Provided are methods, circuits and apparatuses for detecting pressure variations. The circuit can comprise at least two pressure sensors electrically coupled in parallel. At least one pressure sensor can have a differential input and a differential output. The circuit can also comprise a first switching mechanism electrically coupled to the differential input of the at least one pressure sensor. The first switching mechanism can be configured to electrically couple a first current source to the at least one pressure sensor according to a first reference signal. The circuit can also comprise a second switching mechanism electrically coupled to the differential output of the at least one pressure sensor. The second switching mechanism can be configured to electrically couple a second current source to the at least one pressure sensor according to a second reference signal.

Abstract: Pressure sensors having components with reduced variations due to stresses caused by various layers and components that are included in the manufacturing process. In one example, a first stress in a first direction causes a variation in a component. A second stress in a second direction is applied, thereby reducing the variation in the component. The first and second stresses may be caused by a polysilicon layer, while the component may be a resistor in a Wheatstone bridge.

Abstract: A sensor for pressure measurement may include a fabric support, an electrically conductive structure including tracks on the fabric support having resistance variations in response to deformations thereof, and a processor coupled to the electrically conductive structure and configured to sense resistance values of respective tracks of the electrically conductive structure and to provide a signal representative of a pressure difference across opposite faces of the fabric support.

Abstract: A pressure or force sensor has a sensor housing, a measuring element in the housing, and a sensor membrane. The membrane is delimited by an inner edge and an outer edge, which is connected in a pressure-resistant manner to the sensor housing. The inner edge transitions in a pressure-resistant manner into a movable plunger, the travel of which can be detected by the measuring element. The membrane has one or more elastic regions between the outer edge and the inner edge, each region having a thinnest point, wherein the material thickness inside the elastic region increases steadily on both sides of this thinnest point. The cross-section of the membrane has an arched shape in each elastic region, and the arched shape has a convex outer and concave inner contour relative to the arch orientation.

Abstract: A pressure detection apparatus has a pressure-sensitive resistor whose first resistance varies according to pressure and a change of its own temperature, a temperature-sensitive resistor which has a same resistance-temperature coefficient as the pressure-sensitive resistor and whose second resistance varies according to the change of the temperature, a current source supplying first and second constant-currents to the pressure-sensitive and temperature-sensitive resistors respectively, and a pressure signal generation output section. The current source adjusts the first and second constant-currents so that when the pressure is an initial pressure, a reference first voltage appearing across the pressure-sensitive resistor and a reference second voltage appearing across the temperature-sensitive resistor become equal to each other.

Abstract: Pressure sensors having components with reduced variations due to stresses caused by various layers and components that are included in the manufacturing process. In one example, a first stress in a first direction causes a variation in a component. A second stress in a second direction is applied, thereby reducing the variation in the component. The first and second stresses may be caused by a polysilicon layer, while the component may be a resistor in a Wheatstone bridge.

Abstract: A hydraulic solenoid assembly for complex vehicle-borne control systems, such as automatic transmissions, includes a solenoid body or unitary housing operatively enclosing two or more solenoid valves. Each valve has a pressure port extending to an outer surface of the housing, emerging in a spaced-apart matrix. A metal (stainless steel or aluminum) sensor plate is mounted to the outer surface of the housing so as to sealingly overlay the pressure ports. A diaphragm is formed in the sensor plate for each solenoid valve and registers with its associated pressure port. Electrical components, such as thick file resistors arranged in a Wheatstone bridge network are printed or mounted to an outer surface of each diaphragm. The bridge networks are electrically connected to a control circuit and function to output signals as a function of hydraulic pressure induced displacement of the associated diaphragm.

Abstract: A measurement system for measuring a pressure of a fluid is provided. The measurement system includes a sensing module and a liquid electrical circuit. The sensing module includes a flexible film and a liquid electronic device. The flexible film has a first side and a second side opposite to the first side. The fluid is disposed on the first side of the flexible film, and the liquid electronic device is disposed on the second side of the flexible film. The flexible film converts the pressure of the fluid into a parameter of the liquid electronic device. The liquid electrical circuit is electrically coupled to the liquid electronic device. The liquid electronic device and the liquid electrical circuit output a measurement signal corresponding to the parameter in response to an applied electrical energy. A manufacture method of a measurement system is also provided.

Abstract: A pressure sensor for measuring the location and intensity of an applied pressure, including an elastomeric sheet; and a plurality of micro-channels embedded in the elastomeric sheet.

Abstract: An implantable intraocular pressure sensor system has a sealed geometric shape with an internal pressure at a first value. A strain gauge wire is embedded in a surface of the sealed geometric shape. When the surface is deflected by intraocular pressure, a measured resistance of the strain gauge wire indicates the intraocular pressure. The system also has a processor coupled to a power source and memory. The processor is configured to read the measured resistance and write values corresponding to intraocular pressure to the memory.

Abstract: A pressure sensor for measuring the location and intensity of an applied pressure, including an elastomeric sheet; and a plurality of micro-channels embedded in the elastomeric sheet.

Abstract: A measurement element includes a semiconductor substrate with electrical insulating film formed thereon. A resistor formed on the electrical insulating film constitutes a heater; and a cavity is formed by removing a portion of the semiconductor substrate that corresponds to a region where a body part of the resistor is formed. The region where the body part of the resistor is formed is formed into a thin wall part by the cavity, and an opening and a slit is formed in a portion of the thin wall part in such a manner as to penetrate the thin wall part in the thickness direction. The measurement element has a film formed covering the region of the opening or slit.

Abstract: Embodiments of the present disclosure are directed to MEMS-based medical devices including a flexible housing that forms a chamber for encapsulating a fluid or liquid. The devices also include encapsulated electrodes, portions of which are exposed to the fluid or liquid within the chamber for sensing and/or physical actuation (controlled movement). Such medical devices can function specifically as: contact force sensors; and/or out-of-plane actuators. Device function is enabled by the encapsulation of liquid within the microchamber. Depending on the kind of electrical input applied, the encapsulated electrodes can function as electrochemical sensing elements; and/or electrolytic generation electrodes. Devices according to the present disclosure can have a fluidic coupling to the external environment or can be isolated. Fluidic isolation from the surrounding environment can be accomplished by the inclusion of an annular-plate stiction valve within the device.

Abstract: A pressure sensor comprises a sensor platform; a measuring membrane, or diaphragm, which is held by the sensor platform, and can have a pressure applied to it and is deformable as a function of pressure; and at least two resistance elements having an AlxGa1—xN layer. At least a first resistance element of the at least two resistance elements is arranged on the measuring membrane, or diaphragm and has a deformation-dependent resistance value. The pressure sensor can be operated using a measurement circuit to register a signal which depends on the resistance values of the at least two resistance elements in the plane of the AlxGa1—xN layer. Four resistance elements are preferably provided in a full bridge.

Abstract: A pressure sensor grid can comprise a plurality of bottom wires, arranged substantially parallel to each other and overlaid by a plurality of top wires arranged substantially perpendicular to the bottom wires. Each intersection of the top and bottom wires includes a pressure sensor. The sensor comprises a switching junction situated between the bottom wire and the top wire and a conducting channel extending through the switching junction from the bottom wire to the top wire. Pressure applied to the top wire causes an increase in conductance between the bottom wire and the top wire.

Abstract: A pressure or force sensor has a sensor housing, a measuring element in the housing, and a sensor membrane. The membrane is delimited by an inner edge and an outer edge, which is connected in a pressure-resistant manner to the sensor housing. The inner edge transitions in a pressure-resistant manner into a movable plunger, the travel of which can be detected by the measuring element. The membrane has one or more elastic regions between the outer edge and the inner edge, each region having a thinnest point, wherein the material thickness inside the elastic region increases steadily on both sides of this thinnest point. The cross-section of the membrane has an arched shape in each elastic region, and the arched shape has a convex outer and concave inner contour relative to the arch orientation.

Abstract: A semiconductor pressure sensor includes a silicon substrate, an active gauge resistance forming portion having a first diaphragm and a first gauge resistance formed on the silicon substrate, and a dummy gauge resistance forming portion for temperature compensation having a second diaphragm and a second gauge resistance, formed on the substrate. The first diaphragm of the active gauge resistance forming portion and the second diaphragm of the dummy gauge resistance forming portion for temperature compensation are formed of a common polysilicon film. The polysilicon film has an anchor portion to be connected to the substrate. The first and second diaphragms have mutually identical or symmetrical structures and the first and second gauges have mutually identical or symmetrical structures. Accordingly, a semiconductor pressure sensor capable of highly accurate temperature compensation and manufacturing method thereof can be provided.

Abstract: An elastomeric particle (1, 1, 1?) comprises a non-conducting elastomeric body (2) having an electrically conducting surface (4a, 4b, 6). Pressure sensor elements (20, 20?, 20?; 30, 30?, 30?, 30??) comprising such elastomeric particles are disclosed, as well as sensor clusters (50?, 50??, 50IV, 50V, 50VI, 50VII, 70) comprising such sensor elements. There is also disclosed a pressure sensor element (40, 40?, 40?, 40??, 40IV, 40V, 40VI, 40VII), comprising a resistive element (44, 44?, 44?) providing a conduction path, a first electrode (42a, 42a-1, 42a-2, 42a-3, 42a-4, 42a-5, 42a-6), connected to the resistive element, a second electrode (42b, 42b?), which in a quiescent state is spaced from said first electrode, wherein the second electrode, when the pressure sensor element is subjected to a pressure, is arranged to contact said first electrode or said resistive element. Systems comprising such sensor elements and sensor clusters are disclosed, as well as methods of their fabrication.

Abstract: In a pressure switch, a joint coupling holder is mounted via an opening in a case constituting a housing. A plurality of engagement pawls that make up the joint coupling holder engages with a bottom of the case. Further, by inserting a cap into a recess of the joint coupling holder, the engaged state of the engagement pawls is maintained, whereby the housing, which is made from a resin material, and the joint coupling holder are strongly and rigidly connected together.

Abstract: A sensor system for measuring the pressure in the combustion chamber of an internal combustion engine, by the use of which a high measuring accuracy may be achieved, based on high measuring sensitivity and great thermal stability. In addition, the construction of the sensor system makes possible great system flexibility, and particularly very space-saving installation in the combustion chamber of an internal combustion engine.

Abstract: An integrated circuit device is provided which comprises a substrate, a conductive line configured to experience a pressure, and a magnetic tunnel junction (“MTJ”) core formed between the substrate and the current line. The conductive line is configured to move in response to the pressure, and carries a current which generates a magnetic field. The MTJ core has a resistance value which varies based on the magnetic field. The resistance of the MTJ core therefore varies with respect to changes in the pressure. The MTJ core is configured to produce an electrical output signal which varies as a function of the pressure.

Abstract: In a pressure sensor with double measuring scale: a monolithic body of semiconductor material has a first main surface, a bulk region and a sensitive portion upon which pressure acts; a cavity is formed in the monolithic body and is separated from the first main surface by a membrane, which is flexible and deformable as a function of the pressure, and is arranged inside the sensitive portion and is surrounded by the bulk region; a low-pressure detecting element of the piezoresistive type, sensitive to first values of pressure, is integrated in the membrane and has a variable resistance as a function of the deformation of the membrane; in addition, a high-pressure detecting element, also of a piezoresistive type, is formed in the bulk region inside the sensitive portion and has a variable resistance as a function of the pressure. The high-pressure detecting element is sensitive to second values of pressure.

Abstract: A resistive thin film (1) made of grains (3) of conductive material having an average size, in a dielectric medium (2) is characterized by the total thickness of the film (1) being between 3 and ten times the average size of the grains (3). The film (1) is used to make a cell of a pressure sensor and the cell is included in a shell of a pressure sensor.

Abstract: A pressure transducer apparatus including: first and second pluralities of piezoresistors each coupled in Wheatstone bridge configurations, wherein the bridges are coupled together to provide a first output being indicative of a differential pressure; and, a third plurality of piezoresistors coupled in a Wheatstone bridge configuration and being suitable for providing a second output being indicative of an absolute line pressure. A compensator may be employed for adjusting the first output for line pressure variation responsively to the second output.

Abstract: The invention relates to a pressure sensor in the form of a film, comprising a first carrier film and a second carrier film which are arranged at a certain distance from each other by means of a spacer. The distance holder comprises at least one recess which defines an active region of the pressure sensor wherein both of the carrier films are arranged opposite each other, also comprising a first electrode and a second electrode and a layer made of pressure-sensitive material. The first electrode, the second electrode and the layer made of pressure-sensitive material are disposed in the active region on the first and/or second carrier film such that when the carrier films are pressed together through the pressure sensitive layer, electric contact is produced between the first and the second electrode.

Abstract: A pressure sensor is constructed of a plastic package. The plastic package incorporates in the same material a sensing diaphragm including tensile and compression regions. Deposited on the diaphragm are metal electrodes and a polymer film having piezoresistive properties. The electrodes and/or the polymer film are directly printed onto the plastic package without the use of a mask.

Abstract: A method and system of providing power to a pressure and temperature sensing element is provided. Polarity switching is added to a current source for a sensor, which includes one piezo-resistive sensing element configured as a single implant square located at an edge of a diaphragm of the element, and which produces pressure and temperature outputs. The piezo-sensing element operates as a piezo-resistive radial element when current is conducted through the element radially with respect to the diaphragm. Conversely, the piezo-sensing element operates as a piezo-resistive tangential element when current is conducted through the element tangentially to the edge of the diaphragm. A difference in the radial and tangential resistances is proportional to an applied pressure, while a sum of the resistances is a function of temperature. By alternating the polarity of power applied to the sensor, a build up of ions resulting from PUD is minimized.

Abstract: In a resistively heated heat-loss pressure gauge, electrical current is switched between a sensing element and a compensating element at different duty cycles. As a result, the sensing element is heated relative to the compensating element. A fixed resistance is placed in series with at least the compensating element. The current source applies current to heat the sensing element to a temperature at which the resistance of the sensing element matches the combined resistance of the compensating element and the fixed resistive element.

Abstract: A pressure sensor for sensing a pressure level of a pressurized medium. The pressure sensor includes a housing that has a high pressure side, a low pressure side and an aperture. A substrate is located in the aperture. The substrate has a pair of ends and a center portion. The center portion is brazed to the housing in the aperture. The center portion seals the high pressure side from the low pressure side. A pressure sensitive resistor is mounted to one end of the substrate. A reference resistor is mounted to another end of the substrate. A circuit line is located on the substrate. The circuit line is connected between the pressure sensitive resistor and the reference resistor.

Abstract: One aspect is a pressure transducer package comprising a housing, a diaphragm, a support disposed in the housing and a sensing element disposed in the housing between the diaphragm and the support so that the pressure from the environment acts on the diaphragm to compress the sensing element. The sensing element comprises at least one substrate having a coefficient of thermal expansion greater than 4 ppm/k. In another aspect, the sensing element comprises at least one substrate formed of a first material and an epitaxial layer of a second material having a lower coefficient of thermal expansion. In a further aspect, the support abuts the housing at a spherically-shaped interface to compensate for misalignment between the support and the sensing element to ensure that the sensing element is evenly loaded.

Abstract: The differential pressure sensor is formed of a semiconductor substrate (1) which is thinned out in an inner region into a membrane (2) which may be impinged by pressure on both sides. Measurement resistances (3a to 3d) for detecting the differential pressure (P1 minus P2) are formed within the membrane (2), and compensation resistances (4) are formed on the carrier, which are connected to measurement resistances (3). The measurement resistances (3) are connected into a first measurement bridge (6) and the compensation resistances (4a to 4d) into a second measurement bridge (7).

Abstract: A semiconductor pressure sensor includes a semiconductor substrate having a diaphragm for receiving pressure and a bridge circuit for detecting a distortion of the diaphragm corresponding to the pressure. The bridge circuit includes a pair of first gauge resistors and a pair of second gauge resistors. The first gauge resistors are disposed on a center of the diaphragm, and the second gauge resistors are disposed on a periphery of the diaphragm. Each first gauge resistor has a first resistance, which is larger than a second resistance of each second gauge resistor. The TNO property of the sensor is improved, so that the sensor has high detection accuracy.

Abstract: A pressure sensor includes a sensor element, and a resin package member that holds the sensor element. The sensor element is constructed by a semiconductor, and is capable of externally outputting an electric signal in accordance with strain generated when force is applied thereto. The sensor element is directly adhered to the package member via an adhesive layer that has Young's modulus in a range between 2.45×103 Pa and 2.06×104 Pa. Further the adhesive layer has a thickness equal to or more than 110 ?m. Accordingly, the pressure sensor effectively restricts a variation in a sensor characteristic due to a thermal change.

Abstract: One aspect is a pressure transducer package comprising a housing, a diaphragm, a support disposed in the housing and a sensing element disposed in the housing between the diaphragm and the support so that the pressure from the environment acts on the diaphragm to compress the sensing element. The sensing element comprises at least one substrate having a coefficient of thermal expansion greater than 4 ppm/k. In another aspect, the sensing element comprises at least one substrate formed of a first material and an epitaxial layer of a second material having a lower coefficient of thermal expansion. In a further aspect, the support abuts the housing at a spherically-shaped interface to compensate for misalignment between the support and the sensing element to ensure that the sensing element is evenly loaded.

Abstract: It is an object to provide a method of adjusting a pressure sensor, in which adjustment of a diaphragm portion and adjustment of an amplification circuit connected to the diaphragm portion are simplified. A flexible circuit board having the amplification circuit mounted thereon is connected to a diaphragm member having the diaphragm portion formed with gauge resistances, and offset, span and temperature-compensating adjustment resistances, and adjustment of the adjustment resistances formed on the diaphragm member is performed in this state. The adjustment on the side of the diaphragm member including the amplification circuit accommodates adjustment deviation on the amplification circuit, and hence adjustment of the whole pressure sensor can be achieved by a single adjustment process. The adjustment process thus simplified can reduce manufacturing costs.

Abstract: A thermal pressure sensor monitors pressure by measuring effects caused by variations of thermal conductivity between a member and a substrate to which the member is adhered by stiction. The interface between the member and the substrate behaves as an extremely narrow gap. In a preferred embodiment the member is a bridge extending between a pair of cantilever arms. Two pressure sensors may be combined in a Wheatstone bridge configuration. A method for fabricating a pressure sensor according to the invention comprises forming a layer of oxide on a substrate, depositing a layer of material on the oxide layer, forming the member from the layer of material, removing the oxide layer and then bringing the member into contact with the substrate. The portion of the substrate under the member may be patterned with plateaus and valleys.

Abstract: One aspect is a pressure transducer package comprising a housing, a diaphragm, a support disposed in the housing and a sensing element disposed in the housing between the diaphragm and the support so that the pressure from the environment acts on the diaphragm to compress the sensing element. The sensing element comprises at least one substrate having a coefficient of thermal expansion greater than 4 ppm/k. In another aspect, the sensing element comprises at least one substrate formed of a first material and an epitaxial layer of a second material having a lower coefficient of thermal expansion. In a further aspect, the support abuts the housing at a spherically-shaped interface to compensate for misalignment between the support and the sensing element to ensure that the sensing element is evenly loaded.

Abstract: A pressure sensor apparatus is substantially miniaturized by utilizing dead space. A sensor element is arranged to be present in a medium for detecting the pressure of the medium. A control element serves to control an electric signal from the sensor element, and a power supply element serves to control an input from the power supply and a signal from the control element thereby to generate an output. A lead frame has the control element and the power supply element mounted thereon and serves as an electrical conduction path. A resin body is formed by integrating the control element, the power supply element and the lead frame with one another. Either one of the sensor element, the control element and the power supply element is arranged on one side surface of the lead frame, and the remaining two are arranged on the other side surface of the lead frame.

Abstract: A heat loss gauge for measuring gas pressure in an environment includes a resistive sensing element and a resistive compensating element. The resistive compensating element is in circuit with the sensing element and has temperature response and physical characteristics substantially matching those of the resistive sensing element and is exposed to a substantially matching environment. An electrical source is connected to the sensing element for applying current to heat the sensing element relative to the compensating element. Measuring circuitry is connected to the sensing element and the compensating element for determining gas pressure in the environment to which the sensing element and compensating element are exposed based on electrical response of the sensing element and the compensating element.

Abstract: The invention relates to a device for measuring pressure, temperature and/or flow velocity. It includes a sensor (6) with a sensor support body (13) provided with a diaphragm (15) covering a cavity (14) formed in the support body (13). A pressure sensitive element (41) is mounted on the diaphragm, for recording pressure. Furthermore, a temperature sensitive resistor (42) is mounted in the vicinity of the pressure sensitive resistor and has a known temperature dependence, for recording temperature. It also includes an electrical circuit (43, 44, 45, 46) selectively outputting signals from either of the pressure sensitive element and the temperature sensitive resistor.