Abstract: There is described a multi-channel, multi-range transducer for measuring a parameter, the transducer comprising N channels and M sensing elements, the M sensing elements centered on distinct calibration points of distinct measuring ranges, the M sensing elements distributed across the N channels of the transducer, wherein sensing elements having adjacent measuring ranges are provided in different ones of the N channels.

Abstract: The present disclosure enables measurement with satisfactory sensitivity in a low pressure range, and thus accurate measurement in a wider pressure range, by providing a pressure sensor that includes a diaphragm layer and a pressure receiving region formed in the diaphragm layer. In addition, the pressure sensor includes a first piezostrictive element, a second piezostrictive element, a third piezostrictive element, and a fourth piezostrictive element. In addition, the pressure sensor includes a first magnetostrictive element, a second magnetostrictive element, a third magnetostrictive element, and a fourth magnetostrictive element.

Abstract: A pressure sensor system including at least one pressure sensor unit, the pressure sensor unit being configured with at least one sensor element which is situated in a cavity of a support structure, signal processing elements being integrated into support structure, the at least one sensor element being embeddable into the support structure to form the pressure sensor unit, and the support structure being formed by a land grid array/mold premold structure (LGA/MPM). The pressure sensor unit is introduced into a sensor housing to be provided with a diaphragm and is supported therein, a residual volume of the sensor housing, which is provided with at least one diaphragm and to the wiring of which the pressure sensor unit is electrically connected, being filled with an incompressible fluid. Also described is a method for manufacturing such a pressure sensor system and a measuring device.

Abstract: Described herein is a ruggedized microelectromechanical (“MEMS”) force sensor. The sensor employs piezoresistive or piezoelectric sensing elements for force sensing where the force is converted to strain and converted to electrical signal. In one aspect, both the piezoresistive and the piezoelectric sensing elements are formed on one substrate and later bonded to another substrate on which the integrated circuitry is formed. In another aspect, the piezoelectric sensing element is formed on one substrate and later bonded to another substrate on which both the piezoresistive sensing element and the integrated circuitry are formed.

Abstract: A pressure sensor is provided. The pressure sensor includes a substrate, and a first pressure sensing element, a second pressure sensing element, and sensor conditioning circuitry disposed on the first surface of the substrate. The sensor conditioning circuitry is electronically coupled to the first pressure sensing element and the second pressure sensing element. The pressure sensor further includes a buffer layer disposed on the first surface of the substrate such that the first pressure sensing element is disposed on the buffer layer. Multiple pressure sensing elements disposed on a single substrate for improving the performance of the pressure sensor.

Abstract: A key unit and a key array, the key unit includes a pressing panel, a key unit sensor assembly and a double-sided adhesive tape connected between the key unit sensor assembly and the pressing panel; the key unit sensor assembly includes a substrate, a first group of sensors and a second group of sensors; the first group of sensors are distributed at a central zone of the substrate, the central zone is corresponding to a key center on the pressing panel; two groups of sensors are arranged on the substrate, the first group of sensors are distributed at the central zone of the substrate, the second group of sensors are distributed at a zone of the substrate adjacent to an edge, the first group of sensors and the second group of sensors are used to detect different pressure values of the zone.

Abstract: A pressure sensing package includes a sensor chamber and an annular chamber extending about the sensor chamber. A primary diaphragm divides the sensor chamber into a first part receiving a first pressure and a second part including a differential pressure sensor approximately centered with respect to a sensor axis and a first transmission fluid. The first transmission fluid transmits the first pressure to a first differential pressure sensor face. A secondary diaphragm divides the annular chamber into a first part receiving a second pressure and a second part including a second transmission fluid. The second pressure is transmitted to a second pressure sensor face via the secondary diaphragm and the second transmission fluid. The primary and secondary diaphragms are positioned with respect to one another along the sensor axis direction such that pressures other than the first and second pressures acting on the pressure sensor sum to approximately zero.

Abstract: The invention relates to a device for supporting a MEMS component, especially a pressure sensor, having a substrate formed of a ceramic, a MEMS component on the substrate and walls forming a cavity for surrounding the MEMS component, in which the walls are formed from a machined ceramic cavity array.

Abstract: A pressure sensor including a housing extending along an axial line, a diaphragm fixed to a front-end side of the housing, a piezoelectric unit disposed in a hole in the housing and including a piezoelectric element, a transmission member that transmits deformation of the diaphragm to the piezoelectric unit, and a guide member having a through hole extending along the axial line and surrounding the piezoelectric unit in the through hole. (SL/AL)?0.26 is satisfied in the cross section perpendicular to the axial line passing through the piezoelectric element, where SL is the maximum value of the distance in the radial direction between the center of the through hole and the center of the piezoelectric element and AL is the maximum value of the distance in the radial direction between the outside surface of the piezoelectric element and the center of the through hole.

Abstract: A pressure sensor capsule includes a capsule body, an isolator, a pressure sensor, and a fluid fill pathway. The capsule body defines a process chamber. The isolator is supported by the capsule body and is exposed to the process chamber. The pressure sensor produces a sensor output that is indicative of a pressure within an interior chamber, which is isolated from the process chamber by the isolator. The fluid fill pathway extends from the process chamber to the interior chamber.

Abstract: Implementations of absolute pressure sensor devices may include a microelectromechanical system (MEMS) absolute pressure sensor coupled over a controller die. The MEMS absolute pressure sensor may be mechanically coupled to the controller die and may also be configured to electrically couple with the controller die. A perimeter of the controller die may be one of the same size and larger than a perimeter of the MEMS absolute pressure sensor. The controller die may be configured to electrically couple with a module through an electrical connector.

Abstract: A pressure sensor is disclosed. The pressure sensor includes a pressure sensor unit provided with a pressure detecting element configured to receive a drive voltage from a control substrate and electrically send a pressure detection signal to the control substrate so as to detect a pressure of fluid, and a plurality of electric wires connected to the pressure detecting element so as to supply the drive voltage and drawn to the outside so as to send the pressure detection signal. The pressure sensor may also include a relay substrate connected to the plurality of electric wires and having a converting circuit mounted thereon. The converting circuit converts either or both of the drive voltage supplied from the control substrate and the pressure detection signal sent to the control substrate.

Abstract: Provided is a semiconductor device including: a first substrate having a first primary surface, a second primary surface, and a side surface; a semiconductor element formed on the first primary surface; a first electrode formed on the first primary surface and connected to the semiconductor element on the first primary surface; a second electrode formed on the second primary surface; a through-electrode formed so as to penetrate the first substrate and connecting the first electrode and the second electrode to each other; a second substrate bonded to the first substrate so as to face the first primary surface; and a third electrode formed on the side surface of the first substrate and connected to the second electrode.

Abstract: The application describes MEMS transducers comprising a flexible membrane layer supported in a fixed relation relative to a substrate along at least one supporting edge, wherein a plurality of slits are provided through the membrane layer. The slits define a plurality of beams. Each beam defines a path between first and second endpoints of the beam, the path comprising at least one change in direction. Also described are transducers wherein the membrane layer is supported in a fixed relation relative to the substrate along a plurality of supporting edges which define a membrane region that is substantially bounded by the supporting edges.

Abstract: Apparatus and associated methods relate to generating redundant measurement of pseudo differential pressure using two absolute-pressure sensors, each exposed to a different environment. Each of the two absolute-pressure sensors has complementary first and second output nodes. The first output node has a positive relation with and/or response to increasing pressure, while the second output node has a negative relation with and/or response to increasing pressure. A first difference measurement signal is calculated based on a difference between the positive relation output signals of the first and second absolute-pressure sensors. A second difference measurement signal is calculated based on a difference between the negative relation output signals of the first and second absolute-pressure sensors. Both the first and second difference measurement signals are indicative of a pressure difference between the first and second environments.

Abstract: A MEMS pressure sensing element and integrated circuit (IC) are mounted on a circuit board. The sensing element and IC can be either stacked or unstacked. Bond wires connect the IC to the circuit board. Other bond wires connect the sensing element to the IC. A cap covers the sensing element and IC. The cap is attached to the circuit board and has a small hole in it, through which viscous gel is inserted. The gel encapsulates the MEMS sensing element, IC and bond wires in the cap. The hole also allows pressurized fluid to enter the cap and exert force on the MEMS pressure sensing element after encapsulation in the gel. Chip capacitors can also be mounted on the circuit board, outside the cap. Electrical signals are generated, which represent pressure applied to the MEMS pressure sensing element through the hole and gel.

Abstract: An integrated circuit (“IC”) package mold includes an upper mold platen that defines an upper mold cavity for receiving an upper substrate having a die attach side with a plurality of dies mounted thereon and a non-attach side with no dies mounted thereon. The die attach side of the upper substrate faces upwardly. A lower mold platen defines a lower mold cavity for receiving a lower substrate having a die attach side with a plurality dies mounted thereon and a non-attach side with no dies mounted thereon. The die attach side of the lower substrate faces downwardly.

Abstract: A pressure sensor device with a MEMS piezoresistive pressure sensing element attached to an in-circuit ceramic board comprises a monolithic ceramic circuit board formed by firing multiple layers of ceramic together. The bottom side of the circuit board has a cavity, which extends through layers of material from the ceramic circuit board is formed. A ceramic diaphragm, which is one of the layers, has a peripheral edge. The diaphragm's thickness enables the diaphragm bounded by the edge to deflect responsive to applied pressure. A MEMS piezoresistive pressure sensing element attached to the top side of the ceramic circuit board generates an output signal responsive to deflection of the ceramic diaphragm. A conduit carrying a pressurized fluid (liquid or gas) can be attached directly to the ceramic circuit board using a seal on the bottom of the ceramic circuit board, which surrounds the opening of the cavity through the bottom.

Abstract: A pressure sensor includes: a first substrate having first and second diaphragms on one surface provided by first and second recesses on another surface; first and second detecting elements on the first and second diaphragms; a second substrate providing a first reference pressure chamber with the one surface of the first substrate; a third substrate providing a second reference pressure chamber sealing the second recess; and a calculator calculating an offset value by a difference between a reference signal and an inspection signal and detecting a pressure of a measurement medium by a difference between a detection signal and the offset value. The first detecting element outputs the detection signal or the inspection signal according to a pressure difference between a first reference pressure or a reference medium pressure and a measurement medium pressure in the first recess.

Abstract: In a microelectromechanical system (MEMS) pressure sensor, thin and fragile bond wires that are used in the prior art to connect a MEMS pressure sensing element to an application specific integrated circuit (ASIC) for the input and output signals between these two chips are replaced by stacking the ASIC on the MEMS pressure sensing element and connecting each other using conductive vias formed in the ASIC. Gel used to protect the bond wires, ASIC and MEMS pressure sensing element can be eliminated if bond wires are no longer used. Stacking the ASIC on the MEMS pressure sensing element and connecting them using conductive vias enables a reduction in the size and cost of a housing in which the devices are placed and protected.

Abstract: An object of the present invention is to realize a pressure sensor with a small variation in sensor characteristics. The pressure sensor includes a diaphragm having longitudinal and lateral sides, and four strain gauges disposed on the diaphragm. The four strain gauges are arranged at a center of the diaphragm. Two of the four strain gauges are arranged along a lateral direction, and other two strain gauges are arranged along a longitudinal direction.

Abstract: A header assembly for a pressure sensor and methods for manufacturing and using the same are provided. In one example embodiment, a header insert may include a base; a hollow protusion coupled to the base and having a metalized inner surface and a metalized outer surface, wherein the metalized outer surface of the hollow protrusion is used to couple to a header and the metalized inner surface of the hollow protrusion is used to couple to a header pin; and wherein a seal is formed between the header, the header insert and the header pin.

Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to an optical sensor that includes a substrate and a sensor die. A through-hole extends through the substrate, and a trench is formed in a first surface of the substrate and is in fluid communication with the through-hole. The sensor die is attached to the first surface of the substrate and covers the first through-hole and a first portion of the trench. A second portion of the trench is left uncovered by the sensor die.

Abstract: A method, device and system for a gage pressure transducer including the making thereof are provided. In one embodiment, a method includes receiving, at a first diaphragm, a first pressure, wherein the first diaphragm is composed of metal; transferring, from the first diaphragm, to a first sensor, the first pressure using a first oil region, wherein the first oil region is disposed between the first diaphragm and the first sensor; receiving, at the first sensor, the first pressure; measuring, by the first sensor, the first pressure to generate a first pressure signal; and outputting, from the first sensor, to a first header pin, the first pressure signal, wherein the first header pin is electrically coupled to the first sensor using a first conductive glass frit.

Abstract: Even when a strain sensor chip and an object to be measured are bonded to each other by using a metallic bonding material such as solder, the metallic bonding material shows the creep behavior when used under high temperature environment of, for example, 100° C. or higher, and therefore, the strain detected by the strain sensor chip is gradually reduced, and the strain is apparently reduced. In the strain sensor chip mounting structure which is one embodiment of the present application, a strain sensor chip is fixed onto a surface to be measured of the object to be measured via a metallic bonding material. And, the metallic bonding material is bonded to a metallic film that is formed on a side surface of the strain sensor chip. In this manner, temporal change in a measurement error can be suppressed.

Abstract: Compensated pressure sensor includes a MEMS pressure sensor die having resistors RA and RD connected in series in a first leg of a Wheatstone bridge and resistors RB and RC connected in series in a second leg of the Wheatstone bridge; a first and second fuse; and a first, second third, fourth, fifth and sixth resistor; wherein: a first end of the first resistor is connected in series with the first leg of the bridge and a first end of the second resistor is connected in series with the second leg of the bridge; the first fuse is connected, at a first end, to a first output of the bridge, and at a second end, to a second end of the third resistor and to a first end of the second fuse; the second fuse is connected, at a second end, to a second output of the bridge; a first end of the third resistor is connected to an input to the bridge and to a first end of the fourth resistor; a second end of the fourth resistor is connected to a second end of the first resistor, a second end of the second resistor and a firs

Abstract: A method for making a mechanically flexible silicon substrate is disclosed. In one embodiment, the method includes providing a silicon substrate. The method further includes forming a first etch stop layer in the silicon substrate and forming a second etch stop layer in the silicon substrate. The method also includes forming one or more trenches over the first etch stop layer and the second etch stop layer. The method further includes removing the silicon substrate between the first etch stop layer and the second etch stop layer.

Abstract: A pressure scanner assembly having at least one replaceable sensor plate, wherein each of the replaceable sensor plates has at least one pressure sensor adapted to transmit a signal substantially indicative of a sensed pressure condition. A memory chip, which stores correction coefficients for each of the pressure sensor to compensate for thermal errors, may be installed on each of the replaceable sensor plates. The signals from the pressure sensors are multiplexed and may be outputted in analog or digital form. The pressure scanner assemblies described herein have sensor plates that can be interchanged with other sensor plates of the same or different pressure range without disrupting the electronic configuration of the pressure scanner assembly or having to recalibrate and/or update the memory chip installed thereon.

Abstract: The claimed invention is directed to a real-time noise classification and tuning system for cochlear implant and other hearing device applications. The system is capable of automatically selecting the optimized parameters of a noise suppression algorithm in response to different noisy environments. The feature vector and the classifier deployed in the system to automatically identify the background noise environment are selected so that the computation burden is kept low to achieve a real-time throughput. The results reported herein indicate improvement in speech enhancement when using this intelligent real-time hearing device system.

Abstract: A differential pressure sensor includes a sensor chip provided with a sensor diaphragm, a first retaining member bonded facing a peripheral edge portion of one face of the sensor diaphragm and having a first pressure guiding hole guiding a first fluid pressure to the one face of the sensor diaphragm, and a second retaining member bonded facing a peripheral edge portion of the other face of the sensor diaphragm and having a second pressure guiding hole guiding a second fluid pressure to the other face of the sensor diaphragm. The differential pressure sensor also includes a sensor housing having a sensor chamber containing the sensor chip, a first pressure guiding duct guiding the first fluid pressure to a first inner wall face of the sensor chamber, and a second pressure guiding duct guiding the second fluid pressure to a second inner wall face of the sensor chamber.

Abstract: An electrostatic pressure sensor has a supporting diaphragm bonded to be held between first and second pedestal plates, a sensor chip supported on a top face of a center portion of the second pedestal plate. The supporting diaphragm has in the center portion thereof a large-diameter hole that forms a slit-shaped space between the first and second pedestal plates. The first pedestal plate has at least one inlet hole, for the fluid being measured, connecting to the slit-shaped space. The second pedestal plate has at least an outlet hole, connecting to the slit-shaped space, for directing the fluid being measured to the pressure-sensitive diaphragm of the sensor chip. The pedestal plate has an inlet hole of the first pedestal plate and an outlet hole of the second pedestal plate do not overlap each other in the direction of thickness of the first and second pedestal plates.

Abstract: A process for manufacturing low-profile and flexible integrated circuits includes manufacturing an integrated circuit on a wafer having a thickness larger than the desired thickness. After the integrated circuit is manufactured the integrated circuit may be released with a portion of the wafer leaving a remainder of the bulk portion of the wafer. A second integrated circuit may be manufactured on the remainder of the wafer and the process repeated to manufacture additional integrated circuits from a single wafer. The integrated circuits may be released from the wafer by etching vias through the integrated circuit and into the wafer. The via may be used to start an etch process inside the wafer that undercuts the integrated circuit separating the integrated circuit from the wafer.

Abstract: A flowmeter includes a first chamber and a second chamber connected through a channel. The first chamber is provided with a first deformable membrane and with first and second gauges. The second chamber is provided with a second deformable membrane and with third and fourth gauges. The four gauges form a Wheatstone bridge.

Abstract: A method of manufacturing an electronic package module is provided. The method forms dual-side and selective encapsulation by using a dam filling process and a sacrificial layer. Electronic components are protected from electromagnetic interference while not interfering functioning of specific electronic components which are not encapsulated.

Abstract: A pressure sensor includes: a sensor section having one fixed end and first to four gauge resistors arranged on a diaphragm; and a support member fixing the sensor section. A first pair to fourth pair of piezoresistive elements are arranged on the diaphragm. Two piezoresistive elements of each pair have opposite resistance value change directions, and distances to the support member are equal to each other. A distances between each piezoresistive element of the third pair and the fourth pair and the support member is longer than a distance between each piezoresistive element of the first pair and the second pair and the support member. Each gauge resistor includes a combined resistance, which is provided by serially connecting two corresponding piezoresistive elements. The two corresponding piezoresistive elements have a same resistance value change direction.

Abstract: Exemplary embodiments of the present invention provide a differential pressure transducer that comprises first and second diaphragms of different configurations, i.e., different diameters and/or thicknesses. The pressure transducer provides more versatility over prior art designs as the diaphragms can be of different configurations yet still maintain substantially similar back pressures. Therefore, the errors commonly associated with back pressures are eliminated because the back pressures from the diaphragms ultimately cancel out in the sensor's differential pressure measurement.

Abstract: A method of making a pressure sensing apparatus is provided herein. A plurality of trenches are etched on a first surface of a substrate. The substrate is annealed to form a diaphragm and an embedded cavity from the plurality of trenches, the diaphragm formed of a portion of the substrate wherein an exterior surface of the diaphragm is the first surface of the substrate and an interior surface of the diaphragm is a surface defining the embedded cavity. Piezoresistors are fabricated on the exterior surface of the diaphragm, the piezoresistors configured to change resistivity in response to strain resulting from deflection of the diaphragm. The substrate is mounted, including the diaphragm, in a housing such that a media can apply pressure to the diaphragm and such that the pressure can be sensed by determining a change in the resistivity of the piezoresistors.

Abstract: A pressure sensor chip includes a sensor diaphragm that outputs a signal in accordance with a pressure differential, and first and second holding members that face, on peripheral edge portions thereof, one face and another face of a sensor diaphragm, and are in contact therewith. In the peripheral edge portion of the first holding member, in a region that faces the one face of the sensor diaphragm, a region on an outer peripheral side is a region that is bonded to the one face of the sensor diaphragm, and a region on an inner peripheral side is a region that is not bonded to the one face of the sensor diaphragm.

Abstract: A diaphragm piezoresistive pressure sensor includes: a base member; a diaphragm including a middle portion and a surrounding portion surrounding the middle portion; a spacer disposed between and cooperating with the base member and the diaphragm to define a cavity thereamong; an inner abutment member disposed in the cavity and spaced apart from the base member by a clearance; and a piezoresistive sensor unit embedded in the diaphragm. The spacer surrounds and is spaced apart from the inner abutment member. At least one of the inner abutment member and the middle portion of the diaphragm defines a chamber therebetween.

Abstract: A powered mobile test device for measuring loads supported by a running tire, said device being composed of a rigid frame carried by at least two carrying wheels to which a torque is applied, and having an axle which is fixed to the frame and which carries a test wheel for measuring the loads supported by said tire. The axle is connected to the frame by a loading actuator, a torque is applied to the test wheel, said torque applied to the test wheel is in the opposite direction to those applied to the carrying wheels, and a linkage system between the test wheel and the carrying wheels transmits at least some of the power developed by the braking torque applied to the test wheel or by the braking torques applied to the carrying wheels.

Abstract: The present invention provides a self-heated pressure sensor assembly and method of utilizing the same. The self-heated pressure sensor assembly regulates and maintains the temperature of the pressure sensor, regardless of the external temperature environment, without an external heater as in prior art embodiments. Exemplary embodiments of the pressure sensor assembly incorporate a resistance heater that is built into the sensing chip of the pressure sensor assembly. The pressure sensor assembly also utilizes the resistance of the pressure sensing elements to monitor the temperature of the assembly, which works alongside the resistance heater to maintain a stable temperature within the pressure sensor assembly.

Abstract: A method for production of a pressure sensor including a flat flexible membrane made of a ceramic material and a flat rigid support thereof made of a ceramic material is provided. Steps include: —establishing an electric circuit on the membrane; —establishing an electric contact with the outside on the support; —depositing an electrically conductive material on the support; —establishing an electrical and mechanical coupling between the membrane and the support. The electrical coupling between the membrane and the support are performed by deposition and sintering of at least one layer of an electrically conductive sinterable electrical connection material. The mechanical coupling between the membrane and the support are performed by deposition and sintering of at least one layer of sinterable mechanical connection material that is electrically insulating and/or isolated from the layer of sinterable electrical connection material.

Abstract: An oil-filled pressure transducer having reduced back pressure, comprising an alignment plate having a sensor accommodating aperture, a sensor module inserted into the sensor accommodating aperture, a header surrounding the alignment plate, the header having a protruding top surface, and a diaphragm disposed on the protruding top surface to create a relatively small oil accommodating region between the diaphragm and the sensor. This configuration reduces the oil volume required for operation, which ultimately reduces the back pressure applied against the diaphragm.

Abstract: A pressure sensor is claimed for measuring the pressure of a fluid. The pressure sensor comprises two or more half bridges, an analog-to-digital converter, a microcontroller, an output generator, and one or more redundancy circuits. Each half bridge comprises two resistive pressure sensing elements (RSPE) electrically coupled to the analog-to-digital converter. Each redundancy circuit comprises a switch and resistor electrically in series. A redundancy circuit may be disposed electrically in parallel with any or all of the RSPEs of the half bridges such that when an RSPE fails open, its corresponding redundancy circuit may be activated in order to permit the resistor of the redundancy circuit to take the place of the RSPE. This permits the analog-to-digital converter to continue to operate normally, even with a failed RSPE. The pressure sensor may then base its calculated pressure on the remaining half bridges which do not have a failed RSPE.

Abstract: A semiconductor filter is provided to operate in conjunction with a differential pressure transducer. In one embodiment, a method comprises receiving, at a filter having a plurality of apertures, a pressure, wherein the pressure includes a static pressure component and a dynamic pressure component; filtering, by the plurality of apertures, at least a portion of the dynamic pressure component of the pressure, wherein a diameter of each of the plurality of apertures is such that the plurality of apertures filters at least the portion of the dynamic pressure component of the pressure; outputting, from the filter, a filtered pressure; and wherein the filtered pressure is used to determine the dynamic pressure component of the pressure.

Abstract: An MEMS pressure sensor is designed to reduce or eliminate thermal noise, such as temperature offset voltage output. The pressure sensor includes a pressure sensing element having a diaphragm, and a cavity formed as part of the pressure sensing element, where the cavity receives a fluid such that the diaphragm at least partially deflects. The pressure sensing element also includes a plurality of piezoresistors, which are operable to generate a signal based on the amount of deflection in the diaphragm. At least one trench is integrally formed as part of the pressure sensing element, and an adhesive connects the pressure sensing element to the at least one substrate such that at least a portion of the adhesive is attached to the trench and redistributes thermally induced stresses on the pressure sensing element such that the thermally induced noise is substantially eliminated.

Abstract: A catheter die is provided and includes an elongate body having first and second opposing end portions and an end face at the first one of the first and second opposing end portions. The elongate body defines a cavity within the first end portion with an interior facing surface of the cavity disposed to extend alongside at least a portion of the first end face. At least one or more piezoresistive pressure sensors are operably disposed proximate to the cavity.

Abstract: Fabry-Perot and Bragg grating optical measuring principles are combined with a torsional stress sensing mechanism that converts torque applied in one fluid environment to force exerted in a second environment to measure extreme environmental parameters such as pressure in a petroleum producing borehole.

Abstract: A pressure detector detecting a pressure of cold or hot water; a temperature detector detecting a temperature of a pressure sensor; correcting equation storage storing, cold water correcting equation information applied when the temperature detected by the temperature detector is included in a cold water temperature range, and hot water correcting equation information applied when the temperature detected by the temperature detector is included in a hot water temperature range; a temperature range determiner determining the temperature range that includes the temperature detected by the temperature detector as either a cold water temperature range or a hot water temperature range; and a correction calculating portion using the correcting equation corresponding to the temperature range determined by the temperature range determiner correcting the detection signal by the pressure detector, and outputting the post-correction signal as a measurement signal.

Abstract: A catheter die is provided and includes a device layer defining a cavity and including a piezoresistive pressure sensor operably disposed proximate to the cavity and an insulator having an opening and being disposed on an upper surface of the device layer such that a portion of the piezoresistive pressure sensor is exposed through the opening. The catheter die further includes an insulation layer bonded to a lower surface of the device layer and first and second bond pads, the first bond pad being electrically coupled to the portion of the piezoresistive pressure sensor via the opening and the second bond pad being disposed on the insulation layer.