Resistive Patents (Class 73/725)
  • Patent number: 10260978
    Abstract: A pressure detection unit includes a pressure receiving structure including a ring-shaped ring member, a receiving member facing the ring member, and a diaphragm interposed between the ring member and the receiving member, a base made of ceramic joined to the ring member to form a pressure receiving space between the base and the diaphragm, a semiconductor type pressure detection device installed on a side of the pressure receiving space of the base, and a terminal pin which is electrically connected to the semiconductor type pressure detection device and penetrates the base.
    Type: Grant
    Filed: February 10, 2017
    Date of Patent: April 16, 2019
    Assignee: FUJIKOKI CORPORATION
    Inventors: Tomohisa Aoyama, Motohisa Mukai, Youko Tamura
  • Patent number: 10079215
    Abstract: An electronic chip including: a plurality of first semiconductor bars of a first conductivity type and of second semiconductor bars of a second conductivity type arranged alternately and contiguously on a region of the first conductivity type; two detection contacts arranged at the ends of each second bar; a circuit for detecting the resistance between the detection contacts of each second bar; insulating trenches extending in the second bars down to a first depth between circuit elements; and insulating walls extending across the entire width of each second bar down to a second depth greater than the first depth.
    Type: Grant
    Filed: October 20, 2017
    Date of Patent: September 18, 2018
    Assignee: STMICROELECTRONICS (ROUSSET) SAS
    Inventors: Alexandre Sarafianos, Mathieu Lisart, Jimmy Fort
  • Patent number: 10070230
    Abstract: According to one embodiment, a microphone package includes: a pressure sensing element including a film and a device; and a cover. The film generates strain in response to pressure. The device includes: a first electrode; a second electrode; and a first magnetic layer. The first magnetic layer is provided between the first electrode and the second electrode and has a first magnetization. The cover includes: an upper portion; and a side portion. The side portion is magnetic and provided depending on the first magnetization and the second magnetization.
    Type: Grant
    Filed: December 8, 2016
    Date of Patent: September 4, 2018
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yoshihiro Higashi, Yoshihiko Fuji, Michiko Hara, Akiko Yuzawa, Shiori Kaji, Tomohiko Nagata, Akio Hori, Hideaki Fukuzawa
  • Patent number: 10006826
    Abstract: A semiconductor pressure sensor device in which the shape or the structure of a connector portion can be easily changed and which has high waterproof performance. A terminal housing and a second case are engaged with each other via an engagement structure. The terminal housing and a first case are fitted with each other via a fitting structure. Thus, the first case and the second case are fixed to each other via the terminal housing. The first case is fitted in the second case. Then, the terminal housing is fitted with the first case, and the terminal housing is engaged with the second case substantially at the same time. Through such simple process, an opening portion of the first case is covered and a connector portion configured to enable external terminals to be connected to ends, located on one side, of a plurality of lead terminals is formed.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: June 26, 2018
    Assignee: Hokuriku Electric Industry Co., Ltd.
    Inventors: Satoshi Tsubata, Hiroyuki Sawamura
  • Patent number: 9442032
    Abstract: A microelectromechanical pressure sensor structure wherein the length of the diaphragm is at least three times the width of the diaphragm. The oblong diaphragm experiences a minimized difference between lateral bending of the wafer and of the diaphragm along the width of the diaphragm. In a perpendicular direction, the diaphragm is at least three times longer due to which it accurately aligns with the bending form of the wafer. Due to this, the total error caused by bending of the structure is significantly reduced and a more robust structure is achieved. At the same time, the longer diaphragm provides mode deflected area for detection and thus significantly improves sensitivity of the device.
    Type: Grant
    Filed: May 6, 2014
    Date of Patent: September 13, 2016
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Heikki Kuisma
  • Publication number: 20150090042
    Abstract: A pressure sensor package includes a lead and a semiconductor die spaced apart from the lead and including a terminal and a diaphragm disposed at a first side of the die. The die is configured to change an electrical parameter responsive to a pressure difference across the diaphragm. The package further includes an electrical conductor connecting the terminal to the lead, a molding compound encasing the electrical conductor, the die and part of the lead, a cavity in the molding compound exposing the diaphragm, and a sealing ring disposed on a side of the molding compound with the cavity. The sealing ring surrounds the cavity and has a lower elastic modulus than the molding compound. Alternatively, the sealing ring can be a ridge of the molding compound that protrudes from the side of the molding compound with the cavity and surrounds the cavity. A package manufacturing method is also provided.
    Type: Application
    Filed: September 27, 2013
    Publication date: April 2, 2015
    Inventors: Mathias Vaupel, Horst Theuss, Helmut Wietschorke
  • Publication number: 20150059485
    Abstract: A micromechanical sensor system includes a micromechanical sensor chip surrounded at least laterally by a molded housing which has a front side and a rear side. The micromechanical sensor chip includes a chip area on the rear side, which is omitted from the molded housing, and a rewiring device formed on the rear side, which, starting from the chip area, extends to the surrounding molded housing on the rear side, and from there, past at least one via from the rear side to the front side of the molded housing.
    Type: Application
    Filed: August 28, 2014
    Publication date: March 5, 2015
    Applicant: ROBERT BOSCH GMBH
    Inventors: Frieder Haag, Hubert Benzel
  • Publication number: 20140311249
    Abstract: A semiconductor pressure sensor (720) includes a thin film piezoelectric element (701) which applies strain to a portion of a semiconductor substrate that corresponds to a thin region (402). The thin film piezoelectric element (701) is formed at a distance away from diffusion resistors (406, 408, 410, and 412) functioning as strain gauges and is extended to the proximity of a bonding pad (716A) connected to an upper electrode layer of the thin film piezoelectric element and a bonding pad (716F) connected to a lower electrode thereof. The diffusion resistors (406, 408, 410, and 412) constitute a bridge circuit by metal wiring (722) and diffusion wiring (724). During self-diagnosis, a prescribed voltage is applied to a thin film piezoelectric element (701). If the output difference of the bridge circuit between before and after the voltage application falls outside a prescribed range, it is determined that a breakage occurs in the semiconductor pressure sensor (720).
    Type: Application
    Filed: July 2, 2014
    Publication date: October 23, 2014
    Inventors: Nobuyuki Yamada, Masahiro Sakuragi, Takeshi Yoshida, Kei Hayashi
  • Patent number: 8857264
    Abstract: A catheter die is provided and includes an elongate body having first and second opposing end portions and an end face at the first one of the first and second opposing end portions. The elongate body defines a cavity within the first end portion with an interior facing surface of the cavity disposed to extend alongside at least a portion of the first end face. At least one or more piezoresistive pressure sensors are operably disposed proximate to the cavity.
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: October 14, 2014
    Assignee: Amphenol Thermometrics, Inc.
    Inventor: Sisira Kankanam Gamage
  • Publication number: 20140260648
    Abstract: The invention prevents a pressure receiving space of a pressure sensor from being electrically charged. In a pressure sensor, a diaphragm is attached to a base which is fixed within a cover and a pressure receiving space in which an oil is sealed is formed. A semiconductor type pressure detecting device is connected to a plurality of terminal pins by a bonding wire. A neutralization plate attached to a periphery of the semiconductor type pressure detecting device or a part of the periphery thereof is connected to an earth terminal pin by an earth bonding wire, or is connected to the earth terminal pin by a soldering so as to prevent an insulative medium sealed within the pressure receiving space from being electrically charged.
    Type: Application
    Filed: March 11, 2014
    Publication date: September 18, 2014
    Applicant: FUJIKOKI CORPORATION
    Inventors: Tomohisa AOYAMA, Osamu TAKATSUKI, Motohisa MUKAI, Yuichiro SUMIYOSHI
  • Patent number: 8820169
    Abstract: Pressure sensors having components with reduced variations due to stresses caused by various layers and components that are included in the manufacturing process. In one example, a first stress in a first direction causes a variation in a component. A second stress in a second direction is applied, thereby reducing the variation in the component. The first and second stresses may be caused by a polysilicon layer, while the component may be a resistor in a Wheatstone bridge.
    Type: Grant
    Filed: March 26, 2013
    Date of Patent: September 2, 2014
    Assignee: Silicon Microstructures, Inc.
    Inventors: Richard J. August, Michael B. Doelle
  • Publication number: 20140069200
    Abstract: A pressure sensor device comprises a support substrate including a thin film area which is bendable by a pressure, a sensor film comprising a first electrode provided on the thin film area, a second electrode provided on the first electrode, a reference layer provided between the first electrode and the second electrode, a free layer provided between the reference layer and the first electrode or between the reference layer and the second electrode, a spacer layer provided between the reference layer and the free layer, a shield provided on a side of the support substrate.
    Type: Application
    Filed: January 24, 2013
    Publication date: March 13, 2014
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Hiromi Yuasa, Hideaki Fukuzawa, Yoshihiko Fuji, Michiko Hara, Yoshihiro Higashi, Tomohiko Nagata, Akio Hori
  • Publication number: 20140020471
    Abstract: The present invention, in one embodiment, provides a method of measuring pressure or temperature using a sensor including a sensor element composed of a plurality of carbon nanotubes. In one example, the resistance of the plurality of carbon nanotubes is measured in response to the application of temperature or pressure. The changes in resistance are then recorded and correlated to temperature or pressure. In one embodiment, the present invention provides for independent measurement of pressure or temperature using the sensors disclosed herein.
    Type: Application
    Filed: September 24, 2013
    Publication date: January 23, 2014
    Applicant: UT-BATTELLE LLC
    Inventors: Ilia N. Ivanov, David B. Geohegan
  • Publication number: 20130205908
    Abstract: The present invention discloses a Micro-Electro-Mechanical System (MEMS) pressure sensor device and a manufacturing method thereof. The MEMS pressure sensor device includes: a substrate having at least one recess formed on an upper surface thereof, the recess defining a boss; a membrane, which is bonded to at least a part of the upper surface and at least a part of the boss, so that the at least one recess forms a cavity; at least one sensing unit, which is coupled to the membrane, for sensing deflection of the membrane; and an opening, which is formed on a lower surface of the substrate, and connects to the cavity.
    Type: Application
    Filed: February 10, 2012
    Publication date: August 15, 2013
    Inventors: Chin-Fu Hsu, Chia-Hsing Shih
  • Patent number: 8471346
    Abstract: A semiconductor device includes a substrate including a cavity and a first material layer over at least a portion of sidewalls of the cavity. The semiconductor device includes an oxide layer over the substrate and at least a portion of the sidewalls of the cavity such that the oxide layer lifts off a top portion of the first material layer toward a center of the cavity.
    Type: Grant
    Filed: February 27, 2009
    Date of Patent: June 25, 2013
    Assignee: Infineon Technologies AG
    Inventors: Thoralf Kautzsch, Markus Rochel
  • Patent number: 8402835
    Abstract: Pressure sensors having components with reduced variations due to stresses caused by various layers and components that are included in the manufacturing process. In one example, a first stress in a first direction causes a variation in a component. A second stress in a second direction is applied, thereby reducing the variation in the component. The first and second stresses may be caused by a polysilicon layer, while the component may be a resistor in a Wheatstone bridge.
    Type: Grant
    Filed: February 16, 2011
    Date of Patent: March 26, 2013
    Assignee: Silicon Microstructures, Inc.
    Inventors: Richard J. August, Michael B. Doelle
  • Patent number: 8316719
    Abstract: A pressure sensor for measuring the location and intensity of an applied pressure, including an elastomeric sheet; and a plurality of micro-channels embedded in the elastomeric sheet.
    Type: Grant
    Filed: November 12, 2010
    Date of Patent: November 27, 2012
    Assignee: President and Fellows of Harvard College
    Inventors: Carmel S. Majidi, Robert J. Wood, Phillippe Bérard, Yong-Lae Park
  • Patent number: 8182435
    Abstract: An implantable intraocular pressure sensor system has a sealed geometric shape with an internal pressure at a first value. A strain gauge wire is embedded in a surface of the sealed geometric shape. When the surface is deflected by intraocular pressure, a measured resistance of the strain gauge wire indicates the intraocular pressure. The system also has a processor coupled to a power source and memory. The processor is configured to read the measured resistance and write values corresponding to intraocular pressure to the memory.
    Type: Grant
    Filed: May 4, 2009
    Date of Patent: May 22, 2012
    Assignee: Alcon Research, Ltd.
    Inventors: Bruno Dacquay, Matthew J. A. Rickard
  • Patent number: 8130073
    Abstract: A push-button switch test device having a flexible tab fixedly attached to a pushing member. The flexible tab is made of a flexible material and includes a deformation sensitive resistor mounted on a surface. The push-button switch test device may be used to test a push-button by imposing a known force on the flexible tab while receiving a signal level across the deformation sensitive resistor. As the known force pushes on the flexible tab, the signal level indicates when the push-button has engaged. The force may then be reversed to permit sensing of the disengagement of the switch. Configurations of a plurality of push-button switch test devices may be arranged in a test frame that mirrors a configuration of push-button switches.
    Type: Grant
    Filed: November 15, 2010
    Date of Patent: March 6, 2012
    Assignee: Harman International Industries, Incorporated
    Inventor: Adrian Baima
  • Patent number: 8104355
    Abstract: A measurement element includes a semiconductor substrate with electrical insulating film formed thereon. A resistor formed on the electrical insulating film constitutes a heater; and a cavity is formed by removing a portion of the semiconductor substrate that corresponds to a region where a body part of the resistor is formed. The region where the body part of the resistor is formed is formed into a thin wall part by the cavity, and an opening and a slit is formed in a portion of the thin wall part in such a manner as to penetrate the thin wall part in the thickness direction. The measurement element has a film formed covering the region of the opening or slit.
    Type: Grant
    Filed: February 17, 2010
    Date of Patent: January 31, 2012
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Rintaro Minamitani, Keiji Hanzawa, Akio Yasukawa
  • Patent number: 8033178
    Abstract: A pressure sensor comprises a sensor platform; a measuring membrane, or diaphragm, which is held by the sensor platform, and can have a pressure applied to it and is deformable as a function of pressure; and at least two resistance elements having an AlxGa1—xN layer. At least a first resistance element of the at least two resistance elements is arranged on the measuring membrane, or diaphragm and has a deformation-dependent resistance value. The pressure sensor can be operated using a measurement circuit to register a signal which depends on the resistance values of the at least two resistance elements in the plane of the AlxGa1—xN layer. Four resistance elements are preferably provided in a full bridge.
    Type: Grant
    Filed: December 22, 2006
    Date of Patent: October 11, 2011
    Assignee: Endress + Hauser GmbH + Co. KG
    Inventors: Dietfried Burczyk, Anh Tuan Tham, Dieter Stolze
  • Patent number: 7987727
    Abstract: A semiconductor pressure sensor is provided that includes a diaphragm, a resistive element arranged at an upper portion of the diaphragm, an insulating film arranged on an upper face of the resistive element and an upper face of the diaphragm, a via that penetrates through a portion of the insulating film and comes into contact with the resistive element, and wiring that is electrically connected to the resistive element through the via. The insulating film includes a concave portion having a bottom face that is substantially flat. The wiring is arranged on the bottom face of the concave portion, and the depth of the concave portion is substantially equal to the thickness of the wiring.
    Type: Grant
    Filed: July 21, 2008
    Date of Patent: August 2, 2011
    Assignee: Mitsumi Electric Co., Ltd.
    Inventor: Yasuhide Fujioka
  • Patent number: 7926352
    Abstract: For example, to adjust an offset of a pressure sensor, there are provided an external resistor RE and an internal resistor circuit that is connected to both ends of RE and formed in a semiconductor chip such as a processor. The internal resistor circuit includes N pieces of internal resistors RI connected in series between both ends of RE, and (N+1) pieces of switches selecting one of voltages of respective nodes of the serial resistors and outputs the same as a signal. RE has a high absolute value precision of, e.g., several ten ohms to several hundred ohms, and RI has a high relative value precision of, e.g., several kilo-ohms. Therefore, an offset adjustment range is decided at a high absolute value precision mainly by RE, and with regard to the arrangement resolution, a high precision can be obtained along with the relative value precision of the RI.
    Type: Grant
    Filed: December 23, 2008
    Date of Patent: April 19, 2011
    Assignee: Renesas Electronics Corporation
    Inventors: Tadashi Matsushima, Masaru Sugai, Chung Wen Hung, Yuji Shimizu
  • Patent number: 7803628
    Abstract: In a device for measuring the pressure of a medium, in particular a liquid medium, the device including a measuring chamber through which the medium can flow and which has at least one elastically deformable wall, at least one wall that is more rigid by comparison to the elastically deformable wall, and an inlet and outlet for the medium, at least one excitation electrode is provided in or on the at least one more rigid wall of the measuring chamber, and at least one signal electrode is provided on the elastically deformable wall, for impedance measurement.
    Type: Grant
    Filed: April 30, 2004
    Date of Patent: September 28, 2010
    Assignee: MHM Harzbecher Medizintechnik GmbH
    Inventor: Raymond Glocker
  • Publication number: 20100218614
    Abstract: An object of the present invention is to provide a structure unlikely to break in the dicing process while allowing easy execution of screening, for a measurement element in which a resistor constituting a heater is formed on a thin wall part thermally insulated from a semiconductor substrate by providing a cavity part formed in the semiconductor substrate. Provided is a measurement element including: a semiconductor substrate; an electrical insulating film formed on the semiconductor substrate; a resistor formed on the electrical insulating film, the resistor constituting a heater; and a cavity formed by removing a portion of the semiconductor substrate that corresponds to a region where a body part of the resistor is formed. The region where the body part of the resistor is formed is formed into a thin wall part by the cavity, and any of an opening and a slit is formed in a portion of the thin wall part in such a manner as to penetrate the thin wall part in a thickness direction thereof.
    Type: Application
    Filed: February 17, 2010
    Publication date: September 2, 2010
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Rintaro MINAMITANI, Keiji Hanzawa, Akio Yasukawa
  • Patent number: 7762141
    Abstract: A pressure sensor for a pressure medium includes: a sensor chip including a semiconductor substrate, a diaphragm in the substrate and a gauge resistor on the diaphragm; a protection cap covering the diaphragm; a case for accommodating the chip, introducing the pressure medium to the cap, and atmospheric air to the substrate; a terminal; a wiring; and a seal member. An embedded portion of the wiring is coupled with the gauge resistor. A connection portion of the wiring couples the embedded portion and the terminal. The embedded portion is covered with the cap to be isolated from the pressure medium. The seal member is disposed between the case and the substrate to isolate the connection portion from the pressure medium and the atmospheric air.
    Type: Grant
    Filed: February 12, 2008
    Date of Patent: July 27, 2010
    Assignee: DENSO CORPORATION
    Inventors: Hiroaki Tanaka, Tetsuo Fujii
  • Publication number: 20100073123
    Abstract: A miniature pressure transducer is disclosed which is able to operate at high temperatures. The pressure transducer is provided on a substrate comprising an elongate silicon base portion with one or more contact areas formed at one end and a diaphragm formed at the opposite distal end. A plurality of piezoresistive elements are provided on the diaphragm, preferably in a Wheatstone Bridge arrangement, and connected to the contact areas using interconnects. The diaphragm extends across substantially the entire effective width of the elongate base portion providing a compact width whilst still maintaining a sensitive pressure sensing capability.
    Type: Application
    Filed: September 22, 2009
    Publication date: March 25, 2010
    Inventors: Russell CRADDOCK, James Anthony King
  • Patent number: 7624644
    Abstract: A semiconductor pressure sensor includes a diaphragm; a resistor provided on a top surface of the diaphragm; an insulating film formed on the diaphragm and the resistor having a penetrating part exposing a top surface of the resistor; and a wiring pattern formed from the top surface of the resistor exposed by the penetrating part to a top surface of the insulating film; wherein a distance between a first crossing part where a plane orthogonal to the top surface of the diaphragm meets a top end of a side plane of the penetrating part and a second crossing part where the plane orthogonal to the top surface of the diaphragm meets a bottom of the side plane of the penetrating part is equal or greater than a thickness of the insulating film by a factor of a square root of two.
    Type: Grant
    Filed: August 22, 2008
    Date of Patent: December 1, 2009
    Assignee: Mitsumi Electric Co., Ltd.
    Inventor: Yasuhide Fujioka
  • Publication number: 20090071259
    Abstract: A pressure sensor for a pressure medium includes: a sensor chip (3) including a semiconductor substrate (3a), a diaphragm (3b) in the substrate and a gauge resistor (3c) on the diaphragm; a protection cap (5) covering the diaphragm; a case (2) for accommodating the chip, introducing the pressure medium to the cap, and atmospheric air to the substrate; a terminal (2c); a wiring (4); and a seal member (7). An embedded portion (4a-4c, 4e) of the wiring is coupled with the gauge resistor. A connection portion (4d, 4f) of the wiring couples the embedded portion and the terminal. The embedded portion is covered with the cap to be isolated from the pressure medium. The seal member is disposed between the case and the substrate to isolate the connection portion from the pressure medium and the atmospheric air.
    Type: Application
    Filed: February 12, 2008
    Publication date: March 19, 2009
    Inventors: Hiroaki Tanaka, Tetsuo Fujii
  • Publication number: 20090056463
    Abstract: A semiconductor pressure sensor includes a diaphragm; a resistor provided on a top surface of the diaphragm; an insulating film formed on the diaphragm and the resistor having a penetrating part exposing a top surface of the resistor; and a wiring pattern formed from the top surface of the resistor exposed by the penetrating part to a top surface of the insulating film; wherein a distance between a first crossing part where a plane orthogonal to the top surface of the diaphragm meets a top end of a side plane of the penetrating part and a second crossing part where the plane orthogonal to the top surface of the diaphragm meets a bottom of the side plane of the penetrating part is equal or greater than a thickness of the insulating film by a factor of a square root of two.
    Type: Application
    Filed: August 22, 2008
    Publication date: March 5, 2009
    Inventor: Yasuhide Fujioka
  • Publication number: 20090031817
    Abstract: A semiconductor pressure sensor is provided that includes a diaphragm, a resistive element arranged at an upper portion of the diaphragm, an insulating film arranged on an upper face of the resistive element and an upper face of the diaphragm, a via that penetrates through a portion of the insulating film and comes into contact with the resistive element, and wiring that is electrically connected to the resistive element through the via. The insulating film includes a concave portion having a bottom face that is substantially flat. The wiring is arranged on the bottom face of the concave portion, and the depth of the concave portion is substantially equal to the thickness of the wiring.
    Type: Application
    Filed: July 21, 2008
    Publication date: February 5, 2009
    Inventor: Yasuhide Fujioka
  • Publication number: 20080229839
    Abstract: A sensor preferably capable of high resolution sensing over a large operating range includes a composite diaphragm containing nanotubes or nanowires. The nanotubes or nanowires preferably form a mat that is embedded in insulating material, such as high dielectric or insulating thin films. The nanotubes or nanowires may provide the diaphragm with a Young's modulus of greater than about 1000 GPa and a tensile strength of greater than about 100 GPa. The strain in the nanotubes or nanowires may be measured by a change in resistance, voltage, current or capacitance.
    Type: Application
    Filed: March 21, 2007
    Publication date: September 25, 2008
    Applicant: Rosemount Inc.
    Inventor: Swapan Chakraborty
  • Patent number: 7373832
    Abstract: Membrane (24) of a shell (20) of a pressure sensor, having an upper and lower chamber (34, 23), wherein the membrane is made by a support wall (36) and a cap (41) having an upper and lower sheets (31, 32), the support wall having a central aperture (33), the support wall separating but for its central aperture the lower from the upper chamber, the lower sheet (32) having a central aperture (38), edges of the central apertures (33, 38) of the support wall (36) and of the lower sheet (32) respectively being welded to one another, peripheries (37) of the upper and lower sheet (31, 32) being welded to one another so that a volume (40) is present between said upper and lower sheets (31, 32), said volume being in the upper chamber (34) and communicating through the central apertures (33, 38) of the support wall (36) and of the lower sheet (32) respectively, with the lower chamber (23).
    Type: Grant
    Filed: October 27, 2006
    Date of Patent: May 20, 2008
    Assignee: Schlumberger Technology Corporation
    Inventor: Fadhel Rezgui
  • Patent number: 7360430
    Abstract: A resistive thin film (1) made of grains (3) of conductive material having an average size, in a dielectric medium (2) is characterized by the total thickness of the film (1) being between 3 and ten times the average size of the grains (3). The film (1) is used to make a cell of a pressure sensor and the cell is included in a shell of a pressure sensor.
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: April 22, 2008
    Assignee: Schlumberger Technology Corporation
    Inventor: Fadhel Rezgui
  • Patent number: 7316164
    Abstract: A pressure detection device includes a sensing part that is provided at one end portion of the housing to output an electrical signal responsive to an applied pressure, a circuit part that is provided at an other end portion of the housing to process the signal from the sensing part, and a flexible printed board provided in the housing between the sensing part and the circuit part. Furthermore, the flexible printed board has a first end portion electrically connected to the sensing part at a first connecting part, and a second end portion electrically connected to the circuit part at a second connecting part. In the pressure detection device, the flexible printed board is shaped between the first and second end portions to relieve a stress applied to the connecting parts.
    Type: Grant
    Filed: January 17, 2006
    Date of Patent: January 8, 2008
    Assignee: DENSO CORPORATION
    Inventors: Inao Toyoda, Hiroshige Matsui
  • Patent number: 7284438
    Abstract: A method and system of providing power to a pressure and temperature sensing element is provided. Polarity switching is added to a current source for a sensor, which includes one piezo-resistive sensing element configured as a single implant square located at an edge of a diaphragm of the element, and which produces pressure and temperature outputs. The piezo-sensing element operates as a piezo-resistive radial element when current is conducted through the element radially with respect to the diaphragm. Conversely, the piezo-sensing element operates as a piezo-resistive tangential element when current is conducted through the element tangentially to the edge of the diaphragm. A difference in the radial and tangential resistances is proportional to an applied pressure, while a sum of the resistances is a function of temperature. By alternating the polarity of power applied to the sensor, a build up of ions resulting from PUD is minimized.
    Type: Grant
    Filed: November 10, 2005
    Date of Patent: October 23, 2007
    Assignee: Honeywell International Inc.
    Inventor: Thomas G. Stratton
  • Patent number: 7263895
    Abstract: A fluid pressure sensor (1) for measuring the pressure of a fluid comprises a diaphragm portion (12) which is a strain generating body, a silicon oxide film (21) as an insulating film, and a strain gauge (20) made of crystalline silicon, and austenitic precipitation hardening type Fe—Ni heat-resisting steel excellent in mechanical strength and corrosion resistance is used for the diaphragm portion (12). The silicon oxide film (21) is formed with the internal stress thereof adjusted to the range from ?150 to 130 MPa. With this feature, the fluid pressure sensor (1) ensures high precision and reliability, and may be used even for measurement of a highly corrosive fluid.
    Type: Grant
    Filed: July 15, 2005
    Date of Patent: September 4, 2007
    Assignee: Nagano Keiki Co., Ltd.
    Inventors: Hiroshi Nagasaka, Takeshi Abe, Yoshikazu Kaneko
  • Patent number: 7249516
    Abstract: In a resistively heated heat-loss pressure gauge, electrical current is switched between a sensing element and a compensating element at different duty cycles. As a result, the sensing element is heated relative to the compensating element. A fixed resistance is placed in series with at least the compensating element. The current source applies current to heat the sensing element to a temperature at which the resistance of the sensing element matches the combined resistance of the compensating element and the fixed resistive element.
    Type: Grant
    Filed: June 7, 2005
    Date of Patent: July 31, 2007
    Assignee: Brooks Automation, Inc.
    Inventors: Michael D. Borenstein, Paul C. Arnold
  • Patent number: 7240558
    Abstract: A pressure sensor for sensing a pressure level of a pressurized medium. The pressure sensor includes a housing that has a high pressure side, a low pressure side and an aperture. A substrate is located in the aperture. The substrate has a pair of ends and a center portion. The center portion is brazed to the housing in the aperture. The center portion seals the high pressure side from the low pressure side. A pressure sensitive resistor is mounted to one end of the substrate. A reference resistor is mounted to another end of the substrate. A circuit line is located on the substrate. The circuit line is connected between the pressure sensitive resistor and the reference resistor.
    Type: Grant
    Filed: August 31, 2004
    Date of Patent: July 10, 2007
    Assignee: CTS Corporation
    Inventors: Craig Ernsberger, Robert R. Rainey, Patrick B. Blakesley, Jason Langhorn
  • Patent number: 7239246
    Abstract: A 3D liquid detection sensor, liquid-sensitive building material, and liquid detection systems have been provided. The 3D sensor comprises a 3D liquid detection field and an electrical connector to supply a resistance measurement responsive to liquid in the detection field. In one aspect, the 3D liquid detection field includes a first plurality of pins having a distal end electrically connected to a first electrical contact of the electrical connector, and a second plurality of pins having a distal end electrically connected to a second electrical contact. In one aspect, each pin includes a building material attachment barb attached to a pin proximal end. This permits the sensor to be fixedly mounted in drywall or ceiling tile, for example. More specifically, the 3D detection field may include a dielectric sheet (either rigid or flexible), and electrically conductive traces formed overlying the dielectric sheet, with pins extending from the traces.
    Type: Grant
    Filed: March 19, 2004
    Date of Patent: July 3, 2007
    Assignee: Touridan Corporation
    Inventors: David Picco, Ibrahim Hanna Makhlouf, Jeffery Ross Gray
  • Patent number: 7171857
    Abstract: One aspect is a pressure transducer package comprising a housing, a diaphragm, a support disposed in the housing and a sensing element disposed in the housing between the diaphragm and the support so that the pressure from the environment acts on the diaphragm to compress the sensing element. The sensing element comprises at least one substrate having a coefficient of thermal expansion greater than 4 ppm/k. In another aspect, the sensing element comprises at least one substrate formed of a first material and an epitaxial layer of a second material having a lower coefficient of thermal expansion. In a further aspect, the support abuts the housing at a spherically-shaped interface to compensate for misalignment between the support and the sensing element to ensure that the sensing element is evenly loaded.
    Type: Grant
    Filed: December 29, 2004
    Date of Patent: February 6, 2007
    Assignee: Dynisco Instruments
    Inventor: Leo Barron
  • Patent number: 6923068
    Abstract: One aspect is a pressure transducer package comprising a housing, a diaphragm, a support disposed in the housing and a sensing element disposed in the housing between the diaphragm and the support so that the pressure from the environment acts on the diaphragm to compress the sensing element. The sensing element comprises at least one substrate having a coefficient of thermal expansion greater than 4 ppm/k. In another aspect, the sensing element comprises at least one substrate formed of a first material and an epitaxial layer of a second material having a lower coefficient of thermal expansion. In a further aspect, the support abuts the housing at a spherically-shaped interface to compensate for misalignment between the support and the sensing element to ensure that the sensing element is evenly loaded.
    Type: Grant
    Filed: June 19, 2003
    Date of Patent: August 2, 2005
    Assignee: Dynisco, Inc.
    Inventor: Leo Barron
  • Patent number: 6871546
    Abstract: In a pressure sensor module according to the prior art, which is intended for detecting the pressure of a corrosive medium, the conventional sensor cell with a pressure sensor chip is modified in order to protect it from corrosion, which results in a large volume for a pressure-transmitting-fluid. This is disadvantageous for the calibration and for a high degree of measurement precision. In a pressure sensor module (1) according to the invention, a convention sensor cell (5) is used that has an adapter (21) connected to it, which has a very small volume for a pressure-transmitting medium.
    Type: Grant
    Filed: February 14, 2002
    Date of Patent: March 29, 2005
    Assignee: Robert Bosch GmbH
    Inventors: Heiko Scheurich, Martin Mast, Berthold Rogge, Masoud Habibi
  • Patent number: 6860153
    Abstract: A thermal pressure sensor monitors pressure by measuring effects caused by variations of thermal conductivity between a member and a substrate to which the member is adhered by stiction. The interface between the member and the substrate behaves as an extremely narrow gap. In a preferred embodiment the member is a bridge extending between a pair of cantilever arms. Two pressure sensors may be combined in a Wheatstone bridge configuration. A method for fabricating a pressure sensor according to the invention comprises forming a layer of oxide on a substrate, depositing a layer of material on the oxide layer, forming the member from the layer of material, removing the oxide layer and then bringing the member into contact with the substrate. The portion of the substrate under the member may be patterned with plateaus and valleys.
    Type: Grant
    Filed: February 21, 2001
    Date of Patent: March 1, 2005
    Assignee: Simon Fraser University
    Inventor: Albert M. Leung
  • Patent number: 6799468
    Abstract: A heat loss gauge for measuring gas pressure in an environment includes a resistive sensing element and a resistive compensating element. The resistive compensating element is in circuit with the sensing element and has temperature response and physical characteristics substantially matching those of the resistive sensing element and is exposed to a substantially matching environment. An electrical source is connected to the sensing element for applying current to heat the sensing element relative to the compensating element. Measuring circuitry is connected to the sensing element and the compensating element for determining gas pressure in the environment to which the sensing element and compensating element are exposed based on electrical response of the sensing element and the compensating element.
    Type: Grant
    Filed: July 30, 2003
    Date of Patent: October 5, 2004
    Assignee: Helix Technology Corporation
    Inventor: Michael D. Borenstein
  • Publication number: 20040089073
    Abstract: A micromechanical component (10) in which lateral deformations, i.e., deformations of the component (10) parallel to its two main surfaces, are concentrated in a defined area of the component structure, making it possible to decouple lateral and vertical stresses in the component (10). The component structure includes at least one bellows-like structure (11) in which lateral deformations of the component (10) are concentrated.
    Type: Application
    Filed: November 20, 2003
    Publication date: May 13, 2004
    Inventors: Hubert Benzel, Heribert Weber, Frank Schaffer
  • Patent number: 6732589
    Abstract: A pressure sensor includes a housing, an interior chamber of which is sealed by a diaphragm, and a flexible measuring element, which is positioned separately. In addition, the pressure sensor includes a transmission element, which is formed as a chip and is used to transmit force from the diaphragm to the measuring element. In response to a selected deformation of the measuring element, a stop element comes into contact with a region of the transmission element and opposes the applied force. Therefore, it forms an overload protection. The stop element may be configured as a bending bar and/or form a second measuring element, the first measuring element being configured to measure relatively low pressures, and the second measuring element or stop element being configured to measure relatively high pressures. The pressure sensor thus provides a plurality of measuring ranges.
    Type: Grant
    Filed: July 13, 2001
    Date of Patent: May 11, 2004
    Assignees: EADS Deutschland GmbH, Kistler Holding AG
    Inventors: Martin Eickhoff, Gerhard Krötz, Christoph Richter, Claudi Cavalloni, Marco Gnielka
  • Patent number: 6692983
    Abstract: A method of forming a color filter on a substrate having pixel driving elements. A substrate having a plurality of light-transmitting areas and active areas is provided. A pixel driving element is formed on the substrate in each active area, wherein an insulation layer is formed between each pixel driving element. A planarization layer is formed on the pixel driving elements and the insulation layer. Part of the planarization layer is removed to form contact holes and openings, wherein the contact holes expose part of the pixel driving elements, and the openings expose the insulation layer in the light-transmitting areas. Color pigment is filled into the openings to form a color filter on the substrate having the pixel driving elements. Transparent pixel electrodes are formed in the contact holes to electrically connect the pixel driving elements, wherein the transparent electrodes extend onto part of the color filter.
    Type: Grant
    Filed: March 26, 2003
    Date of Patent: February 17, 2004
    Inventors: Chih-Chiang Chen, Ching-Sang Chuang, Jiun-Jye Chang
  • Patent number: 6658941
    Abstract: A heat loss gauge for measuring gas pressure in an environment includes a resistive sensing element and a resistive compensating element. The resistive compensating element is in circuit with the sensing element and has temperature response and physical characteristics substantially matching those of the resistive sensing element and is exposed to a substantially matching environment. An electrical source is connected to the sensing element for applying current to heat the sensing element relative to the compensating element. Measuring circuitry is connected to the sensing element and the compensating element for determining gas pressure in the environment to which the sensing element and compensating element are exposed based on electrical response of the sensing element and the compensating element.
    Type: Grant
    Filed: May 31, 2000
    Date of Patent: December 9, 2003
    Assignee: Helix Technology Corporation
    Inventors: Daniel Granville Bills, Michael Dale Borenstein
  • Patent number: 6643976
    Abstract: A pressure sensor device is described that has a diaphragm acted upon by a working medium, on a first side, and a sensor chip, which is disposed on a second side of the diaphragm that is remote from the working medium. There is formed in the sensor chip a measuring bridge having four sensor elements, which form two pairs disposed parallel, and the pairs are disposed at right angles to one another. The sensor elements are disposed such that they are closely spaced apart from one another in the edge region of the sensor chip that faces toward the central point of the diaphragm.
    Type: Grant
    Filed: March 26, 2002
    Date of Patent: November 11, 2003
    Assignee: First Sensor Technology GmbH
    Inventors: Johannes Ante, Christian Geiger, Markus Gilch, Hans-Peter Landgraf, Andreas Ott