Abstract: A sensor for detecting the pressure of a fluid includes a sensor body having a membrane subject to elastic flexure as a result of the pressure of the fluid, and an electrical circuit configured for measuring an elastic flexure or deformation of the membrane portion. A detection element is prearranged for interacting with the electrical circuit when an elastic flexure of the membrane portion is of a degree at least equal to a safety limit, to generate thereby information representative of an excessive pressure of the fluid or an anomalous state of the device.

Abstract: A battery pack includes a battery, a sensor configured to detect a state of the battery. The sensor includes an insulating layer, and a resistor on one side of the insulating layer, the resistor being formed of a Cr composite film. The sensor detects the state of the battery as a change in a resistance value of the resistor.

Abstract: A system for collecting and managing parametric data via an external communications network comprises one or more parametric stations operatively connected via the external network to a certification server and a payout server. Each parametric station is configured to receive parametric data from a remote source, determine that the parametric data satisfies a predetermined condition, and transmit the parametric data over the external network to the certification server in response to the parametric data satisfying the predetermined condition. The certification server is configured to generate a certification report based on the parametric data and a data model related to the remote source and transmit the generated certification report to the payout server. The payout server is configured to determine that terms of an associated contract are satisfied based on the certification report, and trigger a payout based on the terms that are satisfied based on the certification report.

Abstract: A sensor having a set of grid of bars that are in contact from their bottom at the corners with a set of protrusions that are in contact from above with a plurality of intersections, each having a sensing element, of a grid of wires disposed on a base, and a top surface layer that is disposed atop the grid of bars, so that force imparted from above onto the top surface layer is transmitted to the grid of bars and thence to the protrusions, and thence to the intersections of the grid of wires which are thereby compressed between the base and protrusions; and that the protrusions above thereby focus the imparted force directly onto the intersections. A sensor includes a computer in communication with the grid of wires which causes prompting signals to be sent to the grid of wires and reconstructs a continuous position of force on the surface from interpolation based on data signals received from the grid of wires. A method for sensing.

Abstract: Disclosed is an apparatus for precisely monitoring warpage deformation of a substrate. The apparatus includes a sensing unit and a processor. The sensing unit is removably mounted on the substrate and detects information on the warpage deformation of the substrate during a treatment process performed on the substrate. The processor generates warpage state information on the basis of the warpage information detected by the sensing unit.

Abstract: A system for collecting and managing parametric data via an external communications network comprises one or more parametric stations operatively connected via the external network to a certification server and a payout server. Each parametric station is configured to receive parametric data from a remote source, determine that the parametric data satisfies a predetermined condition, and transmit the parametric data over the external network to the certification server in response to the parametric data satisfying the predetermined condition. The certification server is configured to generate a certification report based on the parametric data and a data model related to the remote source and transmit the generated certification report to the payout server. The payout server is configured to determine that terms of an associated contract are satisfied based on the certification report, and trigger a payout based on the terms that are satisfied based on the certification report.

Abstract: A pressure sensor includes a base substrate, a first insulating layer at the base substrate, a stationary electrode at the first insulating layer, a side-wall portion around the stationary electrode at the first insulating layer, and a membrane having electrical conductivity, facing the stationary electrode across a space, and supported by the side-wall portion. The side-wall portion includes a shield electrode on the first insulating layer and a second insulating layer on the shield electrode. A distance between the stationary electrode and the membrane is less than a distance between the shield electrode and the membrane.

Abstract: An elevator suspension member arrangement includes a monitoring arrangement monitoring an integrity status of suspension members having electrically conductive cords. The monitoring arrangement includes: a generator generating phase shifted first and second alternating voltages; input and output connectors each establishing electrical contacts to cords in one of the suspension members; a voltage analyzer measuring and analyzing a neutral point voltage resulting from applying the first and second alternating voltages to first and second cords of the one suspension member; a supply circuitry having supply lines electrically interconnecting the generator with the input connectors; and a measurement circuitry including measurement lines electrically interconnecting the analyzer with at least one of the input connectors and the output connectors.

Abstract: A system for collecting and managing seismic data via an external communications network comprises one or more seismic stations, each including a seismic measurement apparatus producing seismic signals, a station processor converting the signals to seismic data, a station memory securely storing the seismic data on site and a station communication interface transmitting the seismic data onto an external network. The system further comprises one or more data servers, each including a server computing device, a server communication interface receiving the seismic data from the seismic stations and a server memory storing the received seismic data. The data server can determine if the received seismic data satisfies predetermined conditions for certification and/or triggering a payout in accordance with a contract, and can thereafter transmit the appropriate data signals to another location on the external communications network.

Abstract: If the bridge circuit fails due to damage of the diaphragm, the damage is detected at an early stage. A pressure sensor comprises: a substrate provided with a diaphragm; a bridge circuit having four resistor devices provided at the diaphragm, the bridge circuit being applied with high-voltage-side voltage and low-voltage-side voltage, and having two output terminals; a detecting unit for detecting a first output at a first output terminal and a second output at a second output terminal, each output terminal being of the bridge circuit; and a failure detecting unit for detecting failure of the bridge circuit based on a detection result at the detecting unit.

Abstract: A pressure sensor module, comprising: a pressure measuring cell; and a mounting ring. The pressure measuring cell includes a platform and a measuring membrane, whose front face extends parallel to the rear face of the platform. The mounting ring has a mounting passageway with an inner mounting surface, which defines an inner axial stop plane for mounting the pressure measuring cell, wherein the mounting ring has an outer mounting surface, and the pressure measuring cell is inserted with the rear face preceding into the mounting passageway. The rear face of the platform is adhered with the inner mounting surface, wherein the inner mounting surface has a shoulder, which extends from an inner lateral surface of the mounting ring radially inwards. The mounting surface has between the axial stop surface and the inner lateral surface an annularly surrounding recess, in order to accommodate excess adhesive in the case of the adhering of the axial stop surface with the rear face of the platform.

Abstract: In a semiconductor device, a first protection film covers an end portion of a first metal layer disposed on a semiconductor substrate, and has a first opening above the first metal layer. A second metal layer is disposed on the first metal layer in the first opening. An oxidation inhibition layer is disposed on the second metal layer in the first opening. A second protection film has a second opening and covers an end portion of the oxidation inhibition layer and the first protection film. The second protection film has an opening peripheral portion on a periphery of the second opening, and covers the end portion of the oxidation inhibition layer. An adhesion portion adheres to a portion of a lower surface of the opening peripheral portion. The adhesion portion has a higher adhesive strength with the second protection film than the oxidation inhibition layer.

Abstract: A micromechanical sound transducer according to a first aspect includes a first bending transducer with a free end and a second bending transducer with a free end, the two bending transducers being arranged in a mutual plane, wherein the free end of the first bending transducer is separated from the free end of the second bending transducer via a slit. The second bending transducer is excited in-phase with the vertical vibration of the first bending transducer. A micromechanical sound transducer according to a second aspect includes a first bending transducer that is excited to vibrate vertically and a diaphragm element extending vertically to the first bending transducer, the diaphragm element being separated from a free end of the first bending transducer via a slit.

Abstract: One aspect of the present invention is an adhesive film comprising: a first adhesive layer comprising a first adhesive component, a first conductive particle that is a dendritic conductive particle, and a second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle comprising a nonconductive core body and a conductive layer provided on the core body; and a second adhesive layer comprising a second adhesive component, wherein a volume proportion of the second adhesive component in the second adhesive layer is larger than a volume proportion of the first adhesive component in the first adhesive layer.

Abstract: The present invention is related to a sensor. In particular, the present invention is related to a pressure sensor die and its fabrication process. The pressure sensor comprises a chamber inside which a pressure sensor die is provided. The pressure sensor die is uniformly compressed by the external pressure to be measured and can deform freely inside the chamber. The pressure sensor die is primarily constructed of single crystalline silicon and comprises a substrate and a cap connected together. A recess is formed on the cap. The recess forms a sealed cavity with the substrate. A silicon oxide layer is formed between the substrate and the cap. The substrate further comprises a plurality of piezoresistive sensing elements which are located inside the sealed cavity. The present pressure sensor is more immune to temperature effects. It is especially suitable for operating in a high temperature, high pressure environment and is capable of delivering accurate and reliable pressure measurements at low cost.

Abstract: A method for expanding the dynamic range of a capacitive pressure sensor and a capacitive pressure sensor having an expanded dynamic range are provided. The capacitive pressure sensor may comprise capacitive plates. At least one plate may be contoured to increase a surface area exposed to the other of the capacitive plates. The capacitive pressure sensor may comprise a diaphragm that is movably responsive to pressure. The diaphragm may have a hollowed volume within an interior of the diaphragm operative to increase a flexibility of the diaphragm in response to the pressure. The capacitive pressure sensor may be one of a plurality of capacitive pressure sensors in a pressure sensing device. The capacitive pressure sensors may have different capacitive responses and may each output a pressure measurement, whereby the device may select a pressure measurement to output based at least in part on the capacitive responses.

Abstract: A resonant pressure sensor includes a first substrate including a diaphragm and at least one projection disposed on the diaphragm, and at least one resonator disposed in the first substrate, at least a part of the resonator being included in the projection, and the resonator being disposed between a top of the projection and an intermediate level of the first substrate.

Abstract: One aspect of the present invention is an adhesive film comprising a first adhesive layer comprising a first conductive particle that is a dendritic conductive particle; and a second adhesive layer containing a second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle comprising a nonconductive core body and a conductive layer provided on the core body.

Abstract: Pressure sensor assemblies comprise a sensor body having a sensing membrane and wherein a fluid is placed in communication with the membrane to determine a fluid pressure. A support is connected with the body and includes an opening for receiving the fluid from an external source, wherein the opening is in fluid-flow communication with the membrane. The pressure sensor comprises one or more elements disposed therein configured to mitigate transmission of a fluid pressure spike to the sensing membrane. The body or the support may have a pressure mitigating element, e.g., an internal channel, for receiving the fluid from the opening and transferring it to the membrane, wherein the channel may itself be configured to provide the desired protection against fluid pressure spikes, or may be connected with another internal element to provide such protection.

Abstract: A system for collecting and managing seismic data via an external communications network comprises one or more seismic stations, each including a seismic measurement apparatus producing seismic signals, a station processor converting the signals to seismic data, a station memory securely storing the seismic data on site and a station communication interface transmitting the seismic data onto an external network. The system further comprises one or more data servers, each including a server computing device, a server communication interface receiving the seismic data from the seismic stations and a server memory storing the received seismic data. The data server can determine if the received seismic data satisfies predetermined conditions for certification and/or triggering a payout in accordance with a contract, and can thereafter transmit the appropriate data signals to another location on the external communications network.

Abstract: Various examples provide an electronic device that includes first and second resistor segments. Each of the resistor segments has a respective doped resistive region formed in a semiconductor substrate. The resistor segments are connected between first and second terminals. The first resistor segment is configured to conduct a current in a first direction, and the second resistor segment is configured to conduct the current in a second different direction. The directions may be orthogonal crystallographic directions of the semiconductor substrate.

Abstract: Disclosed is a thin-film transistor-based pressure sensor including a gate electrode; a gate dielectric layer provided on the gate electrode; a semiconductor layer provided on the gate dielectric layer; and a source electrode and a drain electrode provided on the semiconductor layer, wherein each of the source and drain electrodes has an elastic body that includes: an elastic part having a protrusion; and a conductive part provided on a surface of the elastic part and having a conductive material. According to the pressure sensor and a method of manufacturing the same of the present invention, the elastic body coated with the conductive material is patterned to serve as the source electrode and the drain electrode of the pressure sensor whereby it is possible to drive an active matrix, drive the pressure sensor with low power, and manufacture the pressure sensor through a simple process.

Abstract: A method for producing a semiconductor component is proposed. The method includes providing a housing. At least one semiconductor chip is arranged in a cavity of the housing. Furthermore, an electrical contact of the semiconductor chip is connected to an electrical contact of the housing via a bond wire. The method furthermore includes applying a protective material on the electrical contact of the semiconductor chip and also on a region of the bond wire which is adjacent to the electrical contact of the semiconductor chip, and/or on the electrical contact of the housing and also on a region of the bond wire which is adjacent to the electrical contact of the housing. Moreover, the method also includes filling at least one partial region of the cavity with a gel.

Abstract: Disclosed is an apparatus which has, among other things, a MEMS device with a first measurement arrangement for capturing a measurement variable (X1) based on a physical variable, which has a useful variable component (N1) and a first disturbance variable component (Z1), and a second measurement arrangement for capturing a second disturbance variable component (Z2). The apparatus furthermore has a disturbance compensation circuit which is configured to combine the second disturbance variable component (Z2) and the measurement variable (X1) with one another and to obtain a disturbance-compensated measurement variable (Xcomp). The MEMS device is arranged in a housing, wherein the MEMS device is in immediate mechanical contact with the housing by way of at least 50% of a MEMS device surface.

Abstract: A sensor having a set of grid of bars that are in contact from their bottom at the corners with a set of protrusions that are in contact from above with a plurality of intersections, each having a sensing element, of a grid of wires disposed on a base, and a top surface layer that is disposed atop the grid of bars, so that force imparted from above onto the top surface layer is transmitted to the grid of bars and thence to the protrusions, and thence to the intersections of the grid of wires which are thereby compressed between the base and protrusions; and that the protrusions above thereby focus the imparted force directly onto the intersections. A sensor includes a computer in communication with the grid of wires which causes prompting signals to be sent to the grid of wires and reconstructs a continuous position of force on the surface from interpolation based on data signals received from the grid of wires. A method for sensing.

Abstract: A method of forming an acoustic transducer comprises providing a substrate and depositing a first structural layer on the substrate. The first structural layer is selectively etched to form at least one of an enclosed trench or an enclosed pillar thereon. A second structural layer is deposited on the first structural layer and includes a depression or a bump corresponding to the enclosed trench or pillar, respectively. At least the second structural layer is heated to a temperature above a glass transition temperature of the second structural layer causing the second structural layer to reflow. A diaphragm layer is deposited on the second structural layer such that the diaphragm layer includes at least one of a downward facing corrugation corresponding to the depression or an upward facing corrugation corresponding to the bump. The diaphragm layer is released, thereby forming a diaphragm suspended over the substrate.

Abstract: An electromechanical braking (EMB) connector for electrical communication between an interior of a brake caliper assembly and an exterior of the brake caliper assembly is disclosed. The EMB connector includes a body having a distal end for insertion into the interior of the brake caliper assembly and a proximal end for exposure on the exterior of the brake caliper assembly, with the distal end and the proximal end defining a body axis. The EMB connector also includes a load sensor connector for coupling with a load sensor disposed on the interior of the brake caliper assembly. The load sensor connector is compressible along a load sensor axis that is substantially perpendicular to the body axis. The EMB connector further includes a conductive component coupled to the load sensor connector. The conductive component enables electrical connection of the load sensor to the exterior of the brake caliper assembly.

Abstract: Provided are a pressure sensor device and a method of manufacturing the same. The pressure sensor device includes a housing including an air inlet and a fluid inlet provided in different directions, a substrate provided in an inner space of the housing and including a through-hole through which the air passes, and a pressure sensor chip mounted on the substrate to cover the through-hole in such a manner that a pressure of a fluid flowing in from the fluid inlet is applied to a top surface thereof and a bottom surface thereof is exposed to the air through the through-hole, in order to measure the pressure of the fluid relative to a pressure of the air, wherein the inner space is divided into an upper region and a lower region with respect to the substrate, and wherein the upper region is divided into a first inner region in which the pressure sensor chip is provided and a second inner region through which the air passes.

Abstract: A pressure sensing device that includes a pressure sensing element that is of microscopic scale and has a pressure level dependent thermal parameter; a signal source that is configured to supply an input electrical signal to the pressure sensing element; and a monitor that is configured to (a) measure electrical output signals generated by the pressure sensing element as a result of the supply of the input electrical signal and (b) estimate a pressure level applied on the pressure sensing element based on the electrical output signals.

Abstract: An internal combustion engine, as a drive engine for a vehicle, including an engine braking device having a throttle element which is associated with an exhaust gas section, for damming an exhaust gas which is emitted by a combustion device, and including a measuring device by means of which the exhaust gas pressure can be measured at a defined measuring region of the exhaust gas section upstream of the throttle element as seen in the exhaust gas flow direction. According to the disclosure, it is provided that at least one further measuring device is provided, by means of which the exhaust gas pressure can be measured at the defined measuring region, for realizing a redundant exhaust gas pressure measurement, and the measurement signals which are determined by means of the measuring devices can be transmitted to a controller for controlling the throttle element.

Abstract: A manifold assembly is configured to calibrate and test one or more superheat controllers and includes a manifold frame, a manifold having a plurality of fluid conduits mounted to the manifold frame, and a plurality of superheat controller fittings mounted to the fluid conduits, each superheat controller fitting configured to have a superheat controller attached thereto.

Abstract: Monolithic integration of microelectromechanical systems (MEMS) sensors with complementary oxide semiconductor (CMOS) electronics for pressure sensors is a very challenging task. This is primarily due to the requirement for a very high quality thin diaphragm to provide the pressure dependent MEMS deformation that can be sensed and, when seeking absolute rather than relative pressure sensors, a sealed reference cavity. Accordingly, a new manufacturing process is established based upon back-etching and bonding of a monolithic absolute silicon carbide (SiC) capacitive pressure sensor. Beneficially, the process embeds the critical features of the MEMS within a shallow trench formed within the silicon substrate and then processing the CMOS circuit. The process further benefits as it maintains that those elements of the MEMS element fabrication process that are CMOS compatible are implemented concurrently with those CMOS steps as well as the metallization steps.

Abstract: Provided are a highly reliable probe including a light reflecting layer, which is resistant to the falling off of the light reflecting layer, and an information obtaining apparatus using the same. The probe includes: an element including at least one cell, each cell including a first electrode provided on a substrate, and a vibration membrane including a second electrode provided across a gap from the first electrode; an acoustic impedance matching layer disposed above the element; and a light reflecting layer. The light reflecting layer is fixed to the substrate via an adhesive layer.

Abstract: A method to prevent groundings of polycrystalline silicon rod holders to a reactor plate by the residual polymer in the following manner: first, providing a polycrystalline silicon reactor having a reactor plate with a plurality of silicon rod holders separated from the reactor plate with an insulation; next establishing an electrical circuit from a ground connection on the reactor plate connected to high potential test equipment to a high voltage probe; and finally completing the electrical circuit by contacting the high voltage probe to the holder. By this method any remaining polymer is physically removed as the polymer burns or is ejected by the energetic release caused by mild arcing from the holder to the reactor plate.

Abstract: A display panel and a display apparatus are provided. The display panel includes a display area and a non-display area surrounding the display area. The display panel includes at least one semiconductor pressure sensor disposed in the non-display area. Each semiconductor pressure sensor has a planar structure and is provided with a hollow-out zone. In various embodiments of the present disclosure, the pressure detection accuracy of the pressure sensors is improved and the user experience is enhanced.

Abstract: A sensor assembly comprises a substrate arrangement and a sensor chip mounted to the substrate arrangement. A sensing element is integrated on or in the sensor chip and is sensitive to at least one parameter of a fluid. An access opening is provided in the substrate arrangement enabling the fluid to access the sensing element. A metallization arranged on at least a portion of the substrate arrangement seals a chamber containing the sensor chip which portion comprises one or more of a wall defining the access opening or an area facing the sensor chip.

Abstract: A semiconductor differential pressure sensor includes a pressure detection element, which is arranged such that its main surface is fixed on a top of a first protrusion with an adhesive while a second protrusion is fitted into its opening. Thus, the pressure detection element is held with high holding power at an exact position. Moreover, the adhesive does not flow into a first pressure introducing path, whereby blocking of the first pressure introducing path is prevented. Furthermore, by providing a recess around the first protrusion, influence of thermal deformation of a resin package on pressure detection characteristics is decreased.

Abstract: A method for producing a feedthrough component of a medical electronic device, in particular an implantable device, wherein a feedthrough main body, in particular made of ceramic, is produced and is provided over a large area with a metal coating, and the metal coating is then structured, wherein the structuring is performed by at least partially removing the metal coating in layers in a number of sub-steps by means of a processing laser.

Abstract: A mobile terminal is disclosed. The mobile terminal comprises: a case; an input module installed at the case, the input module acquiring a touch input of a user; and a controller generating a control signal, wherein the input module includes: a button having a plurality of holes, the plurality of holes located on the case; a capacitive sensor located in the case, the capacitive sensor acquiring a variation of a electrostatic capacitance in accordance with the touch input; and a dielectric layer located between the button and the capacitive sensor; wherein the electrostatic capacitance includes: a first electrostatic capacitance generated between the user and the capacitive sensor through the plurality of holes; and a second electrostatic capacitance generated between the button and the capacitive sensor, and wherein the controller generates the control signal when the capacitive sensor acquires the variations of the first and second electrostatic capacitances.

Abstract: Sensor packages and methods of assembling a sensor in a sensor package are provided. A preferred embodiment comprises: a base including a sensor coupled to the base wherein the base has at least one electrical connection location and a first mechanical mating interface in the shape of an arc; an electronics package with at least one electrical connection location; and a ring coupled between the base and the electronics package wherein the ring electrically connects the at least one electrical connection location on the base and the at least one electrical connection location on the electronics package and wherein the base has a second mechanical mating interface in the shape of an arc that is reciprocal to the first mating interface.

Abstract: A pressure sensor of an embodiment includes a support portion, a transformable membrane part and a sensor portion. The membrane part includes an end portion supported by the support portion, and a first area and a second area. The first area is positioned between a center of the membrane part and the end portion and has a first rigidity. The second area is positioned between the first area and the end portion, and has a second rigidity lower than the first rigidity. The sensor portion is provided at the first area and includes a first magnetic layer, a second magnetic layer and a first intermediate layer provided between the first magnetic layer and the second magnetic layer. An end-side distance between the first area and the end portion is shorter than a center-side distance between the second area and the center of the membrane part.

Abstract: The present invention relates to a method for preventing gases and fluids to penetrate a surface of an object, comprising the steps of: depositing (S1) an amorphous metal (5) on a surface of an object (4); forming (S2) a continuous layer of the amorphous metal (5) on the surface of the object (4); binding (S3) the amorphous metal (5) to the surface of the object by chemical binding; and passivation (S4) of a surface of the amorphous metal (5) facing away from the surface of the object (4).

Abstract: Each of a plurality of hydraulic pressure sensors includes a lower case and an upper case fixed above the lower case. A valve body includes an upper body including a hole portion arranged to house the hydraulic pressure sensors, and a lower body including an oil passage. A pressed portion is defined in the lower case. The pressed portion is arranged to project horizontally in the lower case so as to be opposed to the upper case. The pressed portion is arranged to be pressed downward by a pressing portion of the upper body. At least one of the upper body and the lower body includes a positioning portion arranged to horizontally position each of the hydraulic pressure sensors in the hole portion.

Abstract: In an oil-pressure-sensor attachment structure according to an aspect of the invention, an oil channel body includes a lower body and an upper body arranged at an upper side of the lower body in a superposed manner. The attachment structure includes the upper body, a sensor case, and a connection member including an electrical connection portion that electrically connects an external power supply with a sensor main body. The connection member contacts the upper body from the upper side. The upper body has a through hole in an up-down direction. The sensor case includes a columnar portion that extends in the up-down direction and is inserted into the through hole, a flange portion that protrudes outward in the radial direction from the columnar portion and is arranged to face the lower side of the upper body, and a first hook portion that is hooked to the connection member.

Abstract: A method for manufacturing a resistive element includes: preparing a substrate including an n-type silicon layer; doping the silicon layer with an impurity to thereby form a resistive region; heat-treating the resistive region by any of rapid thermal annealing, flash lamp annealing, and excimer laser annealing; and epitaxially growing silicon on the resistive region to thereby form a covering layer.

Abstract: A flexible fingerprint sensor laminate comprising: a layer of flexible substrate having a front surface and a back surface, at least a domain of electrically conductive material deposited on the front surface, a protective hard coating layer that covers the domain of electrically conductive material, and a plurality of sensor electrodes deposited preferably on the back surface and related circuitry (e.g. integrated circuit for driving and sensing). Preferably, the layer of flexible substrate is no greater than 20 ?m in thickness, the domain of electrically conductive material has a thickness no greater than 2 ?m, the protective hard coating has a thickness no greater than 1 ?m, and the laminate has a surface sheet resistance no greater than 200 Ohm per square and surface scratch resistance no less than 3 H. The laminate exhibits good scratch resistance, low sheet resistance, good flexibility and mechanical integrity. The invention also provides a biometric sensor, such as a fingerprint sensor.

Abstract: A microelectromechanical sensing structure having a membrane region including a membrane that undergoes deformation as a function of a pressure and a first actuator that is controlled in a first operating mode and a second operating mode, the first actuator being such that, when it operates in the second operating mode, it contacts the membrane region and deforms the membrane in a way different from when it operates in the first operating mode.

Abstract: The present invention generally relates to a MEMS digital variable capacitor (DVC) (900) and a method for manufacture thereof. The movable plate (938) within a MEMS DVC should have the same stress level to ensure proper operation of the MEMS DVC. To obtain the same stress level, the movable plate is decoupled from CMOS ground during fabrication. The movable plate is only electrically coupled to CMOS ground after the plate has been completely formed. The coupling occurs by using the same layer (948) that forms the pull-up electrode as the layer that electrically couples the movable plate to CMOS ground. As the same layer couples the movable plate to CMOS ground and also provides the pull-up electrode for the MEMS DVC, the deposition occurs in the same processing step. By electrically coupling the movable plate to CMOS ground after formation, the stress in each of the layers of the movable plate can be substantially identical.

Abstract: A pressure sensor, comprising: a substrate having a measuring membrane, and an electrically conductive cover layer, which has electrical contact elements and is electrically isolated from the substrate by an insulating layer. The cover layer is divided in such a manner that two independent measurements of the respective resistance between two contact elements are possible in two regions electrically isolated from one another. The regions of the cover layer serve to shield external electromagnetic influences from the sensor elements of the measuring membrane, to detect damage to the measuring membrane, as well as for determining exact temperature.

Abstract: Sensor packages and manners of formation are described. In an embodiment, a sensor package includes a supporting die characterized by a recess area and a support anchor protruding above the recess area. A sensor die is bonded to the support anchor such that an air gap exists between the sensor die and the recess area. The sensor die includes a sensor positioned directly above the air gap.