Base Metal One Or More Of Copper(cu) Or Noble Metal Patents (Class 75/247)
  • Patent number: 9321105
    Abstract: A clay-like composition for forming a sintered copper body of the present invention includes a powder constituent containing a copper-containing metal powder which contains copper and a copper-containing oxide powder which contains copper; a binder; and water, wherein the amount of oxygen contained in the powder constituent is in a range of from 4 mass % to 8 mass %.
    Type: Grant
    Filed: November 17, 2011
    Date of Patent: April 26, 2016
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Takashi Yamaji, Yoshifumi Yamamoto, Yasuo Ido, Shinji Otani
  • Patent number: 9028582
    Abstract: Seizure resistance and wear resistance of Cu—Bi—In copper-alloy sliding material are enhanced by forming a soft phase of as pure as possible Bi. Mixed powder of Cu—In cuprous alloy powder and Cu—Bi containing Cu-based alloy powder is used. A sintering condition is set such that Bi moves outside particles of said Cu—Bi containing Cu-based powder and forms a Bi grain-boundary phase free of In, and In diffuses from said Cu—In containing Cu-based powder to said Cu—Bi containing Cu-based powder.
    Type: Grant
    Filed: January 22, 2009
    Date of Patent: May 12, 2015
    Assignee: Taiho Kogyo Co., Ltd.
    Inventors: Hitoshi Wada, Takashi Tomikawa, Daisuke Yoshitome, Hiromi Yokota
  • Publication number: 20150099118
    Abstract: Electrodes for metal-air batteries and the metal-air batteries employing such electrodes are provided. The electrodes include metal nanoparticles synthesized via a novel route. The nanoparticle synthesis is facile and reproducible, and provides metal nanoparticles of very small dimension and high purity for a wide range of metals. The electrodes utilizing these nanoparticles thus may have superior capability. Electrochemical cells employing said electrodes are also provided.
    Type: Application
    Filed: June 17, 2014
    Publication date: April 9, 2015
    Inventors: Fuminori Mizuno, Michael Paul Rowe, Ryan Daniel Desautels
  • Patent number: 8992658
    Abstract: A sintered metal bearing is obtained by compression-molding of a raw-material powder containing at least a Cu powder, an SUS powder, and a pure Fe powder and thereafter sintering a compression-molded body at a predetermined temperature.
    Type: Grant
    Filed: March 2, 2010
    Date of Patent: March 31, 2015
    Assignee: NTN Corporation
    Inventors: Fuyuki Ito, Kazuo Okamura, Kenji Hibi
  • Patent number: 8968491
    Abstract: [Problems to be Solved] To provide a sputtering target that is capable of forming a Cu—Ga film to which Na is favorably added by a sputtering method, and a method for producing the same. [Means to Solve the Problems] The sputtering target is provided wherein 20 to 40 at % of Ga, 0.05 to 2 at % of Na, and 0.025 to 1.0 at % of S are contained and a remaining portion has a component composition consisting of Cu and unavoidable impurities. Also, a method for producing the sputtering target includes the step of hot pressing a mixed powder of Na2S powder and Cu—Ga alloy powder or a mixed powder of Na2S powder, Cu—Ga alloy powder, and pure Cu powder in a vacuum atmosphere or an inert gas atmosphere or sintering a mixed powder of Na2S powder and Cu—Ga alloy powder or a mixed powder of Na2S powder, Cu—Ga alloy powder, and pure Cu powder by hot isostatic pressing.
    Type: Grant
    Filed: March 8, 2011
    Date of Patent: March 3, 2015
    Assignee: Mitsubishi Materials Corporation
    Inventors: Shoubin Zhang, Masahiro Shoji, Yoshinori Shirai
  • Publication number: 20150041974
    Abstract: A sintered body of silver fine particles for a bonding member to bond components of a semiconductor device, wherein an activation energy for creep of the sintered body of the silver fine particles is from 0.4 to 0.75 times that of an activation energy for a lattice diffusion of bulk silver.
    Type: Application
    Filed: February 26, 2013
    Publication date: February 12, 2015
    Inventors: Makoto Kobayashi, Koji Sasaki
  • Patent number: 8911569
    Abstract: [Problems to be Solved] To provide a sputtering target that is capable of forming a Cu—Ga film to which Na is favorably added by a sputtering method, and a method for producing the same. [Means to Solve the Problems] The sputtering target is provided wherein 20 to 40 at % of Ga, 0.05 to 2 at % of Na, and 0.025 to 1.0 at % of S are contained and a remaining portion has a component composition consisting of Cu and unavoidable impurities. Also, a method for producing the sputtering target includes the step of hot pressing a mixed powder of Na2S powder and Cu—Ga alloy powder or a mixed powder of Na2S powder, Cu—Ga alloy powder, and pure Cu powder in a vacuum atmosphere or an inert gas atmosphere or sintering a mixed powder of Na2S powder and Cu—Ga alloy powder or a mixed powder of Na2S powder, Cu—Ga alloy powder, and pure Cu powder by hot isostatic pressing.
    Type: Grant
    Filed: March 8, 2011
    Date of Patent: December 16, 2014
    Assignee: Mitsubishi Materials Corporation
    Inventors: Shoubin Zhang, Masahiro Shoji, Yoshinori Shirai
  • Patent number: 8871354
    Abstract: Provided is a copper-based sliding material including a steel back-metal layer and a Cu alloy layer. The Cu alloy layer contains, by mass %, 10 to 30% of Bi, 0.5 to 5% of an inorganic compound, and the balance being Cu and inevitable impurities. The Cu alloy layer may further contain 0.5 to 5% of Sn and/or at least one element selected from the group consisting of Ni, Fe, P and Ag in a total amount of 0.1 to 10%. The inorganic compound has an average particle size of 1 to 5 ?m and a specific gravity of 70 to 130% relative to the specific gravity of Bi. Bi phase is formed in the Cu alloy layer in an average particle size of 2 to 15 ?m, and the Bi phase is dispersed in the Cu alloy layer and isotropic.
    Type: Grant
    Filed: February 23, 2011
    Date of Patent: October 28, 2014
    Assignee: Daido Metal Company Ltd.
    Inventors: Takuo Imai, Kouji Zusi, Kentaro Tujimoto
  • Patent number: 8845776
    Abstract: The present invention relates to sliding material provided by sintering a lead-free copper or copper alloy and contains at least one mineral selected from the group consisting of talc, mica, kaolinite mineral and montmorillonite mineral. Pb has conventionally been included in sliding materials for the purpose of obtaining conformability and seizure resistance. Despite the absence of Pb, the Pb-free copper-based sliding material and sliding parts according to the present invention have improved sliding properties.
    Type: Grant
    Filed: April 27, 2010
    Date of Patent: September 30, 2014
    Assignee: Taiho Kogyo Co., Ltd.
    Inventors: Ryo Mukai, Atsushi Koyama, Nahomi Hamaguchi, Kao Mouri, Hiromi Yokota
  • Patent number: 8795489
    Abstract: [Problems] To provide a sputtering target that is capable of forming a Cu—Ga film to which Na is favorably added by a sputtering method, and a method for producing the same. [Means for Solving the Problems] The sputtering target is provided wherein 20 to 40 at % of Ga and 0.05 to 1 at % of Na are contained as metal components except fluorine (F) of the sputtering target, a remaining portion has a component composition consisting of Cu and unavoidable impurities, and Na is contained in the state of a NaF compound. Also, a method for producing the sputtering target includes the steps of forming a molded article consisting of a mixed powder of NaF powder and Cu—Ga powder or a mixed powder of NaF powder, Cu—Ga powder, and Cu powder; and sintering the molded article in a vacuum atmosphere, an inert gas atmosphere, or a reducing atmosphere.
    Type: Grant
    Filed: November 4, 2010
    Date of Patent: August 5, 2014
    Assignee: Mitsubishi Materials Corporation
    Inventors: Shoubin Zhang, Yoshinori Shirai
  • Patent number: 8790439
    Abstract: A composite sintered powder metal article including a first region including a cemented hard particle material such as, for example, cemented carbide. The article includes a second region including: a metallic material selected from a steel, nickel, a nickel alloy, titanium, a titanium alloy, molybdenum, a molybdenum alloy, cobalt, a cobalt alloy, tungsten, a tungsten alloy; and from 0 up to 30 percent by volume of hard particles. The first region is metallurgically bonded to the second region, and each of the first region and the second region has a thickness of greater than 100 microns. The second region comprises at least one mechanical attachment feature so that the composite sintered powder metal article can be attached to another article. The article comprises one of an earth boring article, a metalcutting tool, a metalforming tool, a woodworking tool, and a wear article.
    Type: Grant
    Filed: July 26, 2012
    Date of Patent: July 29, 2014
    Assignee: Kennametal Inc.
    Inventors: Prakash K. Mirchandani, Morris E. Chandler
  • Patent number: 8758476
    Abstract: Provided are a method of producing mixed powder comprising noble metal powder and oxide powder, wherein powder of ammonium chloride salt of noble metal and oxide powder are mixed, the mixed powder is subsequently roasted, and ammonium chloride is desorbed by the roasting process in order to obtain mixed powder comprising noble metal powder and oxide powder, and mixed powder comprising noble metal powder and oxide powder, wherein chlorine is less than 1000 ppm, nitrogen is less than 1000 ppm, 90% or more of the grain size of the noble metal powder is 20 ?m or less, and 90% or more of the grain size of the oxide powder is 12 ?m or less. Redundant processes in the production of noble metal powder are eliminated, and processes are omitted so that the inclusion of chlorine contained in the royal water and nitrogen responsible for hydrazine reduction reaction is eliminated as much as possible.
    Type: Grant
    Filed: August 18, 2009
    Date of Patent: June 24, 2014
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Atsutoshi Arakawa, Kazuyuki Satoh, Atsushi Sato
  • Patent number: 8748006
    Abstract: The invention relates to a slide bearing composite material having at least one carrier layer and a sintered bearing metal layer. The sintered bearing metal layer is designed in at least one layer region as a gradient layer.
    Type: Grant
    Filed: March 10, 2010
    Date of Patent: June 10, 2014
    Assignee: Federal-Mogul Wiesbaden GmbH
    Inventors: Holger Schmitt, Thomas Enghof, Daniel Meister
  • Patent number: 8721961
    Abstract: An Au—Sn alloy bump that does not include large voids and a method of producing the same are provided. The Au—Sn alloy bump that does not include large voids comprises a composition containing Sn: 20.5 to 23.5 mass % and the balance Au and unavoidable impurities, and a structure where 0.5 to 30 area % of Sn-rich primary crystal phase is crystallized in the matrix.
    Type: Grant
    Filed: November 29, 2005
    Date of Patent: May 13, 2014
    Assignee: Mitsubishi Materials Corporation
    Inventors: Masayuki Ishikawa, Masayoshi Kohinata, Akifumi Mishima
  • Patent number: 8715385
    Abstract: A bearing material and a method for the manufacture of a bearing having a lining of the bearing material is described, the bearing material comprising: in wt %: 4-12 tin; 0.1-2 nickel; 1-6 bismuth; 0.01-less than 0.10 alumina; balance copper apart from incidental impurities.
    Type: Grant
    Filed: November 25, 2009
    Date of Patent: May 6, 2014
    Assignee: MAHLE International GmbH
    Inventors: Raymond Brigdeman, Janette Johnston
  • Publication number: 20140120359
    Abstract: [OBJECT] A composition of a metal nanoparticle is provided in which reproducibility in a method of producing a metal film with excellent low-temperature sinterable properties is improved. An article using the metal nanoparticle composition is also provided. [SOLVING MEANS] A composition of a metal nanoparticle that has a secondary aggregation diameter (median diameter) of 2.0 ?m or less as determined by disk centrifugal-type particle size measurement is used.
    Type: Application
    Filed: March 17, 2011
    Publication date: May 1, 2014
    Applicant: DOWA Electronics Materials Co., Ltd.
    Inventors: Gregory A JABLONSKI, Michael A MASTROPIETRO, Kimitaka SATO, Satoru KURITA, Hidefumi FUJITA
  • Publication number: 20140026776
    Abstract: High-density thermodynamically stable nanostructured copper-based metallic systems, and methods of making, are presented herein. A ternary high-density thermodynamically stable nanostructured copper-based metallic system includes: a solvent of copper (Cu) metal; that comprises 50 to 95 atomic percent (at. %) of the metallic system; a first solute metal dispersed in the solvent that comprises 0.01 to 50 at. % of the metallic system; and a second solute metal dispersed in the solvent that comprises 0.01 to 50 at. % of the metallic system. The internal grain size of the solvent is suppressed to no more than 250 nm at 98% of the melting point temperature of the solvent and the solute metals remain uniformly dispersed in the solvent at that temperature. Processes for forming these metallic systems include: subjecting powder metals to a high-energy milling process, and consolidating the resultant powder metal subjected to the milling to form a bulk material.
    Type: Application
    Filed: September 6, 2013
    Publication date: January 30, 2014
    Applicant: U.S. Army Research Laboratory ATTN: RDRL-LOC-I
    Inventors: Laszlo J. Kecskes, Micah J. Gallagher, Anthony J. Roberts, Kristopher A. Darling
  • Publication number: 20130280120
    Abstract: The present invention relates to Cu33Al17 alloys and Cu33Al17-based bulk alloys and coatings that exhibit significantly increased hardness characteristics compared to traditional copper-aluminum alloys
    Type: Application
    Filed: March 15, 2013
    Publication date: October 24, 2013
    Inventor: United States Department of Energy
  • Patent number: 8551210
    Abstract: A composite article (1; 10; 40) comprises a plurality of inclusions (5) of a magnetocalorically active material embedded in a matrix (4) of a magnetocalorically passive material. The inclusions (5) and the matrix (4) have a microstructure characteristic of a compacted powder.
    Type: Grant
    Filed: December 27, 2007
    Date of Patent: October 8, 2013
    Assignee: Vacuumschmelze GmbH & Co. KG
    Inventors: Georg Werner Reppel, Matthias Katter
  • Publication number: 20130140159
    Abstract: A process for producing a Cu—Cr material by powder metallurgy for a switching contact, in particular for vacuum switches, includes the steps of pressing a Cu—Cr powder mixture formed from Cu powder and Cr powder and sintering the pressed Cu—Cr powder mixture to form the material of the Cu—Cr switching contact. The sintering or a subsequent thermal treatment process is carried out with an alternating temperature profile, in which the Cu—Cr powder mixture or the Cu—Cr material is heated above an upper temperature limit value and cooled again below a lower temperature limit value at least twice in alternation. All of the steps are carried out at temperatures at which no molten phase forms.
    Type: Application
    Filed: August 1, 2011
    Publication date: June 6, 2013
    Applicant: PLANSEE POWERTECH AG
    Inventors: Claudia Kowanda, Frank Müller
  • Patent number: 8383015
    Abstract: Copper powder is provided, which, while having fine granularity and resistance to oxidation, does not lose either resistance to oxidation or balance in conductivity, and furthermore, copper powder for conductive paste in which variations in shape and granularity are small and having a low concentration in oxygen content. The copper powder for conductive paste contains 0.05 to 10 atomic % Bi inside each particle.
    Type: Grant
    Filed: August 23, 2010
    Date of Patent: February 26, 2013
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Koyu Ota, Makoto Sekiguchi, Katsuhiko Yoshimaru
  • Patent number: 8377338
    Abstract: Copper powder is provided, which, while having fine granularity, does not loose either resistance to oxidation or balance in conductivity, and furthermore, copper powder for conductive paste in which variations in shape and granularity are small and having a low concentration in oxygen content. The copper powder for conductive paste contains 0.07 to 10 atomic % Al inside each copper particle in the powder.
    Type: Grant
    Filed: October 14, 2010
    Date of Patent: February 19, 2013
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Koyu Ota, Touru Kurimoto, Yoshiaki Uwazumi, Koichi Miyake, Katsuhiko Yoshimaru
  • Patent number: 8221517
    Abstract: A macroscopic composite sintered powder metal article including a first region including cemented hard particles, for example, cemented carbide. The article includes a second region including one of a metal and a metallic alloy selected from the group consisting of a steel, nickel, a nickel alloy, titanium, a titanium alloy, molybdenum, a molybdenum alloy, cobalt, a cobalt alloy, tungsten, and a tungsten alloy. The first region is metallurgically bonded to the second region, and the second region has a thickness of greater than 100 microns. A method of making a macroscopic composite sintered powder metal article is also disclosed, herein. The method includes co-press and sintering a first metal powder including hard particles and a powder binder and a second metal powder including the metal or metal alloy.
    Type: Grant
    Filed: June 2, 2009
    Date of Patent: July 17, 2012
    Assignee: TDY Industries, LLC
    Inventors: Prakash K. Mirchandani, Morris E. Chandler, Eric W. Olsen
  • Patent number: 8142904
    Abstract: The present invention relates to a copper-based sintered slide member comprising 0.5 to 20% by weight of tin, 0.1 to 35% by weight of manganese, 2 to 25% by weight of a solid lubricant and the balance essentially consisting of copper; and a multilayer copper-based sintered slide member comprising a copper-based alloy sintered layer and a metal backing plate which are formed into an integral multilayer structure, wherein the copper-based alloy sintered layer comprises 0.5 to 20% by weight of tin, 0.1 to 35% by weight of manganese, 2 to 25% by weight of a solid lubricant and the balance essentially consisting of copper. The above slide members are in the form of a lead-free copper-based sintered slide member.
    Type: Grant
    Filed: January 15, 2007
    Date of Patent: March 27, 2012
    Assignee: Oiles Corporation
    Inventors: Shoichiro Iwahashi, Kazuo Kato, Takehiro Shirosaki, Takashi Kikkawa
  • Publication number: 20110317949
    Abstract: A sintered metal bearing is obtained by compression-molding of a raw-material powder containing at least a Cu powder, an SUS powder, and a pure Fe powder and thereafter sintering a compression-molded body at a predetermined temperature.
    Type: Application
    Filed: March 2, 2010
    Publication date: December 29, 2011
    Applicant: NTN CORPORATION
    Inventors: Fuyuki Ito, Kazuo Okamura, Kenji Hibi
  • Publication number: 20110236709
    Abstract: [Object] A composition of a metal nanoparticle is provided in which reproducibility in a method of producing a metal film with excellent low-temperature sinterable properties is improved. An article using the metal nanoparticle composition is also provided. [Solving Means] A composition of a metal nanoparticle that has a secondary aggregation diameter (median diameter) of 2.0 ?m or less as determined by disk centrifugal-type particle size measurement is used.
    Type: Application
    Filed: March 17, 2011
    Publication date: September 29, 2011
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Gregory A. JABLONSKI, Michael A. MASTROPIETRO, Kimitaka SATO
  • Patent number: 7955411
    Abstract: A bonding material comprising metal particles coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises first portion of 100 nm or less, and a second portion larger than 100 nm but not larger than 100 ?m, each of the portions having at least peak of a particle distribution, based on a volumetric base. The disclosure is further concerned with a bonding method using the bonding material.
    Type: Grant
    Filed: December 27, 2007
    Date of Patent: June 7, 2011
    Assignee: Hitachi, Ltd.
    Inventors: Yusuke Yasuda, Toshiaki Morita, Eiichi Ide, Hiroshi Hozoji, Toshiaki Ishii
  • Publication number: 20100279139
    Abstract: The present invention relates to a copper-based sintered slide member comprising 0.5 to 20% by weight of tin, 0.1 to 35% by weight of manganese, 2 to 25% by weight of a solid lubricant and the balance essentially consisting of copper; and a multilayer copper-based sintered slide member comprising a copper-based alloy sintered layer and a metal backing plate which are formed into an integral multilayer structure, wherein the copper-based alloy sintered layer comprises 0.5 to 20% by weight of tin, 0.1 to 35% by weight of manganese, 2 to 25% by weight of a solid lubricant and the balance essentially consisting of copper. The above slide members are in the form of a lead-free copper-based sintered slide member.
    Type: Application
    Filed: January 15, 2007
    Publication date: November 4, 2010
    Inventors: Shoichiro Iwahashi, Kazuo Kato, Takehiro Shirosaki, Takashi Kikkawa
  • Patent number: 7794520
    Abstract: A discontinuously reinforced metal matrix composite wherein the reinforcing material is a particulate binary intermetallic compound is described along with methods for preparing the same. The binary intermetallic compound includes the same type of metal as is the principal matrix metal in combination with one other metal. The particle size of the particulate binary intermetallic compound may be less than about 20 ?m and may be between about 1 ?m and about 10 ?m. The intermetallic particles may be present in the discontinuously reinforced metal matrix composites in an amount ranging from about 10% to about 70% by volume. The discontinuous reinforced metal matrix composites of the invention may be used in structures requiring greater strength and stiffness than can be provided by matrix metal alone. The materials of the invention may be used for vehicle parts, structural materials, and the like.
    Type: Grant
    Filed: August 13, 2004
    Date of Patent: September 14, 2010
    Assignee: Touchstone Research Laboratory, Ltd.
    Inventors: Gollapudi S. Murty, Brian E. Joseph
  • Patent number: 7767113
    Abstract: A method of manufacturing a metal-graphite brush material for a motor, which allows high-density formation of copper particles on the surfaces of graphite particles. The method: attaches copper complex to graphite particles; heat-treats the graphite particles attached with the copper particles, thereby to pyrolyze the copper complex to form copper particles on the surfaces of the graphite particles; forms the graphite particles having the copper particles formed thereon, together with a resin, into a formed product; and reduction-sinters the formed product under a reducing atmosphere to pyrolyze the resin, thereby to form a sintered body and also to reduce copper oxide formed in surface layers of the copper particles during the heat-treating.
    Type: Grant
    Filed: February 24, 2006
    Date of Patent: August 3, 2010
    Assignee: Aisin Seiki Kabushiki Kaisha
    Inventor: Hiroshi Kobayashi
  • Patent number: 7691173
    Abstract: The present invention includes consolidated hard materials, methods for producing them, and industrial drilling and cutting applications for them. A consolidated hard material may be produced using hard particles such as B4C or carbides or borides of W, Ti, Mo, Nb, V, Hf, Ta, Zr, and Cr in combination with an iron-based, nickel-based, nickel and iron-based, iron and cobalt-based, aluminum-based, copper-based, magnesium-based, or titanium-based alloy for the binder material. Commercially pure elements such as aluminum, copper, magnesium, titanium, iron, or nickel may also be used for the binder material. The mixture of the hard particles and the binder material may be consolidated at a temperature below the liquidus temperature of the binder material using a technique such as rapid omnidirectional compaction (ROC), the CERACON® process, or hot isostatic pressing (HIP). After sintering, the consolidated hard material may be treated to alter its material properties.
    Type: Grant
    Filed: September 18, 2007
    Date of Patent: April 6, 2010
    Assignee: Baker Hughes Incorporated
    Inventors: Jimmy W. Eason, James C. Westhoff, Roy Carl Lueth
  • Patent number: 7666246
    Abstract: Hard phase particles including Co alloy particles, carbide alloy particles, and silicide particles are dispersed substantially uniformly throughout a matrix composed of Cu self-fluxing alloy of a cladded portion. The cladded portion contains 6 to 15% by weight of Co, 3 to 8% by weight of one of Cr and Mo, 0.3 to 1% by weight of W, 0.5 to 1.8% by weight of Fe, 8 to 15% by weight of Ni, 0.08 to 0.2% by weight of C, 1.5 to 4% by weight of Si, 0.5 to 0.8% by weight of Al, and 0.1 to 0.3% by weight of P, and inevitable impurities and Cu as a balance. The hard phase particles have an average particle diameter of 8 to 20 ?m and a particle size distribution width of 0.1 to 100 ?m, and to occupy 10 to 20% in an arbitrary cross section of the cladded portion.
    Type: Grant
    Filed: August 21, 2006
    Date of Patent: February 23, 2010
    Assignee: Honda Motor Co., Ltd.
    Inventors: Shogo Matsuki, Yositaka Tsujii
  • Patent number: 7662208
    Abstract: An electrical contact used herein comprises chromium; one of copper and silver; and a carbide, in which the electrical contact comprises a matrix and chromium, the matrix phase mainly comprising one of copper and silver, and the chromium being surrounded by the carbide and dispersed in the matrix. The electrical contact contains 1 to 30 percent by weight of a carbide, with the balance being copper. Another electrical contact contains chromium, copper, and a carbide and has a weight ratio of chromium to the carbide within the range of 1:1.5 to 1:50.
    Type: Grant
    Filed: July 6, 2006
    Date of Patent: February 16, 2010
    Assignee: Hitachi, Ltd.
    Inventors: Shigeru Kikuchi, Ayumu Morita, Masato Kobayashi, Satoru Kajiwara, Noboru Baba
  • Patent number: 7641709
    Abstract: Discontinuous diamond particulate containing metal matrix composites of high thermal conductivity and methods for producing these composites are provided. The manufacturing method includes producing a thin reaction formed and diffusion bonded functionally graded interactive SiC surface layer on diamond particles. The interactive surface converted SiC coated diamond particles are then disposed into a mold and between the particles and permitted to rapidly solidify under pressure. The surface conversion interactive SiC coating on the diamond particles achieves minimal interface thermal resistance with the metal matrix which translates into good mechanical strength and stiffness of the composites and facilitates near theoretical thermal conductivity levels to be attained in the composite. Secondary working of the diamond metal composite can be performed for producing thin sheet product.
    Type: Grant
    Filed: October 8, 2007
    Date of Patent: January 5, 2010
    Assignee: Materials and Electrochemical Research (MER) Corporation
    Inventors: Sion M. Pickard, James C. Withers, Raouf O. Loutfy
  • Patent number: 7640861
    Abstract: Medium- and high-density articles are formed from alloys containing tungsten, iron, nickel and optionally manganese and/or steel. In some embodiments, the articles have densities in the range of 8-10.5 g/cm3, and in other embodiments, the articles have densities in the range of 10.5-15 g/cm3. In some embodiments, the articles are ferromagnetic, and in others the articles are not ferromagnetic. In some embodiments, tungsten forms the largest weight percent of the alloy, and in other embodiments the alloy contains no more than 50 wt % tungsten. In some embodiments, the articles are shell shot.
    Type: Grant
    Filed: May 6, 2005
    Date of Patent: January 5, 2010
    Inventor: Darryl D. Amick
  • Patent number: 7608127
    Abstract: The present invention relates to particle reinforced noble metal matrix composites and a method of making the same. The composites include a noble metal such as silver, gold, and alloys thereof, as a base or matrix, and a particle reinforced filler material, such as a carbide. A pressureless infrared heating, or superheating, process is used to produce the particle reinforced noble metal matrix composites thereby providing a composite with at least sufficient hardness, i.e. wear resistance, and/or low resistivity. The composites may be used in the jewelry industry, such as for making watches, rings, and other jewelry, and/or in the power, automobile, and aircraft industries, such as for making electrical contact materials.
    Type: Grant
    Filed: February 22, 2008
    Date of Patent: October 27, 2009
    Assignee: The University of Cincinnati
    Inventors: Ray Y. Lin, Donald E. Stafford
  • Patent number: 7582147
    Abstract: A liquid coating composition including a coating vehicle and composite powder particles disposed within the coating vehicle. Each composite powder particle may include a magnesium component, a zinc component, and an indium component.
    Type: Grant
    Filed: August 18, 2005
    Date of Patent: September 1, 2009
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Donald S. Parker, Louis G. MacDowell
  • Patent number: 7572313
    Abstract: A turbomachinery component includes a substrate having a surface, the surface consisting essentially of at least one composite of at least one metal and at least one compound having the chemical formula Mn+1AXn, wherein M is at least one early transition metal selected from groups IIIB, IVB, VB, and VIB, A is at least one element selected from groups IIIA, IVA, VA, VIA, and VIIA, X is one or both of carbon and nitrogen, and n is an integer between 1 and 3. The component is made by compressing a powdered material to form a substrate that consists essentially of the composite and sintering the substrate, or by coating a substrate with the composite.
    Type: Grant
    Filed: May 10, 2005
    Date of Patent: August 11, 2009
    Assignee: Drexel University
    Inventors: Thirumalai G. Palanisamy, Surojit Gupta, Michel Barsoum, Chien-Wei Li
  • Patent number: 7556669
    Abstract: The problem is to provide an Au—Sn alloy powder for use in producing an Au—Sn alloy solder paste having reduced generation of voids. The problem is solved by an Au—Sn alloy powder for a solder paste, which has a composition consisting of Sn of 20.5-23.5% by mass and a remainder containing Au and inevitable impurities, and which has a microstructure in which 0.5 to 30 area % of fine Sn-rich primary crystal phase regions having a diameter of 3 ?m or less are crystallized in a matrix.
    Type: Grant
    Filed: June 27, 2005
    Date of Patent: July 7, 2009
    Assignee: Mitsubishi Materials Corporation
    Inventors: Masayuki Ishikawa, Masayoshi Kohinata, Akihumi Mishima
  • Patent number: 7556668
    Abstract: The present invention includes consolidated hard materials, methods for producing them, and industrial drilling and cutting applications for them. A consolidated hard material may be produced using hard particles such as B4C or carbides or borides of W, Ti, Mo, Nb, V, Hf, Ta, Zr, and Cr in combination with an iron-based, nickel-based, nickel and iron-based, iron and cobalt-based, aluminum-based, copper-based, magnesium-based, or titanium-based alloy for the binder material. Commercially pure elements such as aluminum, copper, magnesium, titanium, iron, or nickel may also be used for the binder material. The mixture of the hard particles and the binder material may be consolidated at a temperature below the liquidus temperature of the binder material using a technique such as rapid omnidirectional compaction (ROC), the CERACON™ process, or hot ecstatic pressing (HIP). After sintering, the consolidated hard material may be treated to alter its material properties.
    Type: Grant
    Filed: December 4, 2002
    Date of Patent: July 7, 2009
    Assignee: Baker Hughes Incorporated
    Inventors: Jimmy W. Eason, James C. Westhoff, Roy Carl Lueth
  • Patent number: 7479174
    Abstract: An inner rotor having excellent corrosion resistance, which has an outer gear serving as a component of an internal gear pump, and an outer rotor having excellent corrosion resistance, which has an inner gear engaging with the outer gear. The inner rotor and outer rotor of are made of Cu—Ni-based sintered copper alloy that contains 12 to 50% by mass of Ni, 5 to 20% by mass of Sn, 0.5 to 5% by mass of C, and if necessary, further contains 5 to 20% by mass of Zn, 0.1 to 0.9% by mass of P, and a balance being Cu and inevitable impurities.
    Type: Grant
    Filed: March 29, 2005
    Date of Patent: January 20, 2009
    Assignee: Mitsubishi Materials PMG Corporation
    Inventors: Teruo Shimizu, Tuneo Maruyama
  • Patent number: 7449249
    Abstract: The invention relates to a spray powder for coating a substrate (2), in particular for coating a bearing part (2) of a bearing apparatus, the spray powder having at least the following composition: zinc=5% to 30% by weight, tin=1% to 10% by weight, silicon=0.1% to 3% by weight, aluminum=0.1% to 7% by weight, iron=0.01% to 2% by weight, manganese=0.01% to 4% by weight, cobalt=0.01 to 3% by weight, copper=the balance to 100% in % by weight.
    Type: Grant
    Filed: August 15, 2005
    Date of Patent: November 11, 2008
    Assignee: Sulzer Metco AG
    Inventor: Gérard Barbezat
  • Publication number: 20080148904
    Abstract: Copper microparticles that are fine and contain substantially none of agglomerated particles. For example, there are provided copper microparticles of 0.005 to 2.0 ?m average particle diameter (D) as measured by an electron microscope, 0.005 to 2.0 ?m average particle diameter (d) as measured by a dynamic light scattering particle size distribution measuring apparatus and 0.7 to 2 d/D ratio. There is provided a process comprising mixing a divalent copper oxide with a reducing agent in the presence of a complexing agent and a protective colloid in a liquid medium to thereby produce copper microparticles without formation of a univalent copper oxide from the divalent copper oxide.
    Type: Application
    Filed: August 18, 2005
    Publication date: June 26, 2008
    Inventors: Masanori Tomonari, Masatoshi Honma, Yoshiyuki Kunifusa
  • Patent number: 7390344
    Abstract: Metal graphite material including a molded body having a collectivity of graphite particles and copper particles comprises graphite and copper as main elements, the copper particles including copper microparticles where each copper microparticle having average diameter between 5 and 100 nm contacts, and a cluster of the copper microparticles fixed on a surface of the graphite particle to form a conductive path of the contacting copper microparticles on the surface of the graphite particle, wherein a charge induced from the graphite particle is conducted, and a method for making metal graphite material comprises the steps of: applying a solution including metal complex whose main element is copper on a surface of a graphite particle and forming a coating film of the solution on the surface of the graphite particle, and calcinating a molded body of a collectivity of the graphite particles on which the coating films are formed under an oxygen including atmosphere, and heating the molded body under a deoxidizing
    Type: Grant
    Filed: June 18, 2004
    Date of Patent: June 24, 2008
    Assignee: Aisin Seiki Kabushiki Kaisha
    Inventor: Hiroshi Kobayashi
  • Patent number: 7378053
    Abstract: The invention proposes a copper-based material with low thermal expansion and high thermal conductivity having good machinability and adaptability to nickel plating and also proposes a method for producing the same. The copper-based material is prepared through the steps of: adding 5 to 60% of iron-based alloy power having a certain value in thermal expansion coefficient into a matrix powder of pure copper phase powder and/or a precipitation hardening copper alloy powder; mixing the powders together; compacting the obtained powder mixture into a green compact and sintering it at temperatures of 400 to 600° C.
    Type: Grant
    Filed: April 27, 2004
    Date of Patent: May 27, 2008
    Assignee: Hitachi Powered Metals Co., Ltd.
    Inventor: Zenzo Ishijima
  • Publication number: 20080110334
    Abstract: Disclosed are a sintered composite machine part as a cylinder block for piston pumps or piston motors, and a manufacturing method thereof. The machine part has an air-tight main body of sintered porous iron alloy and having an iron oxide layer on the surface; and a sliding part of sintered porous copper alloy being bonded direct to the main body. The sliding part is to be slid in tight contact with a fluid supply/return device. The manufacturing is made by preparing a main body of sintered porous iron alloy and a green compact for sliding part from a raw material metal powder having a composition corresponding to the copper alloy; sintering the green compact for sliding part in contact with the main body to bond the sliding part to the main body by diffused junction; and subjecting the main body to steam treatment to provide an iron oxide layer.
    Type: Application
    Filed: November 13, 2007
    Publication date: May 15, 2008
    Applicant: HITACHI POWDERED METALS CO., LTD.
    Inventor: Michiharu Mogami
  • Patent number: 7288325
    Abstract: A hydrogen storage material includes a nano size material that can be formed in a multi-layered core/shell structure and/or in a nanotabular (or platelet) form.
    Type: Grant
    Filed: March 15, 2004
    Date of Patent: October 30, 2007
    Assignee: The Pennsylvania State University
    Inventors: Peter C. Eklund, Terumi Furuta, Hajime Goto, Yoshiya Fujiwara, James H. Adair, Jennifer A. Nelson, Kishore Sreenivasan
  • Patent number: 7208439
    Abstract: A method is featured for fabricating Carbon-supported AuPt nanoparticle catalysts for fuel cells, and particularly fuel cells using methanol as the fuel. The method prepares AuPt-based fuel cell catalysts having a wide range of controllable Au:Pt ratios. The AuPt catalysis are supportable on both carbon black (C) and C/TiO2 support materials. These materials demonstrate electro-catalytic activity towards CO and methanol oxidation, and O2 reduction. The same catalyst material is useful in constructing both anodes and cathodes, and demonstrates bifunctional activity.
    Type: Grant
    Filed: February 4, 2005
    Date of Patent: April 24, 2007
    Assignee: The Research Foundation of State University of New York
    Inventors: Chuan-Jian Zhong, Jin Luo, Mathew M. Maye, Nancy N. Kariuki
  • Patent number: 7083859
    Abstract: Disclosed are conductive powder having a packing density of 68% by volume or more with a relative value preferably comprising 60 to 92% by weight of roughly spherical and silver-plated copper powder part of the surface of which has been coated with 3 to 30% by weight of silver based on an amount of roughly spherical copper powder with exposing at least a surface of a portion of an alloy of copper with silver, and the surface of which is coated with 0.02 to 1.0% by weight of an aliphatic acid based on an amount of the roughly spherical and silver-plated copper powder, and 8 to 40% by weight of silver powder, and a method for preparing the same.
    Type: Grant
    Filed: July 7, 2004
    Date of Patent: August 1, 2006
    Assignee: Hitachi Chemical Co., Ltd.
    Inventor: Hideji Kuwajima
  • Patent number: 6844085
    Abstract: With the objectives of alleviating the property of attacking on the mating member by scratching-off of local agglutinates on the sliding contact surface, achieving improved wear resistance, and achieving improved seizure resistance through restraint of frictional heat generation by a hard phase, a copper based sintered contact material contains shock-resistant ceramics in an amount of 0.05 to less than 0.5 wt % as non-metallic particles composed of one or more substances selected from pulverized oxides, carbides and nitrides. The shock-resistant ceramics are comprised of SiO2 and/or two or more substances selected from SiO2, Al2O3, LiO2, TiO2 and MgO.
    Type: Grant
    Filed: July 12, 2002
    Date of Patent: January 18, 2005
    Inventors: Takemori Takayama, Tetsuo Ohnishi, Yoshikiyo Tanaka, Keiichi Maeda, Kan'ichi Sato