Base Metal One Or More Of Copper(cu) Or Noble Metal Patents (Class 75/247)
  • Patent number: 5403543
    Abstract: Disclosed is a manufacturing process of an alloy material comprising a chromium component and a base component which comprises at least one element selected from tile group consisting of copper and silver, the manufacturing process comprising steps of: subjecting a chromium material with a carbon material to heat treatment; and manufacturing the alloy material using the chromium material treated at the heat treatment subjecting step and a raw material for tile base component. At the heat treatment subjecting step, the chromium material, mixed with 50 ppm to 5,000 ppm of the carbon material, is heated to a temperature within the range of 800.degree. C. to 1,400.degree. C. in a non-oxidizing atmosphere. According to this manufacturing process, the level of oxygen content in the alloy material are decreased to be not more than 200 ppm. The obtained alloy material can be used as a contact material for vacuum circuit breakers.
    Type: Grant
    Filed: June 3, 1992
    Date of Patent: April 4, 1995
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tsutomu Okutomi, Tsuneyo Seki, Atsushi Yamamoto, Mikio Okawa, Tadaaki Sekiguchi, Yoshiko Majima
  • Patent number: 5360673
    Abstract: A semifinished product for electric contact made from a composite material based on silver-tin oxide is described as well as a powder-metallurgical process of making said product. The structure of the semifinished products contains regions which contain no metal oxide or very little metal oxide in alternation with regions which contain the entire metal oxide component or a greatly predominating/share thereof in a fine division.
    Type: Grant
    Filed: September 17, 1990
    Date of Patent: November 1, 1994
    Assignee: Doduco GmbH + Co. Dr. Eugen Durrwachter
    Inventors: Ursula Mayer, Roland Michal, Karl E. Saeger
  • Patent number: 5354352
    Abstract: Disclosed is a contact material for vacuum circuit breakers and a manufacturing process thereof. The contact material includes a copper component, a chromium component and a bismuth component, and has a metallographic structure comprising: a first phase including the copper component and the bismuth component; and a second phase including the chromium component and interposed among the first phase. In this structure, the boundary surface between the first phase and the second phase appears in a structural cross section of the alloy composition as a substantially smooth boundary line, such that when a segment of the boundary line is defined by two arbitrary points which lie on the boundary line at a straight distance of 10 .mu.m, the ratio of the length of the segment to the straight distance of 10 .mu.m lies within a range of approximately 1.0 to 1.4.
    Type: Grant
    Filed: April 14, 1992
    Date of Patent: October 11, 1994
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tsuneyo Seki, Tsutomu Okutomi, Atsushi Yamamoto, Mikio Okawa, Kiyofumi Otobe
  • Patent number: 5338332
    Abstract: The present invention is an isothermal current shunt device with excellent temperature coefficient of resistivity characteristics stability for use in a power measuring circuit having a wide temperature and dynamic range and particularly for customers of electric utility companies, and it includes a first arm having a first flange portion, a second arm having a second flange portion, and a bridge means coupling the first arm to the second arm wherein the bridge means is a monolithic sintered powdered-metal piece having a block portion and a loop portion. The block portion has a first face juxtaposed to and electrically coupled to the first flange portion of the first arm and a second opposing face juxtaposed to and electrically coupled to the second flange portion of the second arm. This configuration allows a majority of electrical current to conduct between the first arm and the second arm.
    Type: Grant
    Filed: June 15, 1992
    Date of Patent: August 16, 1994
    Assignee: Metricom, Inc.
    Inventors: Paul Baran, Ronald S. Palmer
  • Patent number: 5336444
    Abstract: A novel metal filled via composition for use with ceramics. The via composition can be formulated to have a volume shrinkage approximating that of the ceramic material, and thus overcomes the problem of volume shrinkage mismatch between the via (particularly copper filled via) and ceramic upon sintering. The novel via composition exhibits enhanced adhesion to the ceramic. A sintering process by which shrinkage of the novel via composition is controlled and adhesion is improved is also disclosed.
    Type: Grant
    Filed: May 29, 1992
    Date of Patent: August 9, 1994
    Assignee: International Business Machines Corporation
    Inventors: Jon A. Casey, Renuka S. Divakaruni, Govindarajan Natarajan, Srinivasa S. N. Reddy, Manfred Sammet
  • Patent number: 5334460
    Abstract: A Cu-Pb system composite bearing has three layers including a backing metal, a bearing alloy layer formed on the backing metal, and an overlay formed on the bearing alloy layer. The Cu-Pb bearing alloy contains 2 to 10% Ni and 0.05 to 1.0% B. An example of the composition of the Cu-Pb system bearing alloy consists of 0.5 to 8% Sn, 15 to 30% Pb, 0.2% or less P, 2 to 10% Ni, 0.05 to 1.0% B and the balance of Cu and unavoidable impurities. The Cu-Pb bearing alloy must have a hardness over HV80. Ni and B contained in the bearing alloy decrease the affinity of the Cu-Pb bearing alloy for tin in the overlay of a tin-containing lead alloy. The corrosion resistance of the bearing is improved by plating the both surfaces of the composite bearing with Sn, Pb or an alloy thereof.
    Type: Grant
    Filed: December 2, 1992
    Date of Patent: August 2, 1994
    Assignee: Daido Metal Company
    Inventors: Tadashi Tanaka, Masaaki Sakamoto, Koichi Yamamoto, Kenji Sakai
  • Patent number: 5326384
    Abstract: The Cu-based sintered sliding materials contain: 1-10% of graphite, MoS.sub.2 and/or WS.sub.2 ; 1-30% of hard matter selected from (a) and (b); and, 0.1-15% of Sn. The sliding materials have improved seizure resistance, wear resistance and corrosion resistance.The hard matter:(a) Fe.sub.2 P, Fe.sub.3 P, FeB, Fe.sub.2 B, Mo, Co-based self fluxing alloy and Ni-based self fluxing alloy and(b) Fe-Cr, Fe-Mn, Fe-Ni, Fe-Si, Fe-W, Fe-Mo, Fe-V, Fe-Ti, Fe-Nb, CuP, Cr, and W.
    Type: Grant
    Filed: July 30, 1991
    Date of Patent: July 5, 1994
    Assignee: Taiho Kogyo Co., Ltd.
    Inventors: Eiji Asada, Takashi Tomikawa, Kenichiro Futamura
  • Patent number: 5326526
    Abstract: Sintered iron alloy composition and method of manufacturing the same, the sintered alloy composition comprising: about 1.5 to about 2.5% carbon by weight; about 0.5 to about 0.9% manganese by weight; about 0.1 to about 0.2% sulfur by weight; about 1.9 to about 2.5% chromium by weight; about 0.15 to about 0.3% molybdenum by weight; about 2 to about 6% copper by weight; not more than about 0.3% by weight of a metal element material comprising at least one member selected from the group consisting of tungsten and vanadium; an effective content of a first solid lubricant material comprising at least one member selected from the group consisting of magnesium metasilicate minerals and magnesium orthosilicate minerals; and balance iron. This alloy composition is preferably used for making machine parts, such as slide members of valve operating systems for internal combustion engines.
    Type: Grant
    Filed: September 30, 1991
    Date of Patent: July 5, 1994
    Assignees: Hitachi Powdered Metals Co., Ltd., Nissan Motor Co., Ltd.
    Inventors: Yutaka Ikenoue, Koichiro Hayashi, Makoto Kano, Akira Fujiki
  • Patent number: 5324592
    Abstract: A copper powder-free friction material which is made by sintering and intended for friction surfaces of couplings or brakes contains powdery and/or granular metallic and non-metallic components, at least 50% by weight of the non-ferrous heavy metal component being brass powder.
    Type: Grant
    Filed: March 20, 1992
    Date of Patent: June 28, 1994
    Assignee: Hoerbiger & Co.
    Inventors: Fred Blankenhagen, Hermann Putz
  • Patent number: 5303617
    Abstract: A Cu--Sn based sintered material, which has an improved corrosion-resistance, is provided by setting the Pb content at 1 to less than 10% and adding from 0.1 to 30% of a hard matter(s) selected from the groups (a), (b), (c) and (d). The hard matter is(a) Fe.sub.2 P, Fe.sub.3 P, FeB, Fe.sub.2 B and Mo.(b) Fe--Cr, Fe--Mn, Fe--Ni, Fe--Si, Fe--W, Fe--Mo, Fe--V, Fe--Ti, Fe--Nb, CuP, Cr, and W;(c) SiC, TiC, WC, B.sub.4 C, TiN, cubic BN, Si.sub.3 N.sub.4, SiO.sub.2, ZrO.sub.2, and Al.sub.2 O.sub.3 ;(d) Si--Mn, Cu--Si, and FeS.Most of said hard matter being dispersed in Cu particles, grain boundaries between Cu particles, and between the Cu and Pb particles.
    Type: Grant
    Filed: November 3, 1992
    Date of Patent: April 19, 1994
    Assignee: Taiho Kogyo Co., Ltd.
    Inventors: Eiji Asada, Hiromi Ogino
  • Patent number: 5279638
    Abstract: A Cu-Sn based sintered material, having an improved wear-resistance is obtained by adding from 0.1 to 30% of at least one hard matter(s) selected from the groups consisting of (a), (b), and (c) wherein (a), (b) and (c) are:(a) Fe.sub.2 P, Fe.sub.3 P, FeB, Fe.sub.2 B, Mo, Co, Co-based self-fluxing alloy, and Ni-based self-fluxing alloy;(b) SiC, TiC, WC, B.sub.4 C, TiN, cubic BN, Si.sub.3 N.sub.4, SiO.sub.2, ZrO.sub.2, and Al.sub.2 O.sub.3 ; and(c) Si-Mn, Cu-Si, and FeS.
    Type: Grant
    Filed: February 26, 1991
    Date of Patent: January 18, 1994
    Assignee: Taiho Kogyo Co., Ltd.
    Inventors: Eiji Asada, Hiromi Ogino
  • Patent number: 5258052
    Abstract: A powder metallurgy material for use in the manufacture of electrical contacts and having enhanced cold workability consists essentially, by weight percent, of 5 to 20% tin oxide, 2000 to 5000 ppm, preferably 2000 to less than 4000 ppm copper, 20 to 200 ppm, preferably 20 to 100 ppm, lithium, balance silver. Such materials are produced by compacting the powdered components and heating to sinter the material to at least 93% of theoretical density. Such materials subsequently can be hot or cold worked to a form useful for the manufacture of electrical contacts.
    Type: Grant
    Filed: June 18, 1992
    Date of Patent: November 2, 1993
    Assignee: Advanced Metallurgy Incorporated
    Inventor: Richard C. Bevington
  • Patent number: 5256494
    Abstract: The sliding member of the invention comprises a steel backing and a sintered Cu-alloy layer mounted integrally on one surface of the backing metal, wherein the sintered Cu-alloy comprises 1 to 15% Sn, 1 to 20% Ni-B compound, 1% or less phosphorus, and the balance of Cu and impurities. Cu-alloy may further contain 1 to 30% Pb and/or 0.5 to 8% graphite. Pb and graphite provide the sliding alloy layer with good lubrication property. Preferably the Ni-B compound is used, which is composed of 7 to 15% B and the balance of Ni and impurities.
    Type: Grant
    Filed: November 26, 1991
    Date of Patent: October 26, 1993
    Assignee: Daido Metal Company Ltd.
    Inventors: Tadashi Tanaka, Masaaki Sakamoto, Koichi Yamamoto, Tsukimitsu Higuchi
  • Patent number: 5246480
    Abstract: In a contact material, there is present in addition to silver, at least one higher melting point metal, metal alloy or metal compound. According to the invention, the material contains in addition to silver (Ag), at least iron (Fe) and/or titanium (Ti) in percent by weight of from 2 to 50%. Optionally, nitrides, carbides and/or borides of the metals titanium, zirconium and/or tantalum may also e present. It has been found that in their contact property spectrum such materials are largely equivalent to the material AgNi10. Thus the latter contact material can be replaced completely.
    Type: Grant
    Filed: October 17, 1990
    Date of Patent: September 21, 1993
    Assignee: Siemens Aktiengesellschaft
    Inventors: Wolfgang Haufe, Joachim Grosse, Bernhard Rothkegel, deceased
  • Patent number: 5241745
    Abstract: To produce CuCr contact materials, it is known to use purely powder-metallurgical, sinter impregnation and smelt-metallurgical processes. Only materials produced by smelt-metallurgical processes are suitable as contact materials for vacuum contactors based on copper-chromium. According to the invention, a contact material for vacuum contactors consisting essentially of copper (Cu) and chromium (Cr) in the proportion of 50 to 70% wt. Cu and 30 to 50% wt. Cr is manufactured by pressing and sintering a powdered mixture of the components until a closed porosity is attained and by subsequently cold working the sintered body. It has been possible to demonstrate that an intimate and faultless bonding of the components Cu and Cr is obtained by cold welding the structural constituents with this process as with smelting.
    Type: Grant
    Filed: December 2, 1991
    Date of Patent: September 7, 1993
    Assignee: Siemens Aktiengesellschaft
    Inventor: Horst Kippenberg
  • Patent number: 5217814
    Abstract: The wear resistance and seizure resistance of the sliding material consisting of a metal backing, a Cu-based sintered layer, and resin and solid lubricant filled in the pores of the sintered layer are improved by determining the following features (a) multi-layer Cu particles; from 30 to 200 .mu.m of the diameter of the Cu particles; porosity of from 5 to 70% of the sintered layer; resin, MoS.sub.2 and graphite filled in the pores.
    Type: Grant
    Filed: February 7, 1992
    Date of Patent: June 8, 1993
    Assignee: Taiho Kogyo Co., Ltd.
    Inventors: Shinya Kawakami, Shinichi Miziguchi, Tatsuhiko Fukuoka, Yasunori Kabeya, Keiichi Shimasaki
  • Patent number: 5207821
    Abstract: Disclosed is a sintered alloy composition and method of manufacturing the same, the sintered alloy composition having a multi-phase structure, comprising: a first phase composed of aluminum and copper; and a second phase being dispersed in the first phase and composed of molybdenum, chromium, silicon and cobalt. This alloy composition has excellent abrasion and corrosion resistance, preferably to be used for making machine parts such as valve seats for engines.
    Type: Grant
    Filed: July 9, 1991
    Date of Patent: May 4, 1993
    Assignees: Hitachi Powdered Metals Co., Ltd., Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Yutaka Ikenoue, Keitaro Suzuki, Yoshimasa Aoki, Hideo Urata, Koji Koishikawa, Makoto Tsuji
  • Patent number: 5198015
    Abstract: A silver base electrical contact material with superior resistance to arc erosion along with improved wear and welding resistance. The contact material consists essentially of 0.5 to 39.9 wt % of nickel, 0.14 to 7.0 wt % of nickel oxides, and balance silver. The material contains not less than, 0.4 wt % of nickel responsible for constituting minute nickel and nickel particles which have a particle size of not more than 1 .mu.m and are dispersed in a silver matrix for strengthening the material to give improved wear and welding resistance. The dispersed minute nickel oxide particles are included to stabilize arcing occurring at the time of opening and closing contacts in such a manner as to anchor one end of an arc substantially at any immediately available point over the entire contact surface as soon as the arcing occurs, thereby preventing the arc end from moving violently across or beyond the contact surface and therefore minimizing arc related damages or arc erosion.
    Type: Grant
    Filed: June 20, 1991
    Date of Patent: March 30, 1993
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Koji Tsuji, Yoshinobu Takegawa, Hayato Inada, Shuji Yamada
  • Patent number: 5192622
    Abstract: A ternary-alloy/glass composite suitable for use in vias in glass-ceramic electronic structures includes gold, palladium, and either platinum or silver in the alloy where the gold is less than 50% by weight of the alloy. The alloy is combined with glass frit where the glass is present as 5-50% by volume in the composition. The ternary-alloy glass composite is sintered in the glass-ceramic structure and provides a hermetic seal. Chips and pins can be bonded directly to the ternary-alloy/glass composite using a eutectic braze without causing cracks in the glass-ceramic. The ternary-alloy/glass composite has good adhesion with glass-ceramics and is useful in vias in electronic structures.
    Type: Grant
    Filed: August 9, 1991
    Date of Patent: March 9, 1993
    Assignee: International Business Machines Corporation
    Inventors: Armando S. Cammarano, Giulio DiGiacomo, Nunzio DiPaolo
  • Patent number: 5167697
    Abstract: A substrate material for mounting a semiconductor device thereon, comprises a skeleton prepared by liquid-phase presintering the composition of W and/or Mo powder in which Cu and/or Ag powder is uniformly dispersed, and a Cu and/or Ag phase infiltrated into the pores of the skeleton. The total amount of Cu and/or Ag in the product is adjusted to 10-50 vol. %. The substrate material is manufactured by two steps of: presintering the Cu and/or Ag-contng. powdery composition to form a porous skeleton, and infiltrating Cu and/or Ag into the pores of the skeleton. Since the skeleton contng. Cu and/or Ag exhibits an excellent affinity to molten Cu and/or Ag, the infiltration of molten Cu and/or Ag is performed uniformly into every nook and corner of the skeleton. Consequently, the obtained product is free from pores which would deteriorate a junction plane between the substrate and a semiconductor device mounted thereon.
    Type: Grant
    Filed: April 17, 1991
    Date of Patent: December 1, 1992
    Assignee: Nippon Tungsten Co., Ltd.
    Inventors: Takeshie Koumura, Yoshihiro Umeda, Jitsuo Matsumoto
  • Patent number: 5149362
    Abstract: An Ag-Cu-WC contact forming material for a vacuum interrupter comprising a highly conductive component comprising Ag and Cu and an arc-proof component comprising WC wherein the content of the highly conductive component is such that the total amount of Ag and Cu(Ag+Cu) is from 25% to 65% by weight and the percentage of Ag based on the total amount of Ag and Cu[Ag/(Ag+Cu)] is from 40% to 80% by weight; wherein the content of the arc-proof component is from 35% to 75% by weight; wherein the structure of the highly conductive component comprises a matrix and a discontinuous phase, the discontinuous phase having a thickness or width of no more than 5 micrometers and wherein said arc-proof component comprises a discontinuous grain having a grain size of no more than 1 micrometer.
    Type: Grant
    Filed: July 28, 1989
    Date of Patent: September 22, 1992
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tsutomu Okutomi, Atsushi Yamamoto, Seishi Chiba, Tsuneyo Seki, Mikio Okawa, Mitsutaka Honma, Kiyofumi Otobe, Yoshinari Satoh, Tadaaki Sekiguchi
  • Patent number: 5145504
    Abstract: Ceramic metal compositions are described that include a ceramic phase content of at least 60 percent by volume of said composition and a copper metal phase permeating the ceramic phase. The resulting composition is substantially fully densified, having a connected or isolated ceramic grain structure, preferably of fine B.sub.4 C grains of less than 3 micrometers. Flexure strength and fracture toughness for 80 volume percent B.sub.4 C-20 volume percent Cu cermets are 6.62 MPa.multidot.m1/2 and 725 MPa, respectively. The process of the invention includes as a key element, contacting a porous article of ceramic phase with copper metal followed by heating to above melting and subjecting said article to pressure of at least 200 MPa, such that the porous body is filled with metal and the composition is substantially fully densified.
    Type: Grant
    Filed: July 8, 1991
    Date of Patent: September 8, 1992
    Assignee: The Dow Chemical Company
    Inventors: Aleksander J. Pyzik, Robert T. Nilsson
  • Patent number: 5132083
    Abstract: A laser padding material in accordance with the present invention comprises copper as its main component and at least one, as other contained elements, selected from the group consisting of 1-5 weight % of nickel (Ni), 0.2-5 weight % of silicon (Si), less than 1 weight % of boron (B), less than 2 weight % of phosphorus (P) and less than 3 weight % of manganese (Mn), whereby there can be easily formed at a high speed a padded layer which is high both in sliding friction resistance and in quality.In accordance with a laser padding method of the present invention, since material powder having such a composition as mentioned above is blown onto a metal base material and at the same time a laser beam is irradiated thereon in an inert gas atmosphere to thereby melt the material powder and form a padded layer, there can be easily formed at a high speed a padded layer which is high both in sliding friction resistance and in quality.
    Type: Grant
    Filed: January 19, 1990
    Date of Patent: July 21, 1992
    Assignee: Kabushiki Kaisha Komatsu Seisakusho
    Inventors: Toshihide Takeda, Kazuo Okamura
  • Patent number: 5125962
    Abstract: A sintered material resistant to heat and mechanical strain, particularly to impact and friction, for the production of molded articles, made of a matrix metal powder having approximately 70 to 100% by weight of a copper component and approximately 0 to 30% by weight of an alloy component of cobalt, chromium, iron, manganese, nickel, tungsten and/or carbon. In another embodiment, the sintered material may also include an additional high-alloy metal powder admixed as a hard phase to the matrix metal powder. The additional high-alloy metal powder is present in the amount of a maximum 30% by weight, with respect to the sum of the matrix metal powder and high-alloy metal powder. The sintered material is especially suitable for heat- and wear-resistant molded articles for use in high gas environments, for example, in internal combustion engines. For example, guides, bearings, and valve elements may be made of this material and especially valve seat rings.
    Type: Grant
    Filed: November 13, 1989
    Date of Patent: June 30, 1992
    Assignee: Sintermetallwerk Krebsoge GmbH
    Inventor: Bernd Krentscher
  • Patent number: 5045972
    Abstract: A thermally conductive diamond metal composite consisting essentially of 5 to 80 volume percent diamond particles having a particle size ranging from about 1 to 50 .mu.m and a metal matrix comprising a thermally conductive metal. Preferably, a fine metal powder having particle size below 53 microns is utilized as the source for the metal matrix.
    Type: Grant
    Filed: August 27, 1990
    Date of Patent: September 3, 1991
    Assignee: The Standard Oil Company
    Inventors: Edward C. Supan, Joseph F. Dolowy, Jr., Bradley A. Webb
  • Patent number: 5030275
    Abstract: This invention relates to substantially full-dense, near-net shape bodies made of dispersion strengthened copper (D.S.C.) powder and products which are cold formed and/or machined from these bodies, such as resistance welding electrodes. The invention includes processes for manufacturing substantially full-dense, near-net shape, substantially equiaxed bodies from D.S.C. powder.
    Type: Grant
    Filed: June 20, 1989
    Date of Patent: July 9, 1991
    Assignee: SCM Metal Products, Inc.
    Inventors: Prasan K. Samal, Anil V. Nadkarni
  • Patent number: 5019156
    Abstract: A sintered electric contact material for use in vacuum switch tubes comprises about 50 to 70% by volume of a Cr powder, about 0.1 to 1.15% by volume of a Ti powder, and the remainder of a Cu powder. The sintered material can be obtained advantageously by heating a mixture of the Cr powder, the Ti powder and the Cu powder in a non-oxidizing atmosphere under pressure, at a temperature below the melting point of Cu (the melting point is 1083.degree. C. at normal pressure).
    Type: Grant
    Filed: May 17, 1990
    Date of Patent: May 28, 1991
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Eizo Naya, Mitsuhiro Okumura
  • Patent number: 5000779
    Abstract: The subject of this invention is the development of new alloys along with new processing approaches for the utilization of the alloys. A particular class of alloys comprises at least one noble metal selected from the group comprising gold, palladium, silver and copper and an amount of between about 0.20 weight percent and about 0.80 weight percent of at least one metalloid selected from the group of metalloids consisting of boron, phosphorous, silicon and lithium. Rapid solidification technology in powder fabrication and the addition of metalloids have been combined to produce a new class of palladium based alloys. The metalloid additions greatly increase the hardness, enhance the fine grain structure and aid sintering densification. Net-shape forming is a benefit derived from the characteristics of the new alloys.
    Type: Grant
    Filed: May 18, 1988
    Date of Patent: March 19, 1991
    Assignee: Leach & Garner
    Inventors: Randall M. German, Laura L. Bourguignon, Dwarika P. Agarwal, Shaji Faroog
  • Patent number: 4988386
    Abstract: A copper-tungsten mixture net-shaped product produced using powder metallurgical techniques with injection molding and liquid phase sintering. The product has a very low leak rate in helium gas, a high thermal conductivity and a rate of thermal expansion which is substantially the same as some glass and ceramic materials.
    Type: Grant
    Filed: June 29, 1988
    Date of Patent: January 29, 1991
    Assignee: Fine Particles Technology Corporation
    Inventors: James B. Oenning, Ian S. R. Clark
  • Patent number: 4963184
    Abstract: A meterial well-suited for gold fillings in tooth cavities consists of a porous sintered compact which is prepared from platelet-shaped gold powder produced by chemical precipitation and which exhibits a pore volume of 80 to 90%.
    Type: Grant
    Filed: June 13, 1989
    Date of Patent: October 16, 1990
    Assignee: Degussa Aktiengesellschaft
    Inventors: Walter Diehl, Hans-Martin Ringelstein
  • Patent number: 4958569
    Abstract: A wrought metal liner for a shaped charge device having a ductile metal matrix and a discrete second phase is provided. The alloy composition is selected so the second phase is molten when the liner is accelerated following detonation. The molten phase reduces the tensile strength of the matrix so the liner slug is pulverized on striking a well casing. The slug does not penetrate the hole perforated in the well casing by the liner jet and the oil flow into the well bore is not impeded.
    Type: Grant
    Filed: March 26, 1990
    Date of Patent: September 25, 1990
    Assignee: Olin Corporation
    Inventor: Frank N. Mandigo
  • Patent number: 4943319
    Abstract: Disclosed is herein a process for producing a molding product of Al or Cu composite material, which comprises admixing a functional material capable of improving the desired property of the composite material by dispersion into a matrix to a powder of metal selected from Al, Cu or alloys thereof constituting the matrix, charging the dust directly into a molding die, applying cold dust core molding under the pressure of greater than 5 t/cm.sup.2 of facial pressure and applying a diffusing treatment at a temperature higher than 300.degree. C.
    Type: Grant
    Filed: December 30, 1988
    Date of Patent: July 24, 1990
    Assignee: Kabushiki Kaisha Kobe Seiko Sho
    Inventors: Masahiro Yanagawa, Mutsumi Abe, Kenichi Aota, Takashi Motoda
  • Patent number: 4941919
    Abstract: The sintered sliding material according to the present invention consists of from 0.1 to 10% by of graphite, from 1 to 7% by of alumina, and balance of copper, and occasionally at least one member selected from the group consisting of from 1 to 10% of Sn and from 1 to 30% of Pb, and/or not more than 1% of P, and includes the alumina dispersed in the copper matrix. The alumina is held by the copper matrix so that the particles of alumina are not separated from the material during sliding under a boundary lubricating condition.
    Type: Grant
    Filed: June 15, 1988
    Date of Patent: July 17, 1990
    Assignee: Taiho Kogyo Co., Ltd.
    Inventors: Eiji Asada, Takashi Tomikawa, Tatsuhiko Fukuoka
  • Patent number: 4937041
    Abstract: Metallization compositions utilizing a (1) relatively refractory flake product, e.g. flake-shaped powder of stainless steel, in combination with (2) a conductive metal such as silver which, upon being fired to melting, is held in the flake type matrix providing an excellent and inexpensive conductor. Termination compounds will comprise ceramic-adhesive frits. Body electrodes will usually comprise organic binders readily removable by thermal oxidation.
    Type: Grant
    Filed: February 2, 1989
    Date of Patent: June 26, 1990
    Assignee: Carlisle Memory Products Group Incorporated
    Inventor: Robert J. Deffeyes
  • Patent number: 4935056
    Abstract: A wear-resistant copper-base sintered oil-containing bearing material having a structure which contains 2 to 11 % by weight of tin and 1 to 20 % by weight of cobalt and further includes 2 to 15 % by weight of at least one of molybdenum disulfide, graphite and lead serving as solid lubricants. Disperesed throughout that structure is cobalt at an average particle size equal to or less than 20 .mu.m.
    Type: Grant
    Filed: October 11, 1989
    Date of Patent: June 19, 1990
    Assignee: Hitachi Powdered Metals Co., Ltd.
    Inventor: Motohiro Miyasaka
  • Patent number: 4919717
    Abstract: Sintered composite material containing 80% to 95% weight of copper, 2% to 15% weight of nickel and 2% to 5% weight of graphite, designed for the manufacture of electrical contact pads for low voltage switchgear devices. The copper powder can be of a spongy form having an average diameter of less than 24 .mu.m, an oxygen content of lower than 2000 ppm and a purity in metallic elements of 99.5%. The graphite powder can be of pellicular form, having particles about 100 .mu.m in length and 20 .mu.m in thickness, and an ash content of less than 0.2 ppm. The nickel powder can be of a spheroid shape having an average diameter of less than 5 .mu.m.
    Type: Grant
    Filed: April 25, 1988
    Date of Patent: April 24, 1990
    Assignee: Merlin Gerin
    Inventors: Jean Ambier, Marie-Jo Francillon, Colette Allibert, Catherine Laugee
  • Patent number: 4909841
    Abstract: A process of hot pressing of materials to form articles or compacts is characterized by the steps: (A) providing a compactable particulate mixture; (B) uniaxially pressing the particles without heating to provide article or compact (22); (C) placing at least one article or compact (22) in an open pan (31) having an insertable frame (32) with edge surfaces (34) that are not significantly pressure deformable, where the inside side surfaces of the frame are parallel to the central axis B--B of the open pan, and where each article or compact is surrounded by fine particles of a separating material; (D) evacuating air from the container and sealing the articles or compacts inside the container by means of top lid (36); (E) hot pressing the compacts at a pressure from 352.5 kg/cm.sup.2 to 3,172 kg/cm.sup.
    Type: Grant
    Filed: June 30, 1989
    Date of Patent: March 20, 1990
    Assignee: Westinghouse Electric Corp.
    Inventors: Natraj C. Iyer, Alan T. Male, William R. Lovic
  • Patent number: 4908158
    Abstract: An electrical contact material consists of Ag in which a metallic oxide is produced and dispersed through an internal oxidation and containing as metallic elements Cd, Mn and Al. With this contact material of this composition, there can be shown a high anti-welding property and a stably low contact resistance.
    Type: Grant
    Filed: February 13, 1989
    Date of Patent: March 13, 1990
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Koji Tsuji, Shuji Yamada, Yoshinobu Takegawa
  • Patent number: 4871394
    Abstract: Sintered copper friction facing suitable for operation in oil and quieter in operation than current facing of this type has a void volume not less than 30% of the total volume. It can be made by employing, as the copper to form the facing matrix, copper powder which is in dendritic form and of apparent density not greater than 1.3 gram/cm.sup.3.
    Type: Grant
    Filed: November 8, 1988
    Date of Patent: October 3, 1989
    Assignee: Ferodo Limited
    Inventors: Ralph Baker, Stephen N. Foulkes
  • Patent number: 4871438
    Abstract: Cermet electrode compositions comprising NiO-NiFe.sub.2 O.sub.4 -Cu-Ni, and methods for making, are disclosed. Addition of nickel metal prior to formation and densification of a base mixture into the cermet allows for an increase in the total amount of copper and nickel that can be contained in the NiO-NiFe.sub.2 O.sub.4 oxide system. Nickel is present in a base mixture weight concentration of from 0.1% to 10%. Copper is present in the alloy phase in a weight concentration of from 10% to 30% of the densified composition. Such cermet electrodes can be formed to have electrical conductivities well in excess of 100 ohm.sup.-1 cm.sup.-1. Other alloy and oxide system cermets having high content metal phases are also expected to be manufacturable in accordance with the invention.
    Type: Grant
    Filed: November 3, 1987
    Date of Patent: October 3, 1989
    Assignee: Battelle Memorial Institute
    Inventors: Steven C. Marschman, Norman C. Davis
  • Patent number: 4871437
    Abstract: Cermet electrode compositions and methods for making are disclosed which comprise NiO--NiFe.sub.2 O.sub.4 --Cu--Ni. Addition of an effective amount of a metallic catalyst/reactant to a composition of a nickel/iron/oxide, NiO, copper, and nickel produces a stable electrode having significantly increased electrical conductivity. The metallic catalyst functions to disperse the copper and nickel as an alloy continuously throughout the oxide phase of the cermet to render the electrode compositon more highly electrically conductive than were the third metal not present in the base composition. The third metal is preferably added to the base composition as elemental metal and includes aluminum, magnesium, sodium and gallium. The elemental metal is converted to a metal oxide during the sintering process.
    Type: Grant
    Filed: November 3, 1987
    Date of Patent: October 3, 1989
    Assignee: Battelle Memorial Institute
    Inventors: Steven C. Marschman, Norman C. Davis
  • Patent number: 4863514
    Abstract: There is provided a material for dentures having metallic matrix, containing 0.5-30 volume % glass having a softening temperature above 650.degree. C. and/or ceramic particles having a maximum grain size of 40 .mu.m.
    Type: Grant
    Filed: February 8, 1989
    Date of Patent: September 5, 1989
    Assignee: Degussa Atiengesellschaft
    Inventors: Werner Groll, Josef Rothaut
  • Patent number: 4855102
    Abstract: A sintering method and fusion welding method of the present invention are characterized in that energy is radiated to the black component of starting materials so as to convert it from the state of an energy absorber to the state of an energy reflector (the state where metallic luster is exhibited). The methods can be utilized effectively for forming the electrode of a sensor or the bump of an electronic component. When applied to the production of the sensor and the electrode, the methods can produce these products by a simple production process and with extremely high producibility.
    Type: Grant
    Filed: March 21, 1988
    Date of Patent: August 8, 1989
    Assignee: Hitachi, Ltd.
    Inventors: Ryoji Okada, Mitsuaki Haneda, Takeshi Araya, Susumu Hioki
  • Patent number: 4836979
    Abstract: A method of producing a composite material from a mixture of copper and a low coefficient of thermal expansion nickel-iron alloy (Invar) powder is disclosed wherein advantageously at least part of the copper is deposited on the Invar powder prior to processing. Processing includes cold compacting to a green strip or other configuration, annealing in the temperature range of 550.degree.-750.degree. C. and working the annealed material at a temperature in that range to high density.
    Type: Grant
    Filed: June 14, 1988
    Date of Patent: June 6, 1989
    Assignee: Inco Limited
    Inventors: James A. E. Bell, Thijs Eerkes, Carlos M. Diaz, William L. Mankins
  • Patent number: 4818283
    Abstract: A process for producing a dispersion hardened copper alloy includes admixing to a copper melt from 0.3 to 15 weight % of molybdenum to provide a mixture which is a melt; superheating the mixture to a temperature ranging from about 200.degree. C. to about 1000.degree. C. above the melting point of coper to provide a superheated melt; and subjecting the superheated melt to very rapid solidification at a cooling rate ranging from 104.degree. to 106.degree. C./sec. The above process produces dipsersion hardened copper alloy comprising copper and from 1 to 15 weight % of molybdenum which is present in the dispersion hardened copper alloy as particles having a diameter of less than 0.1 .mu.m embedded in the copper matrix. Such dispersion hardened copper alloys are useful for providing electrical conductors which are subjected to elevated temperatures, such as for providing spot welding electrodes, particularly for welding of zinc-galvanized sheet metal.
    Type: Grant
    Filed: October 16, 1987
    Date of Patent: April 4, 1989
    Assignee: Battelle-Institut e.V.
    Inventors: Karl-Heinz Grunthaler, Dieter Langbein, Fehmi Nilmen, Heinrich Winter
  • Patent number: 4810289
    Abstract: A process of hot isostatic pressing of powders to form electrical contacts is characterized by the steps: (A) mixing powders, 1 in the Drawing, from metal containing powder or metal containing powder plus carbon powder, where at least one of Ag and Cu is present, (B) thermal cleaning treatment of the powder, 2 in the Drawing, (C) granulating the thermally treated powder, 3 in the Drawing, (D) uniaxially pressing the powders without heating, 5 in the Drawing, to provide a compact, (E) placing at least one compact in a pressure-transmitting, pressure-deformable container, 6 in the Drawing, and surrounding each compact with fine particles of a separating material, (F) evacuating air from the container, 7 in the Drawing, (G) sealing the compacts inside the container, 8 in the Drawing, (H) hot isostatic pressing, 9 in the Drawing, the compacts through the pressure transmitting material at a pressure from 352 kg/cm.sup.2 to 2,115 kg/cm.sup.2 and a temperature from 0.5.degree. C. to 100.degree. C.
    Type: Grant
    Filed: April 4, 1988
    Date of Patent: March 7, 1989
    Assignee: Westinghouse Electric Corp.
    Inventors: Norman S. Hoyer, Natraj C. Iyer
  • Patent number: 4799955
    Abstract: Disclosed is a composite metal powder made from a base iron powder milled with an alloying component such as nickel, copper, managnese, chromium, silicon, phosphorus, boron, vanadium, and molybdenum, where the composite metal powder has a compressibility comparable to the compressibility of the soft base iron powder prior to milling. Such a composite is obtained by using a short mill time followed by an annealing step.
    Type: Grant
    Filed: October 6, 1987
    Date of Patent: January 24, 1989
    Assignee: Elkem Metals Company
    Inventor: Melvin L. McClellan
  • Patent number: 4781980
    Abstract: The present invention provides a copper powder for use in a conductive paste which allows the paste to possess excellent initial electrical conductivity, thermal resistance, and humidity resistance, and which enables the paste to maintain stable electrical conductivity for a long period of time. The copper powder of the present invention comprises a raw material copper powder; an anti-oxidization film comprising an organic acid salt of a higher aliphatic amine which is formed on the surface of the copper powder; and a surface film which comprises 0.2 to 10 parts by weight of a dispersing agent of a boron-nitrogen composite type and 0.1 to 10 parts by weight of at least one coupling agent of the group consisting of isopropyl-triisostearoyl-titanate and aceoalkoxy-aluminum-diisopropylate, relative to 100 parts by weight of the copper powder, and which is formed on the anti-oxidization film.
    Type: Grant
    Filed: March 23, 1987
    Date of Patent: November 1, 1988
    Assignee: Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Masayoshi Yoshitake, Shigeru Kito, Jiro Yamamoto
  • Patent number: 4775414
    Abstract: Inorganic adhesives suitable for bonding metals to metals, metals to ceramics, or ceramics to ceramics with high bonding strength are disclosed, which contain a composite mechanical alloy powder comprising:(a) from about 10 to 60 wt % of particles of at least one of Cu and Ni;(b) from about 10 to 80 wt % of particles of at least one of Ti, Nb, and Zr; and(c) from about 10 to 80 wt % of Ag particles.The composite powder can be dispersed in an organic solvent to form a paste adhesive.
    Type: Grant
    Filed: June 26, 1987
    Date of Patent: October 4, 1988
    Assignee: Showa Denko Kabushiki Kaisha
    Inventor: Takashi Shoji
  • Patent number: 4769071
    Abstract: There is provided a process for infiltrating a compacted ferrous powder metal body with copper or a copper alloy which process is characterized by presintering the ferrous metal body at a temperature of from about 1875.degree. F. to a temperature below the melting point of the infiltrant, and then in the same furnace, raising the temperature above the melting point of the copper or copper alloy infiltrant for a period sufficient to infiltrate the powder metal body. This process is more economical than the prior double run infiltration processes and provides excellent impact strengths and tensile strengths.
    Type: Grant
    Filed: August 21, 1987
    Date of Patent: September 6, 1988
    Assignee: SCM Metal Products, Inc
    Inventors: Erhard Klar, Mark Svilar