With Preparatory Or Simultaneous Ancillary Treatment Of Work Patents (Class 83/14)
-
Publication number: 20100295055Abstract: To improve an adhesion to a substrate holder, and improve a device production yield by uniformizing a temperature distribution in a surface of a substrate and uniformizing characteristics such as a film thickness.Type: ApplicationFiled: November 17, 2009Publication date: November 25, 2010Applicant: Hitachi Cable, Ltd.Inventor: Shunsuke YAMAMOTO
-
Publication number: 20100275752Abstract: Clean-Necks System is a hair cutting method and apparatus that may be used by an individual to accurately trim his or her own hair. The clean-necks system may fasten around an individual's head using hook and loop fasteners. In a size-adjustable embodiment, notches found on the back may adjust the size of the unit, allowing use of the product by both adults and children. The bands that hold the clean-necks system around an individual's head may be elastic and flexible for comfort. A curved sloping guard may be attachable on the back of the clean-necks system whereby the curved sloping guard may be adjusted as desired by the user and may provide a cutting line. Once the clean-necks system is comfortably in place, individuals may utilize standard beard or hair trimmers and follow the curved sloped guard to cleanly remove hair from their neck in a straight line. Hair that is contained above and within the clean-necks system will be protected from unintentional shaving or cutting by the user.Type: ApplicationFiled: April 23, 2010Publication date: November 4, 2010Inventor: Sam Ciccarelli
-
Publication number: 20100206684Abstract: A method for producing fibril-exhibiting high-performance fibers comprising the steps a) providing an organic, high-performance filament yarn having a breaking tenacity of at least 10 g/dtex and a modulus of elasticity in extension of at least 150 g/dtex, b) fibrillation of the high-performance filament yarn in a dry yarn state, through which a fibril-exhibiting high-performance filament yarn results, and c) cutting the fibril-exhibiting high-performance filament yarn resulting from step b) into fibril-exhibiting high-performance chopped fibers of substantially the same length, fibril-exhibiting high-performance chopped fibers of substantially the same length, an article comprising said fibers and one or more fillers, and a method for producing such an article are presented.Type: ApplicationFiled: October 9, 2008Publication date: August 19, 2010Applicant: Teijin Aramid GmbHInventors: Michael Schmitt, Gerald Ortlepp
-
Publication number: 20100132520Abstract: In a method for slotting a pipe, a sacrificial liner is inserted into the pipe and radially expanded into contact against the inner pipe wall surface, where-upon rotating blades are plunged through the pipe wall and partially into the sacrificial liner. The sacrificial liner prevents the formation of wickers, and prevents cuttings and cutting fluid from entering the interior of the pipe, thus facilitating production of wicker-free slotted pipe requiring reduced post-slotting cleaning. An apparatus for implementing the method incorporates a fixed seal sub-assembly and a movable seal sub-assembly, interconnectable to form an elongate assembly which is adjustable to suit different pipe lengths. A cylindrical re-usable liner is disposable around the assembled fixed and movable seal sub-assemblies, and sized for insertion into the sacrificial liner. The re-usable liner may be expanded by internal pressure, thereby expanding the sacrificial liner.Type: ApplicationFiled: March 28, 2008Publication date: June 3, 2010Inventors: Maurice William Slack, Leon K. Jantzen
-
Publication number: 20100129682Abstract: A method for providing coil shaved metal fibers according to the present invention comprises the steps of -providing a metal composite foil, the metal composite foil comprising oat least two metal layers (Lx) for being converted into metal fibers, each pair of adjacent metal layers are mutually separated by a sacrificial layer (Sy) provided from a sacrificial metal, each sacrificial layer (Sy) having a first and second surface, whereby for each sacrificial layer, the first surface contacts one of the pair of adjacent metal layers, the second surface is contacting the other of the pair of adjacent metal layers; -coiling said metal composite foil on a shaft thereby providing a metal coil having one free end surface; -rotating the metal coil and cutting the free end surface of the metal coil by means of a cutting tool, thereby providing a bundle of composite fibers; -removing the sacrificial metal of the sacrificial layers from the composite fibers thereby providing a bundle of metal fibers, each metal fiber beiType: ApplicationFiled: April 25, 2008Publication date: May 27, 2010Inventors: Stefaan De Bondt, Inge Schildermans
-
Publication number: 20100089209Abstract: A method for simultaneously cutting a compound rod of semiconductor material into a multiplicity of wafers. The method includes selecting a first workpiece and a second workpiece, each having two end surfaces; grinding at least one of the two end surfaces of each workpiece so as to create a ground end surface on each workpiece; cementing the ground end surface of the first workpiece to the ground end surface of second workpiece using a fastener so as to produce a compound rod piece having a longitudinal axis, wherein the fastener is disposed between the workpieces so as create a distance between the workpieces; fixing the compound rod piece in a longitudinal direction on a mounting plate; clamping the mounting plate with the compound rod piece in a wire saw; and cutting the compound rod piece perpendicularly to the longitudinal axis using the wire saw.Type: ApplicationFiled: October 14, 2009Publication date: April 15, 2010Applicant: SILTRONIC AGInventors: Alexander Rieger, Hans Oelkrug, Josef Schuster
-
Publication number: 20100073534Abstract: An optical element according to the present invention includes: an optical surface at a center portion thereof; and a spacer section having a predetermined thickness on an outer circumference side of the optical surface, wherein a bottom portion for positioning an adhesive is provided on a further outer circumference side of the spacer section with a tapered portion interposed therebetween.Type: ApplicationFiled: September 23, 2009Publication date: March 25, 2010Applicant: Sharp Kabushiki KaishaInventors: Yuji Yano, Kenji Hirano
-
Publication number: 20100073533Abstract: An optical element according to the present invention includes: an optical surface at a center portion thereof; a spacer section having a predetermined thickness on an outer circumference side of the optical surface; a support plate including one or a plurality of through holes penetrating the optical surface, inside a transparent resin material; and a penetrating portion and/or a concave portion for releasing the resin material when forming resin, in a further outer peripheral portion of the support plate.Type: ApplicationFiled: September 23, 2009Publication date: March 25, 2010Applicant: Sharp Kabushiki KaishaInventors: Yuji Yano, Takahiro Nakahashi, Tetsuya Tamiya
-
Publication number: 20100073532Abstract: An optical element according to the present invention is provided, which comprises an optical surface at a center portion thereof; and a spacer section having a predetermined thickness on an outer circumference side of the optical surface, in which a surface height of the spacer section is configured to be higher than a surface height of the optical surface.Type: ApplicationFiled: September 22, 2009Publication date: March 25, 2010Applicant: Sharp Kabushiki KaishaInventors: Yuji Yano, Shigeru Yasukawa
-
Publication number: 20100050837Abstract: A method is described for measuring a workpiece on a machine tool using an analogue probe having a deflectable stylus. The method comprises the step of taking a workpiece having a nominal surface profile, the workpiece being located within the working area of the machine tool. The machine tool is used to move the analogue probe along a predetermined (known) measurement path relative to the workpiece whilst deflection of the stylus is measured. The analogue probe is moved relative to the workpiece at a speed greater than five millimeters per second and the predetermined measurement path is selected to provide intermittent contact between the stylus and the workpiece.Type: ApplicationFiled: December 11, 2007Publication date: March 4, 2010Applicant: RENISHAW PLCInventors: John Charles Ould, Kevin James Tett
-
Publication number: 20100024615Abstract: A shaving device that includes a shaving head intended to be moved in contact with the skin, where the head has at least one blade made of conducting material having a cutting edge suitable for cutting hairs. The blade is supplied electrically by a current source suitable for transmitting a current generating an electrolysis effect at the root of a hair. A shaving method employing current transmission by the blade is also described.Type: ApplicationFiled: September 20, 2007Publication date: February 4, 2010Applicant: Societe BICInventors: Jean Rebaudieres, Jérôme Buscail
-
Publication number: 20100018369Abstract: A method and system for thin cutting and a cutting tip, the system comprising a saw unit and a guiding unit comprising at least one pair of guides, wherein each pair is configured to impose pressure on corresponding two opposite pre-cut longitudinal edges of a block of raw material and to guide said block of raw material into said saw unit. The cutting tip for thin cutting saw comprises a cutting edge and a root of said tip, located ahead of the cutting edge in the cutting direction. The method for thin cutting comprising guiding a block of raw material into a saw unit by imposing pressure by at least one pair of guides on corresponding two opposite pre-cut longitudinal edges of a block of raw material.Type: ApplicationFiled: July 21, 2009Publication date: January 28, 2010Inventor: Arnon Lavi
-
Publication number: 20100011922Abstract: An apparatus for cutting food product includes an ultrasonic resonant horn. A reciprocating cutting tool is mounted with respect to the ultrasonic resonant horn, and includes a plurality of longitudinally oriented first cutting blades and a plurality of transversely oriented second cutting blades. Each second cutting blade is positioned between and connected with adjacent first cutting blades. Also disclosed is a method for forming a plurality of food product cubes from a food product base.Type: ApplicationFiled: July 8, 2009Publication date: January 21, 2010Inventor: Roberto Capodieci
-
Publication number: 20090282959Abstract: A method for removing flooring from a substrate. A blade is forced between the flooring and substrate and is pneumatically actuated to separate the flooring from the substrate. The blade and actuating elements are contained in a tool having a handle and rolling means for facilitating movement such that the tool can be easily moved horizontally. The removed flooring may be directed towards the front of the tool so that the removed flooring can be easily disposed of. The blade may rotate, move vertically, or any combination of the two. The blade's precise movement is defined by linkages between a pneumatic cylinder and the blade.Type: ApplicationFiled: May 15, 2009Publication date: November 19, 2009Inventor: Douglas C. Willis
-
Publication number: 20090265949Abstract: It is extremely important that wall board form a tight seal between the top of wall board and when fluted deck is the roof that meets the wall board. The present invention relates to a template useful for preparing wall board or related building material to match the fluting pattern of fluted deck panels to form a seal between the decking panels and walls of a building.Type: ApplicationFiled: April 22, 2009Publication date: October 29, 2009Inventor: John P. Ruppe, III
-
Publication number: 20090265948Abstract: It is extremely important that wall board form a tight seal between the top of wall board and when fluted deck is the roof that meets the wall board. The present invention relates to a template useful for preparing wall board or related building material to match the fluting pattern of fluted deck panels to form a seal between the decking panels and walls of a building.Type: ApplicationFiled: April 24, 2008Publication date: October 29, 2009Inventor: John P. Ruppe, III
-
Publication number: 20090260493Abstract: A module for automatic scrap wire isolating and removal is used in systems such as wire insulation lines for extricating scrap wires while minimally interfering with the mechanized wire insulation process. One such module includes a knife assembly with a knife, a scrap tray with a tilt plate for catching the scrap wire below the knife assembly, an accumulator with curved hooks oriented for catching and accumulating, one at a time, the wire and the scrap wire and rotatable for letting go, one at a time, of the wire and scrap wire, so as to allow the knife to completely separate the scrap wire from the wire. A lifting linkage in this module is operatively engaged with the tilt plate tilting it at an angle sufficient for the isolated scrap wire to slide off, whereby the scrap wire is removed.Type: ApplicationFiled: June 30, 2009Publication date: October 22, 2009Inventors: Harold James Hattersley, JR., Richard E. Jakubowski
-
Publication number: 20090133549Abstract: A cutter blade is relatively moved along an outer periphery of a semiconductor wafer, and dust generated at a tape cutting site by the cutter blade and attached to an upper surface of the protective tape is collected with a dust collecting member which relatively moves with the cutter blade with respect to the semiconductor wafer, and the dust collected at a predetermined portion is suctioned and removed with a suction nozzle after the completion of tape cutting.Type: ApplicationFiled: November 23, 2008Publication date: May 28, 2009Inventors: Naoki Ishii, Masayuki Yamamoto
-
Publication number: 20090088706Abstract: A hemorrhoid pad includes a folded laminated body having a folded end and two opposite folded halves diverging from the folded end. Each of the folded halves of the folded laminated body has inner and outer surfaces. The inner surfaces of the folded halves have a release agent coated thereon and face toward each other.Type: ApplicationFiled: April 4, 2008Publication date: April 2, 2009Applicant: KANG NA HSIUNG ENTERPRISE CO., LTD. Jung-Chi Tai, PresidentInventors: Jung-Chi Tai, Chun-Meng Huang, Ho-Hsi Yang, Chien-Chung Su
-
Publication number: 20080250904Abstract: A food processing system is provided for outputting groups of slices of a food product, with each group having a weight greater than a predetermined group weight threshold. The system includes a food slicing machine (10) having control means (32) for regulating the thickness of the slices cut by the machine so that they are cut according to the current value of a slice size parameter. Means (26) are provided for generating an under-weight signal responsive to the generation of any groups of slices by the slicing machine having a weight less than the predetermined group weight threshold, and an end-of-line weighing means monitors the weight of groups of slices outputted by the system and generates an end-of-line weight signal responsive thereto.Type: ApplicationFiled: April 10, 2008Publication date: October 16, 2008Applicant: AEW DELFORD SYSTEMS LIMITEDInventor: Richard David Seager
-
Publication number: 20080230575Abstract: An item such as a hanger for apparels made from corrugated boards is described. The item is made from one, two or more sheets of stacked corrugated boards. An adhesive material is applied to adhere the sheets together. The corrugations in the board(s) in the peripheral areas of the item are crushed to reduce the air gap in the corrugations. Also described are manufacturing methods for making such an item.Type: ApplicationFiled: June 2, 2008Publication date: September 25, 2008Inventor: Joseph Nazari
-
Publication number: 20080210065Abstract: A method for cutting a lead terminal of a packaged electronic component including a resin package (5), an element (2) covered by the package (5), and a lead terminal (3) connected to the element (2) and including a protruding portion extending out of the package (5). The method includes the steps of forming a narrow bridge portion (23) at the lead terminal (3) by removing a part of the protruding portion, providing a metal plate to the protruding portion of the lead terminal (3), and cutting the lead terminal (3) at the narrow bridge portion (23).Type: ApplicationFiled: January 18, 2006Publication date: September 4, 2008Applicant: ROHM CO., LTD.Inventors: Masahiro Noda, Masahiko Kobayakawa, Tadatoshi Miwa
-
Publication number: 20080121079Abstract: Concave/convex portions are consecutively formed on a back of a band saw blade. The concave/convex portions include concave portions engageable with and disengageable from a backup guide of a band saw guide unit, and convex portions adjacent to the concave portions. A length of each of the concave/convex portions is configured to be equal to or smaller than four times a maximum pitch of a tooth top of each tooth.Type: ApplicationFiled: August 18, 2005Publication date: May 29, 2008Applicant: AMADA COMPANY, LIMITEDInventors: Toshiyuki Hashimoto, Yuji Nagano, Susumu Tsujimoto
-
Patent number: 7351282Abstract: Cutting method of ingot into wafers along cleavage plane. Onto surface of single crystal ingot 10 is implanted ion beam 23 to generate lattice defects in a direction defined by the crystal axes that corresponds to the cleavage plane. Cleavage is generated by applying a shock by a knife edge to the position of the lattice having a cutting face as a cleavage plane. Production time of waters is reduced with a more numbers of sliced wafers from one ingot.Type: GrantFiled: May 7, 2003Date of Patent: April 1, 2008Assignee: Kabushiki Kaisha Y.Y.L.Inventor: Sataro Yamaguchi
-
Publication number: 20080038540Abstract: The present invention relates to an adhesive sheet including a substrate and, an adherent layer containing heat-expandable microspheres, the adherent layer being disposed on at least one side of the substrate, in which the adherent layer has a thickness of 10 to 38 ?m, and wherein the heat-expandable microspheres have a maximum particle diameter equal to or smaller than the thickness of the adherent layer and have a mode diameter of 5 to 30 ?m. The adhesive sheet of the invention enables a high-accuracy processing in the step of processing an electronic part such as a small ceramic capacitor to thereby greatly improve product characteristics and productivity.Type: ApplicationFiled: August 14, 2007Publication date: February 14, 2008Applicant: NITTO DENKO CORPORATIONInventors: Takamasa HIRAYAMA, Kazuyuki KIUCHI, Masaaki SATO, Yukio ARIMITSU, Daisuke SHIMOKAWA, Tomoko KISHIMOTO
-
Patent number: 7073419Abstract: A method and apparatus for slicing a food product. The food product is moved in a conveying direction toward a rotary cutter driven in a cutting plane. A sensor detects the width of the food product and provides an output to an adjustment circuit which moves the food product in a direction transverse to the conveying direction.Type: GrantFiled: September 5, 2002Date of Patent: July 11, 2006Assignee: Weber MaschinenbauGmbH & Co. KGInventor: Günther Weber
-
Patent number: 7017462Abstract: A held method of cutting a fiber optic cable having an optical fiber surrounded by at least one protective layer comprises providing a cutting tool having opposingly directed blunt surfaces and opposingly directed sharp surfaces. The cutting tool is movable between an opened position and a closed position. This method also comprises the steps of positioning the fiber optic cable between the opposingly directed blunt surfaces and moving the cutting tool toward the closed position sufficiently to crush the optical fiber without cutting through the protective layer. The method further comprises the steps of moving the cutting tool toward the opened position sufficiently to release the fiber optic cable from between the blunt surfaces, positioning the fiber optic cable between the opposingly directed sharp surfaces and moving the cutting tool toward the closed position sufficiently to cut through the protective layer.Type: GrantFiled: December 8, 2004Date of Patent: March 28, 2006Assignee: IDEAL Industries, Inc.Inventor: Laszlo Hullam
-
Patent number: 6904226Abstract: A method of preparing a coated optical fiber for coupling to a face of an optical device includes placing the coated fiber so that it extends through a stripping station, a cleaning station and a cleaving station. A stripper at the stripping station is brought into engagement with the fiber and relative motion between the fiber and the stripping station, the cleaning station and the cleaving station is effected lengthwise of the fiber, whereby the coating is stripped from a medial length segment of the fiber as the cleaning device at the cleaning station is activated for cleaning fragments of coating material from the medial length segment of the fiber as the medial length segment passes through the cleaning station and the cleaning device is deactivated and stripping is discontinued.Type: GrantFiled: March 15, 2002Date of Patent: June 7, 2005Inventors: David A. Kritler, Warren R. Hill, Frederic Campbell Schildmeyer, Christiaan Johannes Brokke, Francis Martin Ernest Sladen, Damien Slevin, John W. Dyer
-
Patent number: 6810778Abstract: A method for producing a profiled spine in a book having a first side defining a first plane, a second side defining a second plane and a spine. The method includes clamping the book using a first clamp element contacting the first side and the second clamp element contacting the second side and moving the first element with respect to the second element so as to skew the spine by moving at least one of the first side in the first plane and the second side in the second plane.Type: GrantFiled: October 15, 2002Date of Patent: November 2, 2004Assignee: Heidelberger Druckmaschinen AGInventors: Timothy Andrew Burke, John Brian Duquette
-
Patent number: 6800231Abstract: A method for cuffing suture, including: feeding the suture to a drawing axis for drawing and cutting thereof; heating the suture to stiffen a small length; gripping the suture and alternately drawing it along the drawing axis by first and second grippers; cutting the suture to provide uniform lengths; and providing a predetermined length of suture travel between the heating step and the cutting step, which is a discrete number, two or more, times the uniform length of suture being cut by the apparatus, to provide a discrete number, two or more, of apparatus cutting cycles between heating of the suture and cutting of the suture, whereby after heating of a small length of suture, the suture is cooled to allow setting and hardening of the suture material prior to cutting.Type: GrantFiled: February 5, 2001Date of Patent: October 5, 2004Assignee: Ethicon, Inc.Inventors: David D. Demarest, John F. Blanch, William F. Smith
-
Publication number: 20040074355Abstract: There is provided a rotatable cutting tool for supporting at least one knife in at least two alternate angular cutting configurations. The cutting tool includes a body that defines at least one cavity extending generally in a longitudinal direction of the body. Each cavity is defined by first and second knife support surfaces, which are provided in an opposing, non-parallel configuration. The first knife support surface is configured to support one of the knives that is urged against the first surface at a first hook angle, and the second knife support surface is configured to support one of the knives that is urged against the second surface at a second hook angle, which is different from the first hook angle.Type: ApplicationFiled: October 22, 2002Publication date: April 22, 2004Applicant: Moulder Services, Inc.Inventor: David Daniel Rankin
-
Publication number: 20040055634Abstract: Cutting method of ingot into wafers along cleavage plane. Onto surface of single crystal ingot 10 is implanted ion beam 23 to generate lattice defects in a direction defined by the crystal axes that corresponds to the cleavage plane. Cleavage is generated by applying a shock by a knife edge to the position of the lattice having a cutting face as a cleavage plane. Production time of waters is reduced with a more numbers of sliced wafers from one ingot.Type: ApplicationFiled: May 7, 2003Publication date: March 25, 2004Applicant: KABUSHIKI KAISHA Y.Y.L.Inventor: Sataro Yamaguchi
-
Publication number: 20020194969Abstract: The method and apparatus are for controlling a longitudinal shifting of an elongated piece along a predetermined length SL as said piece moves transversely within a plane at a given speed PS. The apparatus comprises a longitudinal arm having a given length PL pivotable within the plane to shift the piece; a flexible link operatively mounted around the arm to contact the piece as the arm is pivoted to shift the piece; a controllable pivoting means for pivoting the arm according to an angle &thgr; determined in relation to the predetermined length SL and the given length PL; and a controllable driving means for driving the flexible link around the arm according to a speed SS determined in relation to the speed PS of the piece and the angle &thgr; so that the longitudinal shifting is controlled.Type: ApplicationFiled: April 25, 2002Publication date: December 26, 2002Applicant: GEMOFOR INC.Inventor: Gino Jobin
-
Publication number: 20020181919Abstract: The present invention provides a method and an apparatus for cutting a plastic optical fiber having a cladding layer. The method includes a plurality of cutting steps for performing rough cutting under a rough cutting condition and finish cutting under a controlled cutting condition. With this method, since a load applied to an optical fiber upon cutting is reduced, degradation of transmission characteristics of the optical fiber after cutting can be reduced.Type: ApplicationFiled: May 20, 2002Publication date: December 5, 2002Inventor: Nobuyuki Yasuda
-
Publication number: 20020145731Abstract: A method of preparing a coated optical fiber for coupling to a face of an optical device includes placing the coated fiber so that it extends through a stripping station, a cleaning station and a cleaving station. A stripper at the stripping station is brought into engagement with the fiber and relative motion between the fiber and the stripping station, the cleaning station and the cleaving station is effected lengthwise of the fiber, whereby the coating is stripped from a medial length segment of the fiber as the cleaning device at the cleaning station is activated for cleaning fragments of coating material from the medial length segment of the fiber as the medial length segment passes through the cleaning station and the cleaning device is deactivated and stripping is discontinued.Type: ApplicationFiled: March 15, 2002Publication date: October 10, 2002Inventors: David A. Kritler, Warren R. Hill, Frederic Campbell Schildmeyer, Christiaan Johannes Brokke, Francis Martin Ernest Sladen, Damien Slevin, John W. Dyer
-
Publication number: 20010054340Abstract: A method of cutting a magnetic recording medium comprising the steps of conveying a web by rollers to guide the web to a cutting blade; and cutting the web by the cutting blade in the lengthwise direction of the web so that magnetic recording mediums are formed, wherein a dynamic unbalance of at least a roller immediately before the cutting blade is made to be 20 g or smaller, and the roller guides the web to the cutting blade.Type: ApplicationFiled: November 16, 1999Publication date: December 27, 2001Inventor: SHINGO FUJIKATA
-
Patent number: 6315852Abstract: The invention concerns a process for the production of osteosynthesis plates with a varying thickness to whatever degree. The plates are manufactured by a metal cutting process carried out on a composite structure made by a layer of the material which will form the osteosynthesis plate, bound through a layer of adhesive to a supporting layer with high thermal conductivity and mechanical strength. When the cutting process terminates, the osteosynthesis plate is separated from the supporting layer by heating the composite structure until the adhesive melts or by using a thinner suitable for the adopted adhesive.Type: GrantFiled: February 26, 1999Date of Patent: November 13, 2001Inventors: Anna Magrini, Maurizio Carta
-
Patent number: 6309202Abstract: Apparatus for cutting an indefinite length suture to uniform lengths for subsequent threading and swaging to surgical needles includes a drawing tower having first and second guide members defining a drawing axis parallel thereto. First and second grippers are provided to grip the indefinite length suture and to alternately draw it along the drawing axis, with each gripper being mounted for reciprocal movement along a guide member. Each gripper alternately grips the suture and draws it a distance beyond the location of a cutter assembly while the other gripper reciprocates to a start position before the cutter assembly. A tipping assembly heats a predetermined small length of the suture to stiffen the suture thereat after subsequent cooling, in preparation for cutting the suture and inserting a stiffened lead cut end of the suture into an end of a needle for swaging thereto.Type: GrantFiled: February 21, 1997Date of Patent: October 30, 2001Assignee: Ethicon, Inc.Inventors: David D. Demarest, Timothy Lenihan
-
Patent number: 6206677Abstract: Apparatus for cutting an indefinite length suture to different lengths for subsequent threading and swaging to surgical needles includes a drawing tower having first and second guide members defining a drawing axis parallel thereto. First and second grippers are provided to grip the indefinite length suture and to alternately draw it along the drawing axis, with each gripper being mounted for reciprocal movement along a guide member. Each gripper alternately grips the suture and draws it a distance beyond the location of a cutter assembly while the other gripper reciprocates to a start position before the cutter assembly. A tipping assembly heats a predetermined small length of the suture to stiffen the suture thereat after subsequent cooling, in preparation for cutting the suture thereat and inserting a stiffened lead cut end of the suture into an end of a needle for swaging thereto.Type: GrantFiled: February 21, 1997Date of Patent: March 27, 2001Assignee: Ethicon, Inc.Inventors: David D. Demarest, John F. Blanch, William F. Smith
-
Patent number: 6128816Abstract: An apparatus for cutting an indefinite length suture strand to uniform lengths for subsequent threading and swaging to a surgical needle includes a drawing tower having at least one guide member defining a drawing axis parallel thereto. First and second gripping devices are provided to grip the indefinite length suture strand and draw it along the drawing axis; each gripping device mounted for reciprocal movement on at least one guide member. A retractable cutter for cutting the indefinite length suture strand is also provided for cutting the strand at a start position along the drawing axis. The indefinite length suture strand is fed to the drawing axis and drawn a predetermined distance beyond the location of the retractable cutter for positioning within a suture receiving opening formed in the surgical needle, while the second gripping device reciprocates to a start position along the drawing axis.Type: GrantFiled: June 4, 1997Date of Patent: October 10, 2000Assignee: Ethicon, Inc.Inventors: David Demarest, Timothy Lenihan, William Rattan
-
Patent number: 6035845Abstract: A saw strip for fixing a crystal of semiconductor material when cutting wafers from this crystal using a wire saw, and a method for cutting wafers using the saw strip. The strip has a section adjoining the crystal that has a hardness which essentially corresponds to the hardness of the crystal. The saw strip may be a composite of several sections and/or may have a hollow cross section.Type: GrantFiled: August 18, 1998Date of Patent: March 14, 2000Assignee: Wacker Siltronic Gesellschaft fur Halbleitermaterialien AGInventor: Maximilian Kaser
-
Patent number: 5972154Abstract: The present invention pertains to methods for dicing wafers which are capable of easily removing chips of an adhesive of a dicing tape adhering on the wafer during dicing by cleaning using cleaning water. One method of dicing a wafer includes sticking an adhesive member having a layer of adhesive on a surface of the wafer. An adhesive force of the adhesive member is reduced along a plurality of dicing lines on the wafer without reducing the adhesive force of the adhesive member between the plurality of dicing lines. After the adhesive force is reduced along the dicing lines, the wafer is diced along the plurality of dicing lines into a plurality of parts by a blade.Type: GrantFiled: June 27, 1996Date of Patent: October 26, 1999Assignee: Sony CorporationInventor: Tomonori Konya
-
Patent number: 5755911Abstract: An apparatus and method for making a custom shim for a die component having one or more blind holes, where the apparatus includes a preformed laminate having an adhesive layer, a protective layer removably attached to one side of the adhesive layer, and a paper impression layer attached to the opposite side of the adhesive layer. The method includes the steps of removing the protective layer from the adhesive layer, attaching the exposed adhesive layer to a piece of shim stock, applying ink to the surface of the die component having the blind hole(s), placing that surface of the die component on the paper layer to form thereon an ink impression of the die component, removing the die component from the paper layer, cutting the piece of shim stock in accordance with the ink impression, and removing the laminate from the cut shim stock to uncover the custom shim which accurately maintains the relationship between the blind hole and the outer contour of the die component.Type: GrantFiled: September 25, 1996Date of Patent: May 26, 1998Inventor: Terry R. McCall
-
Patent number: 5702556Abstract: The present invention relates to a method and apparatus for producing a laminated product in which the deformation of a base element and the squeeze-out of a viscoelastic element from the periphery of the base element can be eliminated.Type: GrantFiled: September 7, 1995Date of Patent: December 30, 1997Assignee: Minnesota Mining and Manufacturing CompanyInventors: Kiyoshi Okuma, Koichiro Saegusa, Ryozo Shiono
-
Patent number: 5688353Abstract: A method of fabricating a low total density, stabilized ramped honeycomb core for high pressure co-cure molding of a lightweight honeycomb core composite article includes forming the honeycomb core by net shaping stabilized honeycomb core material into a ramped honeycomb core. The ramped honeycomb core is prepared for lay-up and co-cure by applying a layer of low areal weight film adhesive to the upper and lower surfaces and to each ramped surface of the ramped honeycomb core. The honeycomb core material is stabilized for the net shaping operation by applying a layer of low areal weight film adhesive to the upper and lower surfaces of the honeycomb core material in a predetermined picture frame format.Type: GrantFiled: December 26, 1995Date of Patent: November 18, 1997Assignee: Sikorsky Aircraft CorporationInventors: Alex C. Dublinski, Thomas A. Carstensen, Philip J. Ramey
-
Patent number: 5609083Abstract: A method and an apparatus for sectioning a specimen (9) by whereas the apparatus is a microtome. The microtome has at least one optical and one additional sensor (35-37) used for generating signals, the value of which is a measure of the sectioning function. At least one essential sectioning parameter, such as the clearance angle of the knife and/or the sectioning speed, is varied. On the basis of the signal values received, the sectioning parameters concerned are set for optimising the sectioning function. The optical sensor (37) senses greyness and/or surface structure of the sections produced. The other sensors are used e.g. for sensing sound (sensor 35) dependent on the sectioning force or work, or stresses in the knife of the microtome (sensor 36) that are dependent on the sectioning force or work.Type: GrantFiled: February 6, 1992Date of Patent: March 11, 1997Assignee: Glass Ultra Micro Trading CompanyInventor: Algy Persson
-
Patent number: 5480679Abstract: Methods for preventing non-fungal discoloration of logs, wood and wood products that are free of non-fungal discolorations are provided. The wood is treated with a phytotoxic agent in order to prevent enzyme-mediated discoloration of the wood. The wood subsequently may be monitored to determine viability of parenchyma cells. This invention also relates to unmilled wood that is substantially free of non-fungal discolorations and has nonviable parenchyma cells.Type: GrantFiled: April 30, 1993Date of Patent: January 2, 1996Assignee: Regents of the University of MinnesotaInventors: Elmer L. Schmidt, Terry L. Amburgey
-
Patent number: 5335611Abstract: A sewing machine includes two machine halves spaced from one another and each provided with respective tongues capable of displacing pieces of the material web previously cut into pieces on a conveyor, the conveyor being provided with guide rails, one of the rails being formed with a starting portion inclined along and transverse to a travel direction of the conveyor, so that each of the pieces of the web received by the conveyor is delivered to a sewing machine with respective longitudinal edges bent upwardly with respect to a main portion of the web, preventing thereby unraveling the weft upon cutting the web by inherent gravity forces.Type: GrantFiled: May 19, 1992Date of Patent: August 9, 1994Assignee: Carl Schmale GmbH & Co. KGInventor: Johannes Freermann
-
Patent number: 5195411Abstract: A cut edge position correcting apparatus is used for correcting a direction and a wave-like contour of a cut edge of a belt-shaped member cut by a cutter unit. The cut edge position correcting apparatus includes a support base for supporting a belt-shaped member, a bending member arranged extendible above and retractable into the support base for bending the cut edge portion upwardly, and a restraining member rotatable in a horizontal plane for uriging the belt-shaped member over its entire width against the support base. The apparatus further includes a lifting unit for raising and lowering the restraining member, clamp pawls for clamping the cut edge portioned, a plurality of slide plates arranged aligned with each other in a lengthwise direction of the restraining member to hold the cut edge portion over their entire widths in cooperation with the clamp pawls, and a driving unit for independently moving said slide plates relative to the restraining member.Type: GrantFiled: February 4, 1991Date of Patent: March 23, 1993Assignee: Bridgestone CorporationInventor: Koji Okuyama
-
Patent number: 5158522Abstract: Knocked down boxes made of corrugated paperboard are slit longitudinally in an on-line process directly downstream from the folder/gluer in which the boxes are formed. The boxes are first reoriented 90.degree. in a horizontal plane from the positions in which they are formed in the folder/gluer to a reoriented position for movement in a direction transverse to the box fold lines, the boxes are formed into a shingle in the direction of movement, and the shingle is conveyed in that direction into an alignment station. In the alignment station, the lateral edges of the boxes in the shingle are aligned vertically, while the shingle moves through the alignment station, by shifting the boxes transversely to the direction of movement.Type: GrantFiled: September 20, 1991Date of Patent: October 27, 1992Assignee: Marquip, Inc.Inventors: James A. Cummings, Richard F. Paulson