Abstract: The present disclosure relates to a bone conduction earphone. The bone conduction earphone may include an ear hook assembly and a core module. The ear hook assembly may include an ear hook housing. The core module may be disposed on one end of the ear hook assembly. The core module may include a core housing and a core. An opening may be disposed on one end of the core housing to form a chamber structure for accommodating the core. An elastic modulus of the core housing may be greater than an elastic modulus of the ear hook housing.
Type:
Grant
Filed:
July 21, 2023
Date of Patent:
September 24, 2024
Assignee:
SHENZHEN SHOKZ CO., LTD.
Inventors:
Zhen Wang, Zhiqing Liu, Yonggen Wang, Xinnan Mao
Abstract: A headset has earmuffs connected by a connection element. The earmuffs have inner sides facing each other and outer sides facing away from each other in a first transverse direction. The earmuffs extend from a bottom side to a top side in a vertical direction. The earmuffs extend from a first to a second longitudinal side in a second transverse direction. At least one of the earmuffs has a positioning pocket at the outer side with a button arranged therein. The positioning pocket extends across a width in second transverse direction that corresponds to at least 50% of a width of the at least one of the earmuffs. The positioning pocket has a bottom end and a top end and extends in vertical direction from the bottom end to the top end. The top end of the positioning pocket forms a stop edge for fingertips of an operator's hand.
Type:
Grant
Filed:
November 28, 2021
Date of Patent:
March 19, 2024
Assignee:
Andreas Stihl AG & Co. KG
Inventors:
Harald Mang, Maren Langhammer, Julian Danner, Nils Conrad