Patents Represented by Attorney Charles Bergere
  • Patent number: 8350592
    Abstract: A single-supply digital voltage level shifter has a first inverter having a first input for receiving an input signal with a first voltage swing, and a first output for outputting a first output signal. A second inverter has a second input for receiving the first output signal, and a second output for outputting a second output signal with a second voltage swing, where the second output signal is a level-shifted version of the input signal. A comparison stage includes a first comparison stage input for receiving the input signal, a second comparison stage input for receiving the second output signal, and a comparison stage output for outputting a comparison stage output control signal. A control stage is connected in a circuit branch of the first inverter and has a control stage switch that assumes a non-conducting state dependent on a logical state of the comparison stage output control signal.
    Type: Grant
    Filed: January 23, 2012
    Date of Patent: January 8, 2013
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Bipin B. Malhan, Gaurav Goyal, Umesh Chandra Lohani
  • Patent number: 8351291
    Abstract: A semiconductor device has an e-fuse module and a programming current generator. The e-fuse module includes an array of electrically programmable e-fuse elements. The programming current generator has a set of reference transistor elements, a selector for actuating the reference transistor elements to generate a selected reference current, and a current mirror for applying a programming current that is a function of the selected reference current to a selected e-fuse element of the array to program the resistance of the e-fuse element.
    Type: Grant
    Filed: May 6, 2011
    Date of Patent: January 8, 2013
    Assignee: Freescale Semiconductor, Inc
    Inventors: Lini Lee, Yen Hau Lee
  • Patent number: 8350631
    Abstract: A relaxation oscillator for generating oscillator signal includes a ramp voltage generating circuit, a reference voltage generating circuit, a reference voltage switching circuit, and a digital logic circuit. The reference voltage generating circuit generates one or more reference voltages and the ramp voltage generating circuit generates one or more ramp voltages. The ramp voltages are compared with each of the reference voltages by sequentially switching the reference voltages using a reference voltage switching signal generated by the reference voltage switching circuit. The oscillator signal is generated by the digital logic circuit based on the results of the comparisons.
    Type: Grant
    Filed: June 14, 2011
    Date of Patent: January 8, 2013
    Assignee: Freescale Semiconductor, Inc
    Inventors: Sanjay K. Wadhwa, Deependra K. Jain
  • Patent number: 8344713
    Abstract: An LDO regulator system has first and second current mirror circuits connected to its output terminal. A load attached to the output terminal is supplied with a constant voltage. Variations in the load that cause variations in the magnitude of the output voltage trigger one of the first or second current mirror circuits to generate a current that varies the magnitude of a gate voltage of a pass-transistor. The variation in the gate voltage in turns varies the drain current of the pass-transistor, which varies the output voltage to counter the change in the magnitude of the output voltage. Using the first and second current mirror circuits avoids the need for a large load capacitor and very high bandwidth of a conventional LDO regulator.
    Type: Grant
    Filed: January 11, 2011
    Date of Patent: January 1, 2013
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Mithlesh Shrivas, Mayank Jain
  • Patent number: 8338828
    Abstract: A packaged integrated circuit includes a substrate having a wire layout pattern and a solder mask layer. An integrated circuit attached to a surface of the substrate is electrically connected to the wire layout pattern. An encapsulation material covers at least the integrated circuit and the solder mask layer. One or more crack seal rings are disposed on the solder mask surface. The crack seal rings are copper traces with terminals that allow current to be applied to the traces. A broken trace (open circuit condition) is indicative of a crack in the package. Thus, electrical testing is performed to detect physical defects.
    Type: Grant
    Filed: August 5, 2010
    Date of Patent: December 25, 2012
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Boon Yew Low, Teck Beng Lau, Vemal Raja Manikam
  • Patent number: 8338236
    Abstract: A substrate with a vent for a semiconductor device where the vent is integrated within the substrate itself. The integrated air vent forms a passageway or relief path for gas or air within a mold cavity to escape during a transfer molding packaging process. The vents integrated in the substrate reduce trapped gas and mold voids and limit vent flash to improve yield.
    Type: Grant
    Filed: June 15, 2011
    Date of Patent: December 25, 2012
    Assignee: Freescale Semiconductor, Inc.
    Inventor: Boon Yew Low
  • Patent number: 8320201
    Abstract: A method for reading a memory cell (20) of a semiconductor memory (10) includes initiating a precharge or predischarge operation on a bit line (24) prior to arrival of a triggering edge of a clock signal (32) that initiates a read operation. A word line (22) is activated responsive to the triggering edge of the clock signal (32), and data is read from the memory cell (20).
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: November 27, 2012
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Amit Kumar Gupta, Devesh Dwivedi, Sanjeev Kumar Jain, Yatender Mishra
  • Patent number: 8321603
    Abstract: A method for detecting a type of a port connected to a USB connector and a rechargeable device with a USB connector, a USB controller and a power management module. The power management module selectively powers up the USB controller depending on the type of port connected to the USB connector. A hardware detector is connected to the USB connector for determining the port type. If the port type is for recharging only then the power management module does not enable power to the USB controller.
    Type: Grant
    Filed: July 28, 2010
    Date of Patent: November 27, 2012
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Somvir Singh, Asif Iqbal, Rajan Kapoor
  • Patent number: 8321649
    Abstract: A system and a method for configuring a memory controller that communicates with a memory device muxes selected pins for the data transfer. The memory controller includes a set of pins where each pin of the set is associated with a data bit and an address bit. A programmable logic block is connected to the set of pins and uses a subset of the set of pins to enable data transfer between the memory device and the memory controller depending on the size of the memory device such that the pins not included in the subset are available for other applications.
    Type: Grant
    Filed: March 18, 2011
    Date of Patent: November 27, 2012
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Hemant Nautiyal, Dhruv Satsangi
  • Patent number: 8319283
    Abstract: A semiconductor device includes a source region within a semiconductor substrate, a drain region within the semiconductor substrate, a control gate over the semiconductor substrate and between the source region and the drain region, a first gate between the control gate and the drain region, and a first doped region within the semiconductor region and between the control gate and the first gate. The method of forming the semiconductor device may include depositing an electrode material over the semiconductor substrate, patterning the electrode material to form a control gate and a first gate, implanting a first doped region within the semiconductor substrate between the control gate and the first gate while using the control gate and the first gate as a mask, and implanting a source region within the semiconductor substrate.
    Type: Grant
    Filed: May 29, 2009
    Date of Patent: November 27, 2012
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Won Gi Min, John L. Huber, Jiang-Kai Zuo
  • Patent number: 8319608
    Abstract: An electronic control device transmits a function control signal within a predetermined area. Other electronic devices within the predetermined area receive the function control signal. The function control signal initiates a control program in an electronic device in the predetermined area that adjusts one or more user setting conditions of the electronic device, such as audio volume level, display brightness level, etc. The original user setting conditions are returned to their prior values when the device exits the predetermined area or otherwise stops receiving the function control signal.
    Type: Grant
    Filed: August 5, 2009
    Date of Patent: November 27, 2012
    Assignee: Freescale Semiconductor, Inc.
    Inventor: Sadeque Hanif
  • Patent number: 8288814
    Abstract: A semiconductor die includes a first set of metal lines and a second set of metal lines. The first set of metal lines and the second set of metal lines are placed in alternate planes and are orthogonal to each other. A via is used to connect a first metal line from the first set of metal lines with a second metal line from the second set of metal lines. The via location is offset such that a side of the first metal line is aligned with a side of the second metal line. Consequently, a metal line adjacent to the first metal line does not need to detour around the via.
    Type: Grant
    Filed: November 17, 2009
    Date of Patent: October 16, 2012
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Pankaj K Jha, Rajesh Bansal, Chetan Verma
  • Patent number: 8291368
    Abstract: A method for reducing a surface area of a pad limited semiconductor die layout includes choosing an outer die pad row from a group of outer die pad rows on the semiconductor die, each of the outer die pad rows being adjacent an edge of the semiconductor die. Next, the method performs selecting, from the outer die pad row, a common die pad group with die pads that are arranged to be electrically connected to an external connection pad. The method then performs repositioning a subgroup of the common die pad group on an inner die pad row, the inner pad row being adjacent the outer die pad row. After he repositioning there is performed a step of adjusting positions of at least some of the remaining pads in the outer die pad row thereby reducing an overall length of the outer die pad row.
    Type: Grant
    Filed: February 4, 2011
    Date of Patent: October 16, 2012
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Chetan Verma, Sumeet Aggarwal, Meng Kong Lye
  • Patent number: 8289001
    Abstract: A battery charging circuit and a battery charger that stabilizes operation when switching between charging modes. The battery charging circuit includes first and second transistors that form a current mirror circuit with an output transistor. The source terminal of the first transistor is connected to a first resistor, and the source terminal of the second transistor is connected to a second resistor. Each source terminal is connected to a switch circuit, which controls switching between a trickle charge mode and a fast charge mode. The supply of current to the first and second resistors from the discrete transistors reduces the difference in phase lag resulting from the CR time constant and stabilizes operation in the trickle charge and the fast charge modes.
    Type: Grant
    Filed: May 17, 2010
    Date of Patent: October 16, 2012
    Assignee: Freescale Semiconductor, Inc.
    Inventor: Masami Aiura
  • Patent number: 8288847
    Abstract: A dual die semiconductor package has a grid array of electrical contacts on a bottom surface of a substrate. There is a first semiconductor die with a base surface mounted to an upper surface of the substrate and the first semiconductor die has first die upper surface external electrical connection pads on an upper surface that are electrically connected to respective electrical contacts of the grid array. There is also a second semiconductor die with a base surface mounted to an upper surface of a lead frame flag. There are second die upper surface external electrical connection pads on an upper surface of the second semiconductor die. The dual die semiconductor package includes leads and at least some of the leads are electrically connected to respective pads that provide the second die upper surface external electrical connection pads. A package body at encloses the first semiconductor die and the second semiconductor die.
    Type: Grant
    Filed: July 6, 2010
    Date of Patent: October 16, 2012
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Meiquan Huang, Hejin Liu, Wenjian Xu, Dehong Ye
  • Patent number: 8286011
    Abstract: A method and apparatus for storing and classifying packets transmitted over a network to a processor in a low power mode. The processor receives and classifies the packets as interesting or not interesting. Uninteresting packets are discarded while interesting packets are stored in memory. For the first interesting packet received, a receive timer is activated and for every interesting packet received a counter is incremented. A transmit timer is activated when the processor enters the low power mode. When either the receive timer expires, the transmit timer expires or the counter reaches a threshold value then a wake-up interrupt is asserted.
    Type: Grant
    Filed: February 28, 2010
    Date of Patent: October 9, 2012
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Mohit Satsangi, E. S. Kalyana Chakravarthy, Benjamin C. Eckermann, Gregory B. Shippen
  • Patent number: 8283780
    Abstract: A surface mount semiconductor device has a semiconductor die encapsulated in a molding compound. Electrical contact elements of an intermediate set are disposed on the molding compound. A set of coated wires electrically connect bonding pads of the semiconductor die and the electrical contact elements of the intermediate set. A layer of insulating material covers the coated wires, the die and the electrical contact elements of the intermediate set. Electrically conductive elements are exposed at an external surface of the layer of insulating material and contact respective electrical contact elements of the intermediate set through the layer of insulating material.
    Type: Grant
    Filed: November 25, 2010
    Date of Patent: October 9, 2012
    Assignee: Freescale Semiconductor, Inc
    Inventors: Wai Yew Lo, Ly Hoon Khoo, Wen Shi Koh
  • Patent number: 8283898
    Abstract: A battery charging circuit that stabilizes operation when switching between charge modes includes first and second transistors. The first transistor has a source connected to a first switch circuit. The first switch circuit connects the second transistor to either one of first and second external terminals. A mode switch circuit generates a switch signal for switching from a trickle charge mode to a fast charge mode. The mode switching circuit provides the switching signal to a comparison circuit. After a predetermined time elapses, the mode switching circuit provides the switching signal to the switch circuit. The comparison circuit lowers a current restriction reference voltage, which determines a charging current value, and returns the current restriction reference voltage to its original value after switching modes.
    Type: Grant
    Filed: May 17, 2010
    Date of Patent: October 9, 2012
    Assignee: Freescale Semiconductor, Inc.
    Inventor: Masami Aiura
  • Patent number: 8285908
    Abstract: A method for interfacing an out-of-order bus and multiple ordered buses and a bus bridge. The bus bridge includes multiple ordered bus interfaces, where each ordered bus interface is coupled to an ordered bus. A flow control logic circuit is coupled to the out-of-order bus and to the multiple ordered bus interfaces. The flow control logic circuit controls a flow of transaction requests between the out-of-order bus and each of the ordered buses interfaces. The flow control logic circuit includes an updating circuit for updating dependency resolution attributes and data readiness attributes associated with transaction requests, and a shared memory unit for storing the dependency resolution attributes, the data readiness attributes and the transaction requests where the transaction requests are destined to the ordered buses.
    Type: Grant
    Filed: January 24, 2010
    Date of Patent: October 9, 2012
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Amar Nath Deogharia, Hemant Nautiyal
  • Patent number: 8253458
    Abstract: A method to operate a digital phase locked loop (DPLL) in which the DPLL includes a phase-frequency detector that compares the frequency of a reference signal with a feedback signal to generate an error signal. The error signal is used to generate first and second control words. Binary current control word bits and thermometric current control word bits are generated using the first and second control words, respectively. A binary controller switches a first set of binary current sources prior to a frequency lock being achieved using the binary current control word bits and the thermometric current control word bits are held at a predetermined value. After achieving the frequency lock, the binary current sources are fixed and then a thermometric controller switches a second set of thermometric current sources using the thermometric current control word bits.
    Type: Grant
    Filed: January 11, 2011
    Date of Patent: August 28, 2012
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Anand K. Sinha, Sanjay K. Wadhwa