Abstract: A method for wafer registration, the method may include: moving a wafer by an X-Y stage and acquiring wafer edge area images; and processing the wafer edge area images to locate an edge of the wafer. A system that includes a camera, an X-Y stage for moving a wafer; wherein the camera is arranged to acquire wafer edge area images; and a processor that is arranged to process the wafer edge area images to locate an edge of the wafer.

Abstract: A system and a method for milling and inspecting an object. The method may include performing at least one iteration of a sequence that includes: milling, by a particle beam, a first surface of the object, during a first surface milling period; obtaining, by an electron detector, an image of a second surface of the object during at least a majority of the first surface milling period; wherein the object is expected to comprise an element of interest (EOI) that is positioned between the first and second surfaces; milling, by the particle beam, the second surface of the object during a second surface milling period; wherein each of the first surface milling period and the second surface milling period has a duration that exceeds a long duration threshold; obtaining by the electron detector an image of the first surface of the object during at least a majority of the second surface milling period.

Abstract: System, computer readable medium and method. The system includes (i) a data obtaining module arranged to obtain data about at least one portion of an inspected article; and (ii) a processor arranged to perform at least one processing operation of the data out of: (a) processing the data to provide the inspection recipe; and (b) processing the data, while utilizing the inspection recipe, to detect defects; wherein the inspection recipe comprises multiple zones of multiple types of zones; wherein a zone of a first type of zones differs from a zone of a second type of zone.

Abstract: There is provided a chuck that includes a supporting element that is connected to a closing element. An upper surface of the supporting element includes a chemically etched zone and an un-etched zone. The chemically etched zone includes multiple upper areas that are surrounded by trenches. At least one pressurized gas conduit is formed in the supporting element so as to enable pressurized gas provided to a lower surface of the supporting element to propagate through the trenches. The un-etched zone is shaped in response to a shape of an object to be placed on the supporting element. The un-etched zone reduces pressurized gas leakage from the un-etched zone and the closing element reduces pressurized gas leakage from a lower surface of the supporting element when the object is placed on the chuck in alignment with the un-etched zone and pressurized gas is provided to the chuck.

Abstract: A system and a method may be provided. The system may include an illumination module arranged to illuminate an object by short pulses of light that form at least one spot on the object; a collection module that comprises a sensor that is arranged to generate detection signals representative of three dimensional information about the object: and a mechanical stage that is arranged to introduce a movement between the object and at least one of the collection module and the illumination module.

Abstract: A system and a method for printing a desired pattern on a substrate, the method may include: receiving or generating printing instructions for printing multiple patterns during multiple printing iterations, wherein at least two different printing iterations are expected to be executed by different sets of nozzles of an array of nozzles, wherein a superposition of the multiple patterns is expected to differ from the desired pattern by a tolerable difference even when a nozzle of the array of nozzles malfunctions; and printing the multiple patterns during multiple printing iterations, wherein at least two different printing iterations are expected to be executed by different sets of nozzles of the array of nozzles.

Abstract: A method, system and computer program product for controlling a manufacturing process of an electronic circuit, the method includes: calculating at least one layer misalignment between layers of an electrical circuit that are expected to be mutually aligned; wherein the layers are manufactured by at least a direct imaging device that exposes a photo-resistive material to radiation to provide a pattern; selecting, in response to the at least one layer misalignment and in response to at least one allowable misalignment threshold, a selected response out of: manufacturing at least one additional layer of the electrical circuit; and stopping the manufacturing process of the electrical circuit; and participating in executing the selected response.

Abstract: A method for printing a curable ink, the curable ink comprises a mixture of reactive monomers and oligomers; at least one pigment; at least one photo initiator; and at least a resin out of phenolic resin, amino resin and epoxy resin.

Abstract: A system for acquiring multiple images of objects, the system includes: a lateral transferor that comprises multiple lateral transferor portions adapted to transfer the objects to a lateral imaging area in a lateral manner; wherein each lateral transferor portion comprises a object receiver and a transfer element; wherein the transfer element moves the object receiver towards an imaging area unless encountering a resistance that is above a predefined resistance; and an imager that is configured to obtain images of two opposite sides of the object when the objects are positioned at the lateral imaging area.

Abstract: A method, system and a computer program product for evaluating contact elements, the method includes: acquiring images of multiple groups of contact elements, wherein each group of contact element was expected to be contacted during a test by the same group of probes so as to form multiple probe marks; and evaluating at least one characteristic of a first contact element in response to a comparison between a number of potential probe marks that appear in the image of a first contact element and a number of potential probe marks that appear in an image of a second contact element.

Abstract: A method for inspecting a wafer and a system. The system includes: a chuck; and a robot that includes a movable element connected to a detachable adaptor selected from a group of diced wafer detachable adaptors and non-diced wafer detachable adaptors; wherein a diced wafer detachable adaptor is shaped such to partially surround the diced wafer and comprises at least one vacuum groove adapted to apply vacuum on a tape that supports the diced wafer; and wherein the robot is adapted to fetch the wafer from a cassette and to place the wafer on the chuck.

Abstract: A method and an inspection system may be provided. The inspection system may include (a) a hybrid sensor that may include a monochromatic portion that is arranged to obtain a monochromatic image of a first area of an object; a multiple-color portion that is arranged to obtain a multi-colored image of a second area of the object; wherein the monochromatic portion comprises monochromatic sensing elements that sense radiation of a same frequency band; wherein the multiple-color portion comprises color sensing elements of different types, wherein different types of color sensing elements are associated with different frequency bands; (b) a storage element arranged to store the monochromatic image and the multiple-color image; and (c) a defect detection module arranged to detect defects by processing at least one of the monochromatic image and the multiple-color image.

Abstract: A method, a printing system and a printing bridge. The printing bridge is configured to accommodate in a precise manner a jet print head. The jet print head includes first jet nozzles for injecting a first type jettable substance to form a first pattern onto the surface of a object, and a second jet nozzles for injecting a second type of jettable substance to form a first pattern onto the surface of a object. The first type jettable substance is utilized for printing a solder mask pattern and the second type jettable substance is utilized for printing a legend pattern.

Abstract: An illumination module that may include a LED driver; a strip cable comprising multiple conductors that have a high ratio form factor and a low impedance and a low inductance factor; the forms factor is a ratio between a width of the strip cable and a thickness of the strip cable; a group of light emitting diodes (LEDs) that comprises at least one LED; the group of LED is coupled to the LED driver via the strip cable; wherein the LED driver is arranged to activate the group of LEDs by driving a high current short duration driving signal via the strip cable; and wherein the group of LEDs is arranged to emit at least one light pulse in response to the high current short duration driving signal.

Abstract: A method for inspecting an object and an inspection system, the system includes: at least one primary light source followed by at least one illumination path imaging lens adapted to direct at least one primary light beam towards an area of an inspected object; at least one secondary light source followed by at least one collimating component and at least one concentrating component adapted to direct at least one secondary light beam towards the area; wherein the at least one primary light beam and the at least one secondary light beam illuminate the area such that substantially each point within an imaged portion of the area is illuminated over a large angular range characterized by substantially uniform intensity; a collection path that comprises an image sensor, a beam splitter path and a collection path imaging lens; wherein the beam splitter is positioned between the area and between the collection path imaging lens; and wherein the at least one collimating component defines a central aperture through whi

Abstract: An inspection system and a method for defect detection, the method includes: generating a first beam that comprises a near infrared spectral component and a visible light component; directing at least the near infrared spectral component of the first beam towards an inspected object; directing, towards a sensor, a near infrared spectral component of a second beam generated from the illuminating of the inspected object; wherein the sensor is sensitive to visual light radiation and to near infrared radiation; generating, by the sensor, detection signals that are responsive to the near infrared component of the second beam; and detecting defects in the inspected object by processing the detection signals.

Abstract: Method, device, and system, for directed multi-deflected ion beam milling of a work piece, and, determining and controlling extent thereof. Providing an ion beam; and directing and at least twice deflecting the provided ion beam, for forming a directed multi-deflected ion beam, wherein the directed multi-deflected ion beam is directed towards, incident and impinges upon, and mills, a surface of the work piece. Device includes an ion beam source assembly; and an ion beam directing and multi-deflecting assembly, for directing and at least twice deflecting the provided ion beam, for forming a directed multi-deflected ion beam, wherein the directed multi-deflected ion beam is directed towards, incident and impinges upon, and mills, a surface of the work piece.

Abstract: A system and a method for inspection aided printing, the method may include printing, by a printing unit of a system, a pattern on an area of a substrate, during a printing process; inspecting, by an inspection unit of the system, the area to provide inspection results; searching, by a processor of the system, for a defect, based upon the inspection results; and wherein if a defect is found—determining whether to (a) repair the substrate, (b) perform a corrective measure for improving the printing process, or (c) perform no corrective measure in response to the defect.

Abstract: A device for measuring a height of a microscopic structure, the device may include: a storage circuit arranged to store information that comprises amplitude information and phase information, wherein the information is indicative of a shape and a size of the microscopic structure; a mask generation circuit arranged to threshold pixels of the amplitude information to provide a mask that comprises masked amplitude pixels; a phase information circuit arranged to apply the mask on the phase information to provide masked phase pixels; select, out of the masked phase pixels, selected phase pixels that correspond to a phase criterion, the selected phase pixels have selected phase pixels attribute values; find, out of the phase information, elected phase pixels that have the selected phase pixel attribute values; and a height calculation circuit arranged to generate a height measurement result based the elected phase pixels.

Abstract: A system that may include a printing module arranged to print patterns on a substrate by inkjetting ink on the substrate; and a substrate supporting module that comprises: a porous material module for supporting the substrate and providing vacuum to multiple locations of the substrate when the substrate is placed on a flat upper surface of the porous material module; and an interface module that comprises: at least one inlet for receiving vacuum from a vacuum system; at least one outlet for providing the vacuum to the porous material module; and at least one structural element arranged to contact the porous material module and provide mechanical support to the porous material module.