Abstract: An inspection system and a method. The method may include: illuminating the object with impinging light of a first polarization; performing a polarization based filtering of (a) multiple-reflected light signals, each multiple-reflected light signal being reflected from at least two different bevel side surfaces of the object, and (b) additional light signals, each additional light signal being reflected from a single element of the object, such as to suppress the multiple-reflected light signals, and to provide polarization based filtered light signals; and detecting the polarization based filtered light signals.

Abstract: A dark field illuminator that includes: (i) a light source adapted to provide ring of light characterized by uniform intensity distribution; (ii) a collimating ring adapted to receive the ring of light and to direct collimated light beams towards an area of an inspected object such that different points within the area are illuminated by identical cones of light characterized by an incidence angle; and wherein the collimating ring and the light source are co-centric to an optical axis of the dark field illuminator.

Abstract: A method for inspecting a wafer and a system. The system includes: a chuck; and a robot that includes a movable element connected to a detachable adaptor selected from a group of diced wafer detachable adaptors and non-diced wafer detachable adaptors; wherein a diced wafer detachable adaptor is shaped such to partially surround the diced wafer and comprises at least one vacuum groove adapted to apply vacuum on a tape that supports the diced wafer; and wherein the robot is adapted to fetch the wafer from a cassette and to place the wafer on the chuck.

Abstract: A method and an inspection system that includes: a multi wafer support device arranged to concurrently support multiple wafers; optics arranged to acquire images of the multiple wafers supported by the multi wafer support element; a mechanical stage arranged to introduce movement between the multi wafer support element and the optics; and a processor arranged to process the images acquired by the optics.

Abstract: A method and an inspection system may be provided. The inspection system may include (a) a hybrid sensor that may include a monochromatic portion that is arranged to obtain a monochromatic image of a first area of an object; a multiple-color portion that is arranged to obtain a multi-colored image of a second area of the object; wherein the monochromatic portion comprises monochromatic sensing elements that sense radiation of a same frequency band; wherein the multiple-color portion comprises color sensing elements of different types, wherein different types of color sensing elements are associated with different frequency bands; (b) a storage element arranged to store the monochromatic image and the multiple-color image; and (c) a defect detection module arranged to detect defects by processing at least one of the monochromatic image and the multiple-color image.

Abstract: A method for height triangulation measurement particularly for measuring the height of an object on a surface, the method includes: a) illuminating said object from a known angle with a narrow strip of light, having a large numerical aperture along said light strip and a small numerical aperture perpendicular to said light strip; b) imaging said object from a known angle having a large numerical aperture along said light strip and a small numerical aperture perpendicular to said light strip, having an image of said object illuminated by said light strip; and c) calculating the height of said object from the location of said light strip on said image.

Abstract: An inspection method and an inspection system, the inspection system includes: (i) a first group of sensors, for sensing light components of a first light band of an image of an area of an inspected object, and for generating first detection signals reflecting sensed light components of the first light band; (ii) a second group of sensors, for sensing light components of a second light band of the image of the area of the inspected object, wherein the second light band differs from the first light band, and for generating second detection signals reflecting sensed light components of the second light band; (iii) optics, for projecting the image of the area of the inspected object towards the first group of sensors and towards the second array of sensors; and (iv) a processing unit, coupled to the first and second group of sensors, for detecting defects based on the first or second detection signals.

Abstract: A method for analyzing probe mark, the method includes: scanning the probe mark by multiple spots; evaluating a probe mark characteristic in response to detection signals generated by multiple sensors of the chromatic confocal system that is characterized by a sub-micron axial resolution.

Abstract: A system includes a first supporting element, a first supporting element rotation module, a controller and a first optical head. The controller is configured to control a rotation of the first supporting element by the first supporting element rotation module. The first supporting element is coupled to the first optical head. The first supporting element rotation module is configured to rotate the first supporting element until text that is imprinted on a first side of a semiconductor wafer is located within a field of view of the first optical head. Semiconductors wafers of different size have text located at different locations.

Abstract: A method and system for interference based detection of height (H) of a microscopic structure. Wherein N*(Ws/2)>H>(N?1)*(Ws/2); wherein N is a positive integer, w1 is a first wavelength of first light beams used to generate first interference patterns, w2 is a second wavelength of second light beams used to generate second interference patterns, and Ws is a synthetic wavelength and equals a ratio between (i) a product of a multiplication of w1 by w2 and (ii) a difference between w1 and w2.

Abstract: Method and inspection system. The inspection system includes: (i) a stage, for supporting an inspected object and for moving the inspected object by a movement that is characterized by speed variations; (ii) a signal generator, for generating triggering pulses at a fixed frequency regardless of the speed variations; (iii) a stage location generator, for providing location information indicative of a location of the stage at points of time that are determined by the triggering pulses; (iv) a strobe illuminator for illuminating areas of the inspected object in response to the triggering pulses; (v) a camera for acquiring images of areas of the inspected object in response to the triggering pulses; wherein overlaps between the images of the areas of the inspected object are characterized by overlap variations; and (vi) a processor for associating location information to the acquired images.

Abstract: A method for inspecting a wafer and a system. The system includes: a chuck; and a robot that includes a movable element connected to a detachable adaptor selected from a group of diced wafer detachable adaptors and non-diced wafer detachable adaptors; wherein a diced wafer detachable adaptor is shaped such to partially surround the diced wafer and comprises at least one vacuum groove adapted to apply vacuum on a tape that supports the diced wafer; and wherein the robot is adapted to fetch the wafer from a cassette and to place the wafer on the chuck.

Abstract: A system and a method for method for printing a solder mask on a printed circuit board (PCB), the method includes: acquiring images of multiple areas of a PCB by an inspection unit while the PCB is supported by a mechanical stage; determining spatial differences between a model of the PCB and the PCB based on the images; determining solder mask ink deposition locations based on (i) the spatial differences, and (ii) locations of the model of the PCB that should be coated with the solder mask ink; and printing solder mask ink on the solder mask deposition locations by a printing unit, while the PCB is supported by the mechanical stage.

Abstract: A device and a method for supporting an optical component (240) of an optical evaluation system, the device includes: (a) a supporting element (220) that includes a sloped portion (222); (b) at least one movement control component (210) that is coupled to the sloped portion; and (c) a movable element (230), adapted to move along the at least one movement control component; wherein the movable element is adapted to support the optical component; wherein when the movable element supports the optical component a center Of gravity of a combination of the movable element and the optical component is positioned above, the sloped portion or in proximity to the sloped portion.

Abstract: A method for inspecting objects and an inspection system, the system includes: an image acquisition unit adapted to acquire multiple images, according to a predefined image acquisition scheme, of multiple portions of a diced wafer that comprises multiple dice; and a processor adapted to locate multiple unique features within the multiple images, at least partially during the acquisition of images; associate multiple unique features with multiple dice, at least partially during the location of multiple unique features; determine multiple transformations between multiple die coordinate systems and a global coordinate system, in response to a locations of unique features and their associations with multiple dice, at least partially during an association between multiple unique features with multiple dice; and detect defects in response to a comparison between dice and corresponding reference dice, in response to the transformations, at least partially during the determination of the multiple transformations.

Abstract: A method for achieving a clean substrate, the method may include depositing a protective material on an area of a substrate, to prevent the area from being contaminated by a coating material that is to be deposited during a deposition process; and removing the protective material from the area after the coating material was cured.

Abstract: A method for printing a pattern on a electrical circuit, the method includes jetting on the electrical circuit an ultraviolet curable ink to form a pattern; and at least partially curing the ultraviolet curable ink by exposing the pattern to ultraviolet radiation generated from at least one ultraviolet light emitting diode (LED).

Abstract: A wafer inspection system and a method for inspecting a wafer. The method includes: acquiring multiple frames that cover a first area that comprises a die and a first surrounding area that surrounds the die; wherein the frames partially overlap to provide overlap areas; and processing a sequence of decomposed images of overlap areas such as to align mutually misaligned frames and generating a die reference image.

Abstract: A system and a method, the method includes determining or receiving a multiple iteration printing scheme indicative of multiple printing iterations of a coating material to be applied on an electrical circuit that comprises at least one three dimensional structure to be coated by the coating material; wherein the multiple iteration printing scheme is responsive to a shape and size of the at least one three dimensional structure; and performing multiple printing iterations of the coating material, according to the multiple iteration printing scheme; wherein at least one printing iteration is followed by at least partially curing the coating material printed during the at least one printing iteration.

Abstract: A method and a system for printing patterns on an object, is provided. The system may include a copper protective coating printing unit arranged to print copper protective coating ink on the object to provide at least one copper protective coating ink pattern. The system may include zero or more additional printing units selected out of a solder mask printing unit arranged to print solder mask ink on the object to provide at least one solder mask pattern and a notation mark printing unit arranged to print notation mark ink on the object to provide at least one notation mark pattern. The system also includes at least one curing unit arranged to cure each ink printed by each printing unit.