Patents Assigned to Intel Corporation
  • Publication number: 20240143279
    Abstract: Described herein is a technique to implement an efficient floating-point n-input sum of squares operation using faithful rounding to 1 unit in the place (ULP) instead of IEEE rounding. The resulting circuitry is useful to accelerate graphics algorithms that don't require fully IEEE compliant hardware. Multipliers that are 1ulp can be significantly smaller, faster and more power efficient than IEEE rounded multipliers.
    Type: Application
    Filed: December 26, 2023
    Publication date: May 2, 2024
    Applicant: Intel Corporation
    Inventors: Theo Drane, Christopher Louis Poole
  • Publication number: 20240144577
    Abstract: Apparatus and method for non-local means filtering using a media processing block of a graphics processor. For example, one embodiment of a processor comprises: ray tracing circuitry to execute a first set of one or more commands to traverse rays through a bounding volume hierarchy (BVH) to identify BVH nodes and/or primitives intersected by the ray; shader execution circuitry to execute one or more shaders responsive to a second set of one or more commands to render a sequence of image frames based on the BVH nodes and/or primitives intersected by the ray; and a media processor comprising motion estimation circuitry to execute a third set of one or more commands to perform non-local means filtering to remove noise from the sequence of image frames based on a mean pixel value collected across the sequence of image frames.
    Type: Application
    Filed: April 25, 2023
    Publication date: May 2, 2024
    Applicant: Intel Corporation
    Inventors: Attila Tamas AFRA, Johannes GUENTHER
  • Publication number: 20240143020
    Abstract: An apparatus for clock manager redundancy comprises a clock circuitry to manage a clock for a device; a first processing circuitry coupled to the clock circuitry to execute instructions to perform operations for a clock manager, the clock manager to receive messages with time information for a network and generate clock manager control information to adjust the clock to a network time for the network; a hardened execution environment coupled to the clock circuitry and the first processing circuitry, the hardened execution environment to comprise: a detector to monitor the clock manager and generate an alert when the detector identifies abnormal behavior of the clock manager; and a second processing circuitry to execute instructions to perform operations for a redundant clock manager, the redundant clock manager to take over operations for the clock manager in response to the alert from the detector. Other embodiments are described and claimed.
    Type: Application
    Filed: October 26, 2022
    Publication date: May 2, 2024
    Applicant: Intel Corporation
    Inventors: Vuk Lesi, Christopher Gutierrez, Shabbir Ahmed, Marcio Juliato, Manoj Sastry
  • Publication number: 20240143363
    Abstract: An apparatus comprising a memory device, a system on chip (SoC), including a central processing unit (CPU) to execute a virtual machine to retrieve data from the memory device and transmit the data to a remote input/output (I/O) device coupled to a remote computing platform as memory transaction data; and a port to transmit the memory transaction data as transaction layer packets (TLPs) and a network interface card (NIC) to receive the TLPs, including an interface to receive the TLPs and packet conversion hardware to convert the TLPs to network protocol packets and transmit the network protocol packets to the remote I/O memory device.
    Type: Application
    Filed: October 26, 2022
    Publication date: May 2, 2024
    Applicant: Intel Corporation
    Inventor: Reshma Lal
  • Publication number: 20240143410
    Abstract: Technologies for dividing work across one or more accelerator devices include a compute device. The compute device is to determine a configuration of each of multiple accelerator devices of the compute device, receive a job to be accelerated from a requester device remote from the compute device, and divide the job into multiple tasks for a parallelization of the multiple tasks among the one or more accelerator devices, as a function of a job analysis of the job and the configuration of each accelerator device. The compute engine is further to schedule the tasks to the one or more accelerator devices based on the job analysis and execute the tasks on the one or more accelerator devices for the parallelization of the multiple tasks to obtain an output of the job.
    Type: Application
    Filed: January 5, 2024
    Publication date: May 2, 2024
    Applicant: Intel Corporation
    Inventors: Susanne M. Balle, Francesc Guim Bernat, Slawomir Putyrski, Joe Grecco, Henry Mitchel, Evan Custodio, Rahul Khanna, Sujoy Sen
  • Publication number: 20240143802
    Abstract: Embodiments are directed to protection of communications between a trusted execution environment and a hardware accelerator utilizing enhanced end-to-end encryption and inter-context security. An embodiment of an apparatus includes one or more processors having one or more trusted execution environments (TEEs) including a first TEE to include a first trusted application; an interface with a hardware accelerator, the hardware accelerator including trusted embedded software or firmware; and a computer memory to store an untrusted kernel mode driver for the hardware accelerator, the one or more processors to establish an encrypted tunnel between the first trusted application in the first TEE and the trusted software or firmware, generate a call for a first command from the first trusted application, generate an integrity tag for the first command, and transfer command parameters for the first command and the integrity tag to the kernel mode driver to generate the first command.
    Type: Application
    Filed: October 27, 2023
    Publication date: May 2, 2024
    Applicant: Intel Corporation
    Inventors: Salessawi Ferede Yitbarek, Lawrence A. Booth, Jr., Brent D. Thomas, Reshma Lal, Pradeep M. Pappachan, Akshay Kadam
  • Publication number: 20240147230
    Abstract: This disclosure describes systems, methods, and devices related to coexistence network integration. A device may transmit a beacon frame or a probe response frame containing a security element that is not a robust security network element (RSNE) element to indicate opportunistic wireless encryption (OWE) support. The device may identify a first association request frame received from a first station device (STA) comprising an RSNE element with OWE Authentication Key Management (AKM) indicating a compatibility of the first STA with OWE. The device may identify a second association request frame from a second station device (STA) indicating no compatibility with OWE. The device may generate one or more encryption keys for securing data transmission with OWE-compatible STAs. The device may transmit encrypted and unencrypted versions of groupcast data frames to the first STA and the second STA.
    Type: Application
    Filed: December 26, 2023
    Publication date: May 2, 2024
    Applicant: Intel Corporation
    Inventors: Ido OUZIELI, Po-Kai HUANG, Ehud RESHEF
  • Patent number: 11972001
    Abstract: Technologies for securely providing one or more remote accelerators hosted on edge resources to a client compute device includes a device that further includes an accelerator and one or more processors. The one or more processors are to determine whether to enable acceleration of an encrypted workload, receive, via an edge network, encrypted data from a client compute device, and transfer the encrypted data to the accelerator without exposing content of the encrypted data to the one or more processors. The accelerator is to receive, in response to a determination to enable the acceleration of the encrypted workload, an accelerator key from a secure server via a secured channel, and process, in response to a transfer of the encrypted data from the one or more processors, the encrypted data using the accelerator key.
    Type: Grant
    Filed: May 13, 2022
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Ned M. Smith, Brinda Ganesh, Francesc Guim Bernat, Eoin Walsh, Evan Custodio
  • Patent number: 11972165
    Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed for configuring display screen coordinates. An example apparatus includes at least one storage device or storage disk, instructions, and at least one processor to execute the instructions. When executed, the example instructions cause the at least one processor to determine whether a first position of a first display screen is within a threshold of a second position of a second display screen, and in response to determining that the first position is within the threshold of the second position, adjust a first coordinate of the first display screen relative to a second coordinate of the second display screen, the first coordinate and the second coordinate to be adjusted within a graphics properties page related to configuration of content rendering between the first display screen and the second display screen.
    Type: Grant
    Filed: January 24, 2022
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventor: Sean J. Lawrence
  • Patent number: 11973041
    Abstract: Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, the electronic package comprises a mold layer having a first surface and a second surface opposite the first surface, and a plurality of first dies embedded in the mold layer. In an embodiment, each of the plurality of first dies has a surface that is substantially coplanar with the first surface of the mold layer. In an embodiment, the electronic package further comprises a second die embedded in the mold layer. In an embodiment, the second die is positioned between the plurality of first dies and the second surface of the mold layer.
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Srinivas Pietambaram, Gang Duan, Deepak Kulkarni, Rahul Manepalli, Xiaoying Guo
  • Patent number: 11973032
    Abstract: Memory bit cells having internal node jumpers are described. In an example, an integrated circuit structure includes a memory bit cell on a substrate. The memory bit cell includes first and second gate lines parallel along a second direction of the substrate. The first and second gate lines have a first pitch along a first direction of the substrate, the first direction perpendicular to the second direction. First, second and third interconnect lines are over the first and second gate lines. The first, second and third interconnect lines are parallel along the second direction of the substrate. The first, second and third interconnect lines have a second pitch along the first direction, where the second pitch is less than the first pitch. One of the first, second and third interconnect lines is an internal node jumper for the memory bit cell.
    Type: Grant
    Filed: March 8, 2023
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Smita Shridharan, Zheng Guo, Eric A. Karl, George Shchupak, Tali Kosinovsky
  • Patent number: 11972635
    Abstract: In one example, a display includes an array of display pixels. Each display pixel includes at least one light-emitting diode. At least one of the display pixels includes an image sensor.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Akihiro Takagi, Kunjal Parikh
  • Patent number: 11972230
    Abstract: Embodiments for a matrix transpose and multiply operation are disclosed. In an embodiment, a processor includes a decoder and execution circuitry. The decoder is to decode an instruction having a format including an opcode field to specify an opcode, a first destination operand field to specify a destination matrix location, a first source operand field to specify a first source matrix location, and a second source operand field to specify a second source matrix location. The execution circuitry is to, in response to the decoded instruction, transpose the first source matrix to generate a transposed first source matrix, perform a matrix multiplication using the transposed first source matrix and the second source matrix to generate a result, and store the result in a destination matrix location.
    Type: Grant
    Filed: June 27, 2020
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Menachem Adelman, Robert Valentine, Barukh Ziv, Amit Gradstein, Simon Rubanovich, Zeev Sperber, Mark J. Charney, Christopher J. Hughes, Alexander F. Heinecke, Evangelos Georganas, Binh Pham
  • Patent number: 11973923
    Abstract: An example apparatus includes: a camera to record an image; memory to store instructions; and a processor in circuit with the memory, the processor to execute the instructions to: determine a depth based on: (a) the image and (b) a calibration parameter of the camera; and adjust the calibration parameter based on a temperature of the camera and the depth.
    Type: Grant
    Filed: September 2, 2022
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Aviad Zabatani, Sagy Bareket, Ohad Menashe, Erez Sperling, Alex Bronstein, Michael Bronstein, Ron Kimmel, Vitaly Surazhsky
  • Patent number: 11972780
    Abstract: A mechanism is described for facilitating cinematic space-time view synthesis in computing environments according to one embodiment. A method of embodiments, as described herein, includes capturing, by one or more cameras, multiple images at multiple positions or multiple points in times, where the multiple images represent multiple views of an object or a scene, where the one or more cameras are coupled to one or more processors of a computing device. The method further includes synthesizing, by a neural network, the multiple images into a single image including a middle image of the multiple images and representing an intermediary view of the multiple views.
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: April 30, 2024
    Assignee: INTEL CORPORATION
    Inventors: Gowri Somanath, Oscar Nestares
  • Patent number: 11972298
    Abstract: Technologies for migrating data between edge accelerators hosted on different edge locations include a device hosted on a present edge location. The device includes one or more processors to: receive a workload from a requesting device, determine one or more accelerator devices hosted on the present edge location to perform the workload, and transmit the workload to the one or more accelerator devices to process the workload. The one or more processor is further to determine whether to perform data migration from the one or more accelerator devices to one or more different edge accelerator devices hosted on a different edge location, and send, in response to a determination to perform the data migration, a request to the one or more accelerator devices on the present edge location for transformed workload data to be processed by the one or more different edge accelerator devices.
    Type: Grant
    Filed: February 7, 2022
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Evan Custodio, Francesc Guim Bernat, Suraj Prabhakaran, Trevor Cooper, Ned M. Smith, Kshitij Doshi, Petar Torre
  • Patent number: 11973143
    Abstract: Integrated circuit structures having source or drain structures and germanium N-channels are described. In an example, an integrated circuit structure includes a fin having a lower fin portion and an upper fin portion, the upper fin portion including germanium. A gate stack is over the upper fin portion of the fin. A first source or drain structure includes an epitaxial structure embedded in the fin at a first side of the gate stack. A second source or drain structure includes an epitaxial structure embedded in the fin at a second side of the gate stack. Each epitaxial structure includes a first semiconductor layer in contact with the upper fin portion, and a second semiconductor layer on the first semiconductor layer. The first semiconductor layer comprises silicon, germanium and phosphorous, and the second semiconductor layer comprises silicon and phosphorous.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Ryan Keech, Benjamin Chu-Kung, Subrina Rafique, Devin Merrill, Ashish Agrawal, Harold Kennel, Yang Cao, Dipanjan Basu, Jessica Torres, Anand Murthy
  • Patent number: 11972519
    Abstract: Described herein are techniques for learning neural reflectance shaders from images. A set of one or more machine learning models can be trained to optimize an illumination latent code and a set of reflectance latent codes for an object within a set of input images. A shader can then be generated based on a machine learning model of the one or more machine learning models. The shader is configured to sample the illumination latent code and the set of reflectance latent codes for the object. A 3D representation of the object can be rendered using the generated shader.
    Type: Grant
    Filed: June 24, 2022
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Benjamin Ummenhofer, Shenlong Wang, Sanskar Agrawal, Yixing Lao, Kai Zhang, Stephan Richter, Vladlen Koltun
  • Patent number: 11973618
    Abstract: This disclosure relates to apparatuses, systems, and methods for channel estimation, and in particular channel estimation for 5G New Radio systems. The channel estimation interpolates, prior to performing a de-spreading operation, a first combined channel estimation and a second combined channel estimation to provide from the first combined channel estimation one or more channel estimation values at indices associated with the second combined channel estimation and/or to provide from the second combined channel estimation one or more channel estimation values at indices associated with the first combined channel estimation.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: April 30, 2024
    Assignee: INTEL CORPORATION
    Inventors: Thushara Hewavithana, Yuzhou Zhang, Xuebin Yang
  • Patent number: D1024974
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Samantha Rao, Harish Jagadish, Arvind S