Abstract: Thermal heat spreaders and/or an IC die with solderable thermal structures may be assembled together with a solder array thermal interconnects. A thermal heat spreader may include a non-metallic material and one or more metallized surfaces suitable for bonding to a solder alloy employed as thermal interface material between the heat spreader and an IC die. An IC die may include a metallized back-side surface similarly suitable for bonding to a thermal interconnect comprising a solder alloy. Metallization on the IC die and/or heat spreader may comprise a plurality of solderable structures. A multi-chip package may include multiple IC die having different die thickness that are accommodated by a z-height thickness variation in the thermal interconnects and/or the solderable structures of the IC die or heat spreader.
Type:
Grant
Filed:
March 26, 2020
Date of Patent:
May 14, 2024
Assignee:
Intel Corporation
Inventors:
Debendra Mallik, Je-Young Chang, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad
Abstract: An apparatus comprises an input register comprising a state register and a parity field, a first round secure hash algorithm (SHA) datapath communicatively coupled to the state register, comprising a first section to perform a ? step of a SHA calculation, a second section to perform a ? step and a ? step of the SHA calculation, a third section to perform a ? step of the SHA calculation and a fourth section to perform a ? step of the SHA calculation.
Abstract: An embodiment of a latch apparatus for a circuit board comprises a first latch body with a retention mechanism for the circuit board, a second latch body with a coupling mechanism for a connector, and a spring mechanism mechanically coupled between the first latch body and the second latch body. Other embodiments are disclosed and claimed.
Type:
Grant
Filed:
August 24, 2020
Date of Patent:
May 14, 2024
Assignee:
Intel Corporation
Inventors:
Phil Geng, Xiang Li, George Vergis, Mani Prakash
Abstract: Techniques, structures, and materials related to extreme ultraviolet (EUV) lithography are discussed. Multiple patterning inclusive of first patterning a grating of parallel lines and second patterning utilizing EUV lithography to form plugs in the grating, and optional trimming of the plugs may be employed. EUV resists, surface treatments, resist additives, and optional processing inclusive of plug healing, angled etch processing, electric field enhanced post exposure bake are described, which provide improved processing reliability, feature definition, and critical dimensions.
Type:
Grant
Filed:
May 5, 2021
Date of Patent:
May 14, 2024
Assignee:
Intel Corporation
Inventors:
Marie Krysak, James Blackwell, Lauren Doyle, Brian Zaccheo, Patrick Theofanis, Michael Robinson, Florian Gstrein
Abstract: Various embodiments of the present disclosure may be used to determine how activation downlink control information (DCI), release DCI, and dynamic retransmission DCI are distinguished for DCI formats 3_0/3_1 for Mode-1 sidelink resource allocation. Furthermore, in case of asynchronous downlink (DL) and sidelink (SL) carriers, embodiments of the present disclosure may be used to determine how a user equipment (UE) determines transmission slots with respect to system frame number (SFN) or direct frame number (DFN) when activated with Type 1 configured scheduling.
Abstract: Embodiments disclosed herein include memory bitcells and methods of forming such memory bitcells. In an embodiment, the memory bitcell is part of an embedded DRAM (eDRAM) memory device. In an embodiment, the memory bitcell comprises a substrate and a storage element embedded in the substrate. In an embodiment, the storage element comprises a phase changing material that comprises a binary alloy. In an embodiment, the memory bitcell further comprises a first electrode over a first surface of the storage element, and a second electrode over a second surface of the storage element.
Abstract: Techniques are disclosed for using neural network architectures to estimate predictive uncertainty measures, which quantify how much trust should be placed in the deep neural network (DNN) results. The techniques include measuring reliable uncertainty scores for a neural network, which are widely used in perception and decision-making tasks in automated driving. The uncertainty measurements are made with respect to both model uncertainty and data uncertainty, and may implement Bayesian neural networks or other types of neural networks.
Type:
Grant
Filed:
June 24, 2020
Date of Patent:
May 14, 2024
Assignee:
Intel Corporation
Inventors:
Nilesh Ahuja, Ignacio J. Alvarez, Ranganath Krishnan, Ibrahima J. Ndiour, Mahesh Subedar, Omesh Tickoo
Abstract: In one embodiment, an apparatus includes: a first queue to store requests that are guaranteed to be delivered to a persistent memory; a second queue to store requests that are not guaranteed to be delivered to the persistent memory; a control circuit to receive the requests and to direct the requests to the first queue or the second queue; and an egress circuit coupled to the first queue to deliver the requests stored in the first queue to the persistent memory even when a power failure occurs. Other embodiments are described and claimed.
Type:
Grant
Filed:
May 26, 2020
Date of Patent:
May 14, 2024
Assignee:
Intel Corporation
Inventors:
Francesc Guim Bernat, Karthik Kumar, Donald Faw, Thomas Willhalm
Abstract: Embodiments of a system and methods for localized high density substrate routing are generally described herein. In one or more embodiments an apparatus includes a medium, first and second circuitry elements, an interconnect element, and a dielectric layer. The medium can include low density routing therein. The interconnect element can be embedded in the medium, and can include a plurality of electrically conductive members therein, the electrically conductive member can be electrically coupled to the first circuitry element and the second circuitry element. The interconnect element can include high density routing therein. The dielectric layer can be over the interconnect die, the dielectric layer including the first and second circuitry elements passing therethrough.
Type:
Grant
Filed:
December 27, 2022
Date of Patent:
May 14, 2024
Assignee:
Intel Corporation
Inventors:
Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravi V. Mahajan
Abstract: An apparatus of an edge computing node, a method, and a machine-readable storage medium. The apparatus is to decode messages from a plurality of clients within the edge computing network, the messages including respective coded data for respective ones of the plurality of clients; computing estimates of metrics related to a global model for federated learning using the coded data, the metrics including a gradient on the coded data; use the metrics to update the global model to generate an updated global model, wherein the edge computing node is to update the global model by calculating the gradient on the coded data based on a linear fit of the global model to estimated labels from the federated learning; and send a message including the updated global model for transmission to at least some of the clients.
Type:
Application
Filed:
June 9, 2022
Publication date:
May 9, 2024
Applicant:
Intel Corporation
Inventors:
Mustafa Riza Akdeniz, Arjun Anand, Ravikumar Balakrishnan, Sagar Dhakal, Nageen Himayat
Abstract: This disclosure describes systems, methods, and devices related to multi-link device (MLD) device resetup and transition. A device may perform an initial association with a first transition peer. The device may initiate a fast multi-link device (MLD) transition from the first transition peer to a second transition peer, wherein the MLD is configured to use authentication keys, and wherein at least one of the first transition peer or the second transition peer it is an access point (AP) MLD having a plurality of links associated with a plurality of APs within the AP MLD. The device may include an MLD link identification (ID) within a fast basic service set transition element (FTE) of a reassociation request or reassociation response frame, wherein the MLD link ID identifies an individual link of the plurality of links. The device may perform a second association with the second transition peer.
Abstract: An extension device is positioned within a point-to-point link to connect two devices, where the extension device includes error detection circuitry to detect a set of errors at the extension device. The extension device further includes memory to store an event register, where the extension device is to write data to the event register to describe detection of an error by the error detection circuitry. The extension device further includes a transmitter to transmit a notification signal to indicate the detection of the error and presence of the data in the event register associated with the error.
Type:
Application
Filed:
July 24, 2023
Publication date:
May 9, 2024
Applicant:
Intel Corporation
Inventors:
Haifeng Gong, Manisha M. Nilange, Shiwei Xu, Xiaoxia Fu
Abstract: An embodiment of an integrated circuit may comprise first circuitry to manage a memory in accordance with a page size and a channel interleave granularity, and second circuitry coupled to the first circuitry, the second circuitry to store data in a primary region of the memory at a primary address, and manage a mirror of the data in a secondary region of the memory at a secondary address at a regional granularity on demand at run time. Other embodiments are disclosed and claimed.
Abstract: An embodiment of an integrated circuit may comprise circuitry communicatively coupled to two or more sub-non-uniform memory access clusters (SNCs) to allocate a specified memory space in the two or more SNCs in accordance with a SNC memory allocation policy indicated from a request to initialize the specified memory space. An embodiment of an apparatus may comprise decode circuitry to decode a single instruction, the single instruction to include a field for an opcode, and execution circuitry to execute the decoded instruction according to the opcode to provide an indicated SNC memory allocation policy (e.g., a SNC policy hint). Other embodiments are disclosed and claimed.
Type:
Application
Filed:
June 21, 2021
Publication date:
May 9, 2024
Applicant:
Intel Corporation
Inventors:
Zhe Wang, Lingxiang Xiang, Christopher J. Hughes
Abstract: An apparatus to facilitate permissions at a computing system platform is disclosed. The apparatus includes a plurality of agents, each including a non-volatile memory storing firmware executed to perform a function associated with the agent and attestation hardware to detect an update at the computing system platform, generate a cryptographic key associated with each of the plurality of agents, perform an attestation with a relying party using the generated cryptographic keys and receive a tuple associated with each of the plurality of agents, wherein a tuple includes one or more permissions indicating platform resources an agent is permitted to access.
Abstract: In one embodiment, a method of training an autoencoder neural network includes determining autoencoder design parameters for the autoencoder neural network, including an input image size for an input image, a compression ratio for compression of the input image into a latent vector, and a latent vector size for the latent vector. The input image size is determined based on a resolution of training images and a size of target features to be detected. The compression ratio is determined based on entropy of the training images. The latent vector size is determined based on the compression ratio. The method further includes training the autoencoder neural network based on the autoencoder design parameters and the training dataset, and then saving the trained autoencoder neural network on a storage device.
Type:
Application
Filed:
March 25, 2022
Publication date:
May 9, 2024
Applicant:
Intel Corporation
Inventors:
Barath Lakshmanan, Ashish B. Datta, Craig D. Sperry, David J. Austin, Caleb Mark McMillan, Neha Purushothaman, Rita H. Wouhaybi
Abstract: Computer computation of exact floating point addition is described. An example of an apparatus includes a first circuit to add first and second floating point inputs, including sorting the inputs to identify a larger input and a smaller input, adding bits in an upper portion of the smaller input to bits of the larger input, generating a high intermediate value based on the sum, and a generating a low intermediate value based on a lower portion of the lower input; and a second circuit to generate first and second outputs based on the high and low intermediate values, wherein the first output plus the second output exactly equals the first input plus the second input.
Abstract: Some demonstrative embodiments include apparatuses, devices, systems and methods of communicating a PPDU including a training field. For example, an Enhanced Directional Multi-Gigabit (DMG) (EDMG) wireless communication station may be configured to determine one or more Orthogonal Frequency Division Multiplexing (OFDM) Training (TRN) sequences in a frequency domain based on a count of one or more 2.16 Gigahertz (GHz) channels in a channel bandwidth for transmission of an EDMG PPDU including a TRN field; generate one or more OFDM TRN waveforms in a time domain based on the one or more OFDM TRN sequences, respectively, and based on an OFDM TRN mapping matrix, which is based on a count of the one or more transmit chains; and transmit an OFDM mode transmission of the EDMG PPDU over the channel bandwidth, the OFDM mode transmission comprising transmission of the TRN field based on the one or more OFDM TRN waveforms.
Type:
Application
Filed:
December 27, 2023
Publication date:
May 9, 2024
Applicant:
INTEL CORPORATION
Inventors:
Artyom Lomayev, Alexander Maltsev, Claudio Da Silva, Carlos Cordeiro
Abstract: A device comprises a first comparator to generate a first clock signal based on a reference voltage and a first voltage at an output of a switched-capacitor power converter (SCPC), and a second comparator to generate a first control signal based on the first voltage and a threshold voltage. A sensor is to generate a second control signal based on one of a level of a current of the first clock signal, or a duty cycle of the first clock signal. A frequency divider circuit is to generate a second clock signal based on the first control signal and the second control signal, and in some embodiments, further based on one of the first clock signal or a third clock signal. Controller circuitry is to operate switch circuitry of the SCPC based on the first clock signal.
Type:
Application
Filed:
November 9, 2022
Publication date:
May 9, 2024
Applicant:
Intel Corporation
Inventors:
Keng Chen, Huanhuan Zhang, Arvind Raghavan, Tamir Salus, Christopher Schaef, Gayathri Devi Sridharan