Patents Assigned to Intel Corporation
  • Patent number: 11973923
    Abstract: An example apparatus includes: a camera to record an image; memory to store instructions; and a processor in circuit with the memory, the processor to execute the instructions to: determine a depth based on: (a) the image and (b) a calibration parameter of the camera; and adjust the calibration parameter based on a temperature of the camera and the depth.
    Type: Grant
    Filed: September 2, 2022
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Aviad Zabatani, Sagy Bareket, Ohad Menashe, Erez Sperling, Alex Bronstein, Michael Bronstein, Ron Kimmel, Vitaly Surazhsky
  • Patent number: 11973641
    Abstract: Techniques discussed herein can facilitate edge computing in connection with a variety of deployment scenarios. Various embodiments can facilitate one or more of: deploying UPF(s) (User Plane Function(s)) to support edge computing; removing UPF(s) not needed for edge computing; deploying local DN(s) (Data Network(s)); E2E (Edge-to-Edge) OSS (Operations Support System) deployment scenarios; and providing RAN (Radio Access Network) condition data to support various applications (e.g., autonomous driving).
    Type: Grant
    Filed: December 30, 2022
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Joey Chou, Yizhi Yao
  • Patent number: 11973679
    Abstract: This disclosure describes systems, methods, and devices related to enhanced frame exchange. A device may generate a first subset of a plurality of fields, wherein the first subset is mandatory in a probe request frame. The device may generate a second subset of the plurality of fields, wherein the second subset is optional in the probe request frame regardless of capability information of the device. The device may generate the probe request frame comprising the first subset and the second subset. The device may cause to send the probe request frame to an access point (AP) device.
    Type: Grant
    Filed: August 3, 2021
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Po-Kai Huang, Robert Stacey, Daniel Bravo, Ido Ouzieli, Danny Alexander, Ofer Hareuveni
  • Patent number: 11973689
    Abstract: A processor may control a transmitter to send a first signal representing a request for one or more priority rules for data packet prioritization; to receive a second signal in response to the first signal, the second signal representing the one or more priority rules for data packet prioritization, and to receive a third signal representing a data packet including a header and a data payload. The header may comprise a first priority tag representing a first priority level. The processor may be configured to determine from the data payload and the one or more rules for data packet prioritization a second priority tag representing a second priority level and to replace the first priority tag with the second priority tag.
    Type: Grant
    Filed: June 15, 2021
    Date of Patent: April 30, 2024
    Assignee: INTEL CORPORATION
    Inventors: Ehud Reshef, Carlos Cordeiro
  • Patent number: 11973519
    Abstract: Examples described herein relate to an apparatus comprising a central processing unit (CPU) and an encoding accelerator coupled to the CPU, the encoding accelerator comprising an entropy encoder to determine normalized probability of occurrence of a symbol in a set of characters using a normalized probability approximation circuitry, wherein the normalized probability approximation circuitry is to output the normalized probability of occurrence of a symbol in a set of characters for lossless compression. In some examples, the normalized probability approximation circuitry includes a shifter, adder, subtractor, or a comparator. In some examples, the normalized probability approximation circuitry is to determine normalized probability by performance of non-power of 2 division without computation by a Floating Point Unit (FPU). In some examples, the normalized probability approximation circuitry is to round the normalized probability to a decimal.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Bhushan G. Parikh, Stephen T. Palermo
  • Patent number: 11973143
    Abstract: Integrated circuit structures having source or drain structures and germanium N-channels are described. In an example, an integrated circuit structure includes a fin having a lower fin portion and an upper fin portion, the upper fin portion including germanium. A gate stack is over the upper fin portion of the fin. A first source or drain structure includes an epitaxial structure embedded in the fin at a first side of the gate stack. A second source or drain structure includes an epitaxial structure embedded in the fin at a second side of the gate stack. Each epitaxial structure includes a first semiconductor layer in contact with the upper fin portion, and a second semiconductor layer on the first semiconductor layer. The first semiconductor layer comprises silicon, germanium and phosphorous, and the second semiconductor layer comprises silicon and phosphorous.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Ryan Keech, Benjamin Chu-Kung, Subrina Rafique, Devin Merrill, Ashish Agrawal, Harold Kennel, Yang Cao, Dipanjan Basu, Jessica Torres, Anand Murthy
  • Patent number: 11972979
    Abstract: Embodiments disclosed herein include semiconductor devices and methods of forming such devices. In an embodiment a semiconductor device comprises a first interlayer dielectric (ILD), a plurality of source/drain (S/D) contacts in the first ILD, a plurality of gate contacts in the first ILD, wherein the gate contacts and the S/D contacts are arranged in an alternating pattern, and wherein top surfaces of the gate contacts are below top surfaces of the S/D contacts so that a channel defined by sidewall surfaces of the first ILD is positioned over each of the gate contacts, mask layer partially filling a first channel over a first gate contact, and a fill metal filling a second channel over a second gate contact that is adjacent to the first gate contact.
    Type: Grant
    Filed: June 7, 2023
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Leonard P. Guler, Michael Harper, Suzanne S. Rich, Charles H. Wallace, Curtis Ward, Richard E. Schenker, Paul Nyhus, Mohit K. Haran, Reken Patel, Swaminathan Sivakumar
  • Patent number: 11974227
    Abstract: This disclosure describes systems, methods, and devices related to wake up receiver (WUR) frequency division multiple access (FDMA) transmission. A device may cause to send a wake up receiver (WUR) beacon frame on a WUR beacon operating channel to one or more station devices. The device may determine a first wake-up frame to be sent on a first WUR operating channel, wherein the first WUR operating channel is associated with one or more frequency division multiple access (FDMA) channels used for transmitting one or more wake-up frames to the one or more station devices. The device may determine to apply padding to the first wake-up frame based on a field included in a header of the first wake-up frame. The device may cause to send the first wake-up frame to a first station device of the one or more station devices.
    Type: Grant
    Filed: November 9, 2021
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Po-Kai Huang, Shahrnaz Azizi, Daniel F. Bravo, Thomas J. Kenney, Vinod Kristem, Noam Ginsburg
  • Patent number: 11973539
    Abstract: Disclosed herein are optical transceivers with multi-laser modules, as well as related optoelectronic assemblies and methods. In some embodiments, an optical transceiver may include: a first laser and a second laser; an optical output path, wherein an output of the first laser is coupled to the optical output path; and switching circuitry to decouple the output of the first laser from the optical output path and to couple an output of the second laser to the optical output path.
    Type: Grant
    Filed: March 16, 2022
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Saeed Fathololoumi, Ling Liao, Quan Tran
  • Patent number: 11973504
    Abstract: An asynchronous multi-cycle reset synchronization circuit that can correlate any number of resets and synchronous clocks with simultaneous reset de-assertion and removal of reset assertion crossing hazards. The asynchronous multi-cycle reset synchronization circuit can also be paired with a synchronous multi-cycle reset synchronization circuit to correlate same domain asynchronous and synchronous resets. Also described is a synchronous reset multi-cycle synchronization circuit that correlates with any number of asynchronous resets and guarantees simultaneous reset de-assertion.
    Type: Grant
    Filed: August 17, 2020
    Date of Patent: April 30, 2024
    Assignee: INTEL CORPORATION
    Inventors: Leon Zlotnik, Lev Zlotnik, Jeremy Anderson
  • Publication number: 20240135483
    Abstract: Described herein is a graphics processor comprising a system interconnect and a graphics processor cluster coupled with the system interconnect. The graphics processor cluster includes circuitry configurable to generate per-frame neural representations of a multi-view video via incremental training and transferal of weights.
    Type: Application
    Filed: October 23, 2022
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: Shengze Wang, Alexey Supikov, Joshua Ratcliff, Ronald Azuma
  • Publication number: 20240137984
    Abstract: This disclosure describes systems, methods, and devices related to aligned channel access. A device may perform a first backoff countdown on a first link associated with a first station device (STA) of the device, wherein the device is a multi-link device (MLD). The device may detect a second backoff countdown associated with a second STA of the MLD after the first backoff countdown reaches zero. The device may determine to hold the first backoff countdown at zero based on the value of the second backoff countdown. The device may transmit in synchronization on the first link and on the second link from the first STA and the second STA respectively based on holding the first backoff countdown at zero.
    Type: Application
    Filed: December 30, 2023
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: Laurent Cariou, Dibakar Das, Dmitry Akhmetov
  • Publication number: 20240137800
    Abstract: This disclosure describes systems, methods, and devices related to traffic indications for multi-link devices (MLDs). A device may generate a first traffic indication map (TIM) with a first bitmap including a first indication that traffic is to be sent by a first access point (AP) device of the MLD to a first non-AP device of a second MLD using a first communication link The device may generate a second TIM with a second bitmap including a second indication that no traffic is to be sent by a second AP device of the MLD to a second non-AP device of the second MLD using a second communication link The device may send, using the first communication link, the beacon, the beacon including the first TIM and the second TIM. The device may send, using the first communication link, a data frame to the first non-AP device of the second MLD.
    Type: Application
    Filed: December 30, 2023
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: Alexander Min, Laurent Cariou, Minyoung Park, Po-Kai Huang
  • Publication number: 20240136244
    Abstract: Thermal heat spreaders and/or an IC die with solderable thermal structures may be assembled together with a solder array thermal interconnects. A thermal heat spreader may include a non-metallic material and one or more metallized surfaces suitable for bonding to a solder alloy employed as thermal interface material between the heat spreader and an IC die. An IC die may include a metallized back-side surface similarly suitable for bonding to a thermal interconnect comprising a solder alloy. Metallization on the IC die and/or heat spreader may comprise a plurality of solderable structures. A multi-chip package may include multiple IC die having different die thickness that are accommodated by a z-height thickness variation in the thermal interconnects and/or the solderable structures of the IC die or heat spreader.
    Type: Application
    Filed: December 22, 2023
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: Debendra Mallik, Je-Young Chang, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad
  • Publication number: 20240134644
    Abstract: Embodiments detailed herein relate to matrix operations. In particular, support for matrix (tile) addition, subtraction, and multiplication is described. For example, circuitry to support instructions for element-by-element matrix (tile) addition, subtraction, and multiplication are detailed. In some embodiments, for matrix (tile) addition, decode circuitry is to decode an instruction having fields for an opcode, a first source matrix operand identifier, a second source matrix operand identifier, and a destination matrix operand identifier; and execution circuitry is to execute the decoded instruction to, for each data element position of the identified first source matrix operand: add a first data value at that data element position to a second data value at a corresponding data element position of the identified second source matrix operand, and store a result of the addition into a corresponding data element position of the identified destination matrix operand.
    Type: Application
    Filed: December 29, 2023
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: Robert VALENTINE, Dan BAUM, Zeev SPERBER, Jesus CORBAL, Elmoustapha OULD-AHMED-VALL, Bret L. TOLL, Mark J. CHARNEY, Barukh ZIV, Alexander HEINECKE, Milind GIRKAR, Simon RUBANOVICH
  • Publication number: 20240135485
    Abstract: The disclosure relates to tuning configuration parameters for graphics pipeline for better user experience. A device for graphics processing, comprising: hardware engines; a graphics pipeline at least partly implemented by the hardware engines; and a tuner, coupled to the hardware engines and the graphics pipeline, the tuner to: collect statuses of the device during runtime for a previous frame; determine configuration parameters based on the collected statuses, the configuration parameters associated with three-dimensional 3D rendering, pre-processing and video encoding of the graphics pipeline; and tune the graphics pipeline with the determined configuration parameters for processing a next frame.
    Type: Application
    Filed: September 1, 2023
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: Fan He, Yi Qian, Ning Luo, Yunbiao Lin, Changliang Wang, Ximin Zhang
  • Publication number: 20240134705
    Abstract: Adjusting workload execution based on workload similarity. A processor may determine a similarity of a first workload to a second workload. The processor may adjust execution of the first workload based on execution parameters of the second workload and the similarity of the first workload to the second workload.
    Type: Application
    Filed: December 13, 2023
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: Niranjan Hasabnis, Patricia Mwove, Ellick Chan, Derssie Mebratu, Kshitij Doshi, Mohammad Hossain, Gaurav Chaudhary
  • Publication number: 20240136243
    Abstract: Described herein are integrated circuit devices that include semiconductor devices near the center of the device, rather than towards the top or bottom of the device. In this arrangement, heat can become trapped inside the device. Metal fill, such as copper, is formed within a portion of the device, e.g., over the semiconductor devices and any front side interconnect structures, to transfer heat away from the semiconductor devices and towards a heat spreader.
    Type: Application
    Filed: October 24, 2022
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: Min Suet Lim, Telesphor Kamgaing, Ilan Ronen, Kavitha Nagarajan, Chee Kheong Yoon, Chu Aun Lim, Eng Huat Goh, Jooi Wah Wong
  • Publication number: 20240134786
    Abstract: Methods, apparatus, systems and articles of manufacture are disclosed for sparse tensor storage for neural network accelerators. An example apparatus includes sparsity map generating circuitry to generate a sparsity map corresponding to a tensor, the sparsity map to indicate whether a data point of the tensor is zero, static storage controlling circuitry to divide the tensor into one or more storage elements, and a compressor to perform a first compression of the one or more storage elements to generate one or more compressed storage elements, the first compression to remove zero points of the one or more storage elements based on the sparsity map and perform a second compression of the one or more compressed storage elements, the second compression to store the one or more compressed storage elements contiguously in memory.
    Type: Application
    Filed: December 14, 2023
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: Martin-Thomas Grymel, David Bernard, Niall Hanrahan, Martin Power, Kevin Brady, Gary Baugh, Cormac Brick
  • Patent number: D1024974
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Samantha Rao, Harish Jagadish, Arvind S