Abstract: A novolac-type phenolic hydroxyl group-containing resin with formula (1) as a structural site repeating unit, R1 represents one of a hydrogen atom, an alkyl group, and an aryl group, and X represents a structural site (?) represented by formula (2), R2 and R3 each represent one of a hydrogen atom, an alkyl group, an aryl group, and an aralkyl group; n and m are each an integer of 1 to 3; when n or m is 2 or 3, a plurality of each of R2 and R3 present in a molecule may be the same or different; and Ar represents one of a phenyl group, a naphthyl group, an anthryl group, and a structural site in which one or a plurality of hydrogen atoms in an aromatic nucleus of any one of these groups is substituted by one of an alkyl group, an aryl group, and an aralkyl group).

Abstract: A radiation-sensitive resin composition includes a first polymer including an acid-labile group, an acid generator to generate an acid upon exposure to radiation, and a second polymer including a fluorine atom and a functional group shown by a general formula (x). The second polymer has a fluorine atom content higher than a fluorine atom content of the first polymer. R1 represents an alkali-labile group. A represents an oxygen atom, —NR?—, —CO—O—# or —SO2—O—##, wherein the oxygen atom represented by A is not an oxygen atom bonded directly to an aromatic ring, a carbonyl group, or a sulfoxyl group, R? represents a hydrogen atom or an alkali-labile group, and “#” and “##” each indicate a bonding hand bonded to R1. -A-R1??(x).

Abstract: A photosensitive resin composition includes a first binder resin represented by Formula 1. The photosensitive resin composition may be cured at a low temperature (e.g., about 0° C. to about 100° C., about 40° C. to about 100° C., or about 70° C. to about 100° C.). A film may be formed from the photosensitive resin composition. An organic light-emitting display (OLED) device may include the film prepared from the photosensitive resin composition.

Abstract: A resin laminate having a structure in which a support, an intermediate layer and an image-forming resin layer are laminated in the order mentioned, the resin laminate including (A) a cationic polymer in the image-forming resin layer, and (B) an anionic polymer in the intermediate layer in contact with image-forming resin layer, wherein the (B) anionic polymer is a modified and partially saponified polyvinyl acetate in which a carboxyl group is introduced to a polymer side chain using a hydroxyl group of a partially saponified polyvinyl acetate as an origin of introduction.

Abstract: A sulfonium salt containing an acid-eliminatable substituent group which is effective for improving contrast is highly soluble and uniformly dispersible. A resist composition comprising the sulfonium salt as photoacid generator forms a pattern with a high resolution, rectangularity, and reduced LWR.

Abstract: A radiation-sensitive resin composition comprising a binder resin (A), a radiation-sensitive compound (B), a tetrafunctional or lower functional epoxy-based cross-linking agent (C) having an epoxy equivalent of 450 or less and a softening point of 30° C. or less, and an aralkyl phenol resin (D) is provided. According to the present invention, it is possible to provide a radiation-sensitive resin composition able to give a resin film high in adhesion to a metal layer and excellent in developability and low hygroscopicity.

Abstract: A polymer comprises the polymerized product of monomers comprising an acid-deprotectable monomer, a base-soluble monomer, a lactone-containing monomer, and a photoacid-generating monomer; a chain transfer agent of the formula; wherein Z is a y valent C1-20 organic group, x is 0 or 1, Rd is a substituted or unsubstituted C1-20 alkyl, C3-20 cycloalkyl, C6-20 aryl, or C7-20 aralkyl; and optionally, an initiator.

Abstract: Resist underlayer film-forming composition for forming resist underlayer film with high dry etching resistance, wiggling resistance and exerts good flattening property and embedding property for uneven parts, including resin obtained by reacting organic compound A including aromatic ring and aldehyde B having at least two aromatic hydrocarbon ring groups having phenolic hydroxy group and having structure wherein the aromatic hydrocarbon ring groups are bonded through tertiary carbon atom. The aldehyde B may be compound of Formula (1): The obtained resin may have a unit structure of Formula (2): Ar1 and Ar2 each are C6-40 aryl group. The organic compound A including aromatic ring may be aromatic amine or phenolic hydroxy group-containing compound. The composition may contain further solvent, acid and/or acid generator, or crosslinking agent.

Abstract: A resist composition is provided comprising a polymer comprising recurring units (a) having a succinimide structure and recurring units (b) containing a group capable of polarity switch with the aid of acid. The resist composition suppresses acid diffusion, exhibits a high resolution, and forms a pattern of satisfactory profile with low edge roughness.

Abstract: Provided are a novel alicyclic ester compound and a method for producing a compound of general formula (1) at a high yield from a compound of general formula (2) and a compound of general formula (3). An adamantane compound expressed by general formula (2) and a hydroxyalkyl (meth)acrylate ester compound expressed by general formula (3) are reacted with each other by use of a dehydration condensation agent as a catalyst to obtain an alicyclic ester compound expressed by general formula (1).

Abstract: The invention provides a compound for forming an organic film having a partial structure represented by the following formula (ii), wherein the ring structures Ar1, Ar2 and Ar3 each represent a substituted or unsubstituted benzene ring or naphthalene ring; e is 0 or 1; R0 represents a hydrogen atom or a linear, branched or cyclic monovalent organic group having 1 to 30 carbon atoms; L0 represents a linear, branched or cyclic divalent organic group having 1 to 32 carbon atoms; and the methylene group constituting L0 may be substituted by an oxygen atom or a carbonyl group. There can be provided an organic film composition for forming an organic film having high dry etching resistance as well as advanced filling/planarizing characteristics.

Abstract: Provided are a resist and a compound for the resist improving the sensitivity, the resolution and the line edge roughness (LER) in a good balance without spoiling basic properties of a chemical amplification resist such as pattern shape, dry etching resistance, heat resistance and the like. Provided are a method for producing an alicyclic ester compound expressed by general formula (1), an alicyclic ester compound expressed by general formula (1), a (meth)acrylic copolymer obtained by polymerization of the alicyclic ester compound, and a photosensitive resin composition containing the (meth)acrylic copolymer. A method for producing an alicyclic ester compound expressed by general formula (1) includes reacting an adamantane compound expressed by general formula (2) with hydroxyalkylamine expressed by general formula (3) to produce an adamantaneamide compound expressed by general formula (4), and then reacting the adamantaneamide compound expressed by general formula (4) with (meth)acrylic acid.

Abstract: Provided are a polymer used for a manufacturing process of a semiconductor and a display, a resist underlayer film composition containing the polymer for a manufacturing process of a semiconductor and a display, and a method for manufacturing semiconductor device using the composition, and more specifically, the polymer of the present disclosure simultaneously has optimized etching selectivity, planarization characteristic, and excellent thermal resistance, such that the resist underlayer film composition containing the polymer is usable as a hard mask for a multilayer semiconductor lithography process.

Abstract: The present invention provides a resist under layer film composition containing a novolak resin having a repeating unit shown by the formula (1), wherein R represents a group containing one or more fluorine atoms. There is provided a resist under layer film composition that is excellent in filling property, generates little outgas, and has excellent dry etching resistance and heat resistance.

Abstract: A resist overlayer film forming composition for use in a lithography process in semiconductor device production does not intermix with a resist, blocks undesirable exposure light particularly in EUV exposure, for example, UV and DUV and selectively transmits EUV alone, and can be developed with a developer after exposure.

Abstract: The invention provides a compound for forming an organic film having a partial structure represented by the following formula (vii-2), wherein R1 represents a linear, branched or cyclic monovalent hydrocarbon group having 1 to 20 carbon atoms, and a methylene group constituting R1 may be substituted by an oxygen atom; a+b is 1, 2 or 3; c and d are each independently 0, 1 or 2; x represents 0 or 1, when x=0, then a=c=0; L7 represents a linear, branched or cyclic divalent organic group having 1 to 20 carbon atoms, L8? represents the partial structure represented by the following formula (i), 0?o<1, 0<p?1 and o+p=1, wherein the ring structures Ar3 represent a substituted or unsubstituted benzene ring or naphthalene ring; R0 represents a hydrogen atom or a linear, branched or cyclic monovalent organic group having 1 to 30 carbon atoms; and L0 represents a divalent organic group.

Abstract: The present invention is a photo-curable resin composition containing (A) a silicone polymer compound having repeating units shown by the formulae (1) and (2), (B) a photosensitive acid generator capable of generating an acid by decomposition with light having a wavelength of 190 to 500 nm, (C) one or more compounds selected from an amino condensate modified with formaldehyde or formaldehyde-alcohol, a phenol compound having on average two or more methylol groups or alkoxymethylol groups per molecule, and a polyhydric phenol compound whose phenolic hydroxyl group is substituted with a glycidoxy group, and (D) one or more compounds selected from polyhydric phenols having 3 or more hydroxyl groups. As a result, there is provided a photo-curable resin composition that can facilitate thick and fine patterning when the composition is used in patterning.

Abstract: Disclosed are a phenolic hydroxyl group-containing resin which has excellent alkali developing properties and makes it possible to exhibit high heat resistance in a cured product obtained therefrom, a production method therefor, a photosensitive composition, a resist material, a coating film, a curable composition and a cured product thereof, and a resist underlayer film. A phenolic hydroxyl group-containing resin, including a compound (A) having a molecular structure represented by the following Structural Formula (1). (In the formula, R1 represents an alkyl group, an alkoxy group, or an aryl group, R2 represents a hydrogen atom, an alkyl group, or an aryl group, m is an integer of 1 to 3, and n is an integer of 2 to 15. In the case where m is 2 or more, plural R1's may be the same as or different from each other.

Abstract: There are provided a positive photosensitive resin composition excellent in the sensitivity, film residual ratio and storage stability, comprising a resin containing a specific acrylic acid-based constituent unit capable of dissociating an acid-dissociable group to produce a carboxyl group, the resin being alkali-insoluble or sparingly alkali-soluble and becoming alkali-soluble when the acid-dissociable group dissociates, a resin containing a constituent unit having a functional group capable of reacting with the carboxyl group to form a covalent bond, and a compound capable of generating an acid upon irradiation with an actinic ray or radiation; a cured film forming method using the positive photosensitive resin composition; and a cured film excellent in the heat resistance, adhesion, transmittance and the like.

Abstract: A copolymer is prepared by the polymerization of monomers that include an ultraviolet absorbing monomer, and a base-solubility-enhancing monomer. The copolymer is useful for forming a topcoat layer for electron beam and extreme ultraviolet lithographies. Also described are a layered article including the topcoat layer, and an associated method of forming an electronic device.