Patents Examined by Didarul A Mazumder
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Patent number: 11980032Abstract: The present application discloses a method for manufacturing a SONOS memory, including: providing a substrate, wherein a first transistor gate of the SONOS memory and a first layer used for forming a second transistor gate are formed on the substrate; forming a patterned second layer on the upper surface of the first layer, wherein the second layer exposes the first layer corresponding to the outer side of the second transistor gate; performing first etching on the first layer exposed by the second layer; removing the second layer; and performing second etching on the first layer to form the second transistor gate. The present application also discloses a SONOS memory. The present application can form a vertical structure outside a selective transistor and a storage transistor, thus forming a vertical side wall in the subsequent process, so as to improve the performance of the device.Type: GrantFiled: June 21, 2021Date of Patent: May 7, 2024Assignee: Shanghai Huali Microelectronics CorporationInventors: Xiaoliang Tang, Naoki Tsuji, Haoyu Chen, Hua Shao
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Patent number: 11974483Abstract: According to one or more embodiments, provided is a display apparatus including a first subpixel having a rectangular shape, a second subpixel facing a first side of the first subpixel, the second subpixel having a rectangular shape, a third subpixel facing the first side of the first subpixel and spaced apart from the second subpixel, the third subpixel having a rectangular shape, and a blocking portion comprising a blocking layer on at least one of the first subpixel, the second subpixel, or the third subpixel, and, in a plan view, overlapping at least one of the first subpixel, the second subpixel, or the third subpixel, where a distance from the first side of the first subpixel to the second subpixel is different from a distance from the first side of the first subpixel to the third subpixel.Type: GrantFiled: May 5, 2022Date of Patent: April 30, 2024Assignee: Samsung Display Co., Ltd.Inventors: Hyangyul Kim, Sunhwa Kim, Jaehong Kim, Hyomin Kim, Hyunho Jung, Heeseong Jeong
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Patent number: 11973047Abstract: An electronic package is provided, which stacks an electronic structure as an integrated voltage regulator on an electronic component to facilitate close-range cooperation with the electronic component for electrical transmission.Type: GrantFiled: November 24, 2020Date of Patent: April 30, 2024Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Feng Kao, Lung-Yuan Wang
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Patent number: 11973043Abstract: An electronic package is formed by disposing an electronic element and a lead frame having a plurality of conductive posts on a carrier structure having an antenna function, and encapsulating the electronic element and the lead frame with an encapsulant. The encapsulant is defined with a first encapsulating portion and a second encapsulating portion lower than the first encapsulating portion. The electronic element is positioned in the first encapsulating portion, and the plurality of conductive posts are positioned in the second encapsulating portion. End surfaces of the plurality of conductive posts are exposed from a surface of the second encapsulating portion so as to be electrically connected to a connector.Type: GrantFiled: January 30, 2023Date of Patent: April 30, 2024Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chih-Hsien Chiu, Wen-Jung Tsai
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Patent number: 11967641Abstract: According to one embodiment, a semiconductor device includes first to third electrodes, first to third nitride regions, and first and second insulating films. The first nitride region includes Alx1Ga1?x1N, and includes first and second partial regions, a third partial region between the first and second partial regions, a fourth partial region between the first and third partial regions, and a fifth partial region between the third and second partial regions. The first nitride region includes first to fifth partial regions. The second nitride region includes Alx2Ga1?x2N, and sixth and seventh partial regions. At least a portion of the third electrode is between the sixth and seventh partial regions. The first insulating film includes silicon and oxygen and includes first and second insulating regions. The third nitride region includes Alx3Ga1?x3N, and first to seventh portions. The second insulating film includes silicon and oxygen and includes third to seventh insulating regions.Type: GrantFiled: April 26, 2023Date of Patent: April 23, 2024Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATIONInventors: Daimotsu Kato, Yosuke Kajiwara, Akira Mukai, Aya Shindome, Hiroshi Ono, Masahiko Kuraguchi
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Patent number: 11968833Abstract: A memory device includes a source element, a drain element, channel layers, control electrode layers, and a memory layer. The channel layers are individually electrically connected between the source element and the drain element. Memory cells are defined in the memory layer between the control electrode layers and the channel layers.Type: GrantFiled: January 15, 2021Date of Patent: April 23, 2024Assignee: MACRONIX INTERNATIONAL CO., LTD.Inventors: Wei-Chen Chen, Hang-Ting Lue
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Patent number: 11967565Abstract: In one example, a semiconductor structure or device comprises a substrate comprising a conductive structure having a top side and a first shielding terminal on the top side of the conductive structure, an electronic component on the top side of the conductive structure, a package body on the top side of the conductive structure and contacting a side of the electronic component, a shield on a top side of the package body and a lateral side of the package body, and a shield interconnect coupling the shield to the first shielding terminal of the conductive structure. Other examples and related methods are also disclosed herein.Type: GrantFiled: June 13, 2022Date of Patent: April 23, 2024Assignee: Amkor Technology Japan, Inc.Inventors: Takahiro Yada, Tsukasa Takaiwa
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Patent number: 11967644Abstract: A semiconductor device can include: a substrate having a first doping type; a first well region located in the substrate and having a second doping type, where the first well region is located at opposite sides of a first region of the substrate; a source region and a drain region located in the first region, where the source region has the second doping type, and the drain region has the second doping type; and a buried layer having the second doping type located in the substrate and below the first region, where the buried layer is in contact with the first well region, where the first region is surrounded by the buried layer and the first well region, and the first doping type is opposite to the second doping type.Type: GrantFiled: January 11, 2023Date of Patent: April 23, 2024Assignee: Silergy Semiconductor Technology (Hangzhou) LTDInventors: Meng Wang, Yicheng Du, Hui Yu
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Patent number: 11963349Abstract: Embodiments of 3D memory devices and methods for forming the same are disclosed. In an example, a method for forming a 3D memory device is disclosed. A sacrificial layer on a substrate, a first stop layer on the sacrificial layer, an N-type doped semiconductor layer on the first stop layer, and a dielectric stack on the N-type doped semiconductor layer are sequentially formed. A plurality of channel structures each extending vertically through the dielectric stack and the N-type doped semiconductor layer are formed, stopping at the first stop layer. The dielectric stack is replaced with a memory stack, such that each of the plurality of channel structures extends vertically through the memory stack and the N-type doped semiconductor layer. The substrate, the sacrificial layer, and the first stop layer are sequentially removed to expose an end of each of the plurality of channel structures. A conductive layer is formed in contact with the ends of the plurality of channel structures.Type: GrantFiled: September 14, 2020Date of Patent: April 16, 2024Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.Inventors: Kun Zhang, Ziqun Hua, Wenxi Zhou, Zhiliang Xia, Zongliang Huo
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Patent number: 11963356Abstract: Embodiments of structure and methods for forming a three-dimensional (3D) memory device are provided. In an example, a 3D memory device includes a stack structure including a memory block including a plurality of memory cells. The 3D memory device also includes a first top select structure and a bottom select structure in the memory block and aligned with each other vertically; and a second top select structure in the memory block is separated from the first top select structure by at least one of the plurality of memory cells. The first top select structure, the bottom select structure, and the second top select structure each includes an insulating material.Type: GrantFiled: December 20, 2021Date of Patent: April 16, 2024Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.Inventors: Zongliang Huo, Haohao Yang, Wei Xu, Ping Yan, Pan Huang, Wenbin Zhou
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Patent number: 11955418Abstract: Systems, methods, and devices for a ball grid array with non-linear conductive routing are described herein. Such a ball grid array may include a plurality of solder balls that are electrically coupled by a non-linear conductive routing. The non-linear conductive routing may include a plurality of routing sections where each of the plurality of routing sections is disposed at an angle to adjacent routing sections.Type: GrantFiled: July 23, 2021Date of Patent: April 9, 2024Assignee: Cypress Semiconductor CorporationInventors: Chenxi Huang, Yung Chen
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Patent number: 11956962Abstract: A 3D flash memory device includes a substrate having a substantial planar surface. A plurality of active columns of semiconducting material is disposed above the substrate. Each of the plurality of active columns extends along a first direction orthogonal to the planar surface of the substrate. The plurality of active columns is arranged in a two-dimensional array. Each of the plurality of active columns may comprise multiple local bit lines and multiple local source lines extending along the first direction. Multiple channel regions are disposed between the multiple local bit lines and multiple local source lines. A word line stack wraps around the plurality of active columns. A charge-storage element is disposed between the word line stack and each of the plurality of active columns.Type: GrantFiled: October 13, 2021Date of Patent: April 9, 2024Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.Inventors: Min She, Qiang Tang
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Patent number: 11955439Abstract: A semiconductor package includes a semiconductor die, a redistribution structure and connective terminals. The redistribution structure is disposed on the semiconductor die and includes a first metallization tier disposed in between a pair of dielectric layers. The first metallization tier includes routing conductive traces electrically connected to the semiconductor die and a shielding plate electrically insulated from the semiconductor die. The connective terminals include dummy connective terminals and active connective terminals. The dummy connective terminals are disposed on the redistribution structure and are electrically connected to the shielding plate. The active connective terminals are disposed on the redistribution structure and are electrically connected to the routing conductive traces. Vertical projections of the dummy connective terminals fall on the shielding plate.Type: GrantFiled: January 17, 2023Date of Patent: April 9, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei-Cheng Wu, Chien-Chia Chiu, Cheng-Hsien Hsieh, Li-Han Hsu, Meng-Tsan Lee, Tsung-Shu Lin
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Patent number: 11955419Abstract: The present disclosure provides a semiconductor device package including a first substrate and an adhesive layer. The first substrate has a first surface and a conductive pad adjacent to the first surface. The conductive pad has a first surface exposed from the first substrate. The adhesive layer is disposed on the first surface of the first substrate. The adhesive layer has a first surface facing the first substrate. The first surface of the adhesive layer is spaced apart from the first surface of the conductive pad in a first direction substantially perpendicular to the first surface of the first substrate. The conductive pad and the adhesive layer are partially overlapping in the first direction.Type: GrantFiled: January 3, 2023Date of Patent: April 9, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventor: Yi Chun Chou
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Patent number: 11948639Abstract: A method used in forming a memory array comprising strings of memory cells comprises forming a stack comprising vertically-alternating first tiers and second tiers comprising laterally-spaced memory-block regions having horizontally-elongated trenches there-between. Two of the first tiers have different vertical thicknesses relative one another. Channel-material strings of memory cells extend through the first tiers and the second tiers. Through the horizontally-elongated trenches, first conductive material is formed in void space in the two first tiers. The first conductive material fills the first tier of the two first tiers that has a smaller of the different vertical thicknesses in individual of the memory-block regions. The first conductive material less-than-fills the first tier of the two first tiers that has a larger of the different vertical thicknesses in the individual memory-block regions.Type: GrantFiled: July 6, 2021Date of Patent: April 2, 2024Assignee: Micron Technology, Inc.Inventors: John D. Hopkins, Alyssa N. Scarbrough
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Patent number: 11948835Abstract: A device comprises a first metal structure, a dielectric structure, a dielectric residue, and a second metal structure. The dielectric structure is over the first metal structure. The dielectric structure has a stepped sidewall structure. The stepped sidewall structure comprises a lower sidewall and an upper sidewall laterally set back from the lower sidewall. The dielectric residue is embedded in a recessed region in the lower sidewall of the stepped sidewall structure of the dielectric structure. The second metal structure extends through the dielectric structure to the first metal structure.Type: GrantFiled: April 14, 2021Date of Patent: April 2, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Che-Cheng Chang, Chih-Han Lin
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Patent number: 11948880Abstract: Implementations of a silicon-on-insulator (SOI) die may include a silicon layer including a first side and a second side, and an insulative layer coupled directly to the second side of the silicon layer. The insulative layer may not be coupled to any other silicon layer.Type: GrantFiled: October 4, 2022Date of Patent: April 2, 2024Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Mark Griswold, Michael J. Seddon
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Patent number: 11950465Abstract: A display device includes: a substrate including a display area and a peripheral area outside the display area; a power wiring portion including a first power line in the peripheral area, a second power line spaced apart from the first power line and closer to the display area than the first power line, and connection power lines connecting the first power line to the second power line; and data lines in the peripheral area and having portions located between the connection power lines when viewed from a direction perpendicular to the substrate.Type: GrantFiled: June 18, 2021Date of Patent: April 2, 2024Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Bongwon Lee, Hyunchol Bang, Youngsoo Yoon
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Patent number: 11943925Abstract: A semiconductor memory device includes first conductive lines stacked in a first direction perpendicular to a top surface of a substrate, second conductive lines extending in the first direction and intersecting the first conductive lines, and memory cells provided at intersection points between the first conductive lines and the second conductive lines, respectively. Each of the memory cells includes a semiconductor pattern parallel to the top surface of the substrate, the semiconductor pattern including a source region having a first conductivity type, a drain region having a second conductivity type, and a channel region between the source region and the drain region, first and second gate electrodes surrounding the channel region of the semiconductor pattern, and a charge storage pattern between the semiconductor pattern and the first and second gate electrodes.Type: GrantFiled: June 1, 2021Date of Patent: March 26, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hyuncheol Kim, Jaeho Hong, Yongseok Kim, Ilgweon Kim, Hyeoungwon Seo, Sungwon Yoo, Kyunghwan Lee
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Patent number: 11943911Abstract: A semiconductor structure for a memory device includes a substrate including a memory cell region and a peripheral circuit region defined thereon, at least an active region formed in the peripheral circuit region, a buried gate structure formed in the active region in the peripheral circuit region, a conductive line structure formed on the buried gate structure, and at least a bit line contact plug formed in the memory cell region.Type: GrantFiled: August 13, 2018Date of Patent: March 26, 2024Assignees: UNITED MICROELECTRONICS CORP., Fujian Jinhua Integrated Circuit Co., Ltd.Inventor: Yukihiro Nagai