Abstract: A duty correction device includes a clock generation circuit, first and second correction pulse generation circuits, and a duty correction circuit. The clock generation circuit generates first to third divided clock signals, each having a phase offset from a reference clock signal. The first correction pulse generation circuit generates a first correction pulse by detecting a phase difference between a delayed clock signal and the first and second divided clock signals. The second correction pulse generation circuit generates a second correction pulse by detecting a phase difference between the second and third divided clock signals. The duty correction circuit checks whether the first and second correction pulses are generated at a preset logic level of the reference clock signal, and reflects the first or second correction pulses in a duty correction operation for the reference clock signal according to a result of the check.

Abstract: The present disclosure provides a sense amplifier, a memory, and a method for controlling a sense amplifier, relating to the technical field of semiconductor memories. The sense amplifier comprises: an amplification module; and an offset voltage storage unit electrically connected to the amplification module; wherein, in an offset cancellation stage of the sense amplifier, the sense amplifier is configured to comprise a current mirror structure to store an offset voltage of the amplification module in an offset voltage storage unit. The present disclosure can realize the offset cancellation of the sense amplifier.

Abstract: A memory apparatus and method of operation are provided. The apparatus includes memory cells connected to word lines and disposed in strings. A control means is coupled to the word lines and the strings and is configured to ramp a voltage applied to a selected one of the word lines from a verify voltage to a reduced voltage during a program-verify portion of a program operation. The control means successively ramps voltages applied to each of a plurality of neighboring ones of the word lines from a read pass voltage to the reduced voltage beginning with ones of the plurality of neighboring ones of the word lines immediately adjacent the selected one of the word lines and progressing to ones of the plurality of neighboring others of the word lines disposed increasingly remotely from the selected one of the word lines during the program-verify portion of the program operation.

Abstract: A memory cell arrangement is provided that may include: one or more memory cells, each memory cell of the one or more memory cells including: a field-effect transistor structure; a plurality of first control nodes; a plurality of first capacitor structures, a second control node; and a second capacitor structure including a first electrode connected to the second control node and a second electrode connected to a gate region of the field-effect transistor. Each of the plurality of first capacitor structures includes a first electrode connected to a corresponding first control node of the plurality of first control nodes, a second electrode connected to the gate region of the field-effect transistor structure, and a spontaneous-polarizable region disposed between the first electrode and the second electrode of the first capacitor structure.

Abstract: A matrix includes a plurality of volatile switches, each of the volatile switches including an active layer made of an OTS material, the plurality of volatile switches being divided into two groups in such a way as to form a message, each of the volatile switches of the first group having been initialized beforehand by an initialization voltage, none of the volatile switches of the second group having been initialized beforehand, the message being formed by the initialized or non-initialized states of each of the switches of the matrix.

Abstract: A structure includes an array of nonvolatile memory cells, wordlines and bitlines connected to the nonvolatile memory cells, sense amplifiers connected to the nonvolatile memory cells, and reference cells connected to the sense amplifiers. Each of the reference cells has a transistor connected to a variable resistor, one of the wordlines, a reference bitline separate from the bitlines, and the sense amplifiers.

Abstract: A method of providing an auxiliary power by an auxiliary power supply. The method may include converting an external power to a plurality of charging voltages; charging a charging circuit with a first charging voltage of the plurality of charging voltages; monitoring a voltage of the charging circuit; when capacitance of the charging circuit is less than a first reference capacitance, charging the charging circuit with a second charging voltage of the plurality of charging voltages, the second charging voltage being higher than the first charging voltage by a first voltage amount; and providing an auxiliary power to outside the auxiliary power supply. The auxiliary power may be generated based on the voltage of the charging circuit.

Abstract: A semiconductor memory device includes memory cell arrays including a first memory cell and a first word line connected to the first memory cell, a first wiring electrically connected to the first word lines corresponding to the memory cell arrays, a driver circuit electrically connected to the first wiring, second wirings electrically connected to the first wiring via the driver circuit, a voltage generation circuit including output terminals disposed corresponding to the second wirings, and first circuits disposed corresponding to the memory cell arrays. The voltage generation circuit is electrically connected to the first word lines via a first current path including the second wirings, the driver circuit, and the first wiring. The voltage generation circuit is electrically connected to the first word lines via a second current path including the second wirings and the first circuits and without including the driver circuit.

Abstract: Some embodiments include apparatuses and methods of using the apparatuses. One of the apparatuses includes a substrate, a first deck including first memory cell strings located over the substrate, a second deck including second memory cell strings and located over the first deck, first data lines located between the first and second decks and coupled to the first memory cell strings, second data lines located over the second deck and coupled to the second memory cell strings, and first and second circuitries. The first and second data lines extending in a direction from a first portion of the substrate to a second portion of the substrate. The first buffer circuitry is located in the first portion of the substrate under the first memory cell strings of the first deck and coupled to the first data lines. The second buffer circuitry is located in the second portion of the substrate under the first memory cell strings of the first deck and coupled to the second data lines.

Abstract: A memory includes a bank, the bank includes a plurality of sections, each of the plurality of section includes a plurality of word lines, a plurality of bit lines, and a plurality of storage units arranged in an array, and each of the plurality of storage units is connected to one of the plurality of word lines and one of the plurality of bit lines; the bank is configured to: in a preset mode, in response to a control signal, activate each of a plurality of word lines in at least one target section of the bank, pull up or pull down a level of each of a plurality of bit lines in the target section, and pull a complementary bit line of each of the plurality of bit lines in the target section to a level opposite to a level of the plurality of bit lines.

Abstract: A device is disclosed herein. The device includes at least two transmit portions and at least one contact portion. Each of the at least two transmit portions is configured to receive a bit line signal. The at least one contact portion is couple to the at least two transmit portions respectively and configured to transmit the bit line signals from the least two transmit portions to a source line.

Abstract: An electronic device includes a semiconductor memory comprising column lines, row lines crossing the column lines, memory cells located at intersections between the column lines and the row lines, dummy insulating patterns located adjacent to the memory cells, liner layers formed on sidewalls of the memory cells, and dummy liner layers formed on sidewalls of the dummy insulating patterns.

Abstract: A level shifter receives an input signal in a first power domain and generates a corresponding output signal in a second power domain. The transition time of the output signal may be longer during a low-to-high transition than during a high-to-low transition or vice versa. The level shifter may provide two outputs, wherein one of the two outputs has a shorter transition time during a high-to-low transition and the other output has a shorter transition time during a low-to-high transition. By using an inverter on the second output, two non-inverted outputs are generated with different transition times. A ramp selection circuit is used to select between the first output and the inverted second output. The ramp selection circuit selects the output with the shortest transition time.

Abstract: A state detection circuit for an anti-fuse memory cell includes: amplifier, having first input terminal connected with first reference voltage, second input terminal connected with first node and output terminal connected with second node; anti-fuse memory cell array, including anti-fuse memory cell sub-arrays, bit lines of sub-arrays are connected with first node, word lines of sub-arrays are connected with controller and each sub-array includes anti-fuse memory cells; first switch element, having first terminal connected with power supply, second terminal connected with first node and control terminal connected with second node; second switch element, having first terminal connected with power supply, second terminal connected with third node and control terminal connected with second node; third switch element, having first terminal connected with third node, grounded second terminal and control terminal connected with controller; and comparator, having first and second input terminals connected with third

Abstract: In a method of resetting a storage device, an internal power supply voltage is generated based on an external power supply voltage. A first reset control signal that is activated when a level of the internal power supply voltage is higher than a reference level. A second reset control signal that is activated after a power-on of the storage device is completed or deactivated after a predetermined delay time from when the external power supply voltage is turned off. A final reset control signal is generated based on the first reset control signal and the second reset control signal. The final reset control signal is activated when at least one of the first and second reset control signals is activated. After the external power supply voltage is turned off, a reset operation is performed when the final reset control signal is activated.

Abstract: Methods, systems, and devices for controlled and mode-dependent heating of a memory device are described. In various examples, a memory device or an apparatus that includes a memory device may have circuitry configured to heat the memory device. The circuitry configured to heat the memory device may be activated, deactivated, or otherwise operated based on an indication of a temperature (e.g., of the memory device). In some examples, activating or otherwise operating the circuitry configured to heat the memory device may be based on an operating mode (e.g., of the memory device), which may be associated with certain access operations or operational states (e.g., of the memory device). Various operations or operating modes (e.g., of the memory device) may also be based on indications of a temperature (e.g., of the memory device).

Abstract: A storage device and a manufacturing method thereof are provided and relate to the technology field of storage. The storage device includes storage a first chip and a second chip. The first chip includes a storage array. The storage array includes at least one storage block. The second chip includes a logic control circuit. The logic control circuit includes a global bit line decoder. The global bit line decoder is electrically connected to the at least one storage block. An occupied area after the first chip and the second chip are stacked can be reduced by constructing the global bit line decoder block constituted by the global bit line decoder in the top view projection area of the second chip, thereby reducing plane occupied space of the storage device. This is beneficial for minimizing the size of the storage device.

Abstract: Memory might include a controller configured to determine, for each sense circuit of a plurality of sense circuits, a respective plurality of first logic levels for that sense circuit while capacitively coupling a respective plurality of voltage levels to its respective sense node, to determine a particular voltage level in response to each respective plurality of first logic levels for the plurality of sense circuits and their respective plurality of voltage levels, and to determine, for each sense circuit of the plurality of sense circuits, a respective second logic level for that sense circuit while capacitively coupling the particular voltage level to its respective sense node.

Abstract: At least one embodiment of the disclosure is directed to a memory circuit having a leakage current blocking mechanism and a memory device having the memory circuit. In an aspect, one embodiment of the disclosure describes a memory circuit which includes not limited to a memory array which includes a first memory cell connected to a first bit line and a second memory cell connected to a second bit line, a pre-charge circuit which is connected to the memory array and includes a first pre-charge device, and a programming circuit which is connected to the pre-charge circuit and comprises a programming transistor which has a higher drive capability than the first pre-charge device so as to drive the first bit line to a ground voltage in response to the first write operation, wherein in response to a first write operation on the first memory cell, a current flow exists between the programming circuit and the first pre-charge device.

Abstract: An interface of a memory circuit includes a chip enable terminal, at least one data terminal, and a data strobe terminal. The chip enable terminal receives a chip enable signal that varies between a first high voltage and a low voltage for enabling the memory circuit. The at least one data terminal receives at least one first data signal that varies between a second high voltage and the low voltage. The data strobe terminal receives a first data strobe signal that periodically varies between the second high voltage and the low voltage. The first data strobe signal is synchronized with the at least one first data signal, and is arranged to latch and sample the at least one first data signal. The first high voltage is higher than the second high voltage, and the second high voltage is higher than the low voltage.