Abstract: A ferroelectric memory is intended to reduce an applied voltage required at the times of writing and reading. A ferroelectric capacitor includes a ferroelectric film and a top electrode and a bottom electrode including materials with different work functions formed above and below the ferroelectric film. The transistor is connected to either the top electrode or the bottom electrode to select the ferroelectric capacitor. A drive control unit applies, at the times of writing and reading, a voltage lower than that at the time of erasing by a predetermined potential difference to the ferroelectric film.

Abstract: A multiply-and-accumulate (MAC) circuit having a plurality of compute-in-memory bitcells is configured to multiply a plurality of stored weight bits with a plurality of input bits to provide a MAC output voltage. A successive approximation analog-to-digital converter includes a capacitive-digital-to-analog-converter (CDAC) configured to subtract a bias voltage from the MAC output voltage to provide a CDAC output voltage. A comparator compares the CDAC output voltage to a fixed reference voltage.

Abstract: Among other things, an apparatus comprises quantum units; and couplers among the quantum units. Each coupler is configured to couple a pair of quantum units according to a quantum Hamiltonian characterizing the quantum units and the couplers. The quantum Hamiltonian includes quantum annealer Hamiltonian and a quantum governor Hamiltonian. The quantum annealer Hamiltonian includes information bearing degrees of freedom. The quantum governor Hamiltonian includes non-information bearing degrees of freedom that are engineered to steer the dissipative dynamics of information bearing degrees of freedom.

Abstract: A memory cell has first, second, third and fourth transistors forming first and second cross-coupled inverters. The inverters define first and inverted first storage nodes; the first connected to first reference and first supply voltages, second connected to second reference and second supply voltages. A fifth transistor connected between first storage node and first bit line; sixth transistor connected between inverted first node and second bit line; first word line connected to fifth transistor, controlling access of first bit line to first node; second word line connected to sixth transistor, controlling access of second bit line to inverted first node. Relative voltage levels of first word line and first reference voltages, or first supply and first reference voltages, or second word line and second reference voltages, or second supply and second reference voltages, or first and second reference voltages are configured so first/inverted node are read/written independently.

Abstract: A memory includes: a substrate, having a plurality of active regions arranged in an array and a plurality of word lines extending in a first direction, the active regions being inclined at a preset angle to the word lines, the active region having at least one access transistor; a plurality of bit lines, extending in a second direction perpendicular to the first direction; magnetic tunnel junctions, one end of the magnetic tunnel junction is electrically connected to one of bit lines and another end of the magnetic tunnel junction is electrically connected to two access transistors, the two access transistors electrically connected to the magnetic tunnel junction being located in two adjacent active regions, respectively.

Abstract: Apparatuses including a first-in first-out circuit are described. An example apparatus includes: a first-in first-out circuit including a first latch, a second latch and a logic circuit coupled in series. The first latch receives first data and latches the first data responsive to a first input pointer signal. The second latch receives the latched first data from the first latch and latches the received first data responsive to a second input pointer signal that has a different phase from the first input pointer signal and thus provides a second data. The logic circuit receives the second data and an output pointer signal and further provides an output data responsive to the output pointer signal.

Abstract: A method of peak power management (PPM) for a storage system with multiple memory dies is provided, where each of the multiple memory dies includes a PPM circuit having a PPM contact pad and PPM contact pads of the multiple memory dies are electrically connected. The PPM method includes the following steps: switching on a pull-down driver of the PPM circuit on a selected memory die of the storage system; verifying a PPM enablement signal regulated by a pull-down current flowing through the pull-down driver; and performing a peak power operation on the selected memory die when the PPM enablement signal indicates that a total current of the storage system is less than a maximum total current allowed for the storage system.

Abstract: A memory device includes programmable memory cells and a programming circuit for programming a selected memory cell to a target logic state by applying one or more programming current pulses. A temperature sensor operates to sense a temperature of the memory device. A reading circuit reads a current logic state of the selected memory cell after a predetermined programming current pulse of the programming current pulses. The reading circuit includes a sensing circuit that senses a current logic state of the selected memory cell according to a comparison between a reading electric current depending on the current logic state of the selected memory cell and a reference current. An adjusting circuit adjusts one or the other of the reading electric current and the reference electric current to be provided to the sensing circuit according to the temperature of the memory device.

Abstract: Methods, systems, and devices for techniques to perform a sense operation are described. In some examples, a memory device may include a pair of transistor to precharge a digit line. A first transistor of the pair of transistors may be coupled with a first node and a second transistor of the pair of transistors may be coupled with a second node. In some cases, the first node and the second node may be selectively coupled via a transistor. The first and second transistors may be activated to precharge the first and second nodes. In some examples, a pulse may be applied to a capacitor coupled with the second node to transfer a charge to the digit line. In some cases, the cascode transistor may maintain or control the voltage of the digit line to be at or below an upper operating voltage of the memory cell.

Abstract: Apparatuses for supplying power to a plurality of memory core chips are described. An example apparatus includes: a substrate, an interface chip on the substrate, and a plurality of memory core chips on the interface chip coupled to the interface chip via a plurality of electrodes. The plurality of memory core chips includes a first memory core chip, a second memory core chip, and a third memory core chip disposed between the second memory core chip and the interface chip. The first memory core chip and the third memory core chip are activated for data access while the second memory core chip disposed between the first memory core chip and the third memory core chip is deactivated for data access.

Abstract: A die-to-die voltage sharing process that may be implemented to overcome a charge pump failure on a memory die of a non-volatile storage device. When a charge pump failure is detected, a controller causes another memory die with a functional charge pump to generate and supply a voltage to the memory die with the failed charge pump. When the voltage is received by the memory die with the failed charge pump, the voltage may be used to perform a requested memory operation.

Abstract: Memory devices are disclosed that support multiple power ramping sequences or modes. For example, a level shifter device is operably connected to a memory macro in a memory device. The level shifter device receives at least one gating signal. Based on a state of the at least one gating signal, the level shifter device outputs one or more signals that cause or control voltage signals in or received by the memory macro to ramp up, ramp down, or ramp up and ramp down according to one or more power ramping modes.

Abstract: According to one embodiment, a memory system includes a semiconductor memory and a controller. The semiconductor memory includes first to fourth word lines and first to fourth memory cells. The controller is configured to issue first and second instructions. The controller is further configured to execute a first operation to obtain a first read voltage based on a threshold distribution of the first memory cell, and a second operation to read data from the second memory cell.

Abstract: A sub-wordline driver for a semiconductor memory device includes a plurality of first active regions spaced apart from each other by a predetermined distance in each of a first direction and a second direction within a first region and a main wordline formed to traverse the plurality of first active regions by extending in the first direction. The main wordline includes a first line formed to extend in the first direction, a second line formed to extend in the first direction, and configured to be spaced apart from the first line by a predetermined distance in the second direction, and a connection line configured to interconnect the first line and the second line in the second direction at an end portion of the first region.

Abstract: A memory architecture for 3-dimensional thyristor cell arrays is disclosed. Thyristor memory cells are connected in a 3-dimensional cross-point array to form a bit line cluster. The bit line clusters are connected in parallel to sense amplifier and write circuits through multiplexer/demultiplexer circuits. Control circuits select one of the bit line clusters during a read or write operation while the non-selected bit line clusters are not activated to avoid disturbs and power consumption in the non-selected bit line clusters. The bit line clusters, multiplexer/demultiplexer circuits, and sense amplifier and write circuits from a memory array tile (MAT).

Abstract: This application relates to methods and apparatus for computing, especially to circuitry for performing computing, at least partly, in the analogue domain. The circuitry (200) comprises a plurality of memory cells (201), each memory cell having first and second paths between an electrode (202) for receiving an input current and respective positive and negative electrodes (203) for outputting a differential-current output. Memristors (101) are located in the first and second paths. The memory cells are configured into sets (205) of memory cells, the memory cells of each said set being connected so as to provide a differential current set output that corresponds to a combination of the cell outputs of all of the memory cells of that set. For each set, at least some of the memory cells of that set are configured to receive a different input current to other memory cells of that set.

Abstract: Methods, systems, and devices for differential sensing for a memory device are described. A memory device in accordance with examples as disclosed herein may include a sense component having a signal development component for generating a sense signal, a reference component for generating a reference signal, and a tail component coupled with the signal development component and the reference component. The tail component may be configured for canceling common aspects of the sense signal and the reference signal. Additionally or alternatively, a memory device in accordance with examples as disclosed herein may include a sense component having a sense amplifier configured to operate in multiple power domains, with one power domain associated with sense signal and reference signal generation and comparison, and another power domain associated with logical signal or information transfer.

Abstract: An architecture of the memory device may leverage a transmission path resistance compensation scheme for memory cells to reduce the effect of parasitic loads in accessing a memory cell. A memory cell of such a memory device may experience a total resistance including a transmission path resistance associated with the respective access lines of the memory cell and an added compensatory resistance. The foregoing memory device may leverage a spike mitigation scheme to mitigate the harmful effect of a voltage and/or rush current to the near memory cells of the memory device. In addition, spike mitigation circuitry may include coupling a resistor on access lines near the respective decoders. Further, spike mitigation circuitry may include coupling a resistor between the decoders.

Abstract: A method and related apparatus for using an indication of RRAM cell resistance to determine a write condition are disclosed. A cell characteristic of an RRAM cell may be determined to a higher bit resolution than a data read value. A write condition may be selected for the RRAM cell, based on the cell characteristic. The RRAM cell may be written to, using the selected write condition.

Abstract: A method of operating a memory circuit includes generating a first voltage by a first amplifier circuit of a first driver circuit coupled to a first column of memory cells, and generating a first current in response to the first voltage. The first current includes a first set of leakage currents and a first write current. The method further includes generating, by a tracking circuit, a second set of leakage currents configured to track the first set of leakage currents of the first column of memory cells, and mirroring the first current in a first path with a second current in a second path by a first current mirror. The second current includes the second set of leakage currents and a second write current. The first write current corresponds to the second write current. The first set of leakage currents corresponds to the second set of leakage currents.