Abstract: A display apparatus includes a substrate; a first circuit unit located on the substrate and including a first thin-film transistor (TFT) and a first storage capacitor; a first dummy circuit unit on the substrate, including a first dummy TFT and a first dummy storage capacitor, and in the same layer as the first circuit unit; and a first dummy light-emitting unit on the first dummy circuit unit, connected to the first circuit unit, and configured to be driven by the first circuit unit, wherein the first dummy light-emitting unit overlaps the first dummy circuit unit.

Abstract: A manufacturing method for a chip packaging structure, comprising: arranging a metal heat dissipation layer on a substrate comprising at least one flange on its side surface; forming a sealing pin located on an upper surface of the flange, so that the metal heat dissipation layer, the flange and the sealing pin form a cavity for accommodating an encapsulant; attaching a chip structure on an upper surface of the metal heat dissipation layer using an adhesive layer; forming the encapsulant encapsulating an upper surface of the substrate, the metal heat dissipation layer and the chip structure, the sealing pin extends to a periphery of the upper surface of the encapsulant; performing a mechanical or chemical treatment, to make electrode connecting structures on an upper layer of the chip structure exposed outside the first encapsulant; arranging a pin layer for electrically coupling to and covering the electrode connection structures.

Abstract: A display device may include a first pixel column disposed on a substrate, a second pixel column adjacent to the first pixel column, a third pixel column adjacent to the second pixel column, and a first wiring, a second wiring, and a third wiring respectively and electrically connected to the first pixel column, the second pixel column, and the third pixel column. Each of the first wiring, the second wiring, and the third wiring may include a first line, a second line electrically connected to the first line, the first line and the second line being disposed on different layers, and a third line electrically connected to the second line, the first line, the second line, and the third line being disposed on different layers.

Abstract: A single light emitting diode (LED) structure includes an array of spaced discrete light emitting zones separated by isolation areas. Each emitting zone includes an epitaxial structure configured to emit an emitting light having a particular wavelength over an effective emission area. In addition, the effective emission area for each emitting zone can be geometrically defined and electrically configured to provide a desired light intensity. For example, each effective emission area can have a selected size and spacing depending on the application and light intensity requirements. Each emitting zone also includes a wavelength conversion member on its effective emission area configured to convert an emitting wavelength of the emitting light to a different color. The single (LED) structure can include multiple colors at different zones to produce a desired spectra or design.

Abstract: A display cell includes a signal line electrically connected to a pixel arranged in a display area, a signal pad unit disposed in a peripheral area adjacent to the display area, and including a signal pad electrically connected to the signal line, an inspection pad unit disposed in a turn-on inspection area, and including an inspection pad electrically connected to the signal pad, where the inspection pad is configured to receive a turn-on inspection signal, and a power supply voltage line configured to apply a power supply voltage to the pixel, extending from the inspection pad unit to the peripheral area, and divided into a plurality of sublines by at least one slit pattern in a cut-off area between the peripheral area and the turn-on inspection area.

Abstract: A display device includes a first substrate, an insulating layer, a plurality of display elements, a plurality of first spacers, and a second substrate. The first substrate includes a transmission area, a display area surrounding at least a portion of the transmission area, and a first non-display area located between the transmission area and the display area. The insulating layer is arranged on the first substrate in the display area and the first non-display area. The plurality of display elements are disposed on the insulating layer in the display area. The plurality of first spacers each has an island shape and are spaced apart from each other on the insulating layer in the first non-display area. The second substrate faces the first substrate.

Abstract: Among other things a method including releasing a discrete component from an interim handle and depositing a discrete component on a handle substrate, attaching the handle substrate to the discrete component, and removing the handle substrate from the discrete component.

Abstract: A semiconductor device includes a lower stack structure that includes a lower word line, an upper stack structure that is on the lower stack structure and includes an upper word line, a decoder that is adjacent to the lower stack structure and the upper stack structure, a signal interconnection that is connected to the decoder, a lower selector that is connected to the signal interconnection and further connected to the lower word line, and an upper selector that is connected to the signal interconnection, isolated from direct contact with the lower selector, and further connected to the upper word line.

Abstract: A display apparatus includes a first display area including a plurality of pixel areas, and a second display area including a plurality of pixel areas and a plurality of transmission areas and arranged adjacent to the first display area. The plurality of pixel areas each includes sub-pixels each including a pixel circuit and an organic light-emitting device electrically connected to the pixel circuit. The pixel circuit includes a thin-film transistor and an inorganic insulating layer on the thin-film transistor, and the thin-film transistor includes a semiconductor layer and a gate electrode. The organic insulated layer extends in the transmission areas. The second display area defines a dummy contact hole which passes through the inorganic insulating layer in at least one of the pixel areas and the transmission areas.

Abstract: A display device may prevent signal lines in a non-display area from being damaged by particles. The display device may include a first substrate including a display area and a non-display area, a first electrode in the display area over the first substrate, a light emitting layer over the first electrode, a second electrode over the light emitting layer, lines in the non-display area over the first substrate, organic patterns over the lines and spaced apart from one another, an adhesive layer over the organic patterns, and a second substrate over the adhesive layer. The light emitting layer and the second electrode are provided from the display area to the non-display area, and spaced distances among the organic patterns are shorter than a distance from an upper surface of the second electrode provided over the organic patterns to an upper surface of the adhesive layer.

Abstract: A semiconductor device includes a fin projecting upwardly from a substrate; a gate stack engaging the fin; a gate spacer on a sidewall of the gate stack and in contact with the gate stack; and a dielectric layer on the sidewall of the gate stack and in contact with the gate stack, the dielectric layer being vertically between the fin and the gate spacer, wherein the dielectric layer has a thickness small than the gate spacer.

Abstract: A display device includes a substrate including a display area and a peripheral area, a thin film transistor arranged on the substrate, a first metal wiring layer electrically connected to the thin film transistor, an inorganic protective layer on the first metal wiring layer, a patterned first organic film layer located on the inorganic protective layer and overlapping the first metal wiring layer in a plan view, a second metal wiring layer on the first organic film layer, and a second organic film layer on the second metal wiring layer, where the first organic film layer is patterned to be arranged at a position where the first metal wiring layer and the second metal wiring layer overlap each other in the plan view, and is not arranged on an entirety of the display area, and the second organic film layer is arranged on the entire display area.

Abstract: An organic light emitting display device may include a substrate having a display area and a non-display area at least partially surrounds the display area, a pixel structure disposed in the display area on the substrate, a via insulating layer disposed in the non-display area on the substrate and having a contact hole, a lower pad disposed on the via insulating layer and a connecting structure. Here, the connecting structure may include a flexible substrate disposed on the lower pad, an upper pad disposed between the flexible substrate and the lower pad, and an upper dummy pad spaced apart from the upper pad in a first direction on a bottom surface of the flexible substrate.

Abstract: A light emitting element includes: a substrate including a first surface including a first region and a second region; a first semiconductor layered body on the first region, the first semiconductor layered body comprising a first light emitting layer and including: a first lateral surface, and a second lateral surface opposite to the first lateral surface; and a second semiconductor layered body on the second region, the second semiconductor layered body comprising a second light emitting layer and including: a first lateral surface facing the second lateral surface and located on a first semiconductor layered body side of the second semiconductor layered body, and a second lateral surface opposite to the first lateral surface and located on a side opposite the first semiconductor layered body side of the second semiconductor layered body.

Abstract: A display device includes a substrate including a display area and a non-display area around the display area. A pixel is disposed on the display area. A first dam is disposed on the non-display area. The first dam includes a first sub-dam and a second sub-dam disposed on the first sub-dam. A first power line is disposed on the non-display area and passes between the first sub-dam and the second sub-dam. The first power line is connected to the pixel. A bridge pattern is disposed under the first sub-dam. The bridge pattern is connected to the first power line.

Abstract: An organic EL device (100D) according to an embodiment of the present invention has: a substrate (1); a drive circuit layer (2) having a plurality of TFTs formed on the substrate; interlayer insulation layers (2Pa, 2Pb) formed on the drive circuit layer; an organic EL element layer (3) formed on the interlayer insulation layers; and a thin-film sealing structure (10DE) formed so as to cover the organic EL element layer. The interlayer insulation layers have contact holes (CH1, CH2). Contact parts (C1, C2) that connect the drive circuit layer and the organic EL element layer are formed inside the contact holes. The surface (2Pb_Sb) of the interlayer insulation layers and the surface (C_Sb) of the contact parts are flush, and the arithmetic average roughness Ra of the surfaces are 50 nm or less.

Abstract: An organic light-emitting display including a substrate, an insulating layer on the substrate, the substrate and the insulating layer having an opening therethrough penetrating, a pixel array on the insulating layer, the pixel array including a plurality of pixels that surround the opening, a first pixel adjacent to the opening from among the plurality of pixels includes a pixel electrode layer, an intermediate layer on the pixel electrode layer, and an opposite electrode layer on the intermediate layer, and a stepped portion on the substrate and adjacent to the opening, the stepped portion having an under-cut step, wherein the intermediate layer including an organic emission layer, and wherein at least one of the intermediate layer and the opposite electrode layer extends toward the opening and is disconnected by the stepped portion.

Abstract: A display device includes: a base substrate including an opening area, an opening peripheral area, and a display area at least partially surrounding the opening peripheral area, wherein the opening peripheral area is a non-display area at least partially surrounding the opening area; a thin film transistor disposed on the base substrate in the display area; a via insulating layer disposed on the thin film transistor and having a first opening surrounding the opening area, wherein the first opening is in the opening peripheral area; a pixel defining layer disposed on the via insulating layer and having a first opening which overlaps the first opening of the via insulating layer; a transparent filler disposed on the base substrate in the opening area; and a sealing substrate disposed on the transparent filler.

Abstract: An optoelectronic device includes a semiconductor stack including a top surface; a current blocking region, including a first pad portion formed on the semiconductor stack and wherein the current blocking region includes transparent insulated material; a first opening, formed in the first pad portion, exposing the top surface of the semiconductor stack; a transparent conductive layer, covering the top surface of the semiconductor stack, including a second opening overlapping the first opening; and a first electrode, formed on the semiconductor stack, including a first pad electrode formed on the first pad portion of the current blocking region; wherein the first pad electrode contacts the semiconductor stack through the first opening and the second opening; wherein the first opening includes a first area, the first pad portion and the first opening compose a total area, and a ratio of the first area to the total area is between 10% and 40%.

Abstract: A display device is provided. The display device includes first, second and third front signal lines disposed on a first portion and electrically connected to light emitting elements, connection lines overlapping a second portion, and first, second and third rear signal lines disposed on a third portion. The first, second and third front signal lines are disposed on different layers. The first front signal line and the first rear signal line are disposed on a same layer. The second front signal line and the second rear signal line are disposed on a same layer. The third front signal line and the third rear signal line are disposed on a same layer. The connection lines electrically and selectively connect the front signal lines and the rear signal lines.