Patents Examined by Neel D Shah
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Patent number: 11980455Abstract: A measuring device is provided for reducing the occurrence of damage to a sensor section. The sensor section includes a substrate, a pair of comb electrodes on a first principal surface, and a pair of back-side electrodes disposed on a second principal surface and corresponding to the pair of comb electrodes, respectively. The pair of comb electrodes includes a plurality of tooth sections and connection sections that connect the tooth sections to each other, respectively. The substrate includes via-hole conductors in positions corresponding to the tooth sections inside a region surrounded by the outer tooth sections on opposite ends in a direction in which the tooth sections in the pair of comb electrodes are aligned and the connection sections. The via-hole conductors connect the comb electrodes and the back-side electrodes.Type: GrantFiled: November 30, 2021Date of Patent: May 14, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Jun Takagi, Kenji Tanaka, Tomoki Takahashi
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Patent number: 11982697Abstract: The application discloses a RF vector measurement system including: a first port for generating a RF pulse, a pulse splitter for splitting the pulse into a first pulse send to a device-under-test DUT, and a second pulse send as a reference to a first quantum sensor of the system. The system is arranged to supply a third pulse, which is produced by reflecting or transmitting the first by the DUT, to at least one second quantum sensor phase-correlated with said first quantum sensor by entanglement.Type: GrantFiled: December 23, 2021Date of Patent: May 14, 2024Assignee: Rohde & Schwarz GmbH & Co. KGInventor: Julius Seeger
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Patent number: 11982688Abstract: The present invention relates to a test socket having a thin structure that can reduce durability degradation of a contact itself, have excellent electrical characteristics in processing high-speed signals, and can extend a service life thereof, and relates to spring contacts suitable thereto. The test socket according to the present invention includes: a plurality of spring contacts (100) each of which includes an upper contact pin (110) and a lower contact pin (120) that are assembled cross each other, and a spring (130) supporting the upper and lower contact pins (110 and 120); a main plate (1110) having a plurality of accommodating holes (1111) in which the respective spring contacts (100) are accommodated, with first openings (1113); and a film plate (1120) provided on a lower portion of the main plate (1110), and having second openings (1121).Type: GrantFiled: October 25, 2022Date of Patent: May 14, 2024Assignee: HICON CO., LTD.Inventors: Dong Weon Hwang, Logan Jae Hwang, Jae Baek Hwang
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Patent number: 11982569Abstract: A spectrographic system includes a space-borne spectrometer in communication with a ground-based processor. The space-borne spectrometer may include an interferometer, a detector array downstream from the interferometer, and a spectrometer controller configured to cooperate with the detector array to collect Fourier Transform Spectral (FTS) data, generate Principle Component Analysis (PCA) scores from the collected FTS data, generate an approximate interferogram based upon the PCA scores and the collected FTS data, generate residuals based upon the approximate interferogram, and generate compressed FTS data based upon the PCA scores and residuals to be sent to the ground-based processor.Type: GrantFiled: August 20, 2021Date of Patent: May 14, 2024Assignee: EAGLE TECHNOLOGY, LLCInventor: Richard D. Forkert
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Patent number: 11971463Abstract: Disclosed is a MTJ sensing circuit for measuring an external magnetic field and including a plurality of MTJ sensor elements connected in a bridge configuration, the MTJ sensing circuit having an input for inputting a bias voltage and generating an output voltage proportional to the external magnetic field multiplied by the bias voltage and a gain sensitivity of the MTJ sensing circuit, wherein the gain sensitivity and the output voltage vary with temperature; the MTJ sensing circuit further including a temperature compensation circuit configured to provide a modulated bias voltage that varies as a function of temperature over a temperature range, such that the output voltage is substantially constant as a function of temperature. Also disclosed is a method for compensating the output voltage for temperature.Type: GrantFiled: February 22, 2021Date of Patent: April 30, 2024Assignee: Allegro MicroSystems, LLCInventors: Anuraag Mohan, Robert Zucker
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Patent number: 11971430Abstract: An engaging device in a Mass-Interconnect, which provides an apparatus and method to change test adapters for testing applications. An engaging device of a Mass-Interconnect includes an interchangeable test adapter (ITA) and a locking mechanism. The locking mechanism includes a plunger having a plunger head at a first end thereof, a leaflet insert disposed over the plunger, a sleeve disposed over the leaflet insert, an over-dead-center (ODC) link connected to the plunger at a second end thereof opposite to the first end, and a rotatable handle connected to the ODC link. The plunger, the leaflet insert, and the sleeve of the locking mechanism engage or disengage the ITA when a user rotates the rotatable handle.Type: GrantFiled: May 5, 2023Date of Patent: April 30, 2024Inventors: Jeffery P. Stowers, Benjamin T. Ailinger
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Patent number: 11965926Abstract: The present invention relates to an electronic component test handler comprising: a hand configured to pick up and transfer a plurality of devices; and a scanner configured to scan a region of a movement path of a device picked up by the hand at a predetermined angle. The electronic component test handler having a flying scan function according to the present invention is capable of scanning during a transfer process without a change in position after picking up a device, and thus, operations and time required for the scanning may be reduced, thereby improving efficiency.Type: GrantFiled: April 8, 2020Date of Patent: April 23, 2024Assignee: ATECO INC.Inventor: Taek Seon Lee
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Patent number: 11959941Abstract: A probe card includes a flexible inorganic material layer, a metal micro structure, and a circuit board. The flexible inorganic material layer has a first surface and a second surface opposite to each other. The metal micro structure is disposed on the first surface. The circuit board is disposed on the second surface, and the circuit board is electrically connected to the metal micro structure. The test signal is adapted to be conducted to the circuit board through the flexible inorganic material layer.Type: GrantFiled: December 27, 2021Date of Patent: April 16, 2024Assignee: Industrial Technology Research InstituteInventors: Min-Chieh Chou, Meng-Chi Huang, Tune-Hune Kao, Yue-Zhen Huang
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Patent number: 11953524Abstract: A tool is presented herein capable of performing several electrical measurements and generating several electrical outputs. The tool can be configured to perform measurements and provide outputs most commonly utilized when developing and diagnosing failures of a hardware platform based around a microcontroller. The tool can have a form factor and a header configuration compatible for mating with an external microcontroller or minicomputer developer board such as Arduino, UDOO, Raspberry Pi, TI LaunchPad, STM Nucleo, BeagleBone, etc.Type: GrantFiled: July 9, 2020Date of Patent: April 9, 2024Assignee: Gentiam LLCInventors: Omar Laldin, Tarryn MacPherson
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Patent number: 11953530Abstract: A system frequency detector includes an orthogonal coordinate signal generator generating an orthogonal two-phase voltage signal from a three-phase voltage signal of three-phase alternating current power of a power system by converting the three-phase voltage signal into a two-phase voltage signal orthogonal to the three-phase voltage signal, converting the two-phase voltage signal into a voltage signal of a rotating coordinate system, calculating a moving average of the voltage signal of the rotating coordinate system, and performing an inverse transformation of the voltage signal of the rotating coordinate system after calculating the moving average; and a frequency calculator including an angular frequency calculator calculating an angular frequency of the power system based on the two-phase voltage signal, and an arithmetic unit calculating a system frequency of the power system from the angular frequency, the frequency calculator further including a low-pass filter provided in series with the arithmeticType: GrantFiled: January 30, 2020Date of Patent: April 9, 2024Assignee: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATIONInventors: Yasuaki Mitsugi, Takashi Shigemasa
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Patent number: 11953552Abstract: The present disclosure relates to a system and apparatus for monitoring a partial discharge in a switchboard, including a plurality of partial discharge sensors provided in each of a plurality of switchboards to acquire partial discharge data generated in at least one switchboard, and a noise sensor provided in any one of the plurality of switchboards to acquire noise data to be differentiated from the partial discharge data acquired from the at least one partial discharge sensor, and it can be applied to other exemplary embodiments.Type: GrantFiled: July 16, 2019Date of Patent: April 9, 2024Assignee: LS ELECTRIC CO., LTD.Inventors: Chang Hwan Jin, Jong Ung Choi, Hyun Ho Kwon, Gwang Goo Kang, Jin Ho Lee
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Patent number: 11933837Abstract: In various examples, an inspection jig includes a plate-shaped insulating member having a recess; a first board having a first electrode; and a conducting wire electrically connected to a contact terminal. The insulating member is provided with a through hole penetrating a bottom portion of the recess. One end portion of the conducting wire is disposed in the through hole. The other end of the conducting wire is connected to the first electrode.Type: GrantFiled: March 27, 2020Date of Patent: March 19, 2024Assignee: NIDEC READ CORPORATIONInventors: Minoru Kato, Makoto Fujino
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Patent number: 11933839Abstract: An inspection apparatus for a substrate, comprising: a placing member on which a substrate is placed; a holder configured to hold a probe card having probes; positioning members to be in contact with an upper surface of the placing member to define a height of the placing member with respect to the probes; an adjustment mechanism configured to adjust heights of the positioning members; a detection device; and a control. The controller is configured to execute: positioning the positioning member to a reference height at which an overdrive amount becomes zero, based on the detection results of the probes, the placing member, and the positioning member; and acquiring a height of the positioning member at which a desired overdrive amount is obtained, and raising the placing member while adjusting a driving amount of the adjustment mechanism until the placing member reaches the height.Type: GrantFiled: October 6, 2022Date of Patent: March 19, 2024Assignee: Tokyo Electron LimitedInventor: Kentaro Konishi
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Patent number: 11921151Abstract: An inspection apparatus according to one embodiment of the present disclosure is configured to inspect an inspection object seated on a jig, the jig capable of being introduced into and withdrawn from the inspection apparatus. The inspection apparatus includes: a mover configured to move the jig; and a clamping driver configured to contact and press the jig, the clamping driver including a pressing portion configured to be movable in a clamping direction and an unclamping direction opposite to the clamping direction.Type: GrantFiled: January 22, 2020Date of Patent: March 5, 2024Assignee: KOH YOUNG TECHNOLOGY INC.Inventors: Myong Kang, Kang Jo Hwang, Choung Min Jung
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Patent number: 11921152Abstract: The method is for identifying a signal and its image signal input to the heterodyne frequency sweep system. Comparing to a traditional heterodyne frequency sweep technology, a mixing module with a positive and negative sign filters (PNS filters) is introduced, and the detection and identification module is added, and the typical low-pass filter in the input module is removed. According to the timing order sequence of the signal output from the intermediate frequency (IF) filter and PNS filters, a signal and its image signal can be identified. The bandwidth of the heterodyne frequency sweep system is not limited by the cut-off frequency of the low-pass filter (LPF) of the traditional heterodyne frequency sweep system.Type: GrantFiled: November 20, 2021Date of Patent: March 5, 2024Inventor: Ling Tong
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Patent number: 11906074Abstract: The disclosure relates to the technical field of hydraulic pneumatic systems, in particular to an electric control valve detection plug and an electric control valve signal detection method. The disclosure can accurately measure the electric control signal actually obtained by the valve, thus avoiding the risk of misjudgment. The disclosure has simple manufacture and convenient installation and disassembly.Type: GrantFiled: July 28, 2021Date of Patent: February 20, 2024Assignee: CITIC Dicastal Co., Ltd.Inventors: Zuo Xu, Hanqi Wu, Naili Li
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Patent number: 11904972Abstract: A height detection system of a motorcycle for determining a load-dependent height of a rear carrier part in relation to a rear wheel swing arm of the motorcycle includes a measuring device connecting the rear carrier part and the rear wheel swing arm for measuring the distance between the rear carrier part and the rear wheel swing arm, and a fastening web formed integrally and protruding from the rear carrier part in the direction of the rear wheel swing arm. The fastening web includes a lateral bearing face configured to receive a rear carrier end of the measuring device.Type: GrantFiled: July 3, 2019Date of Patent: February 20, 2024Assignee: Bayerische Motoren Werke AktiengesellschaftInventors: Tim Krych, Martin Pazulla
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Patent number: 11906577Abstract: The present disclosure provides a pad structure and a testkey structure and a testing method for a semiconductor device. The pad structure includes: an insulating dielectric layer formed on a substrate; a metal interconnection structure formed in the insulating dielectric layer, the metal interconnection structure comprising a first section and a second section, which are insulated from each other; and a pad formed on the top of the insulating dielectric layer so as to be exposed therefrom at least at its top surface, electrically connected to the first section, and insulated from the second section. With this disclosure, reduced capture of plasma is achievable, mitigating adverse impact of plasma on the semiconductor device.Type: GrantFiled: December 20, 2021Date of Patent: February 20, 2024Assignee: WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Linzhi Lu, Le Li, Jiwei He
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Patent number: 11908753Abstract: Herein disclosed is a test head connection method, the method comprises the following steps. First, a load board and a card holder are provided between a test head and a probing machine, the card holder is disposed in the probing machine, and the card holder is used to accommodate the load board. A vacuum function of the test head is activated, and the test head is moved to align the card holder. The test head is moved to touch the load board in the card holder. At least one clamping piece is used to fix the test head and the card holder. Wherein the load board and a wafer are connected by direct probing.Type: GrantFiled: November 6, 2021Date of Patent: February 20, 2024Assignee: Chroma ATE Inc.Inventors: Kao-Shan Yang, Ching-Li Lin
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Patent number: 11899058Abstract: An automated test equipment for testing one or more DUTs comprises a test head and a DUT interface. The DUT interface comprises a plurality of blocks of spring-loaded pins, for example groups or fields of spring-loaded pins. For example, the DUT interface is configured for establishing an electronic signal path between the test head and a DUT board or load board, which holds the DUT or which provides a connection to the DUT. The automated test equipment is configured to allow for a variation of a distance between at least two blocks of spring-loaded pins.Type: GrantFiled: November 14, 2022Date of Patent: February 13, 2024Assignee: Advantest CorporationInventor: Marc Mössinger