Abstract: A test apparatus and an automatic test equipment having the same are disclosed. The test apparatus includes a test head having a test area, a socket board combined to the test area of the test, the socket board including a socket body and an active device attached on a first surface of the socket body, the active device configured to operate a semiconductor package, and a heat exchanger arranged on an upper portion of the test head, the heat exchanger being in contact with the socket board.

Abstract: Disclosed is a test device for testing a high-frequency and high-speed semiconductor. The test device includes a probe supporting block formed with a tube accommodating portion along a test direction; a conductive shield tube accommodated in the tube accommodating portion; and a probe accommodated and supported in the shield tube without contact, the tube accommodating portion including a conductive contact portion for transmitting a ground signal to the shield tube. When a high-frequency and high-speed semiconductor or the like subject is tested, the test device easily and inexpensively prevents crosstalk between the adjacent signal probes and improves impedance characteristic.

Abstract: The disclosed apparatus may include support portions, a frame (such as a base) configured to maintain the support portions in a spaced-apart configuration, a sample holder configured to receive a sample, and a probe assembly including micromanipulators configured to position one or more probes in contact with the sample. The sample holder may rotate between the support portions, and the probe assembly may rotate with the sample holder so that the one or more probes may maintain contact with a sample in the sample holder as the sample holder is rotated, for example, to expose a portion of the sample for processing. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: An example test system includes a test head, and a device interface board (DIB) configured to connect to the test head. The DIB is for holding devices under test (DUTs). The DIB includes electrical conductors for transmitting electrical signals between the DUTs and the test head. Servers are programmed to function as test instruments. The servers are external to, and remote from, the test head and are configured to communicate signals over fiber optic cables with the test head. The signals include serial signals.

Abstract: A blade angle feedback system for an aircraft-bladed rotor rotatable about a longitudinal axis and having an adjustable blade pitch angle is provided. A feedback device is coupled to rotate with the rotor and to move along the axis with adjustment of the blade angle. At least one position marker is affixed to a core of the feedback device and extends along a direction angled relative to the axis. The core is made of a first material having a first magnetic permeability and the position marker comprises a second material having a second magnetic permeability greater than the first magnetic permeability. A sensor is positioned adjacent the feedback device and produces, as the feedback device rotates about the axis, a sensor signal in response to detecting passage of the position marker. A control unit generates a feedback signal indicative of the blade angle in response to the sensor signal.

Abstract: A test assembly for testing an antenna-in-package (AiP) device includes a socket over a circuit board, where the socket includes an opening for receiving the AiP device; a plunger configured to move along sidewalls of the opening, where during testing of the AiP device, the plunger is configured to cause the AiP device to be pressed towards the circuit board such that the AiP device is operatively coupled to the circuit board via input/output connections of the AiP device and of the circuit board; and a loadboard disposed within the socket and between the plunger and the AiP device, where the loadboard includes a coupling structure configured to be electromagnetically coupled to a transmit antenna and to a receive antenna of the AiP device, so that testing signals transmitted by the transmit antenna are conveyed to the receive antenna externally relative to the AiP device through the coupling structure.

Abstract: Devices and methods for molecule detection using such devices are disclosed herein. A molecule detection device comprises at least one fluidic channel configured to receive molecules to be detected, a sensor comprising a spin torque oscillator (STO) and encapsulated by a material separating the sensor from the at least one fluidic channel, and detection circuitry coupled to the sensor. At least some of the molecules to be detected are labeled by magnetic nanoparticles (HNPs). A surface of the material provides binding sites for the molecules to be detected. The detection circuitry is configured to detect a frequency or frequency noise of a radio-frequency (RF) signal generated by the STO in response to presence or absence of at least one MNP coupled to one or more binding sites associated with the sensor.

Abstract: An apparatus for providing a test signal from a device under test (DUT) to a measurement instrument is disclosed. The apparatus includes a probe head configured to receive an electrical signal from the DUT. The probe head includes an electro-optic modulator. The apparatus also includes a control box, which includes an optical source. The optical source is configured to provide an input optical signal to the electro-optic modulator, which is configured to provide an output optical signal based on the electrical signal from the DUT. The control box also includes an optical bias control circuit. Only a bias control signal is provided to the electro-optic modulator.

Abstract: The present disclosure discloses a test socket including an inelastic insulating housing formed of an inelastic insulating material having a plurality of housing holes, and a plurality of electro-conductive parts comprising electro-conductive particles in an elastic insulating material, the electro-conductive parts including an electro-conductive part body having a lower end portion to be connected to a signal electrode of the tester, an upper end portion to be connected to the terminal of the device under inspection, and an electro-conductive part bump connected to the electro-conductive part body to protrude from one or both of an upper and lower surface of the inelastic insulating housing.

Abstract: A semiconductor device for testing a semiconductor wafer includes a circuit board, a probe disposed below the circuit board and facing the semiconductor wafer, an integrated substrate disposed between the circuit board and the probe, and signal-transmitting module disposed on the circuit board and next to the integrated substrate. The probe is electrically coupled to the circuit board through the integrated substrate, and the signal-transmitting module transmits a test signal to the probe through the integrated substrate and the circuit board to perform a test to the semiconductor wafer. Another semiconductor device including the integrated substrate and a manufacturing method thereof are provided.

Abstract: The present invention relates to a test socket having a thin structure that can reduce durability degradation of a contact itself, have excellent electrical characteristics in processing high-speed signals, and can extend a service life thereof, and relates to spring contacts suitable thereto. The test socket according to the present invention includes: a plurality of spring contacts (100) each of which includes an upper contact pin (110) and a lower contact pin (120) that are assembled cross each other, and a spring (130) supporting the upper and lower contact pins (110 and 120); a main plate (1110) having a plurality of accommodating holes (1111) in which the respective spring contacts (100) are accommodated, with first openings (1113); and a film plate (1120) provided on a lower portion of the main plate (1110), and having second openings (1121).

Abstract: The invention relates to a probe card (PC) for use with an automatic test equipment (ATE), wherein the probe card (PC) comprises a probe head (PH) on a first side thereof, and wherein the probe card (PC) is adapted to be attached to an interface (IF) and wherein the probe card (PC) comprises a plurality of contact pads on a second side in a region opposing at least a region of the interface (IF), arranged to contact a plurality of contacts of the interface (IF), and wherein the probe card (PC) comprises one or more coaxial connectors (CCPT) arranged to mate with one or more corresponding coaxial connectors (CCPT) of the interface (IF). The invention relates further to pogo tower (PT) for connecting a wafer probe interface (WPI) of an automatic test equipment with the probe card (PC).

Abstract: A measurement system for performing measurements. The measurement system includes a positioning system for positioning at least one device to be positioned. The positioning system includes at least two rotational positioner modules configured to perform a rotational movement, thereby rotating the device to be positioned, as well as at least one linear positioner module configured to perform a linear movement, thereby translationally moving the device to be positioned. The linear positioner module includes a mounting interface for the device to be positioned. The rotational positioner modules and the linear positioner module together are configured to move the device to be positioned from a starting point of the movement. The rotational positioner modules are configured to set the starting point. The linear positioner module is configured to move the mounting interface relative to the starting point.

Abstract: A detection device for detecting a line quality of an electric circuit includes two electrical connection members inserted into a socket and connected to two power lines, a load resistor, a switching member, a displaying module, and a control module. An end of the load resistor is connected to one of the electrical connection members, and another end thereof is connected to a first end of the switching member. A second end of the switching member is connected to the other electrical connection member. The control module controls the switching member to cut off when in a detection mode, and detects a peak voltage in a voltage waveform and records as a maximum open-circuit voltage, and controls the switching member to conduct and detects the peak voltage of the voltage waveform and records as a load voltage and calculates a load current. A line resistance value is calculated based on the maximum open-circuit voltage, the load voltage, and the load current.

Abstract: A temporary bond method and apparatus for allowing wafers, chips or chiplets. To be tested, the temporary bond method and apparatus comprising: a temporary connection apparatus having one of more knife-edged microstructures, wherein the temporary connection apparatus serves, in use, as a probe device for probing the chiplets, each chiplet including a die having one or more flat contact pads which mate with the one of more knife-edged microstructures of the temporary connection apparatus; a press apparatus for applying pressure between the one or more flat contact pads on the chiplet with the one of more knife-edged microstructures of the temporary connection apparatus thereby forming a temporary bond between the temporary connection pad with the knife-edged microstructure in contact with the one or more flat wafer pads; the press being able to apply a pressure to maintain the temporary bond connection during or prior to testing of the chiplet.

Abstract: Disclosed is a detector 10 using a liquid spray 2000 for detecting electrical faults or shorts with the detector including a body 100 having an interior 120; a hose or pipe 130 fluidly connected to interior 120; a trigger valve 140 operatively connected to hose 130; a conductor 200 attached to detector 10; and/or a pump 110 fluidly connected to interior 120. In various embodiments the detector 10 can cause liquid spray 2000 to be sprayed on a subregion of an item such as a remotely operated vehicle to create a closed electrical circuit through the liquid spray and the conductor in the detector.

Abstract: An open architecture for a wafer automatic testing system of one embodiment includes a wafer auto prober including a lifter and a fixture frame; a pogo-pin interface module mounted on the fixture frame; and at least one instrument chassis mounted on the fixture frame and above the pogo-pin interface module. The at least one instrument chassis is electrically connected to the pogo-pin interface module.

Abstract: A control method and system for filtering power line interference is disclosed. The control method includes the following steps. First, ECG signals are pre-segmented and rectified; then the sinusoidal frequency, amplitude, and phase of the rectified segmented signals are extracted. These estimated sinusoidal parameters from each recorded channel are weighted by their individual signal to noise ratios before being averaged to achieve the optimal powerline frequency, amplitude, and phase. Based on these optimal sinusoidal parameters, the individual sinusoidal waveform is reconstructed and then is subtracted from the corresponding ECG segment, in order to obtain the clean ECG signals. This method of filtering the powerline interference through removal from recorded signals enables accurate measurement without any ringing effect that could lead to signal distortion issues.

Abstract: There is disclosed a probe used with a measurement instrument including a pulse circuit for generating pulses. A coaxial connector is secured to the probe case so that the probe case is electrically connected to the ground shield. A center rod has a top end received in the probe case and to extend into a process liquid. The center rod is electrically connected to the center terminal for conducting the pulses. Ground rods are spaced around the center rod and are secured to the probe case. The probe provides an open configuration less susceptible to build-up between the center rod and the ground rods. One or more of the ground rods may by tubes, connected to a flushing port, with nozzles for cleaning the enter rod. Another ground rod may be tubular for carrying a conductor connected to a bottom of the center rod for bottom-up measurement.

Abstract: Provided is a Kelvin contact for inspection in which contacts and an insulating layer are less likely to be shifted relative to each other even after repeatedly performed Kelvin inspection. The Kelvin contact for inspection includes: a first contact having an upper contact point that comes into contact with one electrode terminal of an IC device and a lower contact point that comes into contact with an electrode pad of a substrate for inspection; and a second contact having an upper contact point that comes into contact with the one electrode terminal and the lower contact point that comes into contact with an electrode pad of the substrate for inspection. The first and second contacts are adjacently arranged to contact with the same one electrode terminal and provided with an insulating layer surrounding the entire main body area except upper and lower contact point areas including the upper and lower contact points, respectively.