Abstract: The disclosure relates to the technical field of hydraulic pneumatic systems, in particular to an electric control valve detection plug and an electric control valve signal detection method. The disclosure can accurately measure the electric control signal actually obtained by the valve, thus avoiding the risk of misjudgment. The disclosure has simple manufacture and convenient installation and disassembly.

Abstract: A height detection system of a motorcycle for determining a load-dependent height of a rear carrier part in relation to a rear wheel swing arm of the motorcycle includes a measuring device connecting the rear carrier part and the rear wheel swing arm for measuring the distance between the rear carrier part and the rear wheel swing arm, and a fastening web formed integrally and protruding from the rear carrier part in the direction of the rear wheel swing arm. The fastening web includes a lateral bearing face configured to receive a rear carrier end of the measuring device.

Abstract: The present disclosure provides a pad structure and a testkey structure and a testing method for a semiconductor device. The pad structure includes: an insulating dielectric layer formed on a substrate; a metal interconnection structure formed in the insulating dielectric layer, the metal interconnection structure comprising a first section and a second section, which are insulated from each other; and a pad formed on the top of the insulating dielectric layer so as to be exposed therefrom at least at its top surface, electrically connected to the first section, and insulated from the second section. With this disclosure, reduced capture of plasma is achievable, mitigating adverse impact of plasma on the semiconductor device.

Abstract: Herein disclosed is a test head connection method, the method comprises the following steps. First, a load board and a card holder are provided between a test head and a probing machine, the card holder is disposed in the probing machine, and the card holder is used to accommodate the load board. A vacuum function of the test head is activated, and the test head is moved to align the card holder. The test head is moved to touch the load board in the card holder. At least one clamping piece is used to fix the test head and the card holder. Wherein the load board and a wafer are connected by direct probing.

Abstract: An automated test equipment for testing one or more DUTs comprises a test head and a DUT interface. The DUT interface comprises a plurality of blocks of spring-loaded pins, for example groups or fields of spring-loaded pins. For example, the DUT interface is configured for establishing an electronic signal path between the test head and a DUT board or load board, which holds the DUT or which provides a connection to the DUT. The automated test equipment is configured to allow for a variation of a distance between at least two blocks of spring-loaded pins.

Abstract: An automated test equipment for testing one or more DUTs comprises a test head and a DUT interface. The DUT interface comprises a plurality of blocks of spring-loaded pins, for example groups or fields of spring-loaded pins. For example, the DUT interface is configured for establishing an electronic signal path between the test head and a DUT board or load board, which holds the DUT or which provides a connection to the DUT. The automated test equipment is configured to allow for a variation of a distance between at least two blocks of spring-loaded pins.

Abstract: Disclosed is a test device for testing an electric characteristic of an object to be tested. The test device includes a block comprising a probe hole, a probe supported in the probe hole and retractably configured to connect a first contact point and a second contact point, and a coaxial cable comprising an insulated sheath, a main core surrounded with the insulated sheath, and a probe contact portion exposed from the insulated sheath and extended from the main core so as to be in contact with the probe. An axis of the probe is spaced apart from an axis of the coaxial cable, and the probe contact portion is extended from the main core toward the axis of the probe.

Abstract: A testing device for electronic dies includes a first support part and a second support part configured to be removably assembled with each other. The first and second support parts together define at least one housing where at least one electronic die can be arranged to be tested. The electronic die has a first surface with contacting elements. The at least one housing includes a first portion. This at least one housing is arranged to enable the at least one electronic die to occupy a first position in the housing where the first surface is spaced apart from the first portion, and is further arrange to enable the at least one electronic die to occupy a second position in the housing where the first surface bears against the first portion.

Abstract: Disclosed is a detector 10 using a liquid spray 2000 for detecting electrical faults or shorts with the detector including a body 100 having an interior 120; a hose or pipe 130 fluidly connected to interior 120; a trigger valve 140 operatively connected to hose 130; a conductor 200 attached to detector 10; and/or a pump 110 fluidly connected to interior 120. In various embodiments the detector 10 can cause liquid spray 2000 to be sprayed on a subregion of an item such as a remotely operated vehicle to create a closed electrical circuit through the liquid spray and the conductor in the detector.

Abstract: A current sensor is configured by at least one magnetoelectric conversion element, a conductor, and a signal processing IC being encapsulated by an encapsulating portion. The current sensor includes a pair of first lead terminals that is partially exposed outside of the encapsulating portion, is electrically connected to the conductor, inputs the measurement current to the conductor, and outputs the measurement current from the conductor; a metal member that is partially exposed outside the encapsulating portion and is spaced apart from the conductor; and a supporting portion that supports the at least one magnetoelectric conversion element, the signal processing IC, and the metal member on a first surface, is separated from the conductor, and is separate from the metal member.

Abstract: A probe assembly and a micro vacuum probe station comprising same are disclosed. A probe assembly according to one embodiment may comprise: a base; a guide rail installed on the base; a guide member sliding along the guide rail; a probe connected to the guide member and of which one side contacts a wafer to inspect electrical properties of the wafer; and a thin film connector connected to the other side of the probe so as to supply electricity to the probe.

Abstract: A transfer apparatus for an inspection apparatus according to one embodiment of the present disclosure includes: an upper end engaging portion configured to make contact with an upper surface of a transferred article; a support frame to which the upper end engaging portion is fixed; a lift including a support part configured to support a lower surface of the transferred article, the lift arranged on the support frame to be movable in an up-down direction; and a lifting driver configured to provide a driving force to move the lift in the up-down direction.

Abstract: This application discloses an electrical control device detection circuit, a detection method, and an electric vehicle. The detection circuit includes a drive circuit configured to detect an electrical control device. The drive circuit includes a drive power module, a high-side switch unit, and a low-side switch unit. The detection circuit includes: a detection power module, a first switch module, a second switch module, a first detection module, a second detection module, and a control module. The control module is configured to obtain an electrical signal at a third end of the first detection module and/or an electrical signal at a second end of the second detection module; and determine, based on the electrical signal at the third end of the first detection module and/or the electrical signal at the second end of the second detection module, whether a fault occurs in the drive circuit of the electrical control device.

Abstract: A circuit board for semiconductor test includes first and second sub-circuit boards, and an insulating dielectric layer therebetween. Each sub-circuit board includes a substrate and circuits including upper and lower contacts. The insulating dielectric layer includes through holes, and connecting conductors disposed therein and electrically connected with the upper and lower contacts of two sub-circuit boards. The circuit board is defined with central and peripheral regions. The lower contacts of the first sub-circuit board in the central region are electrically connected with a probe head. The upper contacts of the second sub-circuit board in the peripheral region are electrically connected with a tester, larger in pitch than the lower contacts of the first sub-circuit board in the central region, and larger in amount than the lower contacts of the first sub-circuit board in the peripheral region. The circuit board has great power test uniformity.

Abstract: A probing device includes a probe station. The probe station has a platform having an opening and a plurality of column members supporting the platform. Each of the plurality of column members has one end connected with the platform and an opposite end connected with a moving part. The probing device also includes a manipulator on the platform and a socket configured to support a DUT. The manipulator has a probe. The moving part is configured to allow the probe station to be moved with respect to the DUT.

Abstract: A testing apparatus for Devices Under Test (DUTs) includes at least one intake damper and at least one exhaust damper. At least one fan moves recirculated fluid and exterior fluid across one or more DUTs inside the testing apparatus. In one aspect, the testing apparatus includes a door to provide access to a chamber and the door includes at least one channel. At least a portion of the fluid flows through the at least one channel of the door. In another aspect, the door is configured to provide access to a chamber from the front of the chamber and the fluid is moved in a direction across the one or more DUTs substantially from the front of the chamber towards a rear of the chamber.

Abstract: The present disclosure provides a test apparatus and a jumper thereof. The test apparatus includes a base board and the jumper. The base board has a first slot and a second slot. The first slot has a plurality of electrical contacts, and is configured to receive a plurality of pins of a device under test. The jumper is inserted into the second slot. The jumper includes a body and a plurality of first circuits. The first circuits are disposed on the body and electrically connect the electrical contacts of the first slot to a plurality of pins of a tester.

Abstract: An apparatus for probing a device-under-test (DUT) includes a fixture disposed over the DUT, a circuitry film disposed along a contour of the fixture, a first signal connector, and a plurality of probing tips disposed on the circuitry film and extending toward the device-under-test. The circuitry film includes a first portion attached to a top sidewall of the fixture, and the first signal connector is disposed on and electrically connected to the first portion of the circuitry film. The first signal connector is electrically coupled to the probing tips through the circuitry film. A method for probing a DUT is also provided.

Abstract: A test apparatus comprising a tester interface board (TIB) affixed in a slot of a tester rack, wherein the TIB comprises test circuitry and a plurality of sockets, each socket operable to receive a device under test (DUT). The test apparatus further comprises a carrier comprising an array of DUTs, wherein the carrier is operable to slide into the slot of the tester rack, and wherein each DUT in the array of DUTs aligns with a respective socket on the TIB. Further, the test apparatus comprises a plurality of socket covers, wherein each socket cover of the plurality of socket covers is operable to actuate a top portion of each DUT of the array of DUTs in the carrier.

Abstract: An endoscopic system includes an elongate shaft, a pull wire that runs a length of the elongate shaft, a handle coupled to a proximal portion of the elongate shaft, the handle housing a proximal portion of the pull wire, the handle being couplable to a robotic driver configured to tension the pull wire to cause articulation of the elongate shaft, and one or more conductors that run the length of the elongate shaft, the one or more conductors being electrically coupled to the pull wire at a distal portion of the elongate shaft and configured to form part of a closed electrical circuit with the pull wire.