Abstract: A component can be formed having an integral monolithic body. The integral monolithic body can be formed utilizing electroforming processes such as electrodeposition of metal alloys. The electroformed monolithic body can be formed utilizing multiple anodes powered by multiple power sources. The monolithic body can have differing local material properties determined during formation of the component.
Type:
Grant
Filed:
May 11, 2017
Date of Patent:
August 17, 2021
Assignee:
Unison Industries, LLC
Inventors:
Gordan Tajiri, Donald Templeton, Dattu G V Jonnalagadda, Yanzhe Yang
Abstract: Method for preparing high-strength and durable super-hydrophobic film layer on inner wall of elongated metal tube includes roughening treatment of inner wall of a metal tube, electrodepositing preparation of nickel-phosphorus alloy layer and functional coating, heat treatment, subsequent anodizing and low surface energy modification. The method greatly reduces the influence of local mass transfer resistance, and a uniform nanocrystalline film layer is electroplated under the ultrasound induction. Since only electroplating solution is filled in the tube during the preparation process, the consumption of device and raw materials is greatly reduced. Also, since silica particles are added to the electroplating solution in preparing the nanocrystalline film layer, the surface morphology can be made more uniform and denser in terms of the microscopic morphology.
Abstract: A method for manufacturing a three-dimensional object comprises the steps of (a) bringing at least one nozzle in a first position close to a surface of a substrate, (b) delivering through said at least one nozzle at least one reactant to said surface, (c) effecting a solid forming reaction of said at least one delivered reactant such that said at least one delivered reactant undergoes a transition to become a growing solid deposit on said surface under said at least one nozzle, and (d) detecting an interaction of said growing solid deposit with said at least one nozzle.
Type:
Grant
Filed:
September 28, 2016
Date of Patent:
June 29, 2021
Assignee:
Exaddon AG
Inventors:
Janos Vörös, Tomaso Zambelli, Luca Hirt, Stephan Ihle
Abstract: A method of forming a solderable solder deposit on a contact pad, comprising the steps of providing an organic, non-conductive substrate which exposes said contact pad under an opening of a first non-conductive resist layer, depositing a conductive layer inside and outside the opening such that an activated surface results, thereby forming an activated opening, electrolytically depositing nickel or nickel alloy into the activated opening such that nickel/nickel alloy is deposited onto the activated surface, electrolytically depositing tin or tin alloy onto the nickel/nickel alloy, with the proviso that the electrolytic deposition of later steps results in an entirely filled activated opening, wherein the entirely filled activated opening is completely filled with said nickel/nickel alloy, or in the entirely filled activated opening the total volume of nickel/nickel alloy is higher than the total volume of tin and tin alloy, based on the total volume of the entirely filled activated opening.
Type:
Grant
Filed:
December 22, 2017
Date of Patent:
June 8, 2021
Assignee:
Atotech Deutschland GmbH
Inventors:
Kai-Jens Matejat, Sven Lamprecht, Jan Sperling, Christian Ohde
Abstract: A method of creating a selectively plated three-dimensional thermoplastic part. The method includes the steps of: a) providing a film of uncured polycarbonate film having a hardcoated layer on a first surface thereof; b) selectively catalyzing the polycarbonate film by depositing a catalyst in a desired pattern on the first surface of the polycarbonate film; c) thermoforming the polycarbonate film to form a three-dimensional polycarbonate film; d) UV-curing the hardcoated polycarbonate film by irradiating the film with UV rays; e) molding the hardcoated polycarbonate film to produce a three-dimensional molded part comprising the hardcoated polycarbonate film; f) activating the selectively catalyzed hardcoated polycarbonate film; and g) plating a metal layer on the catalyzed portions of the hardcoated polycarbonate film, wherein the plated metal only deposits on the catalyzed portions of the hardcoated polycarbonate film.
Type:
Grant
Filed:
November 27, 2018
Date of Patent:
May 25, 2021
Assignee:
MacDermid Enthone Inc.
Inventors:
Paul Andrew Bray, Martin Vaughan Herbert, Keith Paul Parsons, Peter Alan Warwick
Abstract: Methods and systems for producing a three-dimensional structure using electrochemical additive manufacturing are described herein. The methods can comprise injecting a growth control solution into an electrolyte comprising a metal salt to form a growth control region and applying an electric potential to a working electrode to thereby form a layer of metal at a location defined by the growth control region. The injecting and applying steps of the methods can be repeated for form the three-dimensional structure on a layer-by-layer basis.
Type:
Grant
Filed:
July 19, 2018
Date of Patent:
May 18, 2021
Assignee:
THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ALABAMA
Abstract: A rotational surface treating device with a high treatment efficiency that allows a treatment liquid to be discharged in a short time is provided. When a treatment bath 2 is rotated, parts 20 contact an electrode 50 to be electroplated. In this event, a plating liquid 16 is used as circulated by a pump P. The plating liquid 16 is discharged to the outside through a gap in a side wall 80 for replacement of the plating liquid 16 or the like. During discharge, the plating liquid 16 is not circulated by the pump P. The gap 8 which is formed in the side wall 80 is formed to be smaller than the minimum dimension of the parts 20 on the inner side. The gap 8 is formed to be wider toward the outer side. Thus, water is discharged immediately.
Abstract: Processes and compositions for electroplating a cobalt deposit onto a semiconductor base structure comprising submicron-sized electrical interconnect features. In the process, a metalizing substrate within the interconnect features is contacted with an electrodeposition composition comprising a source of cobalt ions, an accelerator comprising an organic sulfur compound, an acetylenic suppressor, a buffering agent and water. Electrical current is supplied to the electrolytic composition to deposit cobalt onto the base structure and fill the submicron-sized features with cobalt. The process is effective for superfilling the interconnect features.
Type:
Grant
Filed:
June 30, 2016
Date of Patent:
May 4, 2021
Assignee:
MacDermid Enthone Inc.
Inventors:
John Commander, Vincent Paneccasio, Jr., Eric Rouya, Kyle Whitten, Shaopeng Sun, Jianwen Han
Abstract: Copper electroplating baths containing primary alcohol alkoxylate block copolymers and ethylene oxide/propylene oxide random copolymers having specific HLB ranges are suitable for filling vias with copper, where such copper deposits are substantially void-free and substantially free of surface defects.
Type:
Grant
Filed:
October 27, 2015
Date of Patent:
April 27, 2021
Assignee:
Rohm and Haas Electronic Materials LLC
Inventors:
Matthew Thorseth, Mark Scalisi, Corey Ciullo
Abstract: A method for creating a chrome-plated surface having a matte finish that typically includes: controlling a resistance of a current bridge circuit; depositing a first chromium layer on a substrate positioned in a chromium bath, wherein the first chromium layer is deposited by supplying current from a power source that is electrically connected to the substrate and to anodes positioned in the chromium bath; etching the first chromium layer by engaging a current bridge that closes the current bridge circuit; depositing a first intermediate chromium layer, wherein the first intermediate chromium layer is deposited by supplying current from the power source; etching the first intermediate chromium layer, wherein the first intermediate chromium layer is etched by engaging the current bridge; and depositing a final chromium layer, wherein the final chromium layer is deposited by supplying current from the power source.
Abstract: The disclosure provides a method for fabricating a metallic optical metasurface having an array of hologram elements. The method includes forming a first copper layer protected with a conducting or dielectric barrier layer over a backplane structure by a damascene process. The first copper layer comprises a plurality of nano-gaps vertically extending from the backplane structure. The plurality of nano-gaps is filled with a dielectric material. The method also includes removing the dielectric material and a portion of the conducting or dielectric barrier layer to expose the portions in the nano-gaps of the first copper layer. The method may further include depositing a dielectric coating layer over the top portion and exposed side portions of the first copper layer to form a protected first copper layer, and filling the gaps with an electrically-tunable dielectric material that has an electrically-tunable refractive index.
Type:
Grant
Filed:
April 2, 2018
Date of Patent:
April 6, 2021
Assignee:
Elwha LLC
Inventors:
Gleb M. Akselrod, Erik Edward Josberger, Mark C. Weidman
Abstract: The invention is a metal coating device in which the sheet metal fed to a coating container for being copper-coated by electrolysis in the coating container comprising a first roll device having a roll in contact with the sheet metal forwarded in the vertical position and having a rotational axis perpendicular thereto, a carrier body bearing the roll and a current transmitted via a current plate electrically connected to a power source, a coal device which includes an electric current carrying coals from the carrier body to the roll and a cooling chamber provided around the region where the current plate is connected to the carrier body and through which a cooling liquid flows.
Type:
Grant
Filed:
August 8, 2017
Date of Patent:
March 30, 2021
Assignee:
NET BORU SANAYI VE DIS TICARET KOLLEKTIF SIRKETI BORA SAMAN VE ORTAGI
Abstract: A method for preparing invisible anodic aluminum oxide (AAO) patterns is revealed. The method includes a plurality of steps. First take an aluminum substrate. Then anodize the aluminum substrate for the first time to get a first anodic aluminum oxide (AAO). Next perform photolithography so that a photoresist forms a pattern on the aluminum substrate with the first AAO. Lastly anodize the aluminum substrate for the second time so that a second AAO is formed on the pattern and the pattern becomes invisible.
Abstract: The present invention relates to an electrolytic copper foil for a secondary battery and a method of producing the same. The electrolytic copper foil for a secondary battery, in which a burr and curl of a negative electrode plate are inhibited from being formed after an electrolytic copper foil is coated with a negative electrode active material, thereby increasing the loading volume of a negative electrode and increasing a capacity. The electrolytic copper foil for a secondary battery is produced from a plating solution containing Total Organic Carbon (TOC) by using a drum, in which the electrolytic copper foil is formed of one surface that is in direct contact with the drum and the other surface that is an opposite surface of the one surface, and an average cross-sectional grain size of the one surface is 80% or less of an average cross-sectional grain size of the other surface.
Type:
Grant
Filed:
March 28, 2017
Date of Patent:
February 16, 2021
Assignee:
ILJIN MATERIALS CO., LTD.
Inventors:
Sun Hyoung Lee, Tae Jin Jo, Seul-Ki Park, Ki Deok Song
Abstract: A fluid treatment system is provided, comprising a capacitive deionization (CapDI) system for removing dissolved solids from a fluid. A controller is arranged in a closed feedback loop with the CapDI system to verify whether measured conductivity of the fluid corresponds to a set point conductivity value, and if the measured conductivity of the fluid does not correspond to the set point conductivity value, adjust the operation of the CapDI system to match the set point conductivity value. A pump selectively pressurizes the fluid such that purified fluid is at a pressure greater than line pressure of the fluid treatment system. An accumulator provided downstream of the CapDI system maintains the purified fluid at a pressure greater than the line pressure and intermittently delivers purified fluid to a use device. The purified fluid stored in the accumulator comprising chlorine and or chloramine so as to reduce microbial growth when stored in the accumulator.
Type:
Grant
Filed:
July 20, 2016
Date of Patent:
February 9, 2021
Assignee:
Ecolab USA Inc.
Inventors:
Peter A. Voss, Michael R. Ney, Kyle D. Wood
Abstract: A method for growing nanotubes via flow-regulated microfluidic electrochemical anodization, includes providing a microfluidic device having a fluid inlet; a fluid outlet; and a fluidic microchannel connecting the fluid inlet and outlet, wherein the microchannel includes a Pt cathode and a Ti anode separated by an electrical insulator; providing an electrolyte fluid flow through the microchannel; and providing an electrical current across the anode and cathode sufficient to cause electrochemical anodization growth of TiO2 nanotubes in the microchannel on a surface of the anode.
Abstract: An electrochemical gas generator for ammonia with the use of ionic liquids containing nitrate ions as the electrolyte and to the use of the gas generator for generating gaseous ammonia, especially for testing the function of and/or calibrating gas sensors.
Abstract: Additive-based electroforming manufacturing methods for producing turbomachine components and other metallic articles are provided, as are metallic articles manufactured utilizing such manufacturing methods. In various embodiments, the method includes the step or process of additively manufacturing a sacrificial tooling structure having a component-defining surface region. A metallic body layer or shell is deposited over the component-defining surface region utilizing an electroforming process such that a geometry of the component-defining surface region is transferred to the body layer. The tooling structure is chemically dissolved, thermally decomposed, or otherwise removed, while the metallic body layer is left substantially intact. After tooling structure removal, the metallic body layer is further processed to complete fabrication of the metallic component.
Abstract: Provided are a metallic foil manufacturing method in which a metallic film electrodeposited by electrolysis on the surface of an electrodeposition surface of a cathode is peeled off to form a metallic foil, and the electrodeposition surface used therein is obtained by subjecting a roughened surface, which results from roughening a smoothed surface made of titanium or titanium alloy using a blast treatment, etc., to an oxidation treatment selected from thermal oxidation, anodic oxidation (preferably anodic oxidation carried out while moving the anodic oxidation solution), or a combination treatment of thermal oxidation and anodic oxidation so that the electrodeposition surface has an oxidation layer with a thickness of 30 to 250 nm on the uppermost layer and has a surface roughness RZJIS of 4 to 10 ?m.