Abstract: A method provides a structure that includes a substrate having a metal layer disposed on a surface and a metal feature disposed on the metal layer. The method further includes immersing the structure in a plating bath contained in an electroplating cell, the plating bath containing a selected solder material; applying a voltage potential to the structure, where the structure functions as a working electrode in combination with a reference electrode and a counter electrode that are also immersed in the plating bath; and maintaining the voltage potential at a predetermined value to deposit the selected solder material selectively only on the metal feature and not on the metal layer. An apparatus configured to practice the method is also disclosed.

Abstract: A method for producing cavities in a turbomachine disk, the cavities extending between first and second lateral surfaces of the disk, the method including positioning a ring facing the first surface, the ring including an inner periphery including protrusions complementary in shape to the cavities that are to be produced; circulating an electrolyte close to the protrusions on the ring; activating a first translational movement of the ring towards the second surface; activating a rotation of the disk; generating an electric current pulse in the electrolyte when the ring is substantially at the first surface, the pulse resulting in the ionic dissolution of the disk at the protrusions; reducing the speed of rotation to a first reduced speed, when the ring is substantially at the first surface, for a first period of time; and stopping the first translation of the ring when the ring is beyond the second surface.

Abstract: The present invention is generally directed to a hydrogen peroxide-based lens care system for disinfecting contact lenses. Unlike hydrogen peroxide-based system known in the prior art, a lens care system of the present invention involves electrochemically neutralizing of hydrogen peroxide after any desired period of disinfection time for which contact lenses have been immersed in a hydrogen peroxide-based lens care solution.

Abstract: In manufacturing of a first electroformed component and a second electroformed component having portions fitted to each other into close contact, after the first electroformed component is formed, the first electroformed component is used as a portion of an electroforming mold to form the second electroformed component. Using the first electroformed component as a portion of the electroforming mold to form the second electroformed component, the shape of the first electroformed component is transferred to the second electroformed component. As a result, multiple types of components differing in shape may be accurately manufactured concurrently in a series of manufacturing steps.

Abstract: A method for manufacturing a magnetic write head having a heat sink structure, wherein the magnetic write head is free of voids at the media facing surface. After forming the write pole, a chemical mechanical polishing process is performed prior to defining the heat sink structure. Planarizing the write pole structure by chemical mechanical polishing prior to forming the heat sink structure advantageously reduces the topography over which the heat sink structure. This mitigates shadowing effects from the write pole structure and prevents the formation of voids at the media facing surface.

Abstract: Provided are: a plated material having excellent abrasion resistance, electrical conductivity, sliding performance, and low friction, and wherein a plating layer does not undergo embrittlement properly; and a method for producing the plated material. The method includes a first step of at least partially removing a reflow tin plating layer from a metallic base material having the reflow layer on at least a part thereof and a reactive layer provided at the interface between the reflow layer and the base material; a second step of at least partially subjecting a region in which the reflow tin plating layer has been removed to a nickel plating treatment; a third step of at least partially subjecting the nickel plating layer to a silver strike plating treatment; and a fourth step of at least partially subjecting a region of the silver strike plating to a silver plating treatment.

Abstract: A device for burnishing and smoothing metal parts, particularly suitable for use in mechanical-galvanic processes, comprising a main body having a fastening disc to which guides are radially coupled and the body of which includes at least three mobile propelling systems which are actuated by electro-mechanical means and move in a synchronized concentric manner, approaching and moving away from the central point and acting on a rotating frame from equidistant angles. The frame is configured to secure pieces to be treated and it also has a detachable head that is disposed centrally above a cylindrical tank. The propelling systems, provided with brushes, move from an open position in which they remain separate from one another and at a distance from the center, into a closed position in which they are joined to one another in the center of the tank, coming into contact with the structure containing the parts to be treated.

Abstract: An apparatus for continuous simultaneous electroplating of two metals having substantially different standard electrodeposition potentials (e.g., for deposition of Sn—Ag alloys) comprises an anode chamber for containing an anolyte comprising ions of a first, less noble metal, (e.g., tin), but not of a second, more noble, metal (e.g., silver) and an active anode; a cathode chamber for containing catholyte including ions of a first metal (e.g., tin), ions of a second, more noble, metal (e.g., silver), and the substrate; a separation structure positioned between the anode chamber and the cathode chamber, where the separation structure substantially prevents transfer of more noble metal from catholyte to the anolyte; and fluidic features and an associated controller coupled to the apparatus and configured to perform continuous electroplating, while maintaining substantially constant concentrations of plating bath components for extended periods of use.

Abstract: A method for fabrication of a piece including, superposing an electrically insulating layer including a first orifice, an additional layer including a first aperture, an intermediate layer including a first hole, and a base layer surmounted by a base motif, depositing a metal layer, so that at the end of this step, the metal layer forms a shell covering electrically conductive walls of the base motif, of the first orifice, of the first aperture and of the first hole, and includes a lateral area resting on the insulating layer, dissolving the insulating layer, coating the metal or alloy layer with a volume formed by a base material of the piece, so that the volume conforms to the shapes of the metal layer.

Abstract: Electronic device housing structures and other structures may be formed from molded plastic. Plastic structures such as injection molding housing structures and other structures may be provided with openings. An opening may have sidewall surfaces. Machining operations and other techniques may be used in forming the openings. Openings may be processed to enhance resistance to stress-induced cracking of the plastic structures along the sidewall surfaces. Cracking resistance may be obtained by activating the surface using heat or laser treatment and by electroplating the activated surface to form a metal liner structure. Surface treatments using applied liquid chemicals or heat may form a treated layer on the surface of an opening with enhanced cracking resistance. A plastic sleeve or other insert may form a liner structure in an opening that resists cracking. Liner structures may also be formed by applying heat or light to a coating in an opening.

Abstract: An electromachining system includes at least one steerable electrode. The steerable electrode includes an electrode positioning mechanism configured to facilitate six degrees of freedom referenced to a pitch axis, a yaw axis, and a roll axis. The three axes are substantially perpendicular to each other. The electrode positioning mechanism includes a first end and a rotatable electrode tip coupled to the first end.

Abstract: A composition for electrolytic plating in microelectronics which contains a leveler that comprises the reaction product of an aliphatic di(t-amine) with an alkylating agent. Electrolytic plating methods employing the leveler, a method for making the leveler, and the leveler compound.

Abstract: In an example of a method for making a nano-structure, an aluminum layer is partially anodized to form a porous anodic alumina structure. The aluminum layer is positioned on an oxidizable material layer. The porous anodic alumina structure is exposed to partial anisotropic etching to form tracks within the porous anodic alumina structure. A remaining portion of the aluminum layer is further anodized to form paths where the tracks are formed. The oxidizable material layer is anodized to from an oxide, where the oxide grows through the paths formed within the porous anodic alumina structure to form a set of super nano-pillars.

Abstract: A photovoltaic device, such as a solar cell, including a copper-containing-grid metallization structure that contains a metal phosphorus layer as a diffusion barrier is provided. The copper-containing-grid metallization structure includes, from bottom to top, an electroplated metal phosphorus layer that does not include copper or a copper alloy located within a grid pattern formed on a front side surface of a semiconductor substrate, and an electroplated copper-containing layer. A method of forming such a structure is also provided.

Abstract: A drilling tool for use in machining a conductive work piece that includes a forward electrode tip including an outer radial portion and an inner radial portion. The outer radial portion includes a forward face, and the inner radial portion extends from the forward face of the outer radial portion. The drilling tool further includes a dielectric sheath that extends circumferentially about the outer radial portion, at least one side electrode coupled to the dielectric sheath, and a protective sheath that extends circumferentially about the dielectric sheath. An opening is defined in the protective sheath such that the at least one side electrode is at least partially exposed.

Abstract: To provide an anode holder and a plating apparatus including the same, the anode holder being configured to prevent additives and black films from spreading by moving between an internal space in which an anode is provided and an external space. An anode holder 60 according to the present invention includes: an internal space 61 that houses an anode therein; a diaphragm configured so as to cover a front face of the internal space 61; a hole 71 that is formed on an external surface of the anode holder and which communicates with the internal space 61; and a valve 91 that seals the hole 71 shut.

Abstract: Methods and structures for forming anodization layers that protect and cosmetically enhance metal surfaces are described. In some embodiments, methods involve forming an anodization layer on an underlying metal that permits an underlying metal surface to be viewable. In some embodiments, methods involve forming a first anodization layer and an adjacent second anodization layer on an angled surface, the interface between the two anodization layers being regular and uniform. Described are photomasking techniques and tools for providing sharply defined corners on anodized and texturized patterns on metal surfaces. Also described are techniques and tools for providing anodizing resistant components in the manufacture of electronic devices.

Abstract: An apparatus and a method for plating and/or polishing wafer includes a wafer chuck, an auxiliary nozzle apparatus and a main nozzle apparatus. The wafer chuck holds and positions the wafer, moves horizontally, and rotates. The auxiliary nozzle apparatus supplies uncharged or charged electrolyte to cover the outer edge of the wafer and the wafer chuck, and the main nozzle apparatus supplies charged electrolyte to the surface of the wafer, to improve the plating and/or polishing uniformity of the outer edge of the wafer, reduce the entire electric resistance of the apparatus, and improve the plating and/or polishing rate.

Abstract: A method for metallizing a through silicon via feature in a semiconductor integrated circuit device substrate. The method comprises immersing the semiconductor integrated circuit device substrate into an electrolytic copper deposition composition, wherein the through silicon via feature has an entry dimension between 1 micrometers and 100 micrometers, a depth dimension between 20 micrometers and 750 micrometers, and an aspect ratio greater than about 2:1; and supplying electrical current to the electrolytic deposition composition to deposit copper metal onto the bottom and sidewall for bottom-up filling to thereby yield a copper filled via feature.

Abstract: Certain embodiments herein relate to a method of electroplating copper into damascene features using a low copper concentration electrolyte having less than about 10 g/L copper ions and about 2-15 g/L acid. Using the low copper electrolyte produces a relatively high overpotential on the plating substrate surface, allowing for a slow plating process with few fill defects. The low copper electrolyte may have a relatively high cloud point.