Abstract: Electroplating system seals may include an annular busbar characterized by an inner annular radius and an outer annular radius. The annular busbar may include a plurality of contact extensions. The seals may include an external seal member characterized by an inner annular radius and an outer annular radius. The external seal member may be vertically aligned with and extend inward of the contact extensions at the inner annular radius of the external seal member. The external seal member may include an interior surface at least partially facing the contact extensions. The seals may also include an internal seal member extending a first distance along the interior surface of the external seal member from the inner annular radius. The internal seal member may include a deformable material configured to support a substrate between the internal seal member and the plurality of contact extensions.

Abstract: A tin or tin alloy plating solution includes: (A) a soluble salt containing at least a stannous salt; (B) an acid selected from an organic acid and an inorganic acid or a salt thereof; (C) a surfactant; and (D) a leveling agent. In addition, the surfactant contains polyoxyethylene polyoxypropylene alkylamine, an alkyl group of the polyoxyethylene polyoxypropylene alkylamine is CaH2a+1 (where a is 12 to 18). Further, in a case where a number of a functional group of polyoxypropylene of the polyoxyethylene polyoxypropylene alkylamine is set as p and a number of a functional group of polyoxyethylene of the polyoxyethylene polyoxypropylene alkylamine is set as q, the sum of p and q (p+q) is 8 to 21, and a ratio of p to q (p/q) is 0.1 to 1.6.

Abstract: Disclosed herein is a sensor comprising a conduit; the conduit comprising an organic polymer; a working electrode; the working electrode being etched and decorated with a nanostructured material; a reference electrode; and a counter electrode; the working electrode, the reference electrode and the counter electrode being disposed in the conduit; the working electrode, the reference electrode and the counter electrode being separated from each other by an electrically insulating material; and wherein a cross-sectional area of the conduit that comprises a section of the working electrode, a section of the reference electrode and a section of the counter electrode is exposed to detect analytes.

Abstract: Systems for cleaning electroplating system components may include a seal cleaning assembly incorporated with an electroplating system. The seal cleaning assembly may include an arm pivotable between a first position and a second position. The arm may be rotatable about a central axis of the arm. The seal cleaning assembly may include a cleaning head coupled with a distal portion of the arm. The cleaning head may include a bracket having a faceplate coupled with the arm, and a housing extending from the faceplate. The housing may define one or more arcuate channels extending through the housing to a front surface of the bracket. The cleaning head may also include a rotatable cartridge extending from the housing of the bracket. The cartridge may include a mount cylinder defining one or more apertures configured to deliver a cleaning solution to a pad coupled about the mount cylinder.

Abstract: A drilling tool for use in machining a conductive work piece that includes a forward electrode tip including an outer radial portion and an inner radial portion. The outer radial portion includes a forward face, and the inner radial portion extends from the forward face of the outer radial portion. The drilling tool further includes a dielectric sheath that extends circumferentially about the outer radial portion, at least one side electrode coupled to the dielectric sheath, and a protective sheath that extends circumferentially about the dielectric sheath. An opening is defined in the protective sheath such that the at least one side electrode is at least partially exposed.

Abstract: Systems for cleaning electroplating system components may include a seal cleaning assembly incorporated with an electroplating system. The seal cleaning assembly may include an arm pivotable between a first position and a second position. The arm may be rotatable about a central axis of the arm. The seal cleaning assembly may also include a cleaning head including a bracket portion coupled with a distal portion of the arm. The cleaning head may be characterized by a front portion formed to interface with a seal of the electroplating apparatus. The cleaning head may define a trench along the front portion, and the cleaning head may define a plurality of fluid channels through the cleaning head, each fluid channel of the plurality of fluid channels fluidly accessing a backside of the trench.

Abstract: The present invention relates to a plating hanger device having a shock-absorbing structure and, more specifically, to a plating hanger device having a shock-absorbing structure, the device allowing a hanger to be transferred at a uniform speed and reducing noise and shock, which are generated during transferring, so as to enable a uniform plated layer to be formed on a substrate. According to the plating hanger device having the shock-absorbing structure, of the present invention, an elastic spring is pressed by the load of the plating hanger device and a jig, and sequentially, the elastic spring presses a connection shaft and the connection shaft presses a transfer housing so as to improve adhesion between the transfer housing and a driving gear, thereby enabling transferring at uniform speed, and reducing the noise and shock generated during transferring by means of the elastic spring.

Abstract: A plating apparatus includes a plating tank and a plating unit. The plating unit includes a partition wall allowing the plating solution to pass through but not allowing the plating object to pass through, and defines inside thereof a plating object passage through which the plating object passes, an injector which injects the plating solution upward, a mixing portion in which the plating solution and the plating object are mixed, an anode outside the plating object passage, a cathode inside the plating object passage with a hollow region through which a fluid mixture of the plating solution and the plating object passes upward, a first shielding wall which guides the fluid mixture downward, and a second shielding wall outside the first shielding wall. A lower end of the first shielding wall is lower than an upper end of the second shielding wall.

Abstract: An electroforming system and method for electroforming a component includes an electroforming reservoir with a housing with at least one inlet and at least one outlet, and at least one anode chamber within the housing and fluidly coupled to the at least one inlet. An anode can be located within the at least one anode chamber.

Abstract: A station for localized surface treatment of an industrial workpiece to be treated includes: at least one treatment chamber having a cell or two half-cells, each cell or half-cell delimiting a tight space between walls of the cell or half-cell and a respective portion or face of the industrial workpiece, the cell or each half-cell having a wall having an opening for covering a corresponding portion or face of the industrial workpiece, the opening of the cell or half-cell being delimited by a continuous sealing gasket, the cell or each half-cell including positioning means, the at least one treatment chamber having a supply and emptying circuit; and a plurality of storage vats each containing a treatment fluid, the supply and emptying circuit connecting each storage vat to the at least one treatment chamber so as to supply the at least one treatment chamber with respective treatment fluids.

Abstract: At least one plating pen is brought into aligned relationship with at least one hole defined in a board. The pen includes a central retractable protrusion, a first shell surrounding the protrusion and defining a first annular channel therewith, and a second shell surrounding the first shell and defining a second annular channel therewith. The protrusion is lowered to block the hole and plating material is flowed down the first channel to a surface of the board and up into the second channel, to form an initial deposit on the board surface. The protrusion is raised to unblock the hole, and plating material is flowed down the first annular channel to side walls of the hole and up into the second annular channel, to deposit the material on the side walls of the hole.

Abstract: A tin or tin alloy plating solution includes: (A) a soluble salt containing at least a stannous salt; (B) an acid selected from an organic acid and an inorganic acid or a salt thereof; (C) a phenyl-based surfactant formed of polyoxyethylene bisphenol ether represented by the General Formula (1); and (D) a leveling agent, here, in the Formula (1), X is CaH2a (a is 1 or 3) and m is 2 to 12.

Abstract: An electroforming system and method for electroforming a component includes an electroforming reservoir with a housing defining a fluid passage. An electroforming chamber can be located within the housing and fluidly coupled to the fluid passage via a set of apertures in at least one wall of the electroforming chamber.

Abstract: A machining position correcting device is configured to be applied to an electrochemical machining device configured to make an electrolyte flow out of a distal end part of an electrode bar extending along an axis while rotating the electrode bar about the axis to electrochemically machine a material to be machined in a range from the distal end part of the electrode bar. The machining position correcting device includes a position detector configured to detect a rotational position of a feature point of the electrode bar.

Abstract: A method for producing a metal porous body includes the steps of: performing electrical conduction treatment on a surface of a skeleton of a sheet-like resin porous body having the skeleton with a three-dimensional network structure, to obtain a conductive resin porous body having a conductive layer; performing electroplating treatment on a surface of a skeleton of the conductive resin porous body to obtain a plated resin porous body having a metal plating layer; and performing treatment of removing at least the resin porous body from the plated resin porous body to obtain a metal porous body.

Abstract: A cathode part of an electrochemical reaction device comprises a conductor, a porous body, a reduction catalyst, an electrolytic solution flow path, a first flow path, and a second flow path. The conductor has a conductive surface. The porous body includes a first surface, a second surface, a first porous portion, and a second porous portion. The first surface is in contact with the conductive surface. A contact angle between an inner wall of the second porous portion and water is higher than a contact angle between an inner wall of the first porous portion and the water. The reduction catalyst is supported on the second surface to reduce carbon dioxide. The electrolytic solution flow path faces the reduction catalyst. The first flow path faces the first porous portion. The second flow path faces the second porous portion.

Abstract: A manufacturing process for making aircraft engine parts utilizes reusable reconfigurable smart memory polymer mandrel tooling, low temperature metal deposition, and composite part lay-up with resin coated conformable braided carbon fiber sleeves, to fabricate both metal internal engine parts and non-metal external parts for turbine engines.

Abstract: A component can be formed having an integral monolithic body. The integral monolithic body can be formed utilizing electroforming processes such as electrodeposition of metal alloys. The electroformed monolithic body can be formed utilizing multiple anodes powered by multiple power sources. The monolithic body can have differing local material properties determined during formation of the component.

Abstract: Method for preparing high-strength and durable super-hydrophobic film layer on inner wall of elongated metal tube includes roughening treatment of inner wall of a metal tube, electrodepositing preparation of nickel-phosphorus alloy layer and functional coating, heat treatment, subsequent anodizing and low surface energy modification. The method greatly reduces the influence of local mass transfer resistance, and a uniform nanocrystalline film layer is electroplated under the ultrasound induction. Since only electroplating solution is filled in the tube during the preparation process, the consumption of device and raw materials is greatly reduced. Also, since silica particles are added to the electroplating solution in preparing the nanocrystalline film layer, the surface morphology can be made more uniform and denser in terms of the microscopic morphology.

Abstract: A method for manufacturing a three-dimensional object comprises the steps of (a) bringing at least one nozzle in a first position close to a surface of a substrate, (b) delivering through said at least one nozzle at least one reactant to said surface, (c) effecting a solid forming reaction of said at least one delivered reactant such that said at least one delivered reactant undergoes a transition to become a growing solid deposit on said surface under said at least one nozzle, and (d) detecting an interaction of said growing solid deposit with said at least one nozzle.