Abstract: A manufacturing method of a mold, the mold having at its surface a plurality of recessed portions whose two-dimensional size is not less than 10 nm and less than 500 nm when viewed in a direction normal to the surface, the method comprising: (a) providing a mold base (10); (b) partially anodizing the aluminum alloy layer (18), thereby forming a porous alumina layer (14) which has a plurality of minute recessed portions (14p); (c) bringing the porous alumina layer into contact with an etching solution, thereby enlarging the plurality of minute recessed portions; (d) detecting a protrusion (210) formed at a surface of the porous alumina layer or the mold base; (e) determining whether or not a height of the detected protrusion is greater than a predetermined height; and (f) if it is determined at step (e) that the height of the protrusion is greater, irradiating the protrusion with laser light such that the height of the protrusion becomes smaller than the predetermined height.

Abstract: A method for manufacturing a metallic nanospring includes preparing a nanotemplate having a nanopore and including a working electrode disposed on its one surface, preparing a first metal precursor mixture including ascorbic acid (C6H8O6), vanadium (IV) oxide sulfate (VOSO4.xH2O), and a metal precursor solution including a metal desired to be deposited, preparing a second metal precursor mixture by mixing the first metal precursor mixture with nitric acid (HNO3), depositing a metallic nanospring into the nanopore using electrodeposition by dipping the nanotemplate into the second metal precursor mixture and applying current between a counter electrode inserted into the second metal precursor mixture and the working electrode, and selectively removing the working electrode on the nanotemplate with the deposited metallic nanospring and the nanotemplate.

Abstract: A method of forming a component using electro-chemical machining includes the steps of providing a shield in a current distribution path between a workpiece and an electrode, with the shield concentrating current distribution upon an end of the workpiece.

Abstract: A method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described.

Abstract: Provided are a production method of a mold, a manufacturing method of a pattern sheet, a production method of an electroform, a production method of a mold using an electroform, and an original. The production method includes: preparing an original having an inclined portion which is formed in an enclosed shape on an outer peripheral portion of a protruding pattern formed at a center portion on a base and gradually increases in thickness from inside toward outside, and a thermoplastic resin sheet; and forming a recessed pattern on the thermoplastic resin sheet by pressing the original which is heated against the thermoplastic resin sheet at a position where a flat surface of the original and a surface of the thermoplastic resin sheet are separated from each other, cooling the original in the state where the original is pressed, and separating the original from the thermoplastic resin sheet.

Abstract: Methods, and devices produced by the methods, for electroplating a multitude of micro-scale electrodes that are electrically isolated from each other on a cable or other device is described. A localized area of connections on another end of the cable is shorted together by depositing a metal sheet or other conductive material over the localized area. The metal sheet is connected to a terminal of a power supply, and the electrode end of the cable is immersed in an electrolyte solution for electrodeposition by electroplating. After the electrodes are electroplated, the metal sheet is removed from the cable in order to re-isolate the electrodes.

Abstract: A method for producing round stock (10) which is provided with at least one inscription and/or marking (16), at least the surface (12) of the round stock (10) consisting of a metallic material, in particular of chromium or steel, for example of hardened steel, chromium-plated steel or stainless steel.

Abstract: Method and apparatus are provided for electroplating a surface area of an internal wall defining a cooling cavity present in a gas turbine engine airfoil component.

Abstract: Provided are cleaning methods and systems to remove unintended metallic deposits from electroplating apparatuses using reverse current deplating techniques. Such cleaning involves positioning a cleaning (deplating) disk in an electroplating cup similar to a regular processed substrate. The front surface of the cleaning disk includes a corrosion resistant conductive material to form electrical connections to deposits on the cup's surfaces. The disk is sealed in the cup and submerged into a plating solution. A reverse current is then applied to the front conductive surface of the disk to initiate deplating of the deposits. Sealing compression in the cup may change during cleaning to cause different deformation of the lip seal and to form new electrical connections to the deposits. The proposed cleaning may be applied to remove deposits formed during electroplating of alloys, in particular, tin-silver alloys widely used for semiconductor and wafer level packaging.

Abstract: An anodising apparatus for selectively anodizing at least a portion of a surface of a component can include a conformable wicking element configured to absorb a fluid, the conformable wicking element being conformable to at least the portion of the surface of the component, wherein, upon bringing the component into contact with the conformable wicking element, the fluid completes an electric circuit between the component and a conductive element, the anodising apparatus being configured to grow an anodised layer on the portion of the surface of the component that is in contact with the conformable wicking element when an electric current is supplied to the electric circuit between the conductive element and the component.

Abstract: A plating apparatus enabling a user to conduct maintenance of a substrate holder while an operation of the plating apparatus is being performed is disclosed. The plating apparatus includes: a processing section for plating a substrate; a storage container configured to store the substrate holder for holding the substrate; a transport machine configured to transport the substrate holder between the processing section and the storage container; a maintenance area adjacent to the storage container; and a substrate-holder carrier supported by the storage container. The substrate-holder carrier is movable between the storage container and the maintenance area while supporting the substrate holder.

Abstract: Direct current plating methods inhibit void formation, reduce dimples and eliminate nodules. The method involves electroplating copper at a high current density followed by a pause in electroplating and then turning on the current to electroplate at a lower current density to fill through-holes.

Abstract: Direct current plating methods inhibit void formation, reduce dimples and eliminate nodules. The method involves electroplating copper at a high current density followed by electroplating at a lower current density to fill through-holes.

Abstract: A method of electrolytic additive manufacturing provides 3-D parts. The method can be used to form parts from particulate material in an electrolytic bath. Metal is electrolytically deposited, binding the particles. Layers of the particles are built up to form the parts. The same process can be used to form parts without the particulate material. Layers of metal are electrolytically deposited in the electrolyte bath to form the parts.

Abstract: The presently disclosed apparatus and method offer the capability to electroplate pure metals or alloys onto substrates, having no current collectors or being connected to the power supply by a low conductivity seed layer. Thus, the disclosed system enables pure metal or alloy deposition on various substrates, including flexible electronic circuits, wafers for IC processing, and discrete electronic devices in surface finishing applications.

Abstract: A plating method which can achieve a desired dome height is disclosed. The method includes: preparing correlation data showing a relationship between proportion of dome height to bump height and concentration of chloride ions; producing a plating solution containing chloride ions at a concentration which has been selected based on a desired proportion of dome height to bump height and on the correlation data, the selected concentration being in a range of 100 mg/dm3 to 300 mg/dm3; immersing a substrate in the plating solution; and passing an electric current between an anode and the substrate, both immersed in the plating solution, thereby plating the substrate to form bumps.

Abstract: There is provided a method for forming an electrically conductive ultrafine pattern which has an excellent pattern cross-sectional shape is provided by a composite technique including a printing process and a plating process, and furthermore, by imparting excellent adhesion to each interface of a laminate including a plating core pattern, an electrically conductive ultrafine pattern which can be preferably used as a highly accurate electric circuit and a method for manufacturing the same are also provided. The method includes (1) a step of applying a resin composition to form a receiving layer on a substrate; (2) a step of printing an ink containing plating core particles by a reverse offset printing method to form a plating core pattern on the receiving layer; and (3) a step of depositing a metal on the plating core pattern formed in the step (2) by an electrolytic plating method.

Abstract: The invention relates to a machine (1) adapted to metallize a cavity of a semi-conductive or conductive substrate such as a structure of the through silicon via type, according to a metallization process comprising the steps consisting of: a) depositing an insulating dielectric layer in the cavity, b) depositing a barrier layer to diffusion of the filling metal, c) filling the cavity by electrodeposition of metal, preferably copper, and d) carrying out annealing of the substrate, characterized in that it comprises a series of wet-processing modules (10-60) configured to conduct steps a), b) and c) by wet-processing in a chemical bath (B) and at least one additional module (70) adapted to conduct annealing step d) of the substrate (S) such that the machine (1) is capable of executing the entire metallization process of the cavity.

Abstract: A substrate processing method of performing a predetermined processing by supplying a processing liquid to a processing region of a substrate and using processing target ions in the processing liquid, includes: arranging a template to face the substrate, the template including a passage configured to distribute the processing liquid, a direct electrode, and an indirect electrode, and the substrate including a counter electrode, which matches with the direct electrode, installed in the processing region; supplying the processing liquid to the processing region through the passage; and performing the predetermined processing on the substrate by applying a voltage to the indirect electrode to cause the processing target ions to migrate to the counter electrode side while applying a voltage between the direct electrode and the counter electrode to oxidize or reduce the processing target ions that have migrated to the counter electrode side.

Abstract: A method for producing a steel substrate coated with a chromium metal-chromium oxide (Cr—CrOx) coating layer in a continuous high speed plating line, operating at a line speed (v1) of at least 100 m·min?1, wherein one or both sides of the electrically conductive substrate in the form of a strip, moving through the line, is coated with a chromium metal-chromium oxide (Cr—CrOx) coating layer from a single electrolyte by using a plating process. A coated steel substrate and a packaging made thereof.