Abstract: Some examples described herein provide for an on-die virtual probe in an integrated circuit structure for measurement of voltages. In an example, an integrated circuit comprises a voltage-controlled frequency oscillator circuitry and a processor circuitry. The voltage-controlled frequency oscillator circuitry comprises a plurality of circuitry components and is configured to generate a signal having a frequency related to a supply voltage. The voltage-controlled frequency oscillator circuitry is disposed at a location of the integrated circuit proximal to the supply voltage being monitored. The processor circuitry is configured to identify a relationship between the frequency of the signal and the supply voltage. The processor circuitry is also configured to determine a value of the supply voltage associated with the signal based on the identified relationship. The processor circuitry further monitors on-die transient voltages at the location of the integrated circuit based on the value of the supply voltage.

Abstract: A current sensor is disclosed. The current sensor is substantially immune to stray fields due to the position and orientation of at least two magnetic field sensors and their respective axes of maximum sensitivity, as well as a total current sensor output that is a based on a difference of the individual magnetic field sensor outputs. The specific position and orientation of the magnetic field sensors allows for the current sensor to be smaller than known sensors of similar sensitivity.

Abstract: Circuitry, systems, and methods for fault detection and reporting comprise a fault detection circuit configured to detect one or more fault conditions that cause a state change in a fault pin voltage representative of a transceiver failure. Once the state of the fault pin voltage changes, a transceiver input generates a fault detection code. In embodiments, in response to the transceiver input receiving a first signal, the fault detection code is shifted to a transceiver output that may communicate the fault detection code to a controller. Once the transceiver input receives a second signal, the fault pin voltage may be reset to clear the fault detection code before resuming operations, including detecting additional fault conditions as they arise.

Abstract: The present invention discloses a method for detecting open phase of a startup/standby transformer based on optical CT. A startup/standby transformer in a power plant is in a no-load condition for a long time as a standby power supply. Once a single-phase open phase fault occurs, there is no significant change in the voltage phasor and voltage sequence component of each side. If not found in time, the defect may pose a great threat to the safe operation of the power plant. In the present invention, the optical CT is used to detect a three-phase current of the high-voltage side of the startup/standby transformer. If the current satisfies an open phase criterion, it is determined that an open phase fault occurs, and then, an alarm signal is given after a delay and an operator is informed to handle the fault in time. Therefore, the operation reliability of the startup/standby transformer system in the power plant is enhanced.

Abstract: A transformer state evaluation method combining a FAHP method, a DEMATEL method, and a CRITIC method is provided and includes: selecting a plurality of groups of state quantities, building a hierarchical indicator system; calculating an influencing degree and an influenced degree by using the DEMATEL method on a subjective level, calculating a weight of each of a plurality of indicators of an indicator layer through the FAHP method and the DEMATEL method, calculating the weights of the indicators of the indicator layer through the CRITIC method on an objective level; calculating an optimal weight according to the indicator subjective weights and the indicator objective weights; and calculating state scores layer by layer, finally determining an actual health condition of each of a plurality of transformers by combining state level classification rules. In the disclosure, the weights are calculated based on the subjective level and the objective level.

Abstract: An electrical measurement apparatus may include a bias voltage generator configured to generate and output a bias voltage, a bias probe coupled to the output of bias voltage generator configured to apply voltage bias to a first portion of an external circuit which may be subjected to environmental stresses such as vibration, temperature, humidity etc., a measurement probe configured to receive a second electrical signal from a second portion of the external circuit, and a control unit configured to control the bias voltage generator to generate different bias voltages, patterns, AC/DC etc., receive the second electrical signal from the measurement probe and cause the device to output a response in the second electrical signal to the time-domain discontinuity in the first electrical signal.

Abstract: A method of testing semiconductor devices includes placing a plurality of semiconductor devices in a carrier assembly and performing at least one testing operation on the plurality of semiconductor devices while they remain inside the carrier assembly.

Abstract: A semiconductor device includes a voltage comparison circuit and a calibration control circuit. The voltage comparison circuit compares test reference voltages and generates a comparison result signal. The calibration control circuit controls an offset value of the voltage comparison circuit.

Abstract: The present invention relates to a sensor suite comprising at least one sensor. More particularly, the present invention relates to a sensor suite for measuring absolute and/or relative position, location and orientation of an object on or in which the sensor suite is employed. The present invention further relates to improved, novel sensor types for use in the sensor suite. More particularly, the present invention relates to an improved, novel magnetometer that is self-calibrating and scalable. Still more particularly, the present invention relates to such a magnetometer that is miniaturized. Further embodiments of the present invention relate to systems and methods for providing location and guidance, and more particularly for providing location and guidance in environments where global position systems (GPS) are unavailable or unreliable (GPS denied and/or degraded environments).

Abstract: As a semiconductor device is miniaturized, a scribe area on a wafer also tends to decrease. Accordingly, it is necessary to reduce the size of a TEG arranged in the scribe area, and efficiently arrange an electrode pad for probe contact. Therefore, it is necessary to associate probes and the efficient layout of the electrode pad. The purpose of the present invention is to provide a technique for associating probes and the layout of an electrode pad of a TEG to facilitate the evaluation of electrical characteristics. According to the present invention, the above described problem can be solved by arranging a plurality of probes in a fan shape or manufacturing the probes with micro electro mechanical systems (MEMS) technology.

Abstract: A shunt is composed of multiple pieces with at least some of the pieces being connected by a conductive channel that provides uniform flow of current. The conductive channel may be a recess, raised portion, stand-alone component, or other channel that directs current to flow from one piece of the shunt to another piece in a uniform manner, resulting in an accurate current reading for the shunt. Further, the shunt may include multiple pieces that are composed of different materials.

Abstract: A current sensor and measurement system including such a current sensor. The current sensor includes: an insulating substrate provided with a central opening; a winding surrounding the central opening and including a coil wound around a portion of the insulating substrate; wherein the current sensor includes at least one ferromagnetic layer incorporated within the portion of the insulating substrate, the coil surrounding the ferromagnetic layer.

Abstract: A signal transmission system with at least one signal encoder, a line, and a control and evaluation unit, wherein the signal encoder has an electronic unit and a power source, wherein the signal encoder feeds an imprinted current in the range between a preset first value and a preset second value into the line, in particular between 4 and 20 mA. The control and evaluation unit has a load and a microprocessor, and captures and evaluates a voltage that decreases via the load or a current that flows through the load. Additional information regarding the status of the components, can thus be captured and forwarded in a simple way, in that the load in the control and evaluation unit is connected in series to at least one electrical component at which a direct current appears when a current flows through the electrical component.

Abstract: There is provided a chuck top for use in an inspection apparatus which inspects a plurality of inspection target devices formed on a wafer. The chuck top is configured to be held by a frame during an inspection of the plurality of inspection target devices while holding the wafer, the chuck top being configured to be attachable to and detachable from an aligner. The chuck top includes a main body, and a drop prevention mechanism provided in the main body and including a movable drop prevention hook configured to prevent the chuck top from being dropped when the chuck top is detached from the frame.

Abstract: A data processing device includes an internal volume for housing devices and an isolation test system. The isolation test system makes a determination that an electromagnetic interference suppression state of the data processing device is to be determined; in response to the determination: suppresses generation of electromagnetic radiation by the devices; while the generation of the electromagnetic radiation by the devices is suppressed: identifies a quantity of second electromagnetic radiation that propagated through a boundary of the internal volume; makes a second determination, based at least in part on the quantity, that the electromagnetic interference suppression state of the data processing device is an electromagnetic interference suppression compromised state; and initiates performance of an action set to remediate the electromagnetic interference suppression compromised state of the data processing device based on the second determination.

Abstract: A stiffener includes a first upper cover and a second upper cover, a first lateral side cover and a second lateral side cover, and a first longitudinal side cover and a second longitudinal side cover. The first and second upper covers extend in parallel with each other. The first and second lateral side covers are connected to separate, respective covers of the first and second upper covers, and facing each other. The first and second longitudinal side covers are each connected to the both first and second upper covers, the first and second longitudinal side covers facing each other. The first and second upper covers each include a separate plurality of upper elastic portions. Each upper elastic portion of each separate plurality of upper elastic portions has a vertical elasticity.

Abstract: A system for monitoring operation of rotating electrical machinery including electrical industrial machinery. The system comprises analog sensors configured to measure electrical signals corresponding to the voltage and the current of the rotating electrical machinery. A remote processor identifies the frequency components of the measured electrical signals. Based on the frequency components, the system is monitored and controlled. This may help allow electrical faults, mechanical faults and process faults to be predicted and/or prevented.

Abstract: A system current sensor module can accurately sense or measure system current flowing through a sense current resistor by shunting current through a gain-setting resistor and using an amplifier to measure a resulting voltage, with an output transistor controlled by the amplifier controlling current through the gain setting resistor in a manner that tends to keep the amplifier inputs at the same voltage. The resistors can be thermally coupled to maintain similar temperatures when a system current is flowing. The thermal coupling can include conducting heat from a first resistor layer carrying the current sense resistor to a thermal cage layer located beyond a second resistor layer carrying the gain-setting resistor. This preserves accuracy, including during aging.

Abstract: A thermal test head for an integrated circuit device includes a heat exchanger assembly, a contact assembly configured to contact the integrated circuit, and a thermal control assembly disposed between the heat exchanger assembly and the contact assembly. The thermal control assembly includes a Peltier device in thermal contact with opposing surfaces of the heat exchanger assembly and the contact assembly, and a spacer in physical contact with the opposing surfaces of the heat exchanger assembly and the contact assembly.

Abstract: A probe card test apparatus including an insulating substrate; a conductive pattern on the insulating substrate; and a plurality of device under test (DUT) units on the conductive pattern, wherein each of the DUT units includes a merged-probe opening, a probe opening, and a detector in parallel, and an isolator surrounding the merged-probe opening, the probe opening, and the detector.