Abstract: A shield made from aluminum (AL) or an aluminum-based alloy coated with a solderable plating such as nickel or tin provides thermal improvement over existing shielding materials. The shield for electronic components on a circuit board comprising a base having an upper surface and one or more sidewalls extending from a perimeter of the upper surface, the sidewalls configured to engage a fence of the circuit board, and a fin array attached to the upper surface of the base, the fin array having a plurality of stackable fins, each of the stackable fins having a wall and one or more engagement tabs extending from one or more edges of the wall, the engagement tabs interlocking the plurality of stackable fins together.

Abstract: A semiconductor device includes a semiconductor element accommodated in an outer case; a control circuit board fixed to the outer case at a position away from the semiconductor element; and a shield plate provided between the semiconductor element and the control circuit board. The outer case is provided with a support having a convex portion longer than a thickness of the shield plate at a distal end thereof. The shield plate is formed with a through-hole in which the convex portion of the support passes through. The shield plate is fixed to the support with a fixing device engaging with the convex portion.

Abstract: A semiconductor package includes a processor die (e.g., an SoC) and one or more memory die (e.g., DRAM) coupled to a ball grid array (BGA) substrate. The processor die and the memory die are coupled to opposite sides of the BGA substrate using terminals (e.g., solder balls). The package may be coupled to a printed circuit board (PCB) using one or more terminals positioned around the perimeter of the processor die. The PCB may include a recess with at least part of the processor die being positioned in the recess. Positioning at least part of the processor die in the recess reduces the overall height of the semiconductor package assembly. A voltage regulator may also be coupled to the BGA substrate on the same side as the processor die with at least part of the voltage regulator being positioned in the recess a few millimeters from the processor die.

Abstract: An opto-electronic module used in optical networking may be implemented using two different thermal zones. A first thermal zone at a first temperature may be used for an optical module. A second thermal zone at a second temperature may be used for an electronic module. The first temperature may be different from the second temperature. As a result, a physical dimension of the electronic module may be reduced in comparison to using a single thermal zone for the opto-electronic module.

Abstract: A switch includes a switch chassis that houses a heat producing component. A plurality of side walls are located on the switch chassis and define a chassis perimeter. A top wall extends between the plurality of side walls and defines a top wall perimeter vent adjacent the chassis perimeter. A bottom wall extends between the plurality of side walls, is located opposite the switch chassis from the top wall, and defines a bottom wall perimeter vent adjacent the chassis perimeter. A plurality of feet are located on the bottom wall and provide an air gap between the switch chassis and a support surface when the plurality of feet engage the support surface. In response to the heat producing component generating heat, fresh air is drawn in through the air gap and the bottom wall perimeter vent, and heated air flows through the top wall perimeter vent.

Abstract: A connecting structure includes a housing, a cooler, an inner refrigerant pipe, an outer refrigerant pipe, and a joint pipe. The joint pipe is attached to a through hole of the housing. The inner refrigerant pipe is fitted to the joint pipe from a housing inner side. The outer refrigerant pipe is fitted to the joint pipe from a housing outer side. A tip of the inner refrigerant pipe and a tip of the outer refrigerant pipe define a gap inside the joint pipe. An end surface of a flange or a rib of the outer refrigerant pipe in a refrigerant-pipe axis direction abuts with an end surface of a flange or a rib of the joint pipe in the refrigerant-pipe axis direction.

Abstract: A housing includes a conductive metal base, a number of metal patterns, and a number of insulating fillers. The metal patterns are formed on the base and spaced from each other. Each of the plurality of insulating filler is situated between two adjacent metal patterns of the plurality of metal patterns.

Abstract: A latch device for heat dissipation component includes a main body, a first and a second elastic member, a first and a second rotary unit. Two sides of the main body are respectively formed with a first and a second perforation. The first and second elastic members are fixedly disposed on one face of a motherboard. A first and a second hook/latch section respectively protrude from the first and the second elastic members corresponding to the first and second perforations. By means of a first and a second hook/latch member, the first and second rotary units are correspondingly hooked/latch with the first and second hook/latch sections. Then, the first and second rotary units are rotated to pull upward the first and second hook/latch members; further the first and second hook/latch sections can fix the main body. Hence, a user can assemble/detach the main body without using any hand tool.

Abstract: A display device is provided, comprising: a time sequence control board (300); and a back plate (100), comprising one main body and a plurality of edges, the time sequence control board (300) being attached to one of the edges of the back plate (100) with a connection member (200), the connection member (200) comprising a buckling part (210) and a connection part (220) connected with the buckling part, the buckling part (210) being used to buckle the time sequence control board (300), and the connection part (220) being connected with the edge of the back plate (100).

Abstract: Two opening through which a refrigerant runs are connected by a first connecting pipe and a second connecting pipe. One end of the first connecting pipe is connected to a first opening by a planar seal. Another end of the first connecting pipe is connected to one end of a second connecting pipe by a shaft seal. Another end of the second connecting pipe is connected to a second opening by a planar seal. An axial direction of a shaft seal is perpendicular to a plane that includes the first opening.

Abstract: A power converter magnetics assembly is disclosed. The power converter magnetics assembly can include an interface panel, a magnetic component mounted to the interface panel to form a magnetics subassembly, and a chassis coupled to the magnetics subassembly. The chassis can have a cavity with an opening. The magnetic component can be received within the cavity and the interface panel can be disposed over the opening and secured to the chassis to form an enclosure about the magnetic component.

Abstract: A display apparatus is provided. The display apparatus includes a display which is curved such that opposite lateral ends thereof protrude forward relative to a central portion thereof. A support frame having a lower end supported on a horizontal surface and allowing the display to be disposed inside thereof is provided; wherein the support frame is curved such that opposite lateral ends thereof protrude forward relative to the central portion thereof.

Abstract: A surface mount device is disclosed. The surface mount device can include an electronic component operable in an electronic circuit. The surface mount device can also include a heat transfer component thermally coupled to the electronic component. The heat transfer component can have a heat transfer surface configured to interface with a heat sink. In addition, the surface mount device can include a resiliently flexible lead to electrically couple the electronic component to a circuit board. The resiliently flexible lead can be configured to resiliently deflect to facilitate a variable distance of the heat transfer surface from the circuit board, to enable the heat transfer surface and a planar heat transfer surface of another similarly configured surface mount device to be substantially aligned for interfacing with the heat sink.

Abstract: An electronic device includes a housing defining an exterior shape of the electronic device, a processor, a power supply structured to receive line power and to convert the line power for use by the electronic device, a storage unit structured to store data, and a number of data interfaces structured to receive a data connection. The electronic device has a particular form factor that is compatible with positions in a circuit breaker receiving area of a load center. The electronic device is structured to provide the functionality of at least one of a set-top box, a network data interface, a telephone base station, a security system hub and a home controller.

Abstract: Examples provide data center canopies, data center housings, and data centers including turning vanes to facilitate air flow. In some examples, a data center canopy may include turning vanes to direct portions of an exhaust flow from an exhaust inlet toward floor sections to be output via exhaust outlets opposite the floor sections. Other examples are described and claimed.

Abstract: An electronic component module includes a board, a plurality of external terminals provided on a first surface of the board, and a first semiconductor chip provided on a region on the first surface surrounded by the plurality of external terminals. The first semiconductor chip protrudes more along a normal to the first surface than ends of the external terminals do.

Abstract: A shield made from aluminum (AL) or an aluminum-based alloy coated with a solderable plating such as nickel or tin provides thermal improvement over existing shielding materials. The shield for circuitry on a circuit board comprising an aluminum material plated with a solderable material, the shield providing electromagnetic interference and radio frequency interference shielding and heat transfer when positioned over a circuit.

Abstract: According to an exemplary aspect an electronic module is provided, wherein the electronic module comprises an electronic chip comprising at least one electronic component, a spacing element comprising a main surface arranged on the electronic chip and being in thermally conductive connection with the at least one electronic component, and a mold compound at least partially enclosing the electronic chip and the spacing element, wherein the spacing element comprises a lateral surface which is in contact to the mold compound and comprises surface structures.

Abstract: In a component loading system, a circuit board may include a socket, a first plurality of holes, and a second plurality of holes. A frame may include two opposing sidewalls each substantially perpendicular to a surface of the circuit board and coupled to one another via a plate, a plurality of threaded channels, each channel adjacent to one of the two opposing sidewalls and located between the two opposing sidewalls, and a third plurality of holes. A backing plate may include a plurality of heat dissipater mounting posts and a fourth plurality of holes. A plurality of second fasteners may each be mechanically engaged to a respective one of the plurality of threaded channels and passing through a respective one of the second plurality of holes to mechanically secure the frame and backplate on opposite sides of the circuit board.

Abstract: Provided is an electronic component assembly that can reduce a housing space in a fitting direction of a bus bar and a terminal fitting. An electronic component assembly includes a relay, a diode, a plurality of bus bars, and a plate-shaped resin member. The relay has a relay main body having a rectangular parallelepiped outer shape, and a plurality of terminal portions protruding from a bottom surface of the relay main body. The plurality of bus bars is configured such that one end side is soldered to a terminal portion of the relay or a terminal portion of the diode, and the other end is fitted to a terminal fitting. The one end sides of the plurality of bus bars are embedded in the resin member.