Abstract: A microelectronic package of the present description may comprises a first microelectronic device having at least one row of connection structures electrically connected thereto and a second microelectronic device having at least one row of connection structures electrically connected thereto, wherein the connection structures within the at least one first microelectronic device row are aligned with corresponding connection structures within the at least one second microelectronic device row in an x-direction.

Abstract: An electronic device includes a bulkhead assembly. The bulkhead assembly includes a bulkhead and one or more cable cassettes coupled to the bulkhead. The cable cassettes include floating connectors. The cable cassettes are modular assemblies that contain all the wiring and connectors. As the connectors float in the cable cassettes, the cable cassettes are blind mated to the bulkhead as standalone units.

Abstract: A heat dissipation structure applied to mobile device includes a heat conduction main body. The heat conduction main body has a heat dissipation side and a heat absorption side. A radiation heat dissipation layer is formed on the heat dissipation side. The heat dissipation structure is disposed in the mobile device to provide a very good heat dissipation effect for the closed space of the mobile device by way of natural convection and radiation. Therefore, the heat dissipation performance of the entire mobile device is greatly enhanced.

Abstract: An electronic device can include a heat transfer structure that is positioned between a first component that generates heat and a second component that dissipates heat. The heat transfer structure transfers heat from the first component to the second component. The heat transfer structure can include a heat transfer member including a thermal conductive layer attached to at least one flexible layer and at least one deformable region created by a shape of the heat transfer member.

Abstract: An information handling system (IHS) cooling system includes a multi-IHS chassis having at least one fan system that produces an airflow. An IHS is positioned in the multi-IHS chassis. The IHS includes an IHS chassis that houses a processing system and a memory system. An airflow channel is defined within the IHS chassis and is configured to receive at least a portion of the airflow produced by the at least one fan system. An airflow impedance element is positioned in the airflow channel, and includes a first orientation in which the airflow impedance element extends into the airflow channel to impede airflow through the airflow channel. The airflow impedance element is configured to change shape as a function of temperature into at least one second orientation that reduces the impedance of airflow through the airflow channel. In some embodiments, the airflow impedance element is a bimetallic plate.

Abstract: A rack-based information handling system (RIHS) includes a rack chassis having at least two opposing side panels which are structurally held in place by one or more segments spanning between the two opposing side panels to generate an internal volume between the at least two opposing side panels. The internal volume has structures that enable insertion and retention of information technology (IT) gear and other components of the IHS at one of a front access space and a rear access space of the rack chassis that extend between the two opposing side panels. The RIHS also includes at least one security screen that is removably affixed to opposing edges of the two opposing side panels and span across a first segment of an access space to prevent direct physical access to the IT gear or other components that are inserted within the rack chassis behind the security screen.

Abstract: An electronic device comprises a substrate, at least one electronic chip mounted on and electrically connected to the substrate and being configured as a system control unit for controlling a connected system, a heat removal structure thermally connected to the at least one electronic chip and configured for removing heat generated by the at least one electronic chip upon operation of the electronic device, and an overmolding structure configured for at least partially encapsulating at least the at least one electronic chip and the substrate.

Abstract: A method for designing and assembling a modular IT rack includes a manufacturer designing and constructing lightweight, modular corrugated cardboard modules/segments and corresponding banding and corner components that can be used to assemble the modular IT rack. A user/assembler of the modular IT rack assembles modular tray grouping and enclosure (MTGE) casing units using a first set of cardboard modules. The user constructs trays using a second set of cardboard modules. The user affixes cable support components to the sides of sub-groups of the constructed trays. The user encloses sub-groups of trays having the affixed cable support components within the assembled MTGE casing units to create MTGE blocks. The user vertically stacks the MTGE blocks having the tray sub-groups and the affixed cable support components enclosed within. The user aligns and secures the vertically stacked MTGE blocks in a fixed position using banding and corner components.

Abstract: A blower fan includes a heat source contact portion. A side wall portion includes a tongue portion. In a plan view, The heat source contact portion is arranged to cover a portion of a region surrounded by a third imaginary straight line tangent to an outer circumferential surface of a blade support portion and extending in parallel with the second imaginary straight line toward the air outlet in the first region, a fourth imaginary straight line tangent to the outer circumferential surface of the blade support portion and extending in parallel with the first imaginary straight line in the third region, the outer circumferential surface of the blade support portion, and the air outlet.

Abstract: An electrical device has a housing that includes a main body and a lid both of which are electrically conductive. The lid is fastened to a top surface of a sidewall of the main body so as to cover the main body. On at least one of a bottom surface of the lid and the top surface of the sidewall of the main body, there are formed a plurality of protrusions at predetermined positions; each of the protrusions abuts against that one of the bottom surface of the lid and the top surface of the sidewall which is opposed to the protrusion. Except at those predetermined positions where the protrusions are formed, there is provided, between the bottom surface of the lid and the top surface of the sidewall of the main body, a gap via which the internal and external spaces of the housing communicate with each other.

Abstract: Embodiments of the present invention disclose an electronic equipment cooling system including: a cabinet; at least one electronic equipment chassis that is installed inside the cabinet; and an auxiliary cooling device including an air pressurizing device, an air supply plenum box, and an air-guiding device. The air supply plenum box is disposed on an inner side of the cabinet. The air pressurizing device is disposed at the top or bottom of the cabinet, and an air exhaust on a sidewall of the air pressurizing device is connected to a corresponding air intake on a sidewall of the air supply plenum box. The air-guiding device is installed inside the electronic equipment chassis, an air intake of the air-guiding device is connected to an air exhaust of the air supply plenum device, and an air exhaust of the air-guiding device faces a component inside the electronic equipment chassis.

Abstract: A blower fan according to a preferred embodiment of the present invention is a centrifugal fan. At least a portion of each of a plurality of blades of an impeller portion is arranged above a stator. A lower plate portion is arranged to define an air channel portion and an air outlet arranged on a lateral side of the impeller portion when a side wall portion arranged to surround an outer circumference of the impeller portion and an upper plate portion arranged above the impeller portion are present. The air channel portion is arranged to extend in a circumferential direction between an outer circumference of the stator and the side wall portion. At least a portion of a circuit board is arranged in the air channel portion and on the lower plate portion. A plurality of lead wires extending from the stator are connected to the circuit board in the air channel portion.

Abstract: A data center is cooled through hydronic convection mechanisms, geothermal mechanisms or combinations thereof. The individual computing devices of such a data center are cooled through a thermally conductive interface with a liquid. The liquid's container can extend to a cooling apparatus located physically above such computing devices to provide hydronic convection cooling, or it can extend into the earth, either in the form of a heat pipe, or in the form of conduits through which the liquid is actively pumped. The hydronic convection cooling and geothermal heat pipe cooling operate via temperature differentials and consume no external electrical power. Geothermal cooling avoids heat soak by utilizing multiple different sets of conduits extending into the earth, where at least some of those sets of conduits are not utilized for a period of time. Combinations of hydronic convection mechanisms and geothermal cooling can also be utilized.

Abstract: A heat sink retainer unit includes a buckle body, a retainer member, an elastic member and a handle. The elastic member is disposed in the buckle body and fitted on the retainer member. The retainer member is passed through the buckle body from a lower side thereof. A top end of the retainer member is positioned above the buckle body. The handle is positioned above the buckle body and pivotally connected with the top end of the retainer member. By means of operating the handle, the retainer member can be moved up and down, whereby the elastic member can apply elastic force to the buckle body.

Abstract: An electronics chassis is provided. The electronics chassis includes a plurality of panels that define an interior space. One panel of the plurality of panels has a composite segment having an internal face and an external face. The electronics chassis further includes a conductive thermal pathway that extends through the panel from the internal face of the composite segment to the external face of the composite segment.

Abstract: A thermal interface material (TIM) pad is disclosed for dissipating heat from a component. The TIM pad includes a plurality of thermal interface material layers and at least one graphene layer interposed between the plurality of TIM layers. A method for forming the TIM pad includes stacking the plurality of TIM layers with at least one graphene layer interposed between the plurality of TIM layers to reach a length for the TIM pad. The stacked layers are cut corresponding to a thickness for the TIM pad for compression against the component.

Abstract: The present invention describes a cooling unit for a central processing unit (the CPU) that comprises two flat grooved plates fastened together that jointly form at least one channel that is sealed by hermetic insert blocks wherein the cooling liquid circulates. These plates have heat-dissipating properties for heat-generating electronic components of the CPU contacting with them, while the channel in which the cooling liquid circulates has an inlet and an outlet, to supply and discharge the cooling liquid, respectively. The technical result of the proposed technical solution is to increase the effectiveness and efficiency of a cooling system for the CPU, simplify its design, improve reliability characteristics, and reduce energy consumption of the cooling system.

Abstract: A semiconductor package includes a processor die (e.g., an SoC) and one or more memory die (e.g., DRAM) coupled to a ball grid array (BGA) substrate. The processor die and the memory die are coupled to opposite sides of the BGA substrate using terminals (e.g., solder balls). The package may be coupled to a printed circuit board (PCB) using one or more terminals positioned around the perimeter of the processor die. The PCB may include a recess with at least part of the processor die being positioned in the recess. Positioning at least part of the processor die in the recess reduces the overall height of the semiconductor package assembly. A voltage regulator may also be coupled to the BGA substrate on the same side as the processor die with at least part of the voltage regulator being positioned in the recess a few millimeters from the processor die.

Abstract: An inside surface of a hose for use with liquid-cooled cooling plate assemblies and other applications that contain copper (Cu) components is pre-treated with a passivating agent to reduce depletion of a copper corrosion inhibitor (e.g., benzotriazole (BTA)) dissolved in a liquid coolant (e.g., deionized water) that flows through the hose. Exemplary passivating agents include, but are not limited to, aliphatic alcohols (e.g., 1-hexanol), alkoxysilanes (e.g., (3-aminopropyl)triethoxysilane), and multidentate polymers (e.g., polyvinyl alcohol (PVA)). In one embodiment, a solution of pre-hydrolyzed (3-aminopropyl)triethoxysilane and deionized water is passed through a multilayer hose to form a pre-treated multilayer hose. In some embodiments, one or more pre-treated hoses interconnect liquid-coolant cooling system components (e.g., cold plates, headers, manifolds, pumps, reservoirs, and heat exchangers) of a cooling apparatus that removes heat from one or more electronic components.

Abstract: A resistor for suppressing magnetizing inrush current includes a container made of an insulating material and at least one resistive element housed in the container, the resistive element being connected to two bushings provided at the container, the outer surface of the container being coated with a conductive paint, and the paint being connected to the ground, thereby being able to be located between a cable and a switch, and being able to fix the outer surface thereof to a ground voltage level so that human contact safety is not impaired.