Abstract: Anisotropic thermal energy guiding shells and methods for fabricating thermal energy guiding shells are provided. An anisotropic thermal energy guiding shell includes an interior volume defined within the anisotropic thermal energy guiding shell, a plurality of thermally conductive fibers, and at least one component attachment region. The plurality of thermally conductive fibers are arranged to guide thermal energy received by the anisotropic thermal energy guiding shell non-uniformly relative to the at least one component attachment region according to a thermal energy management objective. A method for fabricating a thermal energy guiding shell includes forming a composite fabric of thermally conductive fibers, impregnating the composite fabric of thermally conductive fibers with a resin, curing the impregnated composite fabric of thermally conductive fibers, and forming the impregnated composite fabric of thermally conductive fibers into the thermal energy guiding shell.

Abstract: A cooling apparatus is provided, which includes: a thermal conductor to cool a heat-dissipating component(s) of an electronics enclosure, the enclosure including an air inlet side through which airflow ingresses. The thermal conductor includes a first conductor portion coupled to the heat-dissipating component(s), and a second conductor portion positioned along the enclosure's air inlet side. The apparatus further includes one or more air-cooled heat sinks coupled to the second conductor portion to facilitate transfer of heat from the second conductor portion to the airflow ingressing into the enclosure, and one or more thermoelectric devices coupled to at least one of the first or second conductor portions to selectively provide auxiliary cooling.

Abstract: A protective cover with information display function includes a main body, at least one receiving unit provided on the main body, and at least one sheet of e-paper. The main body has an opening formed on and sunk from one side of the main body, and an object to be protected can be fitted into the opening and safely covered by the main body. The receiving unit is wirelessly connected to an external interface for receiving an electromagnetic wave. The e-paper is selectively provided on the main body or the receiving unit and is electrically connected to the receiving unit, and can be driven by the electromagnetic wave to display information thereon. With the main body having the receiving unit and the e-paper provided thereon, the protective cover can effectively provide the function of displaying advertisement and other information at any place in real time.

Abstract: A cooling system for use in a mass storage chassis assembly is provided. The cooling system in one example includes a frame including one or more fan bays for receiving one or more fan units, one or more fan bay connectors located in the one or more fan bays and configured to couple to and provide electrical power to the one or more fan units, a plurality of retainer devices positioned in each fan bay, with the plurality of retainer devices configured to receive and hold a plurality of projections extending from each fan unit, and the one or more fan units configured to be installed to the one or more fan bays, with each fan unit including a fan connector that couples to the corresponding fan bay connector.

Abstract: A flat panel display (FPD) including a display panel for displaying an image; a film substrate electrically connected to the display panel, the film substrate including driving circuits; a printed circuit board (PCB) electrically connected to the film substrate, the printed circuit board providing a signal for displaying the image; and a heat radiating unit attached to one surface of the film substrate, the heat radiating unit contacting at least one of the display panel and the PCB.

Abstract: Electronic device assemblies employing dual phase change materials and vehicles incorporating the same are disclosed. In one embodiment, an electronic device assembly includes a semiconductor device having a surface, wherein the semiconductor device operates in a transient heat flux state and a normal heat flux state, a coolant fluid thermally coupled to the surface of the semiconductor device, and a phase change material thermally coupled to the surface of the semiconductor device. The phase change material has a phase change temperature at which the phase change material changes from a first phase to a second phase. The phase change material absorbs heat flux at least when the semiconductor device operates in the transient heat flux state.

Abstract: A communication module including a latching protrusion and an operating unit for operating the latching protrusion and easily accessing the operating unit even in the case of high-density mounting is achieved. The communication module includes a case including a plug connector which is inserted into/pulled out from a receptacle connector provided on a motherboard, a latching protrusion which has a variable protrusion length from the case and which can be latched with and unlatched from a latching hole provided on the motherboard, and an operating unit which moves the latching protrusion toward inside of the case to unlatch the latching protrusion from the latching hole. An operating direction of the operating unit is a direction (X direction) orthogonal to both of an arranging direction of the communication module and other communication module adjacent thereto and an inserting/pulling-out direction of the plug connector.

Abstract: An exemplary modular cooling system for cooling a plurality of electronic components is provided. The cooling system includes a plurality of cooling modules and a clamping arrangement. Each cooling module includes an evaporator unit, a condenser, a first pipe system, and a second pipe system. The clamping arrangement is adapted for holding and pressing an alternation stack in which the evaporator units are stacked in alternation with the power electronic components.

Abstract: Methods of fabricating cooling apparatus are provided which facilitate cooling a multi-component assembly, such as a hub module assembly. The cooling apparatus includes a first liquid-cooled heat sink configured to facilitate removal of heat generated by one or more first electronic components of the multi-component assembly, and a second liquid-cooled heat sink configured to facilitate removal of heat generated by one or more second electronic components of the multi-component assembly. The first liquid-cooled heat sink is separably coupled to the multi-component assembly, and the second liquid-cooled heat sink is fixedly secured to the multi-component assembly. Fluid couplers fluidically couple the first and second liquid-cooled heat sinks to facilitate liquid coolant flow through the fixedly-secured, second liquid-cooled heat sink from the separably-coupled, first liquid-cooled heat sink.

Abstract: Power electronics modules having modular jet impingement assembly utilized to cool heat generating devices are disclosed. The modular jet impingement assemblies include a modular manifold having a distribution recess, one or more angled inlet connection tubes positioned at an inlet end of the modular manifold that fluidly couple the inlet tube to the distribution recess and one or more outlet connection tubes positioned at an outlet end of the modular manifold that fluidly coupling the outlet tube to the distribution recess. The modular jet impingement assemblies include a manifold insert removably positioned within the distribution recess and include one or more inlet branch channels each including an impinging slot and one or more outlet branch channels each including a collecting slot. Further a heat transfer plate coupled to the modular manifold, the heat transfer plate comprising an impingement surface including an array of fins that extend toward the manifold insert.

Abstract: Circuit breakers are provided including a pressure release valve. The pressure release valve includes a vent portion and barrier portion. The barrier portion is configured to open when exposed to excessive heat generated by an arc and allow gases to escape from the circuit breaker. Related electrical distribution panels and systems are also provided.

Abstract: Both a forward direction and a rearward direction of storage racks 20-1 and 20-2 are set to be opening portions 23 and intake and exhaust ducts 61-1, 61-2, 62-1 and 62-2 are provided on doors 11a and 11b in the forward direction and the rearward direction of a storage container 10. Consequently, a ventilation passage linked to an outside from a wall surface in the forward direction of the storage container 10 via a wall surface in the rearward direction is formed for each of storage shelves 31-i and 32-i of the storage racks 20-1 and 20-2 so that heat generated from an electronic apparatus can be efficiently discharged to an outside of the storage container 10, and furthermore, the storage container 10 itself is configured to be isolated electrically by a radio wave absorber so that a function of an anechoic chamber can also be ensured.

Abstract: A solar inverter is provided having a cooling module, a DC module, an inverter module and an AC module provided side-by-side within a chassis. The DC module includes an input accessible from a first side of the chassis and a disconnection switch on a second side of the chassis, with the input being configured to be connected to a DC solar power source. The AC module includes an output accessible from the first side of the chassis and a disconnection switch provided on the second side of the chassis. The cooling module is configured to pump a liquid coolant around the solar inverter in order to cool elements of the DC module, the inverter module and/or the AC module.

Abstract: Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a liquid coolant in an operational mode, and drainage of coolant therefrom in a transport mode. The cooling apparatus includes a liquid-cooled heat sink configured to horizontally couple along a main heat transfer surface to the electronic component(s). The heat sink includes a thermally conductive structure with a coolant-carrying compartment through which coolant flows, and a coolant inlet tube and a coolant outlet tube affixed to the thermally conductive structure and in fluid communication with the coolant-carrying compartment to facilitate coolant flow through the compartment. The coolant-carrying compartment has a base surface, and the coolant outlet tube extends into the coolant-carrying compartment towards the base surface to facilitate withdrawal of the liquid coolant from the compartment in the transport mode of the cooling apparatus.

Abstract: An electronic apparatus, such as a lighting fixture, includes a substrate, an electronic device such as a chip-on-board light emitting diode and a thermal interface located between the substrate and the electronic device. The thermal interface includes at least two distinct materials, including a dielectric material and a thermally conductive material. The dielectric material includes a cutout into which the thermally conductive material is located. The dielectric material can completely surround the perimeter of the electronic device or can be located proximate portions of the electronic device that are prone to arcing in order to protect the substrate from arcing. The electronic apparatus operates at a reduced temperature as compared to an electronic apparatus that does not include the thermal interface. Methods for making an electronic apparatus having a thermal interface with a discrete dielectric material and thermally conductive material are also described.

Abstract: A modular computing system for a data center includes one or more data center modules including rack computer systems. An electrical module is coupled to the data center modules and provides electrical power to computer systems in the data center modules. The data center modules do not include any internal active cooling systems and cannot be coupled with any external active cooling systems. A data center module directs ambient air to flow into intake air plenums extending along intake sides of the rows of racks, through the rows of racks into exhaust plenums extending along exhaust sides of the rows of racks, and out into the ambient environment to cool computer systems in the racks. Directed airflow can be lateral, vertical, at least partially driven by air buoyancy gradients, at least partially induced by air moving devices internal to computer systems in the rows of racks, thereof, etc.

Abstract: The principles described herein provide a server device having a cooling system that provides an efficient cooling of server device components. The cooling system can include a radiator block having air passageways that are oriented substantially orthogonal to the initial airflow path direction. In addition, the server device can include one or more baffles that create an airflow path that passes through the radiator block multiple times. Moreover, the server device can include various additional features that provide convenient access to electronic components within the server device without diminishing the effectiveness of the cooling system.

Abstract: A method of using a heat pipe to spot cool a component in a computer case involves disposing an evaporator portion of the heat pipe to be laterally or horizontally adjacent to, but not in direct contact with, the component in the computer case. The method further involves thermally coupling the laterally adjacent component and the evaporator portion of the heat pipe with a bridging heat transfer component.

Abstract: A server assembly includes a first server and a second server sharing the cooling provided by one or more fans. The first server is stacked on the second server. The first server includes a first bottom plate having vents, a first side plate having first air inlets, and a first back plate having air outlets. The fans are mounted to the first server. The second server includes a second bottom plate, a second side plate having second air inlets, and a second back plate. The servers are configured to dissipate heat from the first server by air that enters the first server and is expelled out of the air outlets by the fans, and to dissipate heat from the second server by air that enters the second server, enters the first server from the vents, and is expelled out of the air outlets by the fans.

Abstract: A cooling apparatus for rack-mounted computing devices includes a heat sink including a thermal interface to conductively contact a computing device mounted on a printed circuit board; a cold plate including a first portion in thermal communication with the heat sink with a working fluid, and a second portion that includes a cooling coil in thermal communication with the first portion, the cooling coil including an inlet to receive chilled liquid; a fan positioned to circulate airflow over the cold plate; and a controller coupled to the fan to adjust a speed of the fan in response to an output of a sensor coupled to the computing device.