Abstract: A heat-dissipation system and a matrix thermal sensing circuit are provided. The heat-dissipation is used in an electronic device. The electronic device comprises a circuit board and a plurality of load elements disposed on the circuit board. The matrix thermal sensing circuit includes a current sensing module and a calculation module. The current sensing module includes a plurality of sensing nodes. Each sensing node is electrically connected to a current feeding terminal of one corresponding load element, and senses the working current of the corresponding load element respectively. The calculation module is connected to the current sensing module and is used to determine thermal state of the location of the sensing node according to the working current respectively.

Abstract: A power electronics system includes a multipart housing having three housing elements of cuboid basic structure to define a central element with inlet and outlet ports for a cooling liquid, an upper and lower cover elements which are arranged on opposite connection surfaces of the central element. A plurality of power electronics switching devices is accommodated in the housing, and a condenser device having condenser connection elements is arranged in the central element of the housing> Further provided is a liquid cooling system having at least one first upper cooling chamber between the central element and the upper cover element, and at least two first and second lower cooling chambers between the central element and the lower cover element. The upper and lower cooling chambers are configured for circulation of the cooling liquid entering through the inlet port and exiting through the outlet port of the housing.

Abstract: A cooling device for an electronic machine includes an airflow channel through which external air passes, an air inlet duct through which external air is introduced and which is disposed at an upper front surface of the airflow channel and extends perpendicularly to the airflow channel, a blower fan disposed in the air inlet duct to draw in external air through the air inlet duct, an air outlet duct disposed at a lower portion of the airflow channel to discharge air from the airflow channel, and a heat-radiating unit disposed to the rear of a circuit board mounted with electronic components on a front surface thereof to absorb heat from the circuit board. The heat-radiating unit is located, apart from the blower fan, in the airflow channel. Through the improved cooling airflow structure, cooling efficiency is increased, noise is reduced and continuous cooling operation is achieved.

Abstract: A power electronic building block includes a housing; a power module mounted within the housing; a controller mounted within the housing and coupled to the power module; a capacitor assembly coupled to the power module and mounted within the housing; an AC bus bar mounted within the housing; and a DC bus bar coupling the capacitor assembly to the power module and mounted within the housing.

Abstract: A lap cushion, for supporting an electronic device on a users lap, provides thermal insulation and cooling airflow between the electronic device and the user. The cushion further includes a shield positioned between the top surface and the electronic device where the shield is electrically-conductive and electrically-grounded so as to provide radiation absorption of RF electromagnetic radiation emanating from the electronic device.

Abstract: Power electronics device, such as a frequency converter, which includes liquid-cooled power units (REC5, REC6, AFE5, AFE6, INU4, INU5, DC/DC, DC/AC) and also a substrate arrangement. The power units include at least one power semiconductor component, e.g. an IGBT or a diode, connected to at least one power circuit connecting them. The power units are mechanically separate and they are disposed on at least one substrate provided with liquid cooling ducts. The substrate is common to more than one power unit, wherein the substrate includes liquid cooling interfaces and power circuit interfaces for each power unit that can be connected to it. In addition, the substrate includes one liquid cooling interface and one power circuit interface (DC+, DC?) to outside the substrate.

Abstract: Embodiments include a liquid cooled electronic device including a compartment configured to enclose an electronic module therein. The compartment includes a stationary cooling plate disposed on an interior portion of the compartment, the stationary cooling plate comprising a liquid cooling system configured to remove heat from the stationary cooling plate and a plurality of electrical connectors configured to connect to the electronic module. The electronic module includes a mobile cooling plate configured to intimately fit with the stationary cooling plate when the plurality of electrical connectors are connected to the electronic device module. The heat generated by the electronic module is removed by the mobile cooling plate and the stationary cooling plate.

Abstract: A protective case for electronic equipment is used to dissipate heat of electronic equipment. The protective case contains a body including a through hole defined therein and a metal plate disposed in the through hole, a Nano heat dissipation layer formed on a back surface of the metal plate, such that the electronic equipment retains with a protective case and contacts with the metal plate. The metal plate has an external rim retained in the body. The body also includes a recess defined thereon, and the metal plate adheres with the recess. The protective case also contains a dissipating piece, and a back surface of the dissipating piece connects with a front surface of the metal plate, a front surface of the dissipating piece contacts with the electronic equipment.

Abstract: Example embodiments of the present invention provide a method of manufacture and an apparatus for optimized server design using dense DIMM spacing, wide heatsink, improved routing channels, and improved air delivery to rear devices. The method of manufacture comprise providing a plurality of compliant pin memory sockets on a first side of a circuit board at a pitch less than that specified in a reference layout requiring solder tail memory sockets and providing a plurality of surface mount capacitors on the second side of the circuit board enabling at least one pair of the plurality of compliant pin memory sockets to be provided at the pitch less than that specified in the reference layout.

Abstract: A flat panel display (FPD) including a display panel for displaying an image; a film substrate electrically connected to the display panel, the film substrate including driving circuits; a printed circuit board (PCB) electrically connected to the film substrate, the printed circuit board providing a signal for displaying the image; and a heat radiating unit attached to one surface of the film substrate, the heat radiating unit contacting at least one of the display panel and the PCB.

Abstract: A servo amplifier includes a housing, a heat source arranged in the housing, and a heat dissipating structure including a heat sink arranged in the housing and thermally connected to the heat source. The heat sink has heat dissipating fins extending from at least a portion of a surface of the heat sink, other than a connecting face thermally connected to the heat source. The at least a portion of the surface of the heat sink, other than the connecting face, is thermally connected to a surface of the housing.

Abstract: An example embodiment includes a thermal management system for an active cable connector. The system includes a shell and a back plate. The shell defines a cavity and includes multiple heat-transfer areas on an internal shell surface. A first heat-transfer area is positioned with respect to a first heat-generating component to absorb a first portion of thermal energy generated by the first heat-generating component. The back plate is positioned with respect to the first heat-generating component to absorb a second portion of the thermal energy generated by the first heat-generating component. The back plate is further positioned proximate to a second heat-transfer area to transfer the second portion of the thermal energy to the shell.

Abstract: An electronic device includes a fan field replaceable unit (FRU). The fan FRU includes a fan FRU chassis defining an airflow pathway through the fan FRU. A fan within the fan FRU chassis causes air to flow along the airflow pathway. The fan FRU further includes an edge connector located at a front face of the fan FRU out of the way of the airflow pathway. Accordingly, the edge connector does not block airflow through the fan FRU thus maximizing the efficiency of the fan FRU and the cooling of the electronic device.

Abstract: A power converter includes an inverter in an inverter case, and a DC/DC converter in a converter case detachably fixed to the inverter case. The inverter includes power semiconductor modules, and the DC/DC converter includes a down-converter circuit and/or a boost converter circuit. The inverter case includes first and second path-forming members thermally contacting the converter case. In the first path-forming member, the power semiconductor module is inserted into a first coolant path. In the second path-forming member, the power semiconductor module inserted into the second coolant path, which is parallel to the first coolant path. The DC/DC converter includes an inductance device, and a switching device board on which a switching device con rolling electric current in the inductance device is mounted. The inductance and switching devices are in an area of the converter case thermally contacting first and second path forming members.

Abstract: A heat dissipation structure for hand-held mobile device includes a supporting body having a first and an opposite second side and including at least one heat dissipation area. In the heat dissipation area, a heat dissipation element is correspondingly fitted without increasing an overall thickness and volume of the supporting body for the hand-held mobile device. With the heat dissipation element fitted in the heat dissipation area on the supporting body, heat produced by the hand-held mobile device during operation thereof can be quickly transferred to the heat dissipation element for dissipating into ambient air.

Abstract: A configurable computer housing includes a frame and a removable motherboard unit. There are a plurality of openings on the frame that are configured to receive the removable motherboard unit.

Abstract: Various embodiments provide safety disconnect systems for a power system. In one aspect, a safety switch system and method for a power system, including a plurality of sequentially interlocked switches capable of being operated in a predetermined sequence to isolate one or more fuses, is provided. The described safety switch system is a convenient and sequential approach to safely remove power from a system and access associated fuses.

Abstract: Cooling apparatuses are provided which facilitate cooling a multi-component assembly, such as a hub module assembly. The cooling apparatus includes a first liquid-cooled heat sink configured to facilitate removal of heat generated by one or more first electronic components of the multi-component assembly, and a second liquid-cooled heat sink configured to facilitate removal of heat generated by one or more second electronic components of the multi-component assembly. The first liquid-cooled heat sink is separably coupled to the multi-component assembly, and the second liquid-cooled heat sink is fixedly secured to the multi-component assembly. Fluid couplers fluidically couple the first and second liquid-cooled heat sinks to facilitate liquid coolant flow through the fixedly-secured, second liquid-cooled heat sink from the separably-coupled, first liquid-cooled heat sink.

Abstract: A height of a signal transmission device is decreased as low as possible as maintaining or improving a cooling performance for the communication module. Ina signal transmission device provided with a communication module provided on a substrate and a cooling mechanism for cooling the communication module, the cooling mechanism includes: a heat-transfer plate including a first region which overlaps with bottom surfaces of a plurality of the communication modules and is thermally connected to the bottom surfaces and a second region which does not overlap with the bottom surfaces of the communication modules; and a heat-release fin provided in the second region of the heat-transfer plate.

Abstract: An immersion server includes: a first surface that is exposed when the server is submerged within a cooling liquid; and at least one vapor bubble deflector physically abutting the first surface and extending away from the first surface at an angle. The deflector divides the first surface into an upper segment and a lower segment when the server is upright. When the server is submerged, the cooling liquid surrounding the lower segment absorbs sufficient heat to evaporate and generate vapor bubbles rising to the liquid surface. The vapor bubble deflector deflects the rising vapor bubbles away from the surface of the upper segment. This enables superior liquid contact with heat dissipating components at the upper segment and better cooling of those components. The deflector can be a device-level deflector separating two or more components or a component-level deflector separating a lower segment from an upper segment of a single component.