Abstract: A method for forming a semiconductor structure is provided. Multiple fins extending along a first direction are formed in a semiconductor substrate. The multiple fins includes a group of active fins, a pair of protection fins sandwiching about the group the active fins, and at least one dummy fin around the pair of protection fins. A fin cut process is performed to remove the at least one dummy fin around the pair of protection fins. After performing the fin cut process, trench isolation structures are formed within the trenches between the multiple fins. The trench isolation structures are subjected to an anneal process. After annealing the trench isolation structures, the pair of protection fins is removed.

Abstract: A method for assembling a camera assembly for viewing in all directions inside a refrigerator, the refrigerator comprising a body, a door, and the camera assembly. The camera assembly comprises a locking base, a securing base, and a camera, the securing base being coupled to the locking base. The camera is coupled to the securing base, the securing base defines a slot for receiving the camera. The locking base is coupled to the door.

Abstract: A method for manufacturing a semiconductor structure includes at least following steps. A device layer is formed on a first semiconductor substrate. The device layer is separated from the first semiconductor substrate. A dielectric layer is formed on a second semiconductor substrate. The device layer is bonded onto the dielectric layer.

Abstract: The present invention provides a compound of formula (I) wherein X, Y, Z1, Z2, R1, R2, A, B, p and q are as disclosed in the specification. A pharmaceutical composition and a method for modulating the Hedgehog pathway are also provided. The present invention further provides a process for preparing the compound.

Abstract: A method includes epitaxially growing a first III-V compound layer over a semiconductive substrate. A second III-V compound layer is epitaxially grown over the first III-V compound layer. A source/drain contact is formed over the second III-V compound layer. A gate structure is formed over the second III-V compound layer. A pattern is formed shielding the gate structure and the source/drain contact, in which a portion of the second III-V compound layer is free from coverage by the pattern.

Abstract: A wafer includes a first set of dies and a second set of dies. The wafer further includes a scribe line separating the first set of dies from the second set of dies, wherein the scribe line has a first width. The wafer further includes a plurality of trenches between adjacent dies of the first set of dies and connected to the scribe line, wherein the plurality of trenches has a second width less than the first width, and a depth of each trench of the plurality of trenches is less than a thickness of the wafer.

Abstract: A method and structure for providing a semiconductor-on-insulator (SCOI) wafer having a buried low-K dielectric layer includes forming a device layer on a first semiconductor substrate. In various embodiments, at least a portion of the device layer is separated from the first semiconductor substrate, where the separating forms a cleaved surface on the separated portion of the device layer. In some examples, a patterned low-K dielectric layer is formed on a second semiconductor substrate. Thereafter, and in some embodiments, the separated portion of the device layer is bonded, along the cleaved surface, to the patterned low-K dielectric layer.

Abstract: A memory device includes: a first conductor extending in parallel with a first axis; a first selector material comprising a first portion that extends along a first sidewall of the first conductor; a second selector material comprising a first portion that extends along the first sidewall of the first conductor; a first variable resistive material comprising a portion that extends along the first sidewall of the first conductor; and a second conductor extending in parallel with a second axis substantially perpendicular to the first axis, wherein the first portion of the first selector material, the first potion of the second selector material, and the portion of the first variable resistive material are arranged along a first direction in parallel with a third axis substantially perpendicular to the first axis and second axis.

Abstract: A rear cover assembly structure of an air purifier allows for rapid opening and demounting of a rear cover and includes a housing, the rear cover, a hooking mechanism, and a magnetic connection mechanism. The rear cover can be assembled on or detached from the housing by the hooking mechanism and the magnetic connection mechanism. The hooking mechanism includes a groove set on the housing and a shaft set on rear cover. The shaft being set in the groove or separated from the groove respectively locks or unlocks the hooking mechanism. The magnetic connection mechanism includes a magnetic assembly set on the housing and a metal sheet set on the rear cover, the metal sheet is attracted to the magnetic assembly. The metal sheet is set on the housing by a fixed structure of the housing.

Abstract: An icon display structure includes a display panel including a silkscreen interlayer, a diffusion sheet, and a light source. The diffusion sheet includes a light transmission zone. The silkscreen interlayer includes a silkscreen icon and defines a hollow icon. The silkscreen icon is aligned with the hollow icon and appears directly on the display panel. The light transmission zone of the diffusion sheet is aligned with the silkscreen icon and the hollow icon. The light source is positioned behind the diffusion sheet. The light source emits light and the light transmits through the light transmission zone and the hollow icon to light up the silkscreen icon on the display panel.

Abstract: An infrared image sensor component includes a semiconductor substrate, an active pixel region disposed on the semiconductor substrate for receiving an infrared ray, and a transistor coupled to the active pixel region. The transistor includes a gate and a source/drain stressor disposed adjacent to the gate. The active pixel region includes a III-V compound material.

Abstract: An electronic device includes an imaging light assembly including a display panel, a circuit board, a light source, and a light cover. The light source is mounted and electrically coupled to the circuit board. The light cover is mounted to a rear surface of the display panel and covers the light source. The light source emits light to the light cover. The light cover includes at least one projection lens located between the light cover and the display panel. The at least one projection lens focuses the light emitted by the light source and projects the focused light to the display panel. The focused light projected to the display panel projects an image of a design of the projection lens.

Abstract: A filter cleaning mechanism includes a sliding rail, a filter, a dust box, a cleaning device, and a driver. The filter is mounted to the sliding rail. The dust box is mounted to a bottom of the sliding rail. The cleaning device is mounted in front of the filter and above the dust box. The cleaning device includes a cleaning brush and a screen. The driver is mounted to a side of the sliding rail and is electrically coupled to the cleaning device. The driver moves up and down along the sliding rail. The cleaning brush and the screen move along with the driver up and down the sliding rail. The driver drives the cleaning brush to brush the filter. The screen blocks the front of the filter while the cleaning brush brushes the filter.

Abstract: A method and structure for providing a semiconductor-on-insulator (SCOI) wafer having a buried low-K dielectric layer includes forming a device layer on a first semiconductor substrate. In various embodiments, at least a portion of the device layer is separated from the first semiconductor substrate, where the separating forms a cleaved surface on the separated portion of the device layer. In some examples, a patterned low-K dielectric layer is formed on a second semiconductor substrate. Thereafter, and in some embodiments, the separated portion of the device layer is bonded, along the cleaved surface, to the patterned low-K dielectric layer.

Abstract: An air purification device includes a housing, an air quality sensor, an LED light group, and a controller. The air quality sensor is mounted within the housing and detects air quality parameters in real time. The LED light group is mounted within the housing and includes at least one LED light. The controller is mounted within the housing and controls the at least one LED light of the LED light group to emit light of a corresponding color according to the air quality parameters. The emitted light corresponds in color to indicate an air quality.

Abstract: A noise reduction device for reducing noise in refrigeration equipment includes at least one transition tube having a diameter gradually increasing from a capillary of the refrigeration equipment to an evaporator of the refrigeration equipment. The refrigerant liquid is circulated through the noise reduction device.

Abstract: Disclosed are improved antenna structures, systems, and methods of manufacturing. In an embodiment, low-cost internal 2G/5G antennas have flat metal dipole construction, which can include a stiffener. External embodiments include quad dipole antenna structures, with broadside or corner arrays. Isolated multi-band center or end-fed dipole antennas can include single-sided PCB or metal-only structures, for operation with at least two distinct frequencies, and can provide RF isolation, such as with an RF trap or a Balun system. Embodiments of non-DC path or pass-through dual band antennas feature trap structures, along with discrete or distributed matching, and can provide a DC feed path for LEDs. Low profile and flat vertically polarized omni-directional antennas, such as for operation at 915 MHz, include an open slot driven cavity. Stacked 2G/5G antenna structures provide axial symmetry between quadrants.

Abstract: A refrigerator includes a refrigeration system and a heating chamber powered by a part of the refrigeration process. The refrigeration system is a closed and recycling system which comprises a compressor, a first condenser, a three-way magnetic valve, a second condenser, at least one capillary pipeline, and an evaporator. The heating chamber is located around the first condenser, and the first condenser emits to the heating chamber heat which is emitted by the refrigeration system.

Abstract: A method for assembling a camera assembly for viewing in all directions inside a refrigerator, the refrigerator comprising a body, a door, and the camera assembly. The camera assembly comprises a locking base, a securing base, and a camera, the securing base being coupled to the locking base. The camera is coupled to the securing base, the securing base defines a slot for receiving the camera. The locking base is coupled to the door.