Abstract: A noise reduction device for reducing noise in refrigeration equipment includes at least one transition tube having a diameter gradually increasing from a capillary of the refrigeration equipment to an evaporator of the refrigeration equipment. The refrigerant liquid is circulated through the noise reduction device.

Abstract: Disclosed are improved antenna structures, systems, and methods of manufacturing. In an embodiment, low-cost internal 2G/5G antennas have flat metal dipole construction, which can include a stiffener. External embodiments include quad dipole antenna structures, with broadside or corner arrays. Isolated multi-band center or end-fed dipole antennas can include single-sided PCB or metal-only structures, for operation with at least two distinct frequencies, and can provide RF isolation, such as with an RF trap or a Balun system. Embodiments of non-DC path or pass-through dual band antennas feature trap structures, along with discrete or distributed matching, and can provide a DC feed path for LEDs. Low profile and flat vertically polarized omni-directional antennas, such as for operation at 915 MHz, include an open slot driven cavity. Stacked 2G/5G antenna structures provide axial symmetry between quadrants.

Abstract: A refrigerator includes a refrigeration system and a heating chamber powered by a part of the refrigeration process. The refrigeration system is a closed and recycling system which comprises a compressor, a first condenser, a three-way magnetic valve, a second condenser, at least one capillary pipeline, and an evaporator. The heating chamber is located around the first condenser, and the first condenser emits to the heating chamber heat which is emitted by the refrigeration system.

Abstract: A method for assembling a camera assembly for viewing in all directions inside a refrigerator, the refrigerator comprising a body, a door, and the camera assembly. The camera assembly comprises a locking base, a securing base, and a camera, the securing base being coupled to the locking base. The camera is coupled to the securing base, the securing base defines a slot for receiving the camera. The locking base is coupled to the door.

Abstract: A dual band end fed dipole provides at least two distinct operating frequencies, e.g. 2.45 GHz and 5.5 GHz. Properties of the antenna include low cost to manufacture, e.g. ease of automation; minimal manual labor to manufacture, e.g. reliability; dual band operation; broad bandwidth; good feed line isolation; omnidirectional beam pattern; minimal vertical beam squint; small diameter; and high efficiency. Embodiments of the invention provide a dual band end fed dipole with a low band trap on the feed side that requires minimal manual labor to manufacture because the antenna is formed from a single flat sheet of metal and soldering is replaced with crimping. Minimal dielectric loading is also achieved.

Abstract: Disclosed are improved antenna structures, systems, and methods of manufacturing. In an embodiment, low-cost internal 2G/5G antennas have flat metal dipole construction, which can include a stiffener. External embodiments include quad dipole antenna structures, with broadside or corner arrays. Isolated multi-band center or end-fed dipole antennas can include single-sided PCB or metal-only structures, for operation with at least two distinct frequencies, and can provide RF isolation, such as with an RF trap or a Balun system. Embodiments of non-DC path or pass-through dual band antennas feature trap structures, along with discrete or distributed matching, and can provide a DC feed path for LEDs. Low profile and flat vertically polarized omni-directional antennas, such as for operation at 915 MHz, include an open slot driven cavity. Stacked 2G/5G antenna structures provide axial symmetry between quadrants.

Abstract: A method of making a metal insulator metal (MIM) capacitor includes forming a copper bulk layer in a base layer, wherein the copper bulk layer includes a hillock extending from a top surface thereof. The method further includes depositing an etch stop layer over the base layer and the copper bulk layer. The method further includes depositing an oxide-based dielectric layer over the etch stop layer. The method further includes forming a capacitor over the oxide-based dielectric layer. The method further includes forming a contact extending through the oxide-based dielectric layer and the etch stop layer to contact the copper bulk layer, wherein the forming of the contact removes the hillock.

Abstract: A simultaneous client wireless device includes wireless modules configured to perform communication functions of a PHY (physical) layer for wireless radios operable in different bands. The simultaneous client wireless device also includes a communication module configured as an intermediate layer between the PHY layer of the wireless modules and a network layer. The communication module is configured to use an application programming interface to retrieve information from the PHY layer and write information to the PHY layer of the wireless modules, perform communication functions of upper MAC (media access control) and lower MAC layers for the wireless bands, and manage simultaneous communications over the wireless bands. The communications over the wireless bands can use a local area network protocol.

Abstract: A simultaneous client wireless device includes wireless modules configured to perform communication functions of lower MAC (media access control) and PHY (physical) layers for wireless radios operable in multiple wireless bands. The simultaneous client wireless device also includes a communication module configured as an intermediate layer between the lower MAC layer of the wireless modules and a network layer. The communication module is configured to use an application programming interface to retrieve information from the lower MAC layer and write information to the lower MAC layer of each wireless module, perform communication functions of an upper MAC layer for the wireless bands, and manage simultaneous communications over the wireless bands. The communications over the wireless bands can use a local area network protocol.

Abstract: A simultaneous client wireless device includes a communication module configured as a layer under a network layer, and configured to receive packets for processing from the network layer and communicate processed packets to the network layer. The communication module is further configured to perform communication functions of an upper MAC (media access control) layer, a lower MAC layer, and a PHY (physical) layer for wireless radios operable in different wireless bands, and manage simultaneous communications over the wireless bands. The communications over the wireless bands can use a local area network protocol.

Abstract: A wafer includes a first set of dies and a second set of dies. The wafer further includes a scribe line separating the first set of dies from the second set of dies, wherein the scribe line has a first width. The wafer further includes a plurality of trenches between adjacent dies of the first set of dies and connected to the scribe line, wherein the plurality of trenches has a second width less than the first width, and a depth of each trench of the plurality of trenches is less than a thickness of the wafer.

Abstract: Various embodiments of mechanisms for forming a slotted metal pad over a TSV in substrate are provided. The dielectric structures in the slotted metal pad reduce dishing effect during planarization of the slotted metal pad. As a result, the risk of having metal stringers in upper metal level(s) caused by the dishing effect is greatly reduced.

Abstract: Various embodiments disclose systems and methods for employing a Sub1G signal (e.g. a signal in the range of approximately 500 Mhz or 800 mHz) for use with internal and/or external components of various user devices. The Sub1G region may provide a path loss advantage over traditional 2.4 and 5 Ghz systems because of the lower frequency in free-space path loss model. Sub 1G may also present less interference compared to 2.4 GHz (e.g., better QoS for applications such as VOIP, Gaming, etc.). In some of the disclosed embodiments, Sub1G may be employed using current 2.4G or 5G Wireless LAN chipset with RF Up/Down Converters. In some embodiments, the Sub1G approach may be used to create a Long Range Bridge, Long Range Extender, Long Range Client, Long Range Hotspot, etc.

Abstract: Disclosed are improved antenna structures, systems, and methods of manufacturing. In an embodiment, low-cost internal 2G/5G antennas have flat metal dipole construction, which can include a stiffener. External embodiments include quad dipole antenna structures, with broadside or corner arrays. Isolated multi-band center or end-fed dipole antennas can include single-sided PCB or metal-only structures, for operation with at least two distinct frequencies, and can provide RF isolation, such as with an RF trap or a Balun system. Embodiments of non-DC path or pass-through dual band antennas feature trap structures, along with discrete or distributed matching, and can provide a DC feed path for LEDs. Low profile and flat vertically polarized omni-directional antennas, such as for operation at 915 MHz, include an open slot driven cavity. Stacked 2G/5G antenna structures provide axial symmetry between quadrants.

Abstract: An infrared image sensor component includes a semiconductor substrate, an active pixel region disposed on the semiconductor substrate for receiving an infrared ray, and a transistor coupled to the active pixel region. The transistor includes a gate and a source/drain stressor disposed adjacent to the gate. The active pixel region includes a III-V compound material.

Abstract: Systems and methods for enabling a WLAN client to communicate simultaneously over more than one band at a time are described, where each client has at least one radio that is operational in each supported band. Load balancing based on traffic requirements optimizes the use of the multiple bands.

Abstract: Systems and methods for enabling a WLAN client to communicate simultaneously over more than one band at a time are described, where each client has at least one radio that is operational in each supported band. Load balancing based on traffic requirements optimizes the use of the multiple bands.

Abstract: A method and structure for providing a semiconductor-on-insulator (SCOI) wafer having a buried low-K dielectric layer includes forming a device layer on a first semiconductor substrate. In various embodiments, at least a portion of the device layer is separated from the first semiconductor substrate, where the separating forms a cleaved surface on the separated portion of the device layer. In some examples, a patterned low-K dielectric layer is formed on a second semiconductor substrate. Thereafter, and in some embodiments, the separated portion of the device layer is bonded, along the cleaved surface, to the patterned low-K dielectric layer.

Abstract: A method of partitioning a wafer includes defining a scribe line surrounding a set of dies. The method further includes etching a plurality of trenches into the wafer, wherein each trench of the plurality of trenches is located between adjacent dies of the set of dies, and a width of each trench of the plurality of trenches is less than a width of the scribe line. The method further includes thinning the wafer to expose a bottom surface of the plurality of trenches. The method further includes cutting along the scribe line to separate the set of dies from another portion of the wafer.