Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: Controlling methods of a wireless communication device and a network are provided. The controlling method of the wireless communication device includes the following steps: transmitting a Mobility Registration Update (MRU) request to a network; keeping a Protocol Data Unit (PDU) command received from the network; and processing the PDU command after a predetermined waiting timer counted from receiving an MRU accept from the network is expired.

Abstract: An electronic device includes two speakers, a single functional chip, a parameter extraction circuit, an audio processing module, a gain adjusting circuit and a current detecting unit. The current detecting unit is disposed in the functional chip for detecting the driving current of the two speakers. The functional chip provides the driving voltage of the two speakers based on an output signal and converts the analogue current/voltages of the two speakers into digital current/voltages. The parameter extraction circuit acquires the parameter of each speaker based on the digital current/voltages. The audio processing module acquires the gains of various physical quantities based on the parameter of each speaker and determines the final gain of each physical quantity. The gain adjusting circuit provides the output signal by adjusting the gain of an input signal based on the final gain of each physical quantity.

Abstract: A high voltage semiconductor device includes a semiconductor substrate, a first drift region, a gate structure, a first sub gate structure, a first spacer structure, a second spacer structure, and a first insulation structure. The first drift region is disposed in the semiconductor substrate. The gate structure is disposed on the semiconductor substrate and separated from the first sub gate structure. The first sub gate structure and the first insulation structure are disposed on the first drift region. The first spacer structure is disposed on a sidewall of the gate structure. The second spacer structure is disposed on a sidewall of the first sub gate structure. At least a part of the first insulation structure is located between the first spacer structure and the second spacer structure. The first insulation structure is directly connected with the first drift region located between the first spacer structure and the second spacer structure.

Abstract: An electronic device includes a rollable panel and a metal layer. The rollable panel includes a first portion and a second portion. The rollable panel has a first side and a second side opposite to the first side. The rollable panel includes a substrate, a circuit layer disposed on the substrate and a cover layer disposed on the circuit layer. The metal layer is disposed on one of the first side and the second side of the rollable panel and outside the rollable panel. In a rolled mode, at least a part of the metal layer is positioned between the first portion and the second portion of the rollable panel.

Abstract: The present disclosure relates to the technical field of semiconductor manufacturing, and provides a semiconductor structure and a forming method thereof. The forming method includes: providing a semiconductor substrate, where a surface of the semiconductor substrate is provided with a plurality of conductive structures arranged at intervals; etching a surface of the conductive structure into a curved surface, and then depositing sequentially to form a first protective layer, a second protective layer and a third protective layer; etching the first protective layer, the second protective layer and the third protective layer to form a contact hole exposing the etched curved surface of the conductive structure; and forming a mask layer on a surface of the contact hole.

Abstract: An automatic fluid replacement device is adapted to be mounted on an opening of a storage barrel. The automatic fluid replacement device includes a robotic arm, at least one fluid convey joint and a controller. The robotic arm has a gripper. The fluid convey joint includes a convey pipe, a sleeve and a sealing bag. The convey pipe is configured to deliver a fluid. The sleeve is sleeved on the convey pipe. The gripper clamps the sleeve. The sealing bag is sleeved on the sleeve. The controller is configured for automatically controlling the robotic arm to move the fluid convey joint into the opening and controlling the sealing bag to be inflated to seal the opening.

Abstract: A system for automatically placing virtual advertisements in sports videos, which includes a shot detection module, background extraction module, a calibration module and an asset placement module. The shot detection module detects the target shot of a sports video via a first trained model. The background extraction module performs a background extraction to extract the background of the first frame of the target shot to obtain a first background mask. The calibration module performs a camera calibration to detect a first transformation relation, between the first frame and a sport field template, via a second trained model. The asset placement module transforms an advertisement asset according to the first transformation relation to obtain a first transformed asset, and execute an asset placement to place the first transformed asset onto the first frame according to the first background mask to obtain a first image frame with placed advertisement.

Abstract: Provided are a passivation layer for forming a semiconductor bonding structure, a sputtering target making the same, a semiconductor bonding structure and a semiconductor bonding process. The passivation layer is formed on a bonding substrate by sputtering the sputtering target; the passivation layer and the sputtering target comprise a first metal, a second metal or a combination thereof. The bonding substrate comprises a third metal. Based on a total atom number of the surface of the passivation layer, O content of the surface of the passivation layer is less than 30 at %; the third metal content of the surface of the passivation layer is less than or equal to 10 at %. The passivation layer has a polycrystalline structure. The semiconductor bonding structure sequentially comprises a first bonding substrate, a bonding layer and a second bonding substrate: the bonding layer is mainly formed by the passivation layer and the third metal.

Abstract: The present disclosure relates to a method for treating a cancer and/or cancer metastasis in a subject comprising administering to the subject irinotecan loaded in a mesoporous silica nanoparticle. The present disclosure also provides a conjugate comprising an agent loaded in a mesoporous silica nanoparticle (MSN) defining at least one pore and having at least one functional group on a sidewall of the at least one pore.

Abstract: A tracer diffusion device includes: a first container, for holding a first fluid containing a tracer; a second container, for holding a second fluid; a drilling pipe; wherein, a first end of the drilling pipe is connected to the first container; a second end of the drilling pipe is extended into a borehole; and the second end of the drilling pipe is equipped with a first sealing capsule and a second sealing capsule; a plurality of through holes are arranged on the drilling pipe between the first sealing capsule and the second sealing capsule; a unidirectional driving device, arranged on the drilling pipe, for injecting the first fluid from the first container into the borehole between the first sealing capsule and the second sealing capsule; and a bidirectional driving device, arranged between the second container and the first sealing capsule.

Abstract: An electronic device includes a substrate, a semiconductor unit and an insulating layer. The semiconductor unit is disposed on the substrate. The insulating layer is disposed on the semiconductor unit, and the insulating layer includes a first portion and a second portion connected to the first portion. In a top view, the first portion partially overlaps the semiconductor unit, the second portion does not overlap the semiconductor unit, and a part of an edge of the insulating layer is irregular.

Abstract: A ceramic material includes zirconia toughened alumina (ZTA), which is doped with zinc ions and other metal ions, in which the other metal ions are chromium (Cr) ions, titanium (Ti) ions, gadolinium (Gd) ions, manganese (Mn) ions, cobalt (Co) ions, iron (Fe) ions, or a combination thereof. The ceramic material may have a hardness of 1600 Hv10 to 2200 Hv10 and a bending strength of 600 MPa to 645 MPa. The ceramic material can be used as wire bonding capillary.

Abstract: A magnetic multi-pole propulsion array system is applied to at least one external cathode and includes a plurality of magnetic multi-pole thrusters connected adjacent to each other. Each magnetic multi-pole thruster includes a propellant provider, a discharge chamber, an anode and a plurality of magnetic components. The propellant provider outputs propellant. The discharge chamber is connected with the propellant provider to accommodate the propellant. The anode is disposed inside the discharge chamber to generate an electric field. The plurality of magnetic components is respectively disposed on several sides of the discharge chamber. One of the several sides of the discharge chamber of the magnetic multi-pole thruster is applied for one side of a discharge chamber of another magnetic multi-pole thruster.

Abstract: A display device includes a display panel including a rollable portion and a non-rollable portion. The display panel includes a supporting structure including a groove disposed on a first side of the supporting structure, a substrate disposed on a second side of the supporting structure and the first side opposite to the second side, and a circuit board fixed onto a back of the display panel. The non-rollable portion has a first region. A first region of the circuit board is joined to the first region of the non-rollable portion. The non-rollable portion has a first end and a second end. The first end is connected to the rollable portion. The second end is connected to the circuit board.

Abstract: In an embodiment, a session management function (SMF) network element obtains first information identifying a data stream, where the first information is used to instruct a transmit end to send a user stream using the data stream and to instruct a receive end to receive the user stream using the data stream; and the receive end is an access network element, and the transmit end is a user plane function network element, or vice versa; the SMF network element sends the first information to the user plane function network element and/or the access network element; the SMF network element obtains second information, where the second information is used to indicate a forwarding rule of transmitting the user stream by the user plane function network element on a data network side; and the SMF network element sends the second information to the user plane function network element.

Abstract: A method for regulating an unmanned aerial vehicle (UAV) includes receiving a UAV identifier and one or more types of contextual information broadcasted by the UAV. The UAV identifier uniquely identifies the UAV from other UAVs. The one or more types of contextual information includes at least geographical information of the UAV. The method further includes authenticating, via an authentication device, an identity of the UAV based on the UAV identifier to determine whether the UAV is authorized for operation, and transmitting a signal to a remote device in response to determining whether the UAV is authorized for operation.

Abstract: The disclosure provides a transparent display device including a display panel. The display panel includes a display area, a non-display area, and a plurality of pixels. The non-display area is adjacent to the display area. The plurality of pixels are disposed in the display area. A difference between a transmittance of the display area and a transmittance of the non-display area is less than 30% of the transmittance of the display area.

Abstract: A carrier configuration method and system for a distributed antenna system, a processing device, and a chip are provided. The distributed antenna system includes at least one access unit and at least one remote unit. The method includes: acquiring a configuration parameter of a carrier to be transmitted of at least one access unit, the configuration parameter including a mapping relationship between the at least one access unit and the at least one remote unit; and establishing a transmission channel between the at least one access unit and the at least one remote unit according to the mapping relationship.

Abstract: An electronic assembly is provided. The electronic assembly includes a first circuit structure including a conductive structure, a second circuit structure disposed on the first circuit structure, a plurality of electronic elements disposed on the first circuit structure, and a connecting element disposed on the first circuit layer. The connecting element is disposed between two adjacent ones of the plurality electronic elements and electrically connected to the second circuit layer and one of the two adjacent ones of the plurality of electronic elements.