Abstract: An electromagnetic interference (EMI) shielding package structure, a manufacturing method thereof, and an electronic assembly are provided. The EMI shielding package structure includes a carrier, at least one chip mounted on a first board surface of the carrier, an encapsulant formed on the carrier and packaging the at least one chip, an EMI shielding layer formed on an outer surface of the encapsulant, and an insulating layer. The insulating layer includes a spraying portion and a capillary permeating portion. The spraying portion is formed at least part of an outer surface of the EMI shielding layer. The capillary permeating portion is formed by extending from a bottom end of the spraying portion toward a second board surface of the carrier through capillarity, and the capillary permeating portion covers a bottom edge of the EMI shielding layer.

Abstract: A three-dimensional printing apparatus includes a liquid tank capable of accommodating a photosensitive liquid. The liquid tank includes a film, a plurality of side walls, a plate and a motor. The film has a workpiece curing area. The plurality of side walls surrounds the film. The plate is capable of supporting the film and having at least one fluid tunnel extending from a first surface of the plate contacting the film to a second surface of the plate. The motor is connected to the liquid tank to incline the liquid tank. A gap is formed between the plat and one of the plurality of side walls of the liquid tank, and the film is communicated with an outside space via the gap.

Abstract: Example embodiments relate to vehicle sensor modules with external audio receivers. An example sensor module may include sensors and can be coupled to a vehicle's roof with a first microphone positioned proximate to the front of the sensor module. The sensor module can also include a second microphone extending into a first side of the sensor module such that the second microphone is configured to detect audio originating from an environment located relative to a first side of the vehicle and a third microphone extending into a second side of the sensor module such that the third microphone is configured to detect audio originating from the environment located relative to a second side of the vehicle, wherein the second side is opposite of the first side.

Abstract: The present invention relates to a powder dry-pressing molding device and method.

Abstract: Various embodiments of the present application are directed to an IC, and associated forming methods. In some embodiments, the IC comprises a memory region and a logic region integrated in a substrate. A plurality of memory cell structures is disposed on the memory region. Each memory cell structure of the plurality of memory cell structures comprises a control gate electrode disposed over the substrate, a select gate electrode disposed on one side of the control gate electrode, and a spacer between the control gate electrode and the select gate electrode. A contact etch stop layer (CESL) is disposed along an upper surface of the substrate, extending upwardly along and in direct contact with a sidewall surface of the select gate electrode within the memory region. A lower inter-layer dielectric layer is disposed on the CESL between the plurality of memory cell structures within the memory region.

Abstract: There is provided a locker with a motion sensor. The motion sensor identifies whether an object is put into or taken out from the locker by calculating coordinates of the object using a motion detection algorithm, by calculating a moving vector of the object using an image time differential algorithm or by comparing a current image frame and a background image frame, and outputs a put-in signal and a taken-out signal to a post control system.

Abstract: CD93 functional domains for use in treating osteoporosis. A method of alleviating, reducing, suppressing, and/or treating an osteoclast-related bone disease is disclosed. The method comprises administering a therapeutically effective amount of an isolated recombinant protein comprising an amino acid sequence that is at least 80% identical to human Cluster of Differentiation 93 protein domain 1 to a subject in need thereof, the recombinant protein lacking amino acid residues 1 to 21, transmembrane and cytoplasmic domains of the human CD93 (SEQ ID NO: 3) and having a total length of no more than 559 amino acid residues. In one embodiment, the osteoclast-related bone disease is at least one selected from the group consisting of osteoporosis, postmenopausal osteoporosis, osteopenia, bone loss, inflammatory bone loss, and any combination thereof. In another embodiment, the recombinant protein comprises the amino acid sequence of SEQ ID NO: 1 or SEQ ID NO: 2.

Abstract: An on-line detection system for defects of an MEA is provided. The detection system includes a workbench, two connecting rods are arranged inside the workbench, two ends of the two connecting rods are both connected to two side walls of the workbench by means of bearings, and conveying rollers are fixedly arranged outside the two connecting rods in a sleeving manner. One side of the workbench is fixedly provided with a first electric motor, and an output end of the first electric motor is fixedly connected to one of the connecting rods. Belt pulleys are fixedly arranged outside the two connecting rods in a sleeving manner, and a belt is arranged outside the two belt pulleys in a sleeving manner. A hollow roller is arranged on an inner side of the workbench, and a plurality of exhaust holes are provided in a top of the hollow roller.

Abstract: A magnetoresistive random access memory (MRAM) device includes a first array region and a second array region on a substrate, a first magnetic tunneling junction (MTJ) on the first array region, a first top electrode on the first MTJ, a second MTJ on the second array region, and a second top electrode on the second MTJ. Preferably, the first top electrode and the second top electrode include different nitrogen to titanium (N/Ti) ratios.

Abstract: A method for predicting clinical severity of a neurological disorder includes steps of: a) identifying, according to a magnetic resonance imaging (MRI) image of a brain, brain image regions each of which contains a respective portion of diffusion index values of a diffusion index, which results from image processing performed on the MRI image; b) for one of the brain image regions, calculating a characteristic parameter based on the respective portion of the diffusion index values; and c) calculating a severity score that represents the clinical severity of the neurological disorder of the brain based on the characteristic parameter of the one of the brain image regions via a prediction model associated with the neurological disorder.

Abstract: Systems and methods are provided for decoding data read from non-volatile storage devices. A method that may include decoding a first codeword read from a storage location of a non-volatile storage device using a first decoder without soft information, determining that the first decoder has failed to decode the first codeword, decoding the first codeword using a second decoder without soft information, determining that the second decoder has succeeded in decoding the first codeword, generating soft information associated with the storage location using decoding information generated by the second decoder and decoding a subsequent codeword from the storage location using the soft information associated with the storage location. The second decoder may be more powerful than the first decoder.

Abstract: A compressor (200), comprising: a first rotor (20) being rotatable around a first axis (11), the first rotor (20) comprising a first portion (22) and a second portion (24); and a first shaft (10) carrying the first portion (22) and the second portion (24), the first shaft (10) having a first end (12) and a second end (14) that are oppositely arranged, wherein the first rotor (20) is configured to be applied with a preset acting force in a direction from the first end (12) toward the second end (14) or from the second end (14) toward the first end (12) during rotation. The size of the compressor (200) can be reduced with the displacement of the compressor (200) remaining substantially unchanged.

Abstract: Dynamic tuning method for a specific absorption rate (SAR) is provided. The dynamic tuning method is applied to user equipment (UE). The dynamic tuning method may include the following steps: the UE may determine the back-off value corresponding to the current antenna state; and the UE may tune the conducted power of the radio frequency (RF) circuit of the UE based on the back-off value.

Abstract: An electronic device and an electronic device operation method are disposed. The electronic device includes a flexible element and a controller. The flexible element includes a plurality of sensing electrodes. In a stacked state, a first portion of the flexible element overlaps a second portion of the flexible element. The controller is electrically connected to the plurality of the sensing electrodes of the flexible element. The controller receives a first signal from the plurality of sensing electrodes in the first portion and receives a second signal from the plurality of the sensing electrodes in the second portion.

Abstract: A method includes planarizing a protective layer over gate materials overlying a recessed region in a substrate. The planarizing includes forming a first planarized surface by planarizing a sacrificial layer over the protective layer, and forming a second planarized surface of the protective layer by etching the first planarized surface of the sacrificial layer at an even rate across the recessed region. An etch mask layer is formed over the second planarized surface, and control gate stacks are formed in the recessed region by etching the gate materials.

Abstract: Semiconductor processing apparatuses and methods are provided in which an electrostatic discharge (ESD) prevention layer is utilized to prevent or reduce ESD events from occurring between a semiconductor wafer and one or more components of the apparatuses. In some embodiments, a semiconductor processing apparatus includes a wafer handling structure that is configured to support a semiconductor wafer during processing of the semiconductor wafer. The apparatus further includes an ESD prevention layer on the wafer handling structure. The ESD prevention layer includes a first material and a second material, and the second material has an electrical conductivity that is greater than an electrical conductivity of the first material.

Abstract: A method and apparatus for forming tungsten features in semiconductor devices is provided. The method includes exposing a top opening of a feature formed in a substrate to a physical vapor deposition (PVD) process to deposit a tungsten liner layer within the feature. The PVD process is performed in a first processing region of a first processing chamber and the tungsten liner layer forms an overhang portion, which partially obstructs the top opening of the feature. The substrate is transferred from the first processing region of the first processing chamber to a second processing region of a second processing chamber without breaking vacuum. The overhang portion is exposed to nitrogen-containing radicals in the second processing region to inhibit subsequent growth of tungsten along the overhang portion. The feature is exposed to a tungsten-containing precursor gas to form a tungsten fill layer over the tungsten liner layer within the feature.

Abstract: The method of forming the semiconductor structure includes the following steps. First trenches and second trenches are respectively formed in a substrate of the logic region and the substrate of the array region. A dielectric liner is formed in the first trenches and second trenches. First coating blocks and second coating blocks are respectively formed in the first trenches and second trenches. A cap layer is formed on the first coating blocks and the second coating blocks. Oxide structures are formed on the cap layer. Part of the oxide structures and part of the cap layer is removed. A semiconductor layer is formed in the array region and disposed on the substrate and between the oxide structures.

Abstract: The disclosure provides a display device. The display device includes a display panel and a vibration generating module. The vibration generating module is attached to the display panel and includes a substrate, a circuit layer, and a plurality of vibrators. The circuit layer and the plurality of vibrators are disposed on the substrate, and the plurality of vibrators are electrically connected to the circuit layer.

Abstract: A projection device including a light source module, an optical engine module and a projection lens is provided. The optical engine module includes a casing, a heat-conducting base, a heat pipe, a light valve and a thermal conductive layer. The casing has an opening. The heat-conducting base has an assembly opening, wherein the heat-conducting base is disposed on the casing, and the assembly opening is aligned with the opening of the casing. The heat pipe is connected to the heat-conducting base and disposed on the heat-conducting base. The light valve is disposed on the heat-conducting base corresponding to the assembly opening. The light valve is thermally coupled to the heat-conducting base through the thermal conductive layer. The light valve has a first stepped surface and a second stepped surface, and the thermal conductive layer covers at least a part of the first stepped surface and the second stepped surface.