Patents by Inventor Hans Wu

Hans Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240141783
    Abstract: A tracer diffusion device includes: a first container, for holding a first fluid containing a tracer; a second container, for holding a second fluid; a drilling pipe; wherein, a first end of the drilling pipe is connected to the first container; a second end of the drilling pipe is extended into a borehole; and the second end of the drilling pipe is equipped with a first sealing capsule and a second sealing capsule; a plurality of through holes are arranged on the drilling pipe between the first sealing capsule and the second sealing capsule; a unidirectional driving device, arranged on the drilling pipe, for injecting the first fluid from the first container into the borehole between the first sealing capsule and the second sealing capsule; and a bidirectional driving device, arranged between the second container and the first sealing capsule.
    Type: Application
    Filed: June 30, 2023
    Publication date: May 2, 2024
    Applicant: CHINA UNIVERSITY OF MINING AND TECHNOLOGY, BEIJING
    Inventors: Yifan ZENG, Shihao MENG, Qiang WU, Lu WANG, Shijie TANG, Xuedong KAN, Chao YU, Han BAO
  • Publication number: 20240145421
    Abstract: Provided are a passivation layer for forming a semiconductor bonding structure, a sputtering target making the same, a semiconductor bonding structure and a semiconductor bonding process. The passivation layer is formed on a bonding substrate by sputtering the sputtering target; the passivation layer and the sputtering target comprise a first metal, a second metal or a combination thereof. The bonding substrate comprises a third metal. Based on a total atom number of the surface of the passivation layer, O content of the surface of the passivation layer is less than 30 at %; the third metal content of the surface of the passivation layer is less than or equal to 10 at %. The passivation layer has a polycrystalline structure. The semiconductor bonding structure sequentially comprises a first bonding substrate, a bonding layer and a second bonding substrate: the bonding layer is mainly formed by the passivation layer and the third metal.
    Type: Application
    Filed: October 27, 2023
    Publication date: May 2, 2024
    Inventors: Kuan-Neng CHEN, Zhong-Jie HONG, Chih-I CHO, Ming-Wei WENG, Chih-Han CHEN, Chiao-Yen WANG, Ying-Chan HUNG, Hong-Yi WU, CHENG-YEN HSIEH
  • Publication number: 20240136484
    Abstract: An electronic device includes a substrate, a semiconductor unit and an insulating layer. The semiconductor unit is disposed on the substrate. The insulating layer is disposed on the semiconductor unit, and the insulating layer includes a first portion and a second portion connected to the first portion. In a top view, the first portion partially overlaps the semiconductor unit, the second portion does not overlap the semiconductor unit, and a part of an edge of the insulating layer is irregular.
    Type: Application
    Filed: January 2, 2024
    Publication date: April 25, 2024
    Applicant: InnoLux Corporation
    Inventors: Jia-Yuan Chen, Tsung-Han Tsai, Kuan-Feng Lee, Yuan-Lin Wu
  • Patent number: 11964915
    Abstract: A ceramic material includes zirconia toughened alumina (ZTA), which is doped with zinc ions and other metal ions, in which the other metal ions are chromium (Cr) ions, titanium (Ti) ions, gadolinium (Gd) ions, manganese (Mn) ions, cobalt (Co) ions, iron (Fe) ions, or a combination thereof. The ceramic material may have a hardness of 1600 Hv10 to 2200 Hv10 and a bending strength of 600 MPa to 645 MPa. The ceramic material can be used as wire bonding capillary.
    Type: Grant
    Filed: December 17, 2021
    Date of Patent: April 23, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Tien-Heng Huang, Yu-Han Wu, Kuo-Chuang Chiu
  • Publication number: 20240129994
    Abstract: In an embodiment, a session management function (SMF) network element obtains first information identifying a data stream, where the first information is used to instruct a transmit end to send a user stream using the data stream and to instruct a receive end to receive the user stream using the data stream; and the receive end is an access network element, and the transmit end is a user plane function network element, or vice versa; the SMF network element sends the first information to the user plane function network element and/or the access network element; the SMF network element obtains second information, where the second information is used to indicate a forwarding rule of transmitting the user stream by the user plane function network element on a data network side; and the SMF network element sends the second information to the user plane function network element.
    Type: Application
    Filed: November 2, 2023
    Publication date: April 18, 2024
    Inventors: Hancheng LI, Wenfu WU, Han ZHOU
  • Publication number: 20240130052
    Abstract: A display device includes a display panel including a rollable portion and a non-rollable portion. The display panel includes a supporting structure including a groove disposed on a first side of the supporting structure, a substrate disposed on a second side of the supporting structure and the first side opposite to the second side, and a circuit board fixed onto a back of the display panel. The non-rollable portion has a first region. A first region of the circuit board is joined to the first region of the non-rollable portion. The non-rollable portion has a first end and a second end. The first end is connected to the rollable portion. The second end is connected to the circuit board.
    Type: Application
    Filed: December 20, 2023
    Publication date: April 18, 2024
    Applicant: InnoLux Corporation
    Inventors: Yuan-Lin WU, Tsung-Han Tsai, Kuan-Feng Lee
  • Publication number: 20240124163
    Abstract: A magnetic multi-pole propulsion array system is applied to at least one external cathode and includes a plurality of magnetic multi-pole thrusters connected adjacent to each other. Each magnetic multi-pole thruster includes a propellant provider, a discharge chamber, an anode and a plurality of magnetic components. The propellant provider outputs propellant. The discharge chamber is connected with the propellant provider to accommodate the propellant. The anode is disposed inside the discharge chamber to generate an electric field. The plurality of magnetic components is respectively disposed on several sides of the discharge chamber. One of the several sides of the discharge chamber of the magnetic multi-pole thruster is applied for one side of a discharge chamber of another magnetic multi-pole thruster.
    Type: Application
    Filed: December 19, 2022
    Publication date: April 18, 2024
    Applicant: National Cheng Kung University
    Inventors: Yueh-Heng Li, Yu-Ting Wu, Chao-Wei Huang, Wei-Cheng Lo, Hsun-Chen Hsieh, Ping-Han Huang, Yi-Long Huang, Sheng-Wen Liu, Wei-Cheng Lien
  • Patent number: 11961444
    Abstract: The disclosure provides a transparent display device including a display panel. The display panel includes a display area, a non-display area, and a plurality of pixels. The non-display area is adjacent to the display area. The plurality of pixels are disposed in the display area. A difference between a transmittance of the display area and a transmittance of the non-display area is less than 30% of the transmittance of the display area.
    Type: Grant
    Filed: February 3, 2023
    Date of Patent: April 16, 2024
    Assignee: Innolux Corporation
    Inventors: Yu-Chia Huang, Yuan-Lin Wu, Tsung-Han Tsai, Kuan-Feng Lee
  • Patent number: 11961093
    Abstract: A method for regulating an unmanned aerial vehicle (UAV) includes receiving a UAV identifier and one or more types of contextual information broadcasted by the UAV. The UAV identifier uniquely identifies the UAV from other UAVs. The one or more types of contextual information includes at least geographical information of the UAV. The method further includes authenticating, via an authentication device, an identity of the UAV based on the UAV identifier to determine whether the UAV is authorized for operation, and transmitting a signal to a remote device in response to determining whether the UAV is authorized for operation.
    Type: Grant
    Filed: June 20, 2022
    Date of Patent: April 16, 2024
    Assignee: SZ DJI TECHNOLOGY CO., LTD.
    Inventors: Ming Gong, Jin Dai, Hao Cui, Xiaodong Wang, Han Huang, Jun Wu, Wei Fan, Ning Ma, Xinhua Rong, Xingsen Lin
  • Publication number: 20240120326
    Abstract: Disclosed is a bio sensing device including a medium layer, a light emitting element and an optical sensor. The light emitting element is configured to emit a light toward a user's skin layer, in which the light passes through the medium layer and has a maximum intensity in a first wavelength. The optical sensor is configured to receive a reflected part of the light from the user's skin layer, in which the reflected part of the light passes through the medium layer, and the medium layer has a first transmittance greater than 60% with respect to the first wavelength.
    Type: Application
    Filed: September 11, 2023
    Publication date: April 11, 2024
    Applicant: InnoLux Corporation
    Inventors: Yuan-Lin WU, Chandra LIUS, Tsung-Han TSAI, Kuan-Feng LEE
  • Publication number: 20240120451
    Abstract: An electronic assembly is provided. The electronic assembly includes a first circuit structure including a conductive structure, a second circuit structure disposed on the first circuit structure, a plurality of electronic elements disposed on the first circuit structure, and a connecting element disposed on the first circuit layer. The connecting element is disposed between two adjacent ones of the plurality electronic elements and electrically connected to the second circuit layer and one of the two adjacent ones of the plurality of electronic elements.
    Type: Application
    Filed: December 19, 2023
    Publication date: April 11, 2024
    Inventors: Jia-Yuan CHEN, Tsung-Han TSAI, Kuan-Feng LEE, Yuan-Lin WU
  • Publication number: 20240120018
    Abstract: A memory device, a failure bits detector, and a failure bits detection method thereof are provided. The failure bits detector includes a current generator, a current mirror, and a comparator. The current generator generates a first current according to a reference code. The current mirror mirrors the first current to generate a second current at a second end of the current mirror. The comparator compares a first voltage at a first input end with a second voltage at a second input end to generate a detection result.
    Type: Application
    Filed: October 5, 2022
    Publication date: April 11, 2024
    Applicant: MACRONIX International Co., Ltd.
    Inventors: Chung-Han Wu, Che-Wei Liang, Chih-He Chiang, Shang-Chi Yang
  • Publication number: 20240121038
    Abstract: A carrier configuration method and system for a distributed antenna system, a processing device, and a chip are provided. The distributed antenna system includes at least one access unit and at least one remote unit. The method includes: acquiring a configuration parameter of a carrier to be transmitted of at least one access unit, the configuration parameter including a mapping relationship between the at least one access unit and the at least one remote unit; and establishing a transmission channel between the at least one access unit and the at least one remote unit according to the mapping relationship.
    Type: Application
    Filed: December 19, 2023
    Publication date: April 11, 2024
    Inventors: Peigao XU, Yaxue XU, Han BAO, Huan FAN, Bangxiang LING, Tuo JIAN, Wenquan WU
  • Patent number: 11955439
    Abstract: A semiconductor package includes a semiconductor die, a redistribution structure and connective terminals. The redistribution structure is disposed on the semiconductor die and includes a first metallization tier disposed in between a pair of dielectric layers. The first metallization tier includes routing conductive traces electrically connected to the semiconductor die and a shielding plate electrically insulated from the semiconductor die. The connective terminals include dummy connective terminals and active connective terminals. The dummy connective terminals are disposed on the redistribution structure and are electrically connected to the shielding plate. The active connective terminals are disposed on the redistribution structure and are electrically connected to the routing conductive traces. Vertical projections of the dummy connective terminals fall on the shielding plate.
    Type: Grant
    Filed: January 17, 2023
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Cheng Wu, Chien-Chia Chiu, Cheng-Hsien Hsieh, Li-Han Hsu, Meng-Tsan Lee, Tsung-Shu Lin
  • Publication number: 20240113036
    Abstract: An electromagnetic interference (EMI) shielding package structure, a manufacturing method thereof, and an electronic assembly are provided. The EMI shielding package structure includes a carrier, at least one chip mounted on a first board surface of the carrier, an encapsulant formed on the carrier and packaging the at least one chip, an EMI shielding layer formed on an outer surface of the encapsulant, and an insulating layer. The insulating layer includes a spraying portion and a capillary permeating portion. The spraying portion is formed at least part of an outer surface of the EMI shielding layer. The capillary permeating portion is formed by extending from a bottom end of the spraying portion toward a second board surface of the carrier through capillarity, and the capillary permeating portion covers a bottom edge of the EMI shielding layer.
    Type: Application
    Filed: November 17, 2022
    Publication date: April 4, 2024
    Inventors: CHIH-HAO LIAO, SHU-HAN WU, HSIN-YEH HUANG
  • Publication number: 20240112088
    Abstract: Systems and methods are provided for vector-quantized image modeling using vision transformers and improved codebook handling. In particular, the present disclosure provides a Vector-quantized Image Modeling (VIM) approach that involves pretraining a machine learning model (e.g., Transformer model) to predict rasterized image tokens autoregressively. The discrete image tokens can be encoded from a learned Vision-Transformer-based VQGAN (example implementations of which can be referred to as ViT-VQGAN). The present disclosure proposes multiple improvements over vanilla VQGAN from architecture to codebook learning, yielding better efficiency and reconstruction fidelity. The improved ViT-VQGAN further improves vector-quantized image modeling tasks, including unconditional image generation, conditioned image generation (e.g., class-conditioned image generation), and unsupervised representation learning.
    Type: Application
    Filed: November 27, 2023
    Publication date: April 4, 2024
    Inventors: Jiahui Yu, Xin Li, Han Zhang, Vijay Vasudevan, Alexander Yeong-Shiuh Ku, Jason Michael Baldridge, Yuanzhong Xu, Jing Yu Koh, Thang Minh Luong, Gunjan Baid, Zirui Wang, Yonghui Wu
  • Publication number: 20240111588
    Abstract: Intelligent process management is provided. A start time is determined for an additional process to be run on a worker node within a duration of a sleep state of a task of a process already running on the worker node by adding a first defined buffer time to a determined start time of the sleep state of the task. A backfill time is determined for the additional process by subtracting a second defined buffer time from a determined end time of the sleep state of the task. A scheduling plan is generated for the additional process based on the start time and the backfill time corresponding to the additional process. The scheduling plan is executed to run the additional process on the worker node according to the start time and the backfill time corresponding to the additional process.
    Type: Application
    Filed: September 29, 2022
    Publication date: April 4, 2024
    Inventors: Jing Jing Wei, Yue Wang, Shu Jun Tang, Yang Kang, Yi Fan Wu, Qi Han Zheng, Jia Lin Wang
  • Patent number: 11945156
    Abstract: A three-dimensional printing apparatus includes a liquid tank capable of accommodating a photosensitive liquid. The liquid tank includes a film, a plurality of side walls, a plate and a motor. The film has a workpiece curing area. The plurality of side walls surrounds the film. The plate is capable of supporting the film and having at least one fluid tunnel extending from a first surface of the plate contacting the film to a second surface of the plate. The motor is connected to the liquid tank to incline the liquid tank. A gap is formed between the plat and one of the plurality of side walls of the liquid tank, and the film is communicated with an outside space via the gap.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: April 2, 2024
    Assignee: YOUNG OPTICS INC.
    Inventors: Li-Han Wu, Chien-Hsing Tsai, Chao-Shun Chen, Tsung-Yu Liu
  • Publication number: 20240107228
    Abstract: Example embodiments relate to vehicle sensor modules with external audio receivers. An example sensor module may include sensors and can be coupled to a vehicle's roof with a first microphone positioned proximate to the front of the sensor module. The sensor module can also include a second microphone extending into a first side of the sensor module such that the second microphone is configured to detect audio originating from an environment located relative to a first side of the vehicle and a third microphone extending into a second side of the sensor module such that the third microphone is configured to detect audio originating from the environment located relative to a second side of the vehicle, wherein the second side is opposite of the first side.
    Type: Application
    Filed: December 6, 2023
    Publication date: March 28, 2024
    Inventors: Cheng-Han Wu, Choon Ping Chng, Jun Hou, Miklos Szentkiralyi, Rutvik Acharya
  • Patent number: 11938653
    Abstract: The present invention relates to a powder dry-pressing molding device and method.
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: March 26, 2024
    Assignees: QINGDAO UNIVERSITY OF TECHNOLOGY, SHENYANG HONGYANG PRECISION CERAMICS CO., LTD.
    Inventors: Changhe Li, Mingcun Shi, Xiangyang Ma, Baoda Xing, Xiaohong Ma, Yanbin Zhang, Min Yang, Xin Cui, Teng Gao, Xiaoming Wang, Yali Hou, Han Zhai, Zhen Wang, Bingheng Lu, Huajun Cao, Naiqing Zhang, Qidong Wu